Anti-deformation packaging frame of semiconductor chip

Abstract

The utility model relates to the technical field of electronic accessories, in particular to an anti-deformation packaging frame of a semiconductor chip, which comprises a constant-temperature storage outer shell for storing free nucleic acid DNA, a base is arranged at the bottom of the constant-temperature storage outer shell, and a top cover is mounted at the top of the constant-temperature storage outer shell. According to the utility model, the semiconductor chips can be accurately positioned and fixed through the plurality of semiconductor chip positioning grooves which are arranged on the packaging outer frame and are the same as the semiconductor chips on the integrated circuit board in number, corresponding to the semiconductor chips in position and matched with the semiconductor chips in size, so that the semiconductor chips can be accurately and stably mounted on the integrated circuit board; the displacement or shaking of the chip in the transportation, installation and working processes is effectively prevented, the risk of chip damage caused by physical factors is reduced, and the stability and reliability of the product are improved; continuous airflow circulation is formed through the ventilation holes and the cooling fan, and deformation caused by too high temperature is prevented.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic fittings technical field, concretely is the anti-deformation packaging frame of semiconductor chip. BACKGROUND

[0002] With the rapid development of semiconductor technology, chip integration continues to improve, and the performance is increasingly powerful, but at the same time, higher requirements are put forward for packaging technology. The packaging of semiconductor chips not only concerns the stability and reliability of the chip, but also directly affects the performance of the entire electronic product. With the increase of semiconductor chip power consumption, the heat dissipation problem is increasingly prominent. The traditional packaging mode is often difficult to effectively dissipate the heat generated by the chip in time, resulting in high temperature of the chip, and then affecting its performance and life. In the process of transportation, installation and use, semiconductor chips are easily affected by various mechanical stresses, such as vibration, impact, etc. These stresses may cause packaging structure deformation, chip damage and other problems, seriously affecting the stability and reliability of the product. SUMMARY

[0003] The utility model discloses a semiconductor chip's anti-deformation packaging frame to solve the problem of poor heat dissipation effect and poor stability of the existing semiconductor chip packaging in the above background technology.

[0004] To achieve the above object, the utility model provides the following technical scheme:

[0005] The anti-deformation packaging frame of semiconductor chip, including the integrated circuit board for installing semiconductor chip, the top surface of integrated circuit board is equipped with the packaging outer frame for fixing semiconductor chip;

[0006] A plurality of semiconductor chip positioning grooves corresponding in position and matching in size with the number of semiconductor chips on the integrated circuit board are formed on the packaging outer frame, and a plurality of groups of ventilation holes are also formed on the packaging outer frame, and a heat dissipation fan is embedded and installed in the ventilation hole.

[0007] The air guide interval is arranged between the packaging outer frame and the integrated circuit board.

[0008] As a preferred, the thickness of the packaging outer frame is greater than the thickness of the semiconductor chip.

[0009] As a preferred, the top and bottom of the ventilation hole are provided with a dust screen cover.

[0010] As a preferred, the edge of the packaging outer frame is provided with a fixing ring seat for sleeving the top edge of the integrated circuit board, and the fixing ring seat and the packaging outer frame are an integral molding structure.

[0011] As preferred, the fixed ring seat is connected to the integrated circuit board through several groups of evenly equidistant fixed bolts.

[0012] As preferred, a gap of 0.5-1mm is left between the semiconductor chip and the side wall of the corresponding semiconductor chip positioning slot.

[0013] As preferred, the height of the air guide section is 2-5mm.

[0014] Compared with the prior art, the semiconductor chip anti-deformation packaging frame has the following beneficial effects:

[0015] 1. In the semiconductor chip anti-deformation packaging frame, the packaging outer frame provides fixation and protection for the semiconductor chip; the several semiconductor chip positioning slots with the same number as the semiconductor chips on the integrated circuit board, corresponding positions and suitable sizes are opened on the packaging outer frame, which can accurately position and fix the semiconductor chip, ensure that the semiconductor chip can be accurately and stably installed on the integrated circuit board, effectively prevent displacement or shaking of the chip during transportation, installation and work, reduce the risk of chip damage caused by physical factors, and improve the stability and reliability of the product; the continuous airflow circulation formed by the ventilation holes and the cooling fan can effectively take away the heat generated by the semiconductor chip during work, avoid performance degradation or damage caused by high temperature, and ensure long-term stable operation of the chip; the air guide section between the packaging outer frame and the integrated circuit board can guide airflow and prevent deformation caused by high temperature.

