Double-sided ink printing device for flexible circuit board
By setting a release layer and a slide rail slider structure on the support frame, the adhesion problem during double-sided ink printing of flexible circuit boards is solved, enabling simultaneous printing on both sides, simplifying the production process and reducing costs and delivery time.
Patent Information
- Application Number
- CN202520012158.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-03
- Publication Date
- 2025-12-26
- Estimated Expiration
- 2035-01-03
AI Technical Summary
When printing ink on both sides of flexible circuit boards, the ink on the first side is prone to sticking to the support frame due to heat, leading to reliability failure. Existing technology requires printing in two separate steps, which is cumbersome and can easily cause poor ink appearance, affecting product delivery time.
A release layer is set on the support frame, and a slide rail and slider are set inside the heating container. The bottom of the support frame is slidably connected, which enables simultaneous printing on both sides of the flexible circuit board, avoids ink sticking, and simplifies the production process.
This technology enables simultaneous printing of ink on both sides of flexible circuit boards, saving production time, reducing costs, and shortening product delivery time.
Smart Images

Figure CN223730026U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of flexible circuit board processing equipment, in particular to a flexible circuit board double-sided ink printing device. BACKGROUND
[0002] At present, due to the soft board characteristics of the flexible circuit board, when printing ink on both sides, it can only be placed horizontally on the support frame after printing for pre-baking. When the second side of the flexible circuit board is printed and pre-baked after the first side of the flexible circuit board is printed, the ink printed on the first side of the flexible circuit board will stick to the support frame due to heating, thereby causing the reliability of the flexible circuit board to fail and be scrapped. Therefore, the industry generally adopts a method of separate production of twice ink printing, that is, pre-treatment-printing first side ink-pre-baking-exposure-development-intermediate curing-pre-treatment-printing second side ink-pre-baking-exposure-development-final curing. However, this processing method is complicated and is prone to cause ink appearance defects and affect product delivery time. CONTENT OF THE UTILITY MODEL
[0003] In order to solve the above technical problems, the present application provides a flexible circuit board double-sided ink printing device with short production process and low cost, which comprises a pretreatment tank, an ink printing tank, a pre-baking mechanism, an exposure tank, a development tank and a curing tank connected in sequence. The pre-baking mechanism comprises a heating container and a support frame, the support frame is placed in the heating container, and a release layer is arranged on the support frame.
[0004] In some embodiments, the outlet end of the pre-baking mechanism is further connected with the inlet end of the ink printing tank.
[0005] In some embodiments, the ink printing tank comprises a first ink printing tank and a second ink printing tank, and the pre-baking mechanism comprises a first pre-baking mechanism and a second pre-baking mechanism. The first ink printing tank, the first pre-baking mechanism, the second ink printing tank and the second pre-baking mechanism are connected in series.
[0006] In some embodiments, the heating container is a temperature-adjustable oven.
[0007] In some embodiments, a sliding rail is arranged in the heating container, and a sliding block matched with the sliding rail is arranged at the bottom of the support frame.
[0008] In some embodiments, the release layer is a glass cloth layer or / and a release film layer fixed on the support frame.
[0009] Compared with the prior art, the flexible circuit board double-sided ink printing device provided by the application can ensure that the first surface ink printed on the flexible circuit board will not stick to the support frame after pre-baking by the pre-baking mechanism, thereby providing protection for the flexible circuit board to realize double-sided simultaneous printing of ink, effectively solving the technical problem that the flexible circuit board double-sided ink product cannot be printed simultaneously in the ink process in the prior art; meanwhile, the slide rail is arranged in the heating mechanism, and the slide block is arranged at the bottom of the support frame, which greatly facilitates the pre-baking operation and improves the production efficiency. Therefore, the flexible circuit board double-sided ink printing device provided by the application saves the production process, reduces the production cost, and shortens the product delivery time. BRIEF DESCRIPTION OF DRAWINGS
[0010] Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the implementation. The accompanying drawings are included only serving the purpose of illustrating some implementations and are not considered limiting to the present application. Moreover, in all the drawings, the same reference numbers are used to denote the same components. In the drawings:
[0011] Figure 1 A structural block diagram of the flexible circuit board double-sided ink printing device in some embodiments of the application is shown,
[0012] Figure 2 A structural schematic diagram of the heating mechanism in some embodiments of the application is shown,
[0013] Figure 3 A structural schematic diagram of the support frame in some embodiments of the application is shown,
[0014] Figure 4 Another structural block diagram of the flexible circuit board double-sided ink printing device in some embodiments of the application is shown.
