Light aluminum nitride heat-conducting gasket

Abstract

The utility model discloses a light aluminum nitride heat-conducting gasket which comprises a first silica gel layer and a second silica gel layer, a heat dissipation layer is arranged between the first silica gel layer and the second silica gel layer, the upper portion of the first silica gel layer is covered with an aluminum nitride sheet layer, and the upper portion of the second silica gel layer is covered with a heat-conducting layer. The first silica gel layer, the second silica gel layer, the aluminum nitride sheet layer and the heat conduction layer are all provided with through holes. The multi-layer heat dissipation structure is adopted, heat is gradually conducted from bottom to top, contact thermal resistance generated between the surface of a heat source and the contact face of a heat dissipation device can be reduced, gaps of the contact face can be well filled, and therefore the heat dissipation effect is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to heat conduction gasket technical field especially, it relates to a light -duty aluminum nitride heat conduction gasket. BACKGROUND

[0002] Heat conduction gasket is an important material for heat conduction and heat dissipation, and is widely used in electronic equipment, automotive electronics, industrial equipment and other fields. Its main function is to improve the heat dissipation efficiency of electronic components, reduce the working temperature, and protect the stability and reliability of the equipment. This paper will introduce the function, characteristics, material, manufacturing process, application field and future development trend of heat conduction gasket in detail, so as to understand this important heat conduction and heat dissipation material more deeply.

[0003] The existing heat conduction gasket structure is relatively single, only one layer of silica gel body, and the heat conduction efficiency is limited. UTILITY MODEL CONTENT

[0004] According to the above technical problems to be solved, a light -duty aluminum nitride heat conduction gasket is provided.

[0005] In order to achieve the above purpose, the utility model discloses a preferable implementation form, comprising silica gel layer one and silica gel layer two, the heat dissipation layer is arranged between the silica gel layer one and the silica gel layer two, the aluminum nitride sheet layer is covered above the silica gel layer one, the heat conduction layer is covered above the silica gel layer two, and the silica gel layer one, the silica gel layer two, the aluminum nitride sheet layer and the heat conduction layer are all provided with through holes.

[0006] The utility model discloses a preferable implementation form can be further configured, the through hole in the heat conduction layer is filled with aluminum nitride powder.

[0007] The utility model discloses a preferable implementation form can be further configured, the upper plane of the silica gel layer one and the silica gel layer two is provided with recessed cavity, and the depth of recessed cavity is one fourth of the thickness of corresponding silica gel layer one and silica gel layer two.

[0008] The utility model discloses a preferable implementation form can be further configured, the through hole inner wall of the silica gel layer one and the silica gel layer two is provided with equidistantly arranged fins.

[0009] The utility model discloses a preferable implementation form can be further configured, the bottom surface of the silica gel layer two is provided with adhesive layer.

[0010] The utility model discloses a light -duty aluminum nitride heat conduction gasket, adopts multilayer heat dissipation structure, gradually heat conduction from bottom to top, can reduce the contact thermal resistance generated between the heat source surface and the contact surface of heat dissipation device, and the gap of contact surface is filled well, thereby improving the heat dissipation efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0011] The utility model will be further described in detail below in combination with the drawings and specific embodiments.

[0012] Figure 1 It is whole structure schematic diagram of the utility model.

[0013] In the drawing, 1 is aluminum nitride sheet layer, 2 is silica gel layer one, 3 is heat dissipation layer, 4 is heat conduction layer, 5 is silica gel layer two. Specific embodiments

[0014] The technical solutions in the embodiments of the utility model will be described clearly and completely below in combination with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the utility model.

[0015] As Figure 1 Indicated, a kind of light aluminum nitride heat-conducting gasket, including silica gel layer one 2 and silica gel layer two 5, heat dissipation layer is arranged between the silica gel layer one 2 and silica gel layer two 5, and the top of silica gel layer one 2 is covered with aluminum nitride sheet layer 1, the top of silica gel layer two 5 is covered with heat conduction layer 4, the silica gel layer one 2, silica gel layer two 5, aluminum nitride sheet layer 1 and heat conduction layer 4 are all opened with through hole.

[0016] The through hole in heat conduction layer 4 is filled with aluminum nitride powder.

[0017] The upper plane of the silica gel layer one 2 and silica gel layer two 5 is provided with recessed cavity, and the depth of recessed cavity is one fourth of the thickness of corresponding silica gel layer one 2 and silica gel layer two 5.

[0018] The inner wall of the through hole of the silica gel layer one 2 and silica gel layer two 5 is provided with equidistantly arranged fins.

[0019] The bottom surface of the silica gel layer two 5 is provided with adhesive layer.

[0020] It should be noted that, in this paper, relationship terms such as first and second are only used to distinguish one entity from another, and do not necessarily require or imply any such actual relationship or order between the entities.

[0021] The above examples are only illustrative of the utility model, and do not constitute a limitation on the protection scope of the utility model, and any design identical or similar to the utility model belongs to the protection scope of the utility model.

Claims

1. A lightweight aluminum nitride thermally conductive gasket, characterized by, It comprises silica gel layer one (2) and silica gel layer two (5), the heat dissipation layer is arranged between the silica gel layer one (2) and the silica gel layer two (5), the upper of the silica gel layer one (2) is covered with the aluminum nitride sheet layer (1), the upper of the silica gel layer two (5) is covered with the heat conduction layer (4), the silica gel layer one (2), the silica gel layer two (5), the aluminum nitride sheet layer (1) and the heat conduction layer (4) all open the through hole.

2. The lightweight aluminum nitride heat conducting gasket of claim 1 wherein, The through hole on the heat conduction layer (4) is filled with aluminum nitride powder.

3. The lightweight aluminum nitride thermal pad of claim 2, wherein, The upper plane of the silica gel layer one (2) and the silica gel layer two (5) is provided with recessed cavity, the depth of recessed cavity is one fourth of the thickness of corresponding silica gel layer one (2) and silica gel layer two (5).

4. The lightweight aluminum nitride heat conducting gasket of claim 3 wherein, The inner wall of the through hole of the silica gel layer one (2) and the silica gel layer two (5) is provided with equidistantly arranged fins.

5. A light weight aluminum nitride heat conducting gasket according to claim 4, wherein The bottom surface of the silica gel layer two (5) is provided with a bonding layer.

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