Soaking device and electronic equipment

By filling the circulating channel of the heat dissipation device with heat-conducting fluid and magnetic particles, and using a coil assembly to drive the movement of the magnetic particles, the problem of poor heat transfer performance caused by the thicker thickness in the prior art is solved, achieving a highly efficient heat dissipation effect, which is suitable for thin and light electronic devices.

CN223730150UActive Publication Date: 2025-12-26HUAWEI TECH CO LTD
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Patent Information

Application Number
CN202423108687.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-16
Publication Date
2025-12-26
Estimated Expiration
2034-12-16

AI Technical Summary

Technical Problem

Existing heat exchange devices are too thick in compact environments, which leads to poor heat transfer performance and prevents good gas-liquid circulation, thus affecting the heat dissipation effect.

Method used

The circulating channel inside the temperature equalizer is filled with heat-conducting fluid and magnetic particles. The magnetic field generated by the coil assembly drives the magnetic particles to move in the driving section, which in turn drives the heat-conducting fluid to circulate, thereby achieving uniform heat conduction and heat dissipation.

Benefits of technology

It achieves efficient heat dissipation with a relatively small thickness, making it suitable for thin and light electronic devices. It is also quiet and provides a good user experience.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a soaking device and electronic equipment. And a circulating flow channel of the temperature equalizing piece is filled with heat-conducting fluid and magnetic particles. The coil assembly is arranged on the temperature equalizing part and is opposite to the driving section of the circulating flow channel, the coil assembly generates a magnetic field at the position of the driving section, so that the magnetic particles in the driving section move in the extending direction of the driving section, the magnetic particles can drive the heat conduction fluid to flow, and the heat conduction fluid circularly flows in the circulating flow channel. The outside heat is conducted to the temperature equalizing part, the heat conduction fluid near the outside heat can absorb the heat conducted to the temperature equalizing part from the outside, the heat conduction fluid after heat absorption flows along the circulating flow channel so as to conduct the heat to different positions of the temperature equalizing part, and the heat is released outwards from the different positions of the temperature equalizing part. And the heat-conducting fluid after heat release is transmitted to the vicinity of external heat to absorb the heat again. And the heat-conducting fluid circularly flows in the circulating flow channel, so that a relatively good soaking and radiating effect is realized. The thickness of the soaking device can be set to be small, and the soaking device is particularly suitable for soaking and heat dissipation of light and thin electronic equipment.
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Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of heat dissipation structures, and in particular to a heat equalizing device and electronic equipment. BACKGROUND

[0002] The heat dissipation methods of related technologies mainly include graphite sheets, heat pipes, and vapor chamber (VC) heat plates. The graphite sheet has the advantages of easy processing, flexibility, and no gas-liquid leakage, but has a low thermal conductivity. The heat pipe has the advantages of flexible arrangement and high thermal conductivity, but has a thick thickness and a single heat conduction mode and a small contact area. The VC heat plate can realize multi-dimensional heat conduction, has a good heat dissipation effect, and has a thin thickness. In a compact space, after the thickness of the VC heat plate is made very thin, the problem of excessive flow resistance of the working medium is caused, good gas-liquid circulation reflux cannot be realized, and the heat transfer performance is poor.

[0003] How to provide a heat equalizing device and electronic equipment, the heat equalizing device has a good heat equalizing and heat dissipation effect, and the thickness can be set to be small, which is a topic that the industry needs to face. Content of the utility model

[0004] Embodiments of the present application provide a heat equalizing device and electronic equipment, the heat equalizing device has a good heat equalizing and heat dissipation effect, and the thickness can be set to be small.

[0005] Embodiments of the present application adopt the following technical solutions:

[0006] In a first aspect, the embodiments of the present application provide a heat equalizing device, which includes a temperature equalizing member and a coil assembly. The temperature equalizing member has a circulating flow channel inside, and the circulating flow channel is filled with a heat-conducting fluid and magnetic particles. The circulating flow channel has a driving section. The coil assembly is arranged on the temperature equalizing member and is arranged opposite to the driving section, and a magnetic field generated by the coil assembly is used to drive the magnetic particles in the driving section to move along the extension direction of the driving section.