[0016] 2. In the semiconductor chip anti-deformation packaging frame, the fixed ring seat is connected to the integrated circuit board through several groups of evenly equidistant fixed bolts, which enhances the connection strength between the packaging outer frame and the integrated circuit board, simplifies the installation steps, and improves the assembly efficiency. The fixed ring seat is firmly connected to the integrated circuit board through several groups of evenly equidistant fixed bolts, which ensures the stability and reliability of the entire semiconductor assembly on the circuit board.

[0017] 3. In the semiconductor chip anti-deformation packaging frame, a gap of 0.5-1mm is left between the semiconductor chip and the side wall of the corresponding semiconductor chip positioning slot, which relieves the thermal stress generated by the chip during work and reduces the influence of thermal expansion on the surrounding structure. BRIEF DESCRIPTION OF DRAWINGS

[0018] The accompanying drawings are used to provide a further understanding of the present application, and constitute a part of the specification, and together with the embodiments of the present application, make a further detailed explanation, but do not constitute a limitation on the present application.

[0019] Fig. 1 is a structural schematic view of the present application;

[0020] Fig. 2 It is a decomposition structure schematic view of the utility model;

[0021] Fig. 3 It is a cross section structure schematic view of the utility model.

[0022] Meaning of each mark in the figure:

[0023] 10, integrated circuit board;

[0024] 20, package outer frame; 21, air vent; 22, dust screen cover; 23, heat dissipation fan; 24, semiconductor chip positioning groove; 25, fixed ring seat;

[0025] 30, semiconductor chip;

[0026] 40, fixed bolt;

[0027] 50, air guide interval. DETAILED DESCRIPTION

[0028] The technical scheme in the embodiments of the utility model will be described clearly and completely in combination with the embodiments of the utility model and the drawings of the specification, apparently, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without creative labor belong to the protection scope of the utility model.

[0029] In the description of the utility model, it is understood that the orientation or position relationship indicated by the terms "center", "vertical", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" are based on the orientation or position relationship shown in the drawings, only for the convenience of describing the utility model and simplifying the description, and not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, therefore, it cannot be understood as the limitation of the utility model.

[0030] The anti-deformation packaging frame of the semiconductor chip, such as Figs. 1-3As shown, including the integrated circuit board 10 for installing semiconductor chip 30, the top surface of the integrated circuit board 10 is provided with a packaging frame 20 for fixing the semiconductor chip 30; the packaging frame 20 is provided with a plurality of semiconductor chip positioning grooves 24 corresponding to the number, position and size of the semiconductor chip 30 on the integrated circuit board 10, and a plurality of ventilation holes 21 are also provided on the packaging frame 20, and the ventilation holes 21 are embedded with heat dissipation fans 23; the packaging frame 20 and the integrated circuit board 10 are provided with a wind guide interval 50, and the integrated circuit board 10 is provided, so that the semiconductor chip 30 can have a stable installation foundation; the packaging frame 20 is provided, which provides fixation and protection for the semiconductor chip 30; the plurality of semiconductor chip positioning grooves 24 corresponding to the number, position and size of the semiconductor chip 30 on the integrated circuit board 10 are provided on the packaging frame 20, which can accurately position and fix the semiconductor chip 30, ensure that the semiconductor chip 30 can be accurately and stably installed on the integrated circuit board 10, effectively prevent the displacement or shaking of the chip during transportation, installation and work, reduce the risk of chip damage caused by physical factors, and improve the stability and reliability of the product; the continuous airflow circulation is formed by the ventilation holes 21 and the heat dissipation fans 23, which can effectively take away the heat generated by the semiconductor chip 30 during work, avoid performance degradation or damage caused by high temperature, and ensure long-term stable operation of the chip; the wind guide interval 50 between the packaging frame 20 and the integrated circuit board 10 can guide the airflow, preventing deformation caused by high temperature.

[0031] It is worth noting that the thickness of the packaging frame 20 is greater than the thickness of the semiconductor chip 30, which effectively provides an additional physical protection layer for the semiconductor chip 30, enhancing the stability and impact resistance of the overall structure.

[0032] Among them, the top and bottom of the ventilation hole 21 are provided with a dust screen 22, which can effectively prevent dust, impurities and other external pollutants from entering the equipment interior, maintain the cleanliness of the internal environment, and avoid problems such as poor heat dissipation or short circuit caused by dust accumulation. At the same time, the ventilation hole can still maintain unobstructed, ensuring that the semiconductor chip 30 can be well cooled during work.

