Connecting structure and electronic equipment

Abstract

The utility model discloses a connection structure and electronic equipment, and relates to the technical field of contactors, the connection structure comprises an installation structure and a fastener, the installation structure comprises a first installation structure and a second installation structure, the first surface of the second installation structure is attached to the first installation structure, and the second surface of the second installation structure is provided with a groove; the fastening piece is arranged in the groove, and the end face of the fastening piece is flush with the second face of the second installation structure. According to the connecting structure, the flat and stable connecting structure is provided by optimizing the assembly of the mounting structure and the fasteners, and the problem of insufficient heat dissipation caused by protruding of the fasteners in a traditional structure is effectively solved.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of contactors, in particular to a connecting structure and an electronic device. BACKGROUND

[0002] The high-voltage distribution unit of an electric vehicle is an important component of the vehicle electrical system, responsible for distributing the high-voltage electrical energy of the battery pack to various high-voltage components of the vehicle. As a key component in the high-voltage distribution unit, the contactor assumes the functions of circuit connection and disconnection.

[0003] Traditional contactors have the problem of poor heat dissipation. In the high-voltage distribution unit, when the contactor works under high current load, the temperature of the contactor body rises due to insufficient heat dissipation, which not only reduces the working efficiency of the contactor, but also may cause contactor sticking and other faults, affecting the stability and safety of the entire high-voltage distribution system. CONTENT OF THE INVENTION

[0004] The purpose of the application is to provide a connecting structure that optimizes the installation structure and the assembly of fasteners, providing a flat and stable connecting structure that effectively solves the problem of insufficient heat dissipation caused by the protrusion of fasteners in traditional structures. Another purpose of the application is to provide an electronic device.

[0005] To achieve the above-mentioned purposes, the application provides a connecting structure, comprising:

[0006] An installation structure, comprising a first installation structure and a second installation structure, the first face of the second installation structure is attached to the first installation structure, and the second face of the second installation structure is provided with a groove;

[0007] A fastener is provided in the groove, and the end face of the fastener is flush with the second face of the second installation structure.

[0008] In some embodiments, it further comprises:

[0009] A heat dissipation assembly is attached to the second face of the second installation structure and the end face of the fastener.

[0010] In some embodiments, the second installation structure comprises:

[0011] A heat dissipation row, the first face of which is attached to the first installation structure, and the second face of the heat dissipation row is provided with a groove.

[0012] In some embodiments, the first installation structure comprises:

[0013] A contactor is attached to the first face of the second installation structure.

[0014] In some embodiments, the heat dissipation assembly comprises:

[0015] The heat dissipation plate is provided with a heat conduction surface;

[0016] The insulating heat conduction pad is provided with a first surface which is attached to the heat conduction surface, and a second surface which is attached to the second surface of the heat dissipation fin and the end surface of the fastener.

[0017] In some embodiments, the heat dissipation plate is provided with a water cooling cavity, and the water cooling cavity is filled with a water cooling medium.

[0018] In some embodiments, the heat dissipation plate is provided with a heat dissipation fin, a first end of the heat dissipation fin is connected to the heat conduction surface, a second end of the heat dissipation fin extends into the water cooling cavity, and a heat dissipation surface is formed between the first end and the second end of the heat dissipation fin and is in contact with the water cooling medium.

[0019] In some embodiments, the number of heat dissipation fins is multiple, and the multiple heat dissipation fins are arranged in a direction perpendicular to the extension direction of the heat dissipation fins.

[0020] In some embodiments, the application further comprises:

[0021] The fixing seat is provided with the mounting structure;

[0022] The case is provided with the fixing seat and the heat dissipation assembly.

[0023] The application also provides an electronic device comprising the above-mentioned connecting structure.

[0024] With respect to the above background technology, the connecting structure provided by the application mainly comprises a mounting structure and a fastener, the mounting structure comprises a first mounting structure and a second mounting structure, the first surface of the second mounting structure is attached to the first mounting structure, and the second surface of the second mounting structure is provided with a groove; the fastener is arranged in the groove, and the end surface of the fastener is flush with the second surface of the second mounting structure.