[0007] The heat equalizing device provided by the embodiments of the present application is filled with heat-conducting fluid and magnetic particles in the circulating flow channel of the heat equalizing member. The coil assembly is arranged on the heat equalizing member and opposite to the driving section of the circulating flow channel. The coil assembly generates a magnetic field at the position of the driving section, so that the magnetic particles in the driving section move along the extension direction of the driving section. The magnetic particles can drive the heat-conducting fluid to flow, so that the heat-conducting fluid circulates in the circulating flow channel. The external heat is conducted to the heat equalizing member. The heat-conducting fluid near the external heat can absorb the heat conducted to the heat equalizing member from the external heat. The heat-absorbed heat-conducting fluid flows along the circulating flow channel to conduct the heat to different positions of the heat equalizing member. The heat is released from the different positions of the heat equalizing member to the outside. The heat-released heat-conducting fluid is transported to the vicinity of the external heat to absorb the heat again. The heat-conducting fluid circulates in the circulating flow channel, so that a better heat equalizing and radiating effect is achieved. In the thickness direction of the heat equalizing device, the size of the circulating flow channel and the wall thickness of the heat equalizing member can be set to be smaller, so that the thickness of the heat equalizing device can be set to be smaller. The heat equalizing device is particularly suitable for heat equalizing and radiating of light and thin electronic devices.

[0008] In an optional implementation, the heat equalizing member is in a plate shape. The plate-shaped heat equalizing member has a compact structure and can be set to a smaller thickness, so that the heat equalizing device can be applied in a compact space. The heat equalizing member can have different shapes such as a rectangle.

[0009] In an optional implementation, the heat equalizing member can be a non-magnetic member. The heat equalizing member is made of a non-magnetic material with good heat-conducting effect, such as aluminum, copper, nickel-silver alloy, plastic, rubber, etc. The magnetic field generated by the coil assembly can penetrate the wall of the heat equalizing member to enter the inside of the driving section, so that the magnetic particles in the driving section are driven by the magnetic field of the coil assembly to move along the extension direction of the driving section.

[0010] In an optional implementation, the heat equalizing member can include a first plate member and a second plate member. The first plate member has a concave flow channel, and the second plate member is fixed to one side of the first plate member with the concave flow channel. The first plate member and the second plate member enclose the circulating flow channel. The first plate member and the second plate member can be sealed and connected by welding or the like. The heat equalizing member is made of the first plate member and the second plate member, which is easy to make and assemble.

[0011] In an optional implementation, the heat equalizing member can be a three-dimensional printed structure. The three-dimensional structure of the heat equalizing member is rapidly formed by a 3D printer.

[0012] In an optional implementation, the heat-conducting fluid can be a traditional heat transfer medium, such as water, alcohol, oil, etc. The external heat is conducted to the heat equalizing member. The heat-conducting fluid near the external heat can absorb the heat conducted to the heat equalizing member from the external heat. The heat-absorbed heat-conducting fluid flows along the circulating flow channel to conduct the heat to different positions of the heat equalizing member. The heat is released from the different positions of the heat equalizing member to the outside. The heat-released heat-conducting fluid is transported to the vicinity of the external heat to absorb the heat again. The heat-conducting fluid circulates in the circulating flow channel, so that a better heat equalizing and radiating effect is achieved.

[0013] In an optional implementation, the magnetic particles can be magnetic particles of iron, nickel, cobalt, etc. The magnetic particles can be nano magnetic particles, such as about 10 nanometers. The magnetic particles can be prepared by conventional grinding, debonding, thermal decomposition, etc.

[0014] In an optional implementation, the coil assembly includes at least three electromagnetic coil groups arranged in sequence along the extension direction of the driving section. The driving section has a plurality of positions (such as a first position, a second position, and a third position) arranged in sequence along the extension direction of the driving section, and each position is provided with an electromagnetic coil group.

[0015] The electromagnetic coil group corresponding to the predetermined position is energized to form a magnetic field at the position, and the magnetic particles at the adjacent position are attracted into the predetermined position by the magnetic field. The three or more electromagnetic coil groups are sequentially energized, and the adjacent electromagnetic coil group is de-energized when any one of the electromagnetic coil groups is energized. A magnetic field with varying magnetic field intensity can be formed at the plurality of positions in sequence, and the magnetic particles in the driving section are sequentially driven to move a small distance at each position, so that a part of the magnetic particles pass through the driving section once. The above-mentioned electromagnetic coil groups are sequentially energized in a continuous manner, so that the magnetic particles at different positions in the circulating flow channel continuously pass through the driving section, and the heat-conducting fluid is driven to flow by the magnetic particles, thereby realizing the circulating flow of the heat-conducting fluid.

