Circuit board mold capable of accurately aligning

Abstract

The utility model discloses a circuit board die capable of being accurately aligned, which relates to the technical field of dies and comprises a lower die, an upper die and a lower die. The upper die is opposite to the lower die and is arranged above the lower die; the lower die cavity is formed in the lower die, a positioning assembly capable of moving in the horizontal direction is installed in the lower die cavity, a monitoring assembly is installed in the lower die cavity, and a material ejecting mechanism is installed in the lower die cavity. The obliquely-arranged positioning plate can guide the circuit board to move downwards, the circuit board can be limited to a certain degree when the circuit board is gradually positioned into the lower die cavity, deviation and movement of the circuit board are reduced, the in-place state of the circuit board in the lower die cavity can be monitored through the monitoring assembly, and the circuit board can be accurately positioned in the lower die cavity. Therefore, the alignment accuracy and the processing efficiency of the circuit board are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to mould technical field especially relates to a circuit board mould that can accurate alignment. BACKGROUND

[0002] With the rapid development of electronic industry, as the important component of electronic equipment, the precision and stability of circuit board are increasingly improved, and the production and manufacturing of circuit board are generally precise manufacturing process, in addition, the design of circuit board needs to control each aspect to micron level, even more rigorous, which has higher requirement for the template of manufacturing circuit board.

[0003] Referring to the existing patent announcement No. CN209748909U, a kind of chip accurate alignment's circuit board mould, including template box, template box cover, template, optical filter, the template box cover is located on template box, the template box upper side middle is opened with a template slot, the template is fixed in template slot, the optical filter is located on template slot, the utility model is not only optimized the design of circuit board mould, improves the setting of the inaccuracy of traditional circuit board template alignment, improves the accuracy of alignment.

[0004] However, the existing circuit board mould has problems such as inaccurate alignment and low machining precision in actual use, because the circuit board is difficult to be placed in place at one time during processing, it needs to be continuously adjusted to the appropriate position in the mould, which not only affects the processing efficiency of the circuit board, but also directly affects the quality and performance of the circuit board. UTILITY MODEL CONTENT

[0005] The utility model aims at solving the shortcomings in the prior art and provides a kind of circuit board mould that can accurate alignment.The utility model is constructed with monitoring assembly and positioning assembly in lower mould cavity, when circuit board is placed in mould, the positioning plate inclinedly arranged can guide circuit board to move downwards, and positioning plate can limit circuit board to a certain extent when gradually positioning in lower mould cavity, reduce the deviation and activity of circuit board, and the in-place state of circuit board in lower mould cavity can be monitored by monitoring assembly, to improve the alignment accuracy and processing efficiency of circuit board.

[0006] In order to achieve the above purpose, the utility model adopts the following technical scheme:

[0007] A kind of circuit board mould that can accurate alignment, comprising:

[0008] Lower mould, as the bottom support structure of mould, for bearing and positioning the circuit board to be processed;

[0009] Upper mould, it is opposite to lower mould and is arranged above the lower mould;

[0010] The lower die cavity is internally provided with a positioning assembly movable in a horizontal direction, a monitoring assembly and a material pushing mechanism.

[0011] The positioning assembly further comprises a mounting groove, a telescopic rod one, an elastic member one and a positioning plate.

[0012] The mounting groove is arranged around the inside of the lower die cavity, the telescopic rod one and the elastic member one are arranged in the mounting groove, and the positioning plate is arranged at one end of the telescopic rod one.

[0013] The upper part of the positioning plate is provided with an inclined surface downwardly inclined, and the horizontal height of the positioning plate is lower than that of the lower die.

[0014] The monitoring assembly comprises an elastic member two, a telescopic rod two and a contact sensor.

[0015] The elastic member two and the telescopic rod two are arranged below the inside of the lower die cavity, and the contact sensor is arranged at the movable end of the telescopic rod two.

[0016] The horizontal height of the contact sensor is higher than that of the lower die cavity.

[0017] The material pushing mechanism comprises an air pump, a connecting pipe and an air nozzle.