[0025] In the conventional connecting structure, the protrusion of the fastener from the surface of the mounting structure often leads to poor contact and poor structural stability, especially in application occasions requiring high contact area and high stability. In view of this technical problem, the connecting structure provided by the application realizes significant technical improvement by optimizing the assembly mode of the mounting structure and the fastener.

[0026] The connecting structure comprises a first mounting structure and a second mounting structure, wherein the first surface of the second mounting structure is attached to the first mounting structure to form a close contact surface. The second surface of the second mounting structure is provided with a groove, and the fastener is arranged in the groove. The key improvement point is that the end surface of the fastener is flush with the second surface of the second mounting structure, which means that the fastener does not protrude from the surface of the second mounting structure.

[0027] This design maximizes the contact area of ​​the connection structure while ensuring uniform contact, thereby improving connection reliability and increasing heat dissipation area. Furthermore, the flush design of the fastener end faces eliminates stress concentration points caused by protruding parts, enhancing the overall stability of the structure. This improvement not only increases the mechanical strength of the connection structure but also potentially reduces the risk of failure due to poor contact, extending the service life of the connection structure.

[0028] Based on the above structural and process descriptions, it can be seen that the connection structure has at least the following beneficial effects: by optimizing the installation structure and fastener assembly, the connection structure provides a flat and stable connection structure, effectively solving the problem of insufficient heat dissipation caused by protruding fasteners in traditional structures. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0030] Figure 1 A schematic diagram of the connection structure provided in the embodiments of this application;

[0031] Figure 2 A split diagram of the connection structure provided in the embodiments of this application;

[0032] Figure 3 A schematic diagram of a contactor module provided in an embodiment of this application;

[0033] Figure 4 for Figure 3 AA diagram;

[0034] Figure 5 A schematic diagram of the contactor module and chassis provided in an embodiment of this application;

[0035] Figure 6 for Figure 5 A schematic diagram of a BB (Baby Window) diagram;

[0036] Figure 7 for Figure 5 A schematic diagram of CC.

[0037] in:

[0038] Mounting structure 1, first mounting structure 11, contactor 1101, second mounting structure 12, heat sink 1201, groove 121.

[0039] fastener 2,

[0040] heat dissipation assembly 3, heat dissipation plate 31, heat conductive surface 311, water cooling cavity 312, heat dissipation fin 313, insulating heat conductive pad 32,

[0041] fixing seat 4,

[0042] chassis 5. DETAILED DESCRIPTION

[0043] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work belong to the scope of protection of the present application.

[0044] In order for those skilled in the art to better understand the technical solutions of the present application, the present application will be further described in detail below with reference to the drawings and specific embodiments.

[0045] Please refer to Figure 1 , Figure 1 The schematic diagram of the connection structure provided by the embodiments of the present application is shown in the figure.

[0046] In the first specific embodiment, the connection structure provided by the embodiments of the present application mainly includes a mounting structure 1 and a fastener 2. The mounting structure 1 includes a first mounting structure 11 and a second mounting structure 12. The first surface of the second mounting structure 12 is attached to the first mounting structure 11, and the second surface of the second mounting structure 12 is provided with a groove 121. The fastener 2 is arranged in the groove 121, and the end surface of the fastener 2 is flush with the second surface of the second mounting structure 12.

[0047] In the traditional connection structure, the protrusion of the fastener from the surface of the mounting structure often leads to poor contact and poor structural stability, especially in applications requiring high contact area and high stability. In view of this technical problem, the connection structure provided by the present application optimizes the assembly mode of the mounting structure 1 and the fastener 2, and achieves significant technical improvement.

[0048] The connection structure includes a first mounting structure 11 and a second mounting structure 12, wherein the first surface of the second mounting structure 12 is attached to the first mounting structure 11 to form a close contact surface. The second surface of the second mounting structure 12 is provided with a groove 121, and the fastener 2 is arranged in the groove 121. The key improvement point is that the end surface of the fastener 2 is flush with the second surface of the second mounting structure 12, which means that the fastener 2 will not protrude from the surface of the second mounting structure 12.