[0015] The reference numbers in the detailed description are as follows:
[0016] 100. Pretreatment tank
[0017] 200. Ink printing tank
[0018] 300. Pre-baking mechanism
[0019] 301. Heating container
[0020] 302. Support frame
[0021] 304. Slide rail
[0022] 305. Slide block
[0023] 400. Exposure tank
[0024] 500. Developing tank
[0025] 600. curing tank
[0026] 700. release layer. DETAILED DESCRIPTION
[0027] In the description of the present application, it is necessary to understand that, as the description of the orientation or position relationship appears, such as the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, if no special description is given, it is understood that the orientation or position relationship is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.
[0028] In the present application, unless otherwise explicitly specified and limited, the terms such as "mounting", "connecting", "connecting", "fixing" and the like should be understood in a broad sense. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected, it can be directly connected, or it can be indirectly connected through an intermediate medium, it can be the communication inside two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0029] In the description of the present application, as the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" appear, it means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are contained in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine the different embodiments or examples described in the present application and the features of the different embodiments or examples without contradiction.
[0030] Reference Figures 1-3As shown, some embodiments of the flexible circuit board double-sided ink printing apparatus of this application include a pretreatment tank 100, an ink printing tank 200, a pre-baking mechanism 300, an exposure tank 400, a developing tank 500, and a curing tank 600 connected in sequence. The outlet end of the pre-baking mechanism 300 is connected to the inlet end of the ink printing tank 200. The pre-baking mechanism 300 includes a heating container 301 and a support frame 302. The support frame 302 is placed inside the heating container 301, and a release layer 700 is provided on the support frame 302.
[0031] In this embodiment, by providing a release layer 700 on the support frame 302, the ink for printing on the flexible circuit board can be prevented from sticking to the support frame due to pre-baking and heating. This effectively solves the technical problem in the prior art that double-sided ink products for flexible circuit boards cannot be printed simultaneously in the ink process. Therefore, this double-sided ink printing device for flexible circuit boards saves production time, reduces production costs, and shortens product delivery time, showing good application prospects.
[0032] In the above embodiment, the outlet end of the pre-baking mechanism 300 is also connected to the inlet end of the ink printing tank 200. In this structure, after the flexible circuit board undergoes the first ink printing and the first pre-baking, it returns to the ink printing tank 200 for the second ink printing.
[0033] like Figure 4 As shown, the ink printing tank 200 includes a first ink printing tank and a second ink printing tank, and the pre-baking mechanism 300 includes a first pre-baking mechanism and a second pre-baking mechanism. The first ink printing tank, the first pre-baking mechanism, the second ink printing tank, and the second pre-baking mechanism are connected in series.
[0034] In the above embodiment, the two ink printing tanks 200 and the two pre-baking mechanisms 300 are connected in series alternately. After the flexible circuit board has undergone the first ink printing and the first pre-baking, it directly enters the second ink printing tank 200 for the second ink printing without returning to the first ink printing tank 200. Then, the flexible circuit board after the second ink printing is sent into the second pre-baking mechanism for pre-baking. When the ink printing on both sides of the flexible circuit board is completed, it can be sent into the exposure tank 400 for double-sided exposure.
[0035] In some embodiments, the heating container 301 is an adjustable temperature oven.
[0036] In the above embodiment, the heating container 301 for pre-baking the flexible circuit board is a temperature-adjustable oven, based on which the temperature during pre-baking can be adjusted, thereby adapting to the pre-baking of the flexible circuit board under different temperature conditions, and to some extent, expanding the application range of the device. In other embodiments, other devices or apparatuses capable of pre-baking the ink printed on the horizontally placed flexible circuit board on the support frame 302 can also be selected.
[0037] In some embodiments, the heating container 301 is provided with a sliding rail 304, and the bottom of the support frame 302 is provided with a sliding block 305 that is slidingly connected with the sliding rail 304.
[0038] In the above embodiment, the sliding rails 304 are arranged in parallel on the inside bottom of the heating container 301. By arranging the sliding rails 304 in the heating container 301 and the sliding block 305 on the bottom of the support frame 302, and based on the sliding connection between the sliding block 305 and the sliding rail 304, the support frame 302 can be quickly taken out of or placed into the heating container 301, and therefore, this structure can effectively improve the pre-baking work efficiency and provide a guarantee for shortening the product delivery time.