[0018] The air pump is arranged in the inside of the lower die, the connecting pipe is connected to both ends of the air pump, and the air nozzle is arranged at one end of the connecting pipe.

[0019] The lower die is provided with guide holes around the surface, the lower part of the upper die is provided with an upper die cavity matched with the lower die cavity, and the lower part of the upper die is provided with guide columns matched with the guide holes.

[0020] The utility model discloses the monitoring assembly and positioning assembly are arranged in the lower die cavity, when the circuit board is placed in the mould, the positioning plate that inclines sets up can guide the circuit board to move down, and when gradually positioning to the inside of the lower die cavity, the positioning plate can carry out certain limit processing to the circuit board, reduces the deviation and activity of circuit board, and the in-place state of the circuit board in the lower die cavity can be monitored through the monitoring assembly, to improve the alignment accuracy and processing efficiency of the circuit board.

[0021] 1. The circuit board mold with accurate alignment function, through the cooperation of the positioning assembly and the monitoring assembly, when the circuit board is placed in the mold, the inclined positioning plate can guide the circuit board to move downward and can push the positioning plate, and the positioning plate can clamp and limit the circuit board when gradually positioning into the lower mold cavity, so as to reduce the deviation and movement of the circuit board, and the in-place state of the circuit board in the lower mold cavity can be monitored by the monitoring assembly, so as to improve the alignment accuracy and processing efficiency of the circuit board.

[0022] 2. The circuit board mold with accurate alignment function, through the setting of the ejection mechanism, after processing the circuit board, the ejection mechanism is started, the air pump works, the connecting pipe and the air nozzle generate output airflow, so as to generate a certain pushing force on the circuit board, drive the circuit board to move upward, and the generated airflow can blow to the lower side of the circuit board, so as to blow and cool the lower surface of the circuit board, improve the use effect. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 The overall structure schematic diagram of the circuit board mold with accurate alignment function is provided.

[0024] Figure 2 The lower mold structure schematic diagram of the circuit board mold with accurate alignment function is provided.

[0025] Figure 3 The front view structure schematic diagram of the circuit board mold with accurate alignment function is provided.

[0026] Figure 4 The rear view structure schematic diagram of the circuit board mold with accurate alignment function is provided. Figure 3 The enlarged structure schematic diagram of the circuit board mold with accurate alignment function is provided.

[0027] In the figure: 1, lower mold; 2, upper mold; 3, guide column; 4, guide hole; 5, mounting groove; 6, lower mold cavity; 7, positioning plate; 8, upper mold cavity; 9, air pump; 10, air nozzle; 11, connecting pipe; 12, telescopic rod one; 13, elastic piece one; 14, elastic piece two; 15, contact type sensor; 16, telescopic rod two. DETAILED DESCRIPTION

[0028] The technical scheme of the patent will be further described in detail in combination with specific implementation manners.

[0029] The embodiments of the patent will be described in detail below, and examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the patent, and cannot be understood as a limitation of the patent.

[0030] In the description of the present patent, it needs to be understood that the orientations or positional relationships indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present patent and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present patent.

[0031] In the description of the present patent, it needs to be understood that unless otherwise explicitly specified and limited, the terms "mount", "connect", "connect", "set" should be understood broadly, for example, it can be fixedly connected, set, or it can be detachably connected, set, or integrally connected, set. For those skilled in the art, the specific meaning of the above terms in the present patent can be understood according to the specific circumstances.

[0032] Referring to Figures 1-4 A line board mold that can be accurately aligned, comprising: a lower mold 1, as a bottom support structure of the mold, used to carry and position the line board to be processed; an upper mold 2, arranged above the lower mold 1 opposite to the lower mold 1, during the mold closing process, the upper mold 2 tightly cooperates with the lower mold 1 to ensure that the line board is uniformly pressed inside the mold; a lower mold cavity 6, constructed inside the lower mold 1, used for the main area of line board placement and processing, a positioning assembly movable in the horizontal direction is installed inside the lower mold cavity 6, which can adjust the position as needed to accurately align the line board, the accurate movement of the positioning assembly ensures the accurate positioning of the line board in the mold, avoiding deviation during processing, a monitoring assembly is installed inside the lower mold cavity 6 for real-time monitoring of the placement alignment state of the line board, a ejection mechanism is installed inside the lower mold cavity 6 for ejecting the line board from the mold after processing is completed, the design of the ejection mechanism makes the line board easier and faster to take out, improving production efficiency.