[0033] Further, the edge of the packaging frame 20 is provided with a fixing ring seat 25 for sleeving the top edge of the integrated circuit board 10, the fixing ring seat 25 and the packaging frame 20 are integrally formed, and the fixing ring seat 25 is connected to the integrated circuit board 10 by a plurality of groups of evenly spaced fixing bolts 40, which enhances the connection strength between the packaging frame and the integrated circuit board 10, simplifies the installation steps, and improves the assembly efficiency. The fixing ring seat is firmly connected to the integrated circuit board 10 by a plurality of groups of evenly spaced fixing bolts 40, ensuring the stability and reliability of the entire semiconductor assembly on the circuit board.

[0034] Specifically, a gap of 0.5-1mm is left between the semiconductor chip 30 and the sidewall of the corresponding semiconductor chip positioning slot 24, which relieves the thermal stress generated by the chip during operation and reduces the impact of thermal expansion on the surrounding structure.

[0035] In addition, the height of the air guide interval 50 is 2-5mm, so that the air can smoothly pass through the interval and effectively take away the heat generated by the semiconductor chip 30. The appropriate height of the air guide interval can not only ensure good heat dissipation effect, but also avoid excessive space waste, optimizing the structural layout of the entire heat dissipation system.

[0036] The working principle of the anti-deformation packaging frame of the semiconductor chip is as follows: first, the semiconductor chip 30 is accurately placed on the corresponding position on the integrated circuit board 10. Then, the semiconductor chip 30 is positioned and fixed by using the semiconductor chip positioning slot 24 on the packaging outer frame 20, ensuring that its position is accurate and stable, and avoiding displacement or shaking during transportation, installation and operation. When the semiconductor chip 30 works, the heat generated will be quickly taken away by the continuous air circulation formed by the several groups of air vents 21 on the packaging outer frame 20 and the embedded installed heat dissipation fan 23. At the same time, the air guide interval 50 between the packaging outer frame 20 and the integrated circuit board 10 can guide the air flow, further enhance the heat dissipation effect, prevent deformation caused by high temperature, and ensure long-term stable operation of the semiconductor chip 30.

[0037] The basic principle, main features and advantages of the present application are shown and described above. Those skilled in the art should understand that the present application is not limited by the above embodiments, and the above embodiments and descriptions in the specification are only preferred examples of the present application and do not limit the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. Anti-deformation package frame of semiconductor chip, comprising an integrated circuit board (10) for mounting a semiconductor chip (30), characterized in that: The top surface of the integrated circuit board (10) is provided with a packaging frame (20) for fixing semiconductor chips (30); A plurality of semiconductor chip positioning grooves (24) are formed on the packaging frame (20), the number of the semiconductor chip positioning grooves (24) is same as that of the semiconductor chips (30) on the integrated circuit board (10), the positions of the semiconductor chip positioning grooves (24) correspond to those of the semiconductor chips (30), and the sizes of the semiconductor chip positioning grooves (24) are adapted to those of the semiconductor chips (30); a plurality of groups of ventilation holes (21) are also formed on the packaging frame (20), and a heat dissipation fan (23) is embedded in each ventilation hole (21); An air guide interval (50) is arranged between the packaging frame (20) and the integrated circuit board (10).

2. The anti-deformation package frame of a semiconductor chip according to claim 1, characterized by: The thickness of the packaging frame (20) is greater than that of the semiconductor chips (30).

3. The anti-deformation packaging frame of a semiconductor chip according to claim 1, wherein: A dustproof mesh cover (22) is arranged on the top and bottom of each ventilation hole (21).

4. The anti-deformation package frame of a semiconductor chip according to claim 1, wherein: A fixing ring seat (25) is arranged on the edge of the packaging frame (20) and is sleeved on the top edge of the integrated circuit board (10), and the fixing ring seat (25) and the packaging frame (20) are formed in an integral structure.

5. The anti-deformation package frame of a semiconductor chip according to claim 4, characterized by: The fixing ring seat (25) is connected to the integrated circuit board (10) through a plurality of groups of fixing bolts (40) arranged uniformly and equidistantly.

6. The anti-deformation packaging frame of a semiconductor chip according to claim 1, wherein: A gap of 0.5-1 mm is left between the semiconductor chip (30) and the sidewall of the corresponding semiconductor chip positioning groove (24).

7. The anti-deformation packaging frame of a semiconductor chip according to claim 1, wherein: The height of the air guide interval (50) is 2-5 mm.

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