[0049] By this design, the contact area of the connection structure is maximized while ensuring uniformity of contact, thereby improving the reliability of the connection and increasing the heat dissipation area. In addition, the flush design of the end surface of the fastener 2 eliminates stress concentration points caused by protruding parts, enhancing the overall stability of the structure. This improvement not only improves the mechanical strength of the connection structure, but also may reduce the risk of failure due to poor contact, extending the service life of the connection structure.

[0050] In combination with the above structure and process description, it can be seen that the connection structure has at least the following beneficial effects: by optimizing the assembly of the mounting structure 1 and the fastener 2, the connection structure provides a flat and stable connection structure, effectively solving the problems of poor contact and poor stability caused by the protrusion of the fastener in traditional structures.

[0051] In some embodiments, the connection structure further comprises:

[0052] The heat dissipation assembly 3 is attached to the second surface of the second mounting structure 12 and the end surface of the fastener 2.

[0053] In this embodiment, an important component of the connection structure is the heat dissipation assembly 3, which is designed to be attached to the second surface of the second mounting structure 12 and the end surface of the fastener 2. This design allows the heat dissipation assembly 3 to directly contact the second mounting structure 12 and the fastener 2, thereby effectively conducting and dissipating the heat generated by the first mounting structure 11.

[0054] The introduction of the heat dissipation assembly 3 significantly enhances the thermal management capability of the connection structure. By closely attaching to the second surface of the second mounting structure 12 and the end surface of the fastener 2, the heat dissipation assembly 3 can quickly conduct heat away from the heat source, reducing heat accumulation and thereby reducing the operating temperature of the first mounting structure 11, improving its operating efficiency and reliability.

[0055] Please refer to Figure 2 , Figure 2 The exploded view of the connection structure provided in the embodiments of the present application.

[0056] In some embodiments, the second mounting structure 12 comprises:

[0057] The heat dissipation row 1201 is attached to the first mounting structure 11, and the second surface of the heat dissipation row 1201 is provided with a groove 121.

[0058] In this embodiment, the second mounting structure 12 is composed of a heat sink 1201, which plays a key role in heat dissipation in the connection structure. The first face of the heat sink 1201 is in contact with the first mounting structure 11, which design allows the heat sink 1201 to directly absorb heat from the first mounting structure 11, improving the efficiency of heat dissipation. The second face of the heat sink 1201 is provided with a groove 121, which provides a mounting position for the fastener 2, so that the fastener 2 can be installed therein, and its end face is flush with the second face of the heat sink 1201.

[0059] The fastener 2 is installed in the groove 121, ensuring that its end face is flush with the second face of the heat sink 1201, which design helps to maintain the flatness of the structure and provides a flat contact surface for the heat dissipation assembly 3. The heat dissipation assembly 3 can be closely attached to the second face of the heat sink 1201 and the end face of the fastener 2, thereby effectively conducting and dissipating heat.

[0060] In some embodiments, the first mounting structure 11 includes:

[0061] The contactor 1101 is in contact with the first face of the second mounting structure 12.

[0062] In this embodiment, the first mounting structure 11 refers to the contactor 1101, which is in close contact with the first face of the second mounting structure 12. This design allows the heat generated by the contactor 1101 during operation to be directly transferred to the heat sink 1201, i.e., the second mounting structure 12. The contactor 1101 as a heat source, its direct contact with the heat sink 1201 maximizes the heat conduction efficiency, thereby helping to quickly conduct heat from the contactor 1101.

[0063] Through the close contact between the first mounting structure 11 and the second mounting structure 12, the connection structure can effectively manage the heat generated by the contactor 1101 under high current load, reduce heat accumulation, reduce the risk of overheating, and improve the working efficiency and reliability of the contactor 1101. In addition, this design also helps to improve the mechanical stability of the entire connection structure, as the heat sink 1201 not only plays a role in heat dissipation, but also provides additional support for the contactor 1101, reducing structural deformation due to thermal expansion or other mechanical stresses.