[0033] Specifically, referring to Figures 2-3 The positioning assembly comprises: a mounting groove 5, a telescopic rod 12, a elastic piece 13 and a positioning plate 7; the mounting groove 5 is constructed around the inside of the lower mold cavity 6, the telescopic rod 12 and the elastic piece 13 are installed inside the mounting groove 5, and the positioning plate 7 is installed at one end of the telescopic rod 12. Through this embodiment, when the line board workpiece is placed in the lower mold cavity 6, the inclined positioning plate 7 can guide the line board to move downward to align and limit the line board, and the positioning plate 7 can be moved, the telescopic rod 12 and the elastic piece 13 are retracted into the mounting groove 5, and the positioning plate 7 can be restored to the initial position state under the action of the elastic piece 13 when gradually positioning in the lower mold cavity 6 to clamp and limit the line board to a certain extent, reducing the deviation and movement of the line board.

[0034] Further, the upper part of the positioning plate 7 is configured with a downwardly inclined slope, and the horizontal height of the positioning plate 7 is lower than the horizontal height of the lower mold 1. Through this design, it is helpful for the circuit board to be more easily contacted and aligned with the positioning plate 7 when placed in the mold. The slope design can also guide the circuit board into the correct position to a certain extent, and can avoid interference during the closing of the mold to affect processing.

[0035] Specifically, referring to Figures 3-4 , the monitoring assembly includes elastic member two 14, telescopic rod two 16, and contact sensor 15. The elastic member two 14 and the telescopic rod two 16 are both installed inside and below the lower mold cavity 6, and the contact sensor 15 is installed at the movable end of the telescopic rod two 16. Through this embodiment, the in-place state of the circuit board in the lower mold cavity 6 can be monitored by the contact sensor 15 in the monitoring assembly. The contact sensor 15 can be elastically moved by the elastic member two 14 and the telescopic rod two 16 to improve the alignment accuracy and processing efficiency of the circuit board.

[0036] Further, the horizontal height of the contact sensor 15 is higher than the horizontal height of the lower plane of the lower mold cavity 6. Through this design, when the circuit board is placed in the lower mold cavity 6, it will first contact the contact sensor 15 to be monitored by the contact sensor 15 to be in place, and be moved under the action of the elastic assembly to improve flexibility and use effect.

[0037] Specifically, referring to Figure 3 , the material ejecting mechanism includes air pump 9, connecting pipe 11, and air nozzle 10. The air pump 9 is installed inside the lower mold 1, the connecting pipe 11 is connected to both ends of the air pump 9, and the air nozzle 10 is installed at one end of the connecting pipe 11. Through this embodiment, the air pump 9 serves as a power source and can provide stable and rapid air pressure output. Through the connecting pipe 11 and the air nozzle 10, air pressure can be quickly transmitted to the material ejecting part of the mold to achieve rapid material ejecting. The output air flow can cause a certain pushing force on the circuit board to push the circuit board upward, and the air flow can blow toward the lower part of the circuit board to perform a certain blowing and cooling treatment on the lower surface of the circuit board, improving the use effect.

[0038] Specifically, referring to Figures 1-3 , the surface of the lower mold 1 is provided with guide holes 4 around, the lower part of the upper mold 2 is configured with an upper mold cavity 8 matched with the lower mold cavity 6, and the lower part of the upper mold 2 is provided with guide columns 3 corresponding to the guide holes 4. Through this design, the cooperation of the guide columns 3 and the guide holes 4 can ensure that the upper mold 2 and the lower mold 1 can be accurately aligned when the mold is closed, which helps to avoid misalignment or deviation of the mold during the closing process to affect the quality and size accuracy of the product. The upper mold cavity 8 cooperates with the lower mold cavity 6 to form the shape of the workpiece to be processed.

