High-strength FCOB circuit carrier plate

Abstract

The utility model belongs to the technical field of FCOB (Flexible Chip On Board) circuit support plates, in particular to a high-strength FCOB circuit support plate, and aims to solve the problems of low overall strength and incomplete signal transmission of the FCOB circuit support plate provided by the background technology, the following scheme is provided: the high-strength FCOB circuit support plate comprises a circuit support plate main body, and an external connection plate is arranged outside the circuit support plate main body; and an aluminum alloy square ring is adhered to the inner wall of the bottom of the external connecting plate. According to the utility model, through the combination of the circuit support plate main body and the external connection plate, the FCOB circuit support plate has high mechanical strength, can well protect the FCOB circuit support plate from being damaged, and increases the strength of the circuit support plate main body, so that the FCOB circuit support plate is not easy to bend under the condition of follow-up stress, thereby prolonging the service life of the circuit support plate main body, and reducing the cost of the FCOB circuit support plate. An eight-layer board structure is adopted in the circuit carrier board body, four wiring layers and four reference surface layers are arranged, electromagnetic interference can be optimized, signals at different speeds can be transmitted, and the integrity of the signals and the EMC characteristic are greatly improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to FCOB circuit carrier plate technical field especially relates to a high strength FCOB circuit carrier plate. BACKGROUND

[0002] FCOB circuit carrier plate is a kind of technology for LED lamp strip packaging, especially suitable for COB technical field.FCOB circuit carrier plate usually includes first ink layer, double-sided substrate layer, cover film layer and via hole.FCOB circuit carrier plate is especially suitable for LED lamp strip packaging, can provide high luminous efficiency and stable voltage output, suitable for various LED lamp strip products.

[0003] FCOB circuit carrier plate usually uses the paper substrate with lower price, although it has good insulation and processability, but the performance of board material is very fragile, so that the two ends of FCOB circuit carrier plate are easy to break under stress, and the overall strength is low;

[0004] In addition, some FCOB circuit carrier plates with few internal layers are susceptible to electromagnetic interference, and there is the problem of incomplete signal transmission. UTILITY MODEL CONTENTS

[0005] In view of the deficiencies of prior art, the utility model provides a kind of high strength FCOB circuit carrier plate, overcome the deficiencies of prior art, effectively solve the problem of low overall strength of FCOB circuit carrier plate and incomplete signal transmission.

[0006] To achieve the above object, the utility model adopts the following technical scheme:

[0007] A kind of high strength FCOB circuit carrier plate, including circuit carrier plate main body, the outer portion of the circuit carrier plate main body is provided with external plate, and aluminum alloy square ring is bonded in the bottom inner wall of external plate;

[0008] The top surface of the circuit carrier plate main body is provided with component layer, and first inner microstrip wire layer, ground layer, first strip line wire layer, second strip line wire layer, power supply layer, second inner microstrip wire layer and outer microstrip wire layer are sequentially arranged from top to bottom in the bottom of component layer, wherein, outer microstrip wire layer is arranged on the bottom surface of circuit carrier plate main body.

[0009] Preferably, the outer circumferential dimension of the aluminum alloy square ring is greater than the size of the circuit carrier plate main body.

[0010] Preferably, the bottom outer wall of the external plate is provided with square ring groove, and the aluminum alloy square ring is arranged in the interior of square ring groove.

[0011] Preferably, the circuit carrier plate main body is provided with equidistance distribution insulation layer inside.

[0012] Preferably, the insulating layer inside the circuit carrier plate body is provided with through holes distributed adjacently, and the through holes are provided with conductive layers.

[0013] Preferably, the circuit carrier plate body and the inner wall of the outer plate are provided with mounting holes for fixing screws.

[0014] Preferably, the bottom outer wall of the outer plate is provided with a bottom square groove inside the circuit carrier plate body.

[0015] The utility model discloses the beneficial effect that:

[0016] 1, the high strength FCOB circuit carrier plate of this design, through the combination of circuit carrier plate body and outer plate, the aluminium alloy square ring in the inner portion of outer plate adopts aluminium alloy material, has very high mechanical strength, can well protect FCOB circuit carrier plate from being damaged, increases the strength of circuit carrier plate body, makes it not easy to bend under subsequent stress, thereby improve the service life of circuit carrier plate body.

[0017] 2, the high strength FCOB circuit carrier plate of this design, the inside of circuit carrier plate body adopts eight layers of board structure, is component layer, first inner microstrip wire layer, ground layer, first stripline wire layer, second stripline wire layer, power supply layer, second inner microstrip wire layer, outer microstrip wire layer, has four wiring layers and four reference surface layers, can optimize electromagnetic interference, transmits the signal of different speed, and the integrity and EMC characteristic of signal are greatly improved. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 The utility model proposes a kind of overall structure perspective view of high-strength FCOB circuit carrier plate;

[0019] Figure 2 The utility model proposes a kind of overall structure bottom view of high-strength FCOB circuit carrier plate;

[0020] Figure 3 The utility model proposes a kind of overall structure split schematic view of high-strength FCOB circuit carrier plate;

[0021] Figure 4 The utility model proposes a kind of circuit carrier plate body sectional schematic view of high-strength FCOB circuit carrier plate.

[0022] In the drawing: 1, circuit carrier plate body;2, outer plate;3, aluminium alloy square ring;4, component layer;5, first inner microstrip wire layer;6, ground layer;7, first stripline wire layer;8, second stripline wire layer;9, power supply layer;10, second inner microstrip wire layer;11, outer microstrip wire layer;12, insulating layer;13, through hole;14, mounting hole. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the utility model will be apparently and completely described in connection with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments.