[0064] In some cases, as shown in Figure 1 , the first face of the heat sink 1201 is in contact with the contactor 1101, and the first face of the heat sink 1201 corresponds to the upper surface of the heat sink 1201 in Figure 1 . The second face of the heat sink 1201 is provided with a groove 121, and the second face of the heat sink 1201 corresponds to the lower surface of the heat sink 1201 in Figure 1 .

[0065] In some embodiments, the heat dissipation assembly 3 comprises:

[0066] A heat dissipation plate 31 is provided with a heat conduction surface 311.

[0067] An insulating heat conduction pad 32 is arranged on the heat dissipation plate 31, the first surface of the insulating heat conduction pad 32 is in contact with the heat conduction surface 311, and the second surface of the insulating heat conduction pad 32 is in contact with the second surface of the heat dissipation fin 1201 and the end surface of the fastener 2.

[0068] In this embodiment, the heat dissipation assembly 3 is designed to achieve efficient heat conduction and dissipation. The heat dissipation plate 31 is a part of the heat dissipation assembly 3, which is specially designed with a heat conduction surface 311, which is used to contact the insulating heat conduction pad 32, so as to conduct heat from the contactor 1101 to the heat dissipation plate 31.

[0069] The insulating heat conduction pad 32 is a key component placed on the heat dissipation plate 31, and its first surface is in close contact with the heat conduction surface 311 of the heat dissipation plate 31, which helps to effectively transfer the heat generated by the contactor 1101 to the heat dissipation plate 31. The second surface of the insulating heat conduction pad 32 is in contact with the second surface of the heat dissipation fin 1201 and the end surface of the fastener 2, which allows heat to be transferred from the contactor 1101 to the heat dissipation fin 1201 through the insulating heat conduction pad 32, thereby achieving heat dissipation.

[0070] Through this structural design, the heat dissipation assembly 3 not only improves the efficiency of heat transfer, but also enhances the safety of the entire system due to the use of the insulating heat conduction pad 32. This design allows the heat generated by the contactor 1101 when working under high current load to be effectively managed and dissipated, thereby improving the stability and reliability of the entire electronic device.

[0071] It should be noted that the heat dissipation form of the heat dissipation assembly 3 is not limited in this embodiment, for example, it can be water cooling or air cooling. The heat dissipation plate 31 can be provided with corresponding heat dissipation structure according to the adopted heat dissipation mode, whether it is water cooling or air cooling, it should belong to the scope of the description of this embodiment. This means that the design of the heat dissipation plate 31 can be flexibly adapted to different heat dissipation requirements to achieve the best heat dissipation effect, whether it is through a water cooling system or an air cooling system to achieve heat dissipation.

[0072] Please refer to Figure 3 and Figure 4 , wherein, Figure 3 is a schematic diagram of a contactor module provided by the embodiment of the present application, Figure 4 is Figure 3 A-A schematic diagram.

[0073] In some embodiments, the connecting structure further comprises:

[0074] The fixing seat 4 is provided with the mounting structure 1.

[0075] In particular, the contactor 1101 and the heat sink row 1201 are fixed to the fixed seat 4.

[0076] In this embodiment, the design of the connection structure takes into account the fixing method of the contactor 1101, in which the fixed seat 4 is used to fix the contactor 1101 and the heat sink row 1201. This design allows the contactor 1101 and the heat sink row 1201 to be combined into a whole structure through the fixed seat 4, ensuring the heat dissipation efficiency and structural stability, and improving the assembly convenience.

[0077] It should be noted that the number of contactors 1101 in this embodiment is not fixed and can be adjusted according to actual application requirements. For example, as shown in Figure 3 and Figure 4 , the contactor 1101 can be arranged in the form of two rows, each row having three, for a total of six. Such a layout is fixed by a single fixed seat 4, not only providing structural support, but also helping to manage and optimize the heat dissipation effect. This flexible design allows the connection structure to adapt to different numbers of contactors 1101, meeting the needs of electronic devices of different scales.