[0016] The heat uniformizing device adopts active magnetic fluid driving, has high thermal cycle efficiency, is quiet and noiseless, and has good user experience. Each electromagnetic coil group receives alternating current to generate an alternating magnetic field. Under the action of the alternating magnetic field, the movement of the magnetic particles can stir the heat-conducting fluid, thereby improving the thermal conductivity and heat conduction capacity of the heat-conducting fluid.

[0017] In an optional implementation, the at least three electromagnetic coil groups arranged in sequence can be connected with the controller, and the controller controls the plurality of electromagnetic coil groups to be energized.

[0018] In an optional implementation, the coil assembly has three electromagnetic coil groups arranged in sequence along the extension direction of the driving section, and the three electromagnetic coil groups are sequentially energized, and the adjacent electromagnetic coil group is de-energized when any one of the electromagnetic coil groups is energized. The three electromagnetic coil groups sequentially form a magnetic field, which can sequentially drive the magnetic particles in the driving section to move along the extension direction of the driving section, and the magnetic particles can drive the heat-conducting fluid to flow.

[0019] In an optional implementation, the coil assembly has five electromagnetic coil groups arranged in sequence along the extension direction of the driving section, and the five electromagnetic coil groups are sequentially energized, and the adjacent electromagnetic coil group is de-energized when any one of the electromagnetic coil groups is energized. The five electromagnetic coil groups sequentially form a magnetic field, which can sequentially drive the magnetic particles in the driving section to move along the extension direction of the driving section, and the magnetic particles can drive the heat-conducting fluid to flow.

[0020] In an optional implementation, the temperature uniforming member is plate-shaped, the at least one electromagnetic coil group has two electromagnetic coils, the two electromagnetic coils are respectively arranged on opposite sides of the driving section in the thickness direction of the temperature uniforming member, and the two electromagnetic coils generate magnetic fields in the same direction. When the two electromagnetic coils in the same electromagnetic coil group are powered, a magnetic field with a larger magnetic field intensity can be formed at the corresponding position of the electromagnetic coil group, which is beneficial to forming a larger electromagnetic driving force on the magnetic particles in the driving section to drive the magnetic particles to move in the driving section and drive the heat-conducting fluid to flow.

[0021] In an optional implementation, the three electromagnetic coil groups are arranged in sequence along the extension direction of the driving section, each electromagnetic coil group has two electromagnetic coils, the two electromagnetic coils are respectively arranged on opposite sides of the driving section in the thickness direction of the temperature uniforming member, and the two electromagnetic coils generate magnetic fields in the same direction.

[0022] In an optional implementation, in the case where the temperature uniforming member is plate-shaped and the at least one electromagnetic coil group has two electromagnetic coils, the two electromagnetic coils are connected in parallel. When the same electromagnetic coil group is powered, the two electromagnetic coils receive the same-phase electric signals, and the two electromagnetic coils can form magnetic fields in the same direction to drive the magnetic particles to move. This mode is easy to control the electromagnetic coil group.

[0023] In an optional implementation, the two electromagnetic coils of the same electromagnetic coil group have the same winding direction / spiral direction. When the same electromagnetic coil group is powered, the two electromagnetic coils receive the same-phase electric signals, and the two electromagnetic coils can form magnetic fields in the same direction to drive the magnetic particles to move.

[0024] In an optional implementation, the temperature uniforming member is plate-shaped, the coil assembly includes three electromagnetic coil groups arranged in sequence along the extension direction of the driving section, each electromagnetic coil group has two electromagnetic coils, the two electromagnetic coils are respectively arranged on opposite sides of the driving section in the thickness direction of the temperature uniforming member, the two electromagnetic coils generate magnetic fields in the same direction, and the two electromagnetic coils are connected in parallel. The driving section has a first position, a second position and a third position arranged in sequence along the extension direction of the driving section. The three electromagnetic coil groups are respectively arranged in one-to-one correspondence with the first position, the second position and the third position.

