Special-shaped FPC and manufacturing method thereof

By designing the stacked structure of irregularly shaped FPCs and using precise manufacturing processes, the problem of circuit breakage caused by forced bending in irregularly shaped layouts of flexible circuit boards has been solved, thereby improving structural stability and electrical reliability. This technology is applicable to fields such as consumer electronics, automotive electronics, and medical devices.

CN121793237APending Publication Date: 2026-04-03JIANGXI YIDONG ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202512023363.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-12-30
Publication Date
2026-04-03

AI Technical Summary

Technical Problem

Existing flexible circuit boards require forced bending, twisting, or stretching to achieve irregular layouts, which leads to stress concentration in the circuitry, easily causing micro-cracks in the copper foil, delamination of the cover film, and circuit breakage, affecting electrical reliability and durability.

Method used

Design an irregularly shaped FPC, comprising an irregularly shaped flexible substrate layer, a circuit layer, an insulating cover layer and an irregularly shaped support layer stacked sequentially. Each layer is bonded to the irregularly shaped surface. The circuit is formed by mold forming and photolithography etching processes. The insulating cover layer is prepared by screen printing, and the support layer is reinforced by flexible epoxy resin composite material.

Benefits of technology

It avoids stress concentration, improves structural stability and electrical connection reliability, reduces production costs, meets the requirements of miniaturization and lightweighting, and is suitable for the electrical reliability and durability of compact three-dimensional spaces.

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Abstract

According to the special-shaped FPC and the manufacturing method thereof, the pre-formed special-shaped flexible base material layer is arranged, the shape of the pre-formed special-shaped flexible base material layer is directly matched with the special-shaped surface of a target installation space, and a circuit layer, an insulation covering layer and a special-shaped supporting layer are all attached to the special-shaped surface of the special-shaped flexible base material layer, so that the FPC does not need to be forcibly bent, twisted or stretched subsequently, and the production efficiency is improved. The problems of circuit breakage and delamination caused by stress concentration are fundamentally avoided, the structural stability of the FPC is improved, and the service life of the FPC is prolonged. The flexible circuit board is used for solving the technical problem that in order to achieve special-shaped layout, the plane of an existing flexible circuit board generally needs to be forcibly bent, twisted or stretched.
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