[0039] Working principle: when using the utility model, first of all, the upper and lower molds are connected and installed, then the circuit board workpiece is placed in the lower mold cavity 6, so that the inclined positioning plate 7 can guide the circuit board to move downward to limit the alignment of the circuit board, and the positioning plate 7 can be pushed into the installation groove 5, and when gradually positioned in the lower mold cavity 6, the positioning plate 7 can be restored to the initial position state under the action of the elastic element 13 to clamp the circuit board to a certain extent, reduce the deviation and activity of the circuit board, and the in-place state of the circuit board in the lower mold cavity 6 can be monitored by the contact sensor 15 in the monitoring assembly, the contact sensor 15 can be elastically moved by the elastic element 14 and the telescopic rod 16 to improve the alignment accuracy and processing efficiency of the circuit board, after processing the circuit board, the ejecting mechanism can be started, so that the air pump 9 can generate output airflow through the connecting pipe 11 and the air nozzle 10, thereby causing a certain pushing force on the circuit board to push the circuit board upward, and the generated airflow can blow to the lower side of the circuit board to blow and cool the lower surface of the circuit board, thereby improving the use effect.

[0040] The above is only a preferred embodiment of the utility model, but the protection scope of the utility model is not limited to this, any skilled person in the art can make equivalent replacement or change according to the technical scheme and the utility model concept of the utility model within the technical range disclosed by the utility model, which should be covered in the protection scope of the utility model.

Claims

1. An alignment-accurate circuit board mold characterized by comprising: Include: Lower die (1), as the bottom support structure of the mold, for carrying and positioning the circuit board to be processed; Upper die (2) is arranged above the lower die (1) opposite to the lower die (1); Lower die cavity (6) is configured inside the lower die (1), the inside of the lower die cavity (6) is provided with a positioning assembly movable in the horizontal direction, the inside of the lower die cavity (6) is provided with a monitoring assembly, and the inside of the lower die cavity (6) is provided with a material pushing mechanism.

2. The precisely alignable circuit board mold of claim 1, wherein, The positioning assembly comprises: mounting groove (5), telescopic rod one (12), elastic element one (13) and positioning plate (7); The mounting groove (5) is configured around the inside of the lower die cavity (6), the telescopic rod one (12) and the elastic element one (13) are installed inside the mounting groove (5), and the positioning plate (7) is installed at one end of the telescopic rod one (12).

3. The precisely alignable circuit board mold of claim 2, wherein, The upper part of the positioning plate (7) is configured with a downward inclined slope, and the horizontal height of the positioning plate (7) is lower than that of the lower die (1).

4. The precisely alignable circuit board mold of claim 1, wherein, The monitoring assembly comprises: elastic element two (14), telescopic rod two (16) and contact sensor (15); The elastic element two (14) and the telescopic rod two (16) are installed inside the lower die cavity (6) below, and the contact sensor (15) is installed at the movable end of the telescopic rod two (16).

5. The precisely alignable circuit board mold of claim 4, wherein, The horizontal height of the contact sensor (15) is higher than that of the lower die cavity (6) lower plane.

6. The precisely alignable circuit board mold of claim 1, wherein, The material pushing mechanism comprises: air pump (9), connecting pipe (11) and air nozzle (10); The air pump (9) is installed inside the lower die (1), the connecting pipe (11) is connected at both ends of the air pump (9), and the air nozzle (10) is installed at one end of the connecting pipe (11).

7. The precisely alignable circuit board mold of claim 1 wherein, The surface of the lower die (1) is provided with guide holes (4) around, the lower part of the upper die (2) is provided with an upper die cavity (8) matched with the lower die cavity (6), and the lower part of the upper die (2) is provided with guide columns (3) corresponding to the guide holes (4).

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