[0025] The electromagnetic coil groups are sequentially energized, and adjacent electromagnetic coil groups are de-energized when any one of the electromagnetic coil groups is energized, i.e., there is a phase difference between the input signals of the two adjacent electromagnetic coil groups, so that the magnetic fields are sequentially formed at the first position, the second position, and the third position, and there is no magnetic field at the adjacent positions when the magnetic field is formed at any one of the positions. The three magnetic fields corresponding to the first position, the second position, and the third position sequentially drive the magnetic particles to move a small distance, so that a part of the magnetic particles pass through the driving section once. The above-mentioned sequential energization of the electromagnetic coil groups is continuously performed, so that the magnetic particles at different positions in the circulation flow channel continuously pass through the driving section, and the heat-conducting fluid is driven to flow by the magnetic particles, thereby realizing the circulation flow of the heat-conducting fluid.

[0026] In an optional implementation, the flow directions of the magnetic particles and the heat-conducting fluid can be changed by adjusting the energization sequence of the electromagnetic coil groups.

[0027] In an optional implementation, the flow speeds of the magnetic particles and the heat-conducting fluid can be adjusted by adjusting the signal duty cycle of the electromagnetic coil groups. The greater the signal duty cycle of the electromagnetic coil groups, the shorter the time interval for forming the magnetic field at the same position, and the faster the flow speeds of the magnetic particles and the heat-conducting fluid.

[0028] In an optional implementation, the signal duty cycle of the electromagnetic coil groups is 1 / 2, the time interval for forming the magnetic field at the same position is relatively short, and the flow speeds of the magnetic particles and the heat-conducting fluid are relatively fast. The heat-conducting fluid is driven to flow along the routes of the first position, the second position, and the third position by the magnetic particles. The magnetic particles at different positions in the circulation flow channel continuously pass through the driving section. Moreover, while the magnetic field at the third position attracts the magnetic particles at the second position, the magnetic field at the first position attracts another part of the magnetic particles outside the driving section, so that the flow speeds of the magnetic particles and the heat-conducting fluid can be improved.

[0029] In an optional implementation, the temperature uniforming member is in a plate shape, and at least one of the electromagnetic coil groups has one electromagnetic coil. The electromagnetic coil is arranged on one side of the driving section in the thickness direction of the temperature uniforming member. When one electromagnetic coil of the electromagnetic coil group is energized, a magnetic field can be formed at the corresponding position of the electromagnetic coil group, a certain electromagnetic driving force is formed on the magnetic particles in the driving section, so that the magnetic particles move in the driving section, and the heat-conducting fluid is driven to flow by the magnetic particles.

[0030] In an optional implementation, three electromagnetic coil groups are sequentially arranged along the extension direction of the driving section, and each of the electromagnetic coil groups has one electromagnetic coil. The electromagnetic coil can be arranged on one side of the driving section in the thickness direction of the temperature uniforming member.

[0031] In an alternative implementation, the driving section has a plurality of driving branches arranged in parallel and side by side, and the coil assembly is arranged opposite to the plurality of driving branches. The heat-conducting fluid and the magnetic particles are shunted to different driving branches. When the coil assembly is energized, the coil assembly can form a relatively uniform electromagnetic driving force at the corresponding positions of the driving branches, so that the magnetic particles are dispersed relatively uniformly in the different driving branches, and the magnetic particles are driven to move in the driving branches, and the heat-conducting fluid is driven to flow by the magnetic particles.

[0032] In an alternative implementation, the driving section can be arranged as a single channel through which the heat-conducting fluid and the magnetic particles pass. A magnetic field is formed at the corresponding position of the coil assembly to form a certain electromagnetic driving force on the magnetic particles in the driving section, so that the magnetic particles move in the driving section, and the heat-conducting fluid is driven to flow by the magnetic particles.

[0033] In an alternative implementation, the temperature uniformizing member has spaced apart hot regions and cold regions, the hot regions are arranged close to the heat source member, and the driving section is arranged close to the cold regions. The driving section is arranged close to the cold regions and away from the hot regions, that is, the coil assembly is arranged close to the cold regions and away from the hot regions. The heat generated by the coil assembly when energized can