[0078] In some cases, the fixed seat 4 is made of plastic, such as using a plastic pressing plate as the fixed base for the contactor 1101 and the heat sink row 1201.

[0079] This design provides a cost-effective and easy-to-process solution while ensuring sufficient structural stability and insulation performance. The plastic pressing plate as the fixed seat 4 can effectively fix the contactor 1101 and the heat sink row 1201 in the predetermined position, ensuring the stability and reliability of the heat dissipation structure. The insulation properties of the plastic material also help to prevent electrical short circuits or electric shock, improving the safety of the entire electronic device. In addition, the plastic pressing plate can be customized as needed to adapt to contactors 1101 and heat sink rows 1201 of different shapes and sizes, providing design flexibility.

[0080] Using a plastic pressing plate as a fixed seat 4 can also reduce the weight of the entire heat dissipation structure, which is an important consideration for electric vehicles, as weight reduction can improve energy efficiency and performance. At the same time, the chemical corrosion resistance and aging resistance of the plastic material make the plastic pressing plate a durable choice that can maintain its performance under various environmental conditions.

[0081] Please refer to Figures 5 to 7 , in which, Figure 5 is a schematic diagram of the contactor module and the case 5 provided by the embodiment of the present application, Figure 6 is a B-B view of Figure 5 , and Figure 7 is a B-B view of Figure 5C-C schematic diagram.

[0082] In some embodiments, the connecting structure further comprises:

[0083] The chassis 5 is provided with the fixing seat 4 and the heat dissipation assembly 3.

[0084] In this embodiment, the connecting structure further comprises a chassis 5 for integrating and protecting the heat dissipation assembly 3 and the fixing seat 4. The heat dissipation assembly 3 and the fixing seat 4 are fixed in the chassis 5, which not only improves the stability of the overall structure, but also facilitates the installation and maintenance of the entire connecting structure.

[0085] The contactor 1101 and the heat dissipation row 1201 are fixed through the fixing seat 4 to form a complete contactor module. This contactor module is then installed with the chassis 5, making the connecting structure more compact and integrated. This modular design allows for quick assembly and disassembly, facilitating individual maintenance or replacement of the contactor 1101 or the heat dissipation row 1201 when needed, while also enhancing the protection performance of the entire system. Through the fixation of the chassis 5, the entire connecting structure can be more stably installed in the electronic equipment of the electric vehicle, ensuring reliability and durability in various working environments.

[0086] In some embodiments, the heat dissipation row 1201 is interference-fitted with the insulating heat-conducting pad 42, and the insulating heat-conducting pad 42 is compressed towards the direction of the heat dissipation plate 41.

[0087] In this embodiment, the heat dissipation row 1201 and the insulating heat-conducting pad 42 are interference-fitted, which means that the insulating heat-conducting pad 42 will be slightly compressed during installation to ensure good contact between it and the heat dissipation row 1201 and the heat dissipation plate 41. Specifically, the insulating heat-conducting pad 42 will be compressed towards the direction of the heat dissipation plate 41 during assembly, which helps to improve heat conduction efficiency.

[0088] Through this interference-fitting method, the insulating heat-conducting pad 42 can tightly fit between the heat dissipation row 1201 and the heat dissipation plate 41, reducing air gaps and thus improving the transfer efficiency of thermal energy from the contactor 1101 to the heat dissipation plate 41 through the heat dissipation row 1201 and the insulating heat-conducting pad 42. This close contact also helps to reduce thermal resistance, ensuring that heat can be quickly and evenly dispersed onto the heat dissipation plate 41, thereby improving the heat dissipation performance of the entire heat dissipation structure. In addition, this assembly method can also provide certain mechanical stability, ensuring that the heat dissipation assembly 3 will not be displaced or damaged due to vibration or impact during the operation of the electronic equipment.

[0089] In some embodiments, the heat dissipation plate 41 is provided with a water-cooling cavity 412 containing a water-cooling medium.

[0090] In this embodiment, the heat sink 41 is specially designed with a water cooling cavity 412, which is a structure specifically for water cooling heat dissipation. The water cooling cavity 412 is filled with water cooling medium, usually a liquid with high thermal conductivity, such as water or other special cooling liquid.