[0024] Embodiment one, refer to Figures 1-3 A high-strength FCOB circuit carrier plate, comprising a circuit carrier plate body 1, an external plate 2 is arranged outside the circuit carrier plate body 1, and an aluminum alloy square ring 3 is bonded to the inner wall of the bottom of the external plate 2.

[0025] In the embodiment, through the combination of the circuit carrier plate body 1 and the external plate 2, the aluminum alloy square ring 3 inside the external plate 2 adopts an aluminum alloy material, has very high mechanical strength, can well protect the FCOB circuit carrier plate from being damaged, increase the strength of the circuit carrier plate body 1, make it not easy to bend under subsequent stress, thereby improving the service life of the circuit carrier plate body 1.

[0026] Embodiment two, refer to Figure 4 A high-strength FCOB circuit carrier plate, a component layer 4 is arranged on the top surface of a circuit carrier plate body 1, and a first inner microstrip wire layer 5, a ground layer 6, a first stripline wire layer 7, a second stripline wire layer 8, a power supply layer 9, a second inner microstrip wire layer 10 and an outer microstrip wire layer 11 are sequentially arranged from top to bottom at the bottom of the component layer 4, wherein the outer microstrip wire layer 11 is arranged on the bottom surface of the circuit carrier plate body 1.

[0027] In the embodiment, the inside of the circuit carrier plate body 1 adopts an eight-layer plate structure, which is respectively the component layer 4, the first inner microstrip wire layer 5, the ground layer 6, the first stripline wire layer 7, the second stripline wire layer 8, the power supply layer 9, the second inner microstrip wire layer 10 and the outer microstrip wire layer 11, has four wiring layers and four reference surface layers, can optimize electromagnetic interference, transmit signals of different speeds, and greatly improve the integrity of signals and EMC characteristics.

[0028] Refer to Figure 3 The outer peripheral size of the aluminum alloy square ring 3 is greater than the size of the circuit carrier plate body 1.

[0029] Refer to Figure 3 A square ring groove is formed in the bottom outer wall of the external plate 2, and the aluminum alloy square ring 3 is arranged inside the square ring groove.

[0030] Refer to Figures 3-4 The circuit carrier plate body 1 is provided with an insulating layer 12 arranged at equal distances inside.

[0031] Refer to Figure 4The insulating layer 12 inside the circuit carrier plate body 1 is provided with through holes 13 distributed adjacently, and the through holes 13 are provided with conductive layers.

[0032] With reference to Figure 1 The four peripheral walls of the circuit carrier plate body 1 and the external plate 2 are provided with mounting holes 14 for fixing screws.

[0033] With reference to Figure 2 The bottom outer wall of the external plate 2 is provided with a bottom square groove inside the bottom of the circuit carrier plate body 1.

[0034] Working principle: the circuit carrier plate body 1 and the external plate 2 can be fixed together by screws, and the aluminum alloy square ring 3 inside the external plate 2 is used to increase the overall strength of the FCOB circuit carrier plate, so as to avoid damage of the circuit carrier plate body 1 under stress.

[0035] The circuit carrier plate body 1 is composed of a component layer 4, a first inner microstrip line layer 5, a ground layer 6, a first stripline line layer 7, a second stripline line layer 8, a power supply layer 9, a second inner microstrip line layer 10 and an outer microstrip line layer 11, and the insulating layer 12 is arranged in the interlayer of the above-mentioned wiring layers and reference surface layers, and the through holes 13 are arranged in the insulating layer 12 for conductive effect.

[0036] The above is only the preferred specific implementation of the present application, but the protection scope of the present application is not limited to this, any skilled person in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.

Claims

1. A high-strength FCOB wiring board comprising a wiring board main body (1), characterized by, The outer part of the circuit carrier plate body (1) is provided with an external plate (2), and the inner wall of the bottom of the external plate (2) is bonded with an aluminum alloy square ring (3); The top surface of the circuit carrier plate body (1) is provided with a component layer (4), and the bottom of the component layer (4) is sequentially provided from top to bottom with a first inner microstrip wire layer (5), a ground layer (6), a first stripline wire layer (7), a second stripline wire layer (8), a power supply layer (9), a second inner microstrip wire layer (10) and an outer microstrip wire layer (11), wherein the outer microstrip wire layer (11) is arranged on the bottom surface of the circuit carrier plate body (1).

2. A high strength FCOB circuit carrier according to claim 1, wherein, The outer circumferential dimension of the aluminum alloy square ring (3) is greater than the dimension of the circuit carrier plate body (1).

3. A high strength FCOB circuit carrier according to claim 1, wherein, The bottom outer wall of the external plate (2) is provided with a square ring groove, and the aluminum alloy square ring (3) is arranged inside the square ring groove.

4. The high strength FCOB circuit carrier of claim 1 wherein, The circuit carrier plate body (1) is provided with an insulating layer (12) arranged at equal distances inside.

5. A high strength FCOB circuit carrier according to claim 1, wherein, The insulating layer (12) inside the circuit carrier plate body (1) is provided with through holes (13) arranged adjacently, and the through holes (13) are provided with conductive layers inside.

6. A high strength FCOB circuit carrier according to claim 1, wherein, The inner walls of the circuit carrier plate body (1) and the external plate (2) are provided with mounting holes (14) for fixing screws.

7. A high strength FCOB circuit carrier according to claim 1, wherein, The bottom outer wall of the external plate (2) is provided with a bottom square groove at the bottom of the circuit carrier plate body (1), and the bottom square groove is arranged inside the square ring groove.

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