[0039] In some embodiments, the release layer 700 is a fiberglass cloth layer or / and a release film layer fixed on the support frame 302.
[0040] In the above embodiment, the support frame 302 is a multi-layer support frame, each layer of which is provided with a release layer 700, and the release layer 700 is a fiberglass cloth layer, based on which the ink printed on the flexible circuit board can be effectively prevented from sticking to the support frame 302 due to pre-baking and heating. In other embodiments, the release layer 700 can also be a release film layer or a combined layer of release film and fiberglass cloth.
[0041] In order to further illustrate the working principle and technical effects of the present application, the working process of the flexible circuit board double-sided ink printing device provided by the present application is described below.
[0042] The working process is as follows:
[0043] 1) Place the flexible circuit board to be processed in the pretreatment tank 100 for double-sided pretreatment;
[0044] 2) Print ink on the first side of the flexible circuit board, and then place it horizontally on the support frame 302, at this time, the second side of the flexible circuit board directly contacts the release layer 700 on the support frame 302;
[0045] 3) Place the support frame 302 in the heating mechanism 301 for pre-baking, and then take out the support frame 302 from the heating mechanism 301 after pre-baking is completed;
[0046] 4) take the flexible circuit board off the support frame 302 and place it in the ink printing tank 200 for ink printing on the second surface, then place it horizontally on the support frame 302, at this time, the first surface of the flexible circuit board is in direct contact with the release layer 700 on the support frame 302;
[0047] 5) place the support frame 302 in the heating mechanism 301 for pre-baking again, and take the support frame 302 out of the heating mechanism 301 after pre-baking is completed;
[0048] 6) take the flexible circuit board off the support frame 302 and place it in the exposure tank 400 for double-sided exposure;
[0049] 7) place the flexible circuit board in the developing tank 500 for double-sided development;
[0050] 8) place the flexible circuit board in the curing tank 600 for final curing, and thus obtain the final product.
[0051] Since the release layer 700 is provided on the support frame 302, even if the first surface of the flexible circuit board is heated during the pre-baking of the second surface, it will not stick to the release layer 700 on the support frame 302, so the flexible circuit board double-sided ink printing device effectively solves the technical problem that the double-sided ink printed flexible circuit board cannot be printed simultaneously in the ink process in the prior art.
[0052] The above describes in detail the flexible circuit board double-sided ink printing device provided by the present application. In this paper, specific examples are used to explain the principles and implementation modes of the present application, and the above examples are only used to help understand the core idea of the present application. It should be pointed out that for ordinary skilled persons in the technical field, some improvements and modifications can be made to the present application without departing from the principles of the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.
Claims
1. A flexible circuit board double-sided ink printing apparatus, characterized by, The pre-treatment tank (100), the ink printing tank (200), the pre-baking mechanism (300), the exposure tank (400), the developing tank (500) and the curing tank (600) are sequentially connected, the pre-baking mechanism (300) comprises a heating container (301) and a support frame (302), the support frame (302) is arranged in the heating container (301), and a release layer (700) is arranged on the support frame (302).
2. The flexible circuit board double-sided ink printing apparatus of claim 1, wherein, The outlet end of the pre-baking mechanism (300) is also connected with the inlet end of the ink printing tank (200).
3. The flexible circuit board double-sided ink printing apparatus of claim 1, wherein, The ink printing tank (200) comprises a first ink printing tank and a second ink printing tank, the pre-baking mechanism (300) comprises a first pre-baking mechanism and a second pre-baking mechanism, and the first ink printing tank, the first pre-baking mechanism, the second ink printing tank and the second pre-baking mechanism are sequentially connected in series.
4. The flexible circuit board double-sided ink printing apparatus of claim 1, wherein, The heating container (301) is a temperature-adjustable oven.
5. The flexible circuit board double-sided ink printing apparatus of claim 4, wherein, The heating container (301) is provided with a sliding rail (304), and the bottom of the support frame (302) is provided with a sliding block (305) matched with the sliding rail for sliding connection.
6. The flexible circuit board double-sided ink printing apparatus of claim 1, wherein, The release layer is a glass cloth layer or / and a release film layer fixed on the support frame (302).