[0091] The feature of this solution is to use water cooling heat dissipation, through the water cooling medium in the water cooling cavity 412 to absorb and conduct heat, so as to realize efficient heat transfer. Compared with traditional air cooling heat dissipation, this water cooling heat dissipation mechanism can provide larger heat exchange area and faster heat conduction speed, making the heat dissipation more rapid and efficient.

[0092] By integrating the water cooling cavity 412 in the heat sink 41, this solution can quickly transfer the heat generated by the contactor 1101 under high current load to the water cooling medium, and then through the circulation of the water cooling system to take away the heat, finally realizing the emission of heat. This heat dissipation method is particularly suitable for application scenarios with high heat dissipation performance requirements, which can ensure that the contactor 1101 still maintains stable temperature under long-time high load work, thereby improving the reliability and life of the entire electronic equipment.

[0093] It should be noted that water cooling heat dissipation can realize the reduction of the specification of the contactor 1101 compared with air cooling heat dissipation, and by reducing the specification requirements of the contactor 1101, the cost reduction requirement is achieved.

[0094] In this embodiment, the contactor 1101 is water cooled, and when a 200A contactor 1101 passes through a 300A current, the temperature rise of the non-water cooled contactor 1101 is 70 degrees different from that of the water cooled contactor 1101, the heat conduction effect is very good, and the 200A contactor 1101 can achieve the performance requirements of the 300A non-water cooled contactor 1101, the contactor 1101 can be used in a reduced specification, and the system cost is reduced.

[0095] In some embodiments, the heat sink 41 is provided with a heat dissipation fin 413, the first end of the heat dissipation fin 413 is connected with the heat conduction surface 411, the second end of the heat dissipation fin 413 extends into the water cooling cavity 412, and the heat dissipation surface in contact with the water cooling medium is formed between the first end and the second end of the heat dissipation fin 413.

[0096] In this embodiment, the heat sink 41 is further designed to include the heat dissipation fin 413, which is a component for enhancing heat dissipation efficiency. The heat dissipation fin 413 is designed such that its first end is connected with the heat conduction surface 411, and its second end extends into the water cooling cavity 412. Such a layout allows the heat dissipation fin 413 to form a heat dissipation surface in contact with the water cooling medium between the two ends, thereby improving the heat dissipation efficiency.

[0097] The role of the heat dissipation fins 413 is to enhance heat dissipation by increasing the heat dissipation area. Since the second end of the heat dissipation fins 413 extends into the water cooling cavity 412, it can directly contact the water cooling medium, allowing heat to be quickly transferred from the heat conduction surface 411 to the heat dissipation fins 413, and then to the water cooling medium through the heat dissipation fins 413. This design improves the efficiency of heat transfer, and because of the high heat capacity and thermal conductivity of the water cooling medium, a large amount of heat can be quickly removed, thereby reducing the operating temperature of the contactor 1101.

[0098] Through this design, the heat sink 41 not only can dissipate the heat generated by the contactor 1101 more effectively, but also can maintain a stable temperature, which is crucial for ensuring the long-term stable operation of electronic equipment. The arrangement of the heat dissipation fins 413 makes the entire heat dissipation system more efficient, which helps to improve the reliability and performance of the entire electric vehicle electrical system.

[0099] In some embodiments, the number of heat dissipation fins 413 is multiple, and the multiple heat dissipation fins 413 are arranged in a direction perpendicular to the extension direction of the heat dissipation fins 413.

[0100] In this embodiment, the heat sink 41 is designed with multiple heat dissipation fins 413, which are not single but arranged in groups to increase the heat dissipation area and improve the heat exchange efficiency. These heat dissipation fins 413 are arranged in a direction perpendicular to their extension direction, i.e. they maintain a certain distance in the horizontal direction from each other.

[0101] This design of spaced arrangement allows the water cooling medium to flow more effectively between the heat dissipation fins 413 when removing heat. Each heat dissipation fin 413 acts as a heat exchange unit, and by increasing the number of heat dissipation fins, the heat exchange capacity of the entire heat sink 41 is improved, thereby more effectively dissipating the heat transferred from the contactor 1101.

[0102] In addition, the spaced arrangement of the heat dissipation fins 413 helps to prevent vortex flow and excessive pressure drop when the water cooling medium flows, which can ensure uniform distribution of the water cooling medium in the entire heat dissipation system, further improving the heat dissipation efficiency. Through this design, the heat dissipation system can respond more quickly to the heat generated by the contactor 1101 under high current load, ensuring that the electronic equipment can maintain an appropriate temperature under various working conditions, improving the stability and life of the system.

[0103] Further, the spacing distance of the heat dissipation fins 413 is set according to the thermal map of the contactor 1101.

[0104] In this embodiment, the spacing distance of the heat dissipation fins 413 is not randomly set, but is optimized according to the thermal map of the contactor 1101. The thermal map is a kind of image that shows the temperature distribution of each part of the contactor 1101 when it is working, which can identify the areas where heat is concentrated and the paths of heat transfer.

[0105] By analyzing the thermal map of the contactor 1101, the hot spot areas where heat is generated and the direction of heat transfer can be determined. Then, according to this information, the spacing distance of the heat dissipation fins 413 can be reasonably set to ensure that the heat dissipation fins 413 can effectively cover these hot spot areas and dissipate heat along the heat transfer path. Such design can make the heat dissipation fins 413 more accurately correspond to the heat distribution of the contactor 1101, thereby achieving more efficient heat dissipation.

[0106] For example, if the thermal map shows that the temperature of some areas of the contactor 1101 is higher, more dense heat dissipation fins 413 can be set in these areas to provide more heat dissipation area. Conversely, if the temperature of some areas is lower, the spacing between the heat dissipation fins 413 can be increased accordingly to reduce unnecessary material use and optimize overall heat dissipation efficiency.

[0107] In some embodiments, the material of the heat dissipation row 1201 is copper.

[0108] In this embodiment, the heat dissipation row 1201 chooses copper as its material, specifically, the heat dissipation row 1201 is a copper row. Copper is chosen because of its excellent thermal conductivity, which enables the copper row to quickly conduct the heat generated by the contactor 1101 away, improving the efficiency of the entire heat dissipation structure.

[0109] The use of copper row is common in heat dissipation solutions because copper has a high thermal conductivity coefficient, which can quickly conduct heat from the heat source to the heat dissipation medium or air. In addition, copper also has good mechanical properties and corrosion resistance, which makes the copper row not only effective in heat dissipation, but also durable and reliable in electronic equipment.

[0110] By using copper row as the heat dissipation row 1201, the heat dissipation structure of this embodiment can more effectively manage the heat generated by the contactor 1101 under high current load, reduce thermal stress, prolong the service life of the contactor, and ensure the stable operation of the electronic equipment. The high thermal conductivity of copper row makes it an ideal choice for efficient heat energy management.

[0111] In a specific implementation, the connection structure adopts a high-efficiency heat dissipation scheme combining insulation, heat conduction, copper row and water cooling.

[0112] Firstly, the heat generated by the contactor 1101 when working in the electronic device is conducted through the heat sink 1201 which is in direct contact with it. The heat sink 1201 is made of copper material, i.e. copper bar, which can quickly disperse the heat generated by the contactor 1101 due to its excellent heat conduction performance, reducing the temperature of the hot spot area.

[0113] The heat of the contactor 1101 is conducted to the insulating heat-conducting pad 42 through the heat sink 1201, which not only provides electrical isolation to prevent short circuits, but also its heat conduction performance helps to quickly transfer heat from the contactor 1101 to the water-cooled heat sink plate 41. The first surface of the insulating heat-conducting pad 42 is in contact with the heat sink 1201, and the second surface is in contact with the heat-conducting surface 411 of the heat sink plate 41. Such a design ensures that heat can be effectively transferred from the contactor 1101 to the heat sink plate 41.

[0114] The heat sink plate 41 is designed with a water-cooled cavity 412, which is filled with water-cooled medium. The heat sink fins 413 on the heat sink plate 41 transfer heat to the water-cooled medium, which is circulated by the water-cooling system to carry away heat from the heat sink plate 41, achieving efficient heat exchange. The first end of the heat sink fin 413 is connected to the heat-conducting surface 411, and the second end extends into the water-cooled cavity 412 to form a heat dissipation surface in contact with the water-cooled medium. Such a structure design increases the contact area with the water-cooled medium and improves the heat dissipation efficiency.

[0115] Finally, this comprehensive heat dissipation scheme enables the heat generated by the contactor 1101 when working in the electronic device to be quickly and effectively conducted and dissipated, achieving the effect of cooling the contactor 1101, thereby improving the service life and current-carrying capacity of the contactor 1101. Through the synergistic effect of insulation heat conduction, copper bar and water cooling, the connection structure can adapt to different working environments and requirements, ensuring the stable operation and long-term performance of the electronic device.

[0116] The application also provides an electronic device comprising the above connection structure.

[0117] The electronic device should have all the beneficial technical effects of the above connection structure, and the electronic device can be applied in the field of electric vehicles.

[0118] It should be noted that many components mentioned in the present application are general standard components or components known to those skilled in the art, and their structure and principle can be known by technical personnel through technical manuals or through conventional experimental methods.

[0119] It should be noted that in the present specification, relational terms such as first and second are only used to distinguish one entity from another, and do not necessarily require or imply any such actual relationship or order between the entities.

[0120] The connection structure and the electronic device provided by the application are described in detail above. The principles and implementation manners of the application are described by applying specific examples in the text, and the above description of the examples is only used to help understand the method of the application and its core idea. It should be pointed out that, for ordinary skilled persons in the technical field, some improvements and modifications can be made to the application without departing from the principles of the application, and these improvements and modifications also fall within the protection scope of the claims of the application.

Claims

1. A connection structure characterized by comprising: The application relates to a connecting structure. The connecting structure comprises: a mounting structure, which comprises a first mounting structure and a second mounting structure, the first surface of the second mounting structure is attached to the first mounting structure, and the second surface of the second mounting structure is provided with a groove; 2. The connection structure according to claim 1, characterized in that a fastener arranged in the groove, and the end surface of the fastener is flush with the second surface of the second mounting structure. The connecting structure further comprises:

3. The connection structure according to claim 1, characterized by a heat dissipation assembly, which is attached to the second surface of the second mounting structure and the end surface of the fastener. The second mounting structure comprises:

4. The connection structure according to claim 1, characterized by a heat dissipation row, the first surface of which is attached to the first mounting structure, and the second surface of the heat dissipation row is provided with a groove. The first mounting structure comprises:

5. The connection structure according to claim 3, wherein a contactor, which is attached to the first surface of the second mounting structure. The heat dissipation assembly comprises: a heat dissipation plate, which is provided with a heat conduction surface; 6. The connection structure according to claim 5, wherein an insulating heat conduction pad, the first surface of which is attached to the heat conduction surface, and the second surface of the insulating heat conduction pad is attached to the second surface of the heat dissipation row and the end surface of the fastener.

7. The connection structure according to claim 6, characterized in that The heat dissipation plate is provided with a water cooling cavity, and the water cooling cavity contains a water cooling medium.

8. The connection structure according to claim 7, characterized by The heat dissipation plate is provided with heat dissipation fins, the first end of the heat dissipation fins is connected to the heat conduction surface, the second end of the heat dissipation fins extends into the water cooling cavity, and the first end and the second end of the heat dissipation fins form a heat dissipation surface which is in contact with the water cooling medium.

9. The connection structure according to claim 2, wherein The number of the heat dissipation fins is multiple, and the multiple heat dissipation fins are arranged in a direction perpendicular to the extension direction of the heat dissipation fins. The connecting structure further comprises: a fixing seat, which is provided with the mounting structure; 10. An electronic device, comprising: a cabinet, which is provided with the fixing seat and the heat dissipation assembly. The connecting structure comprises any one of claims 1 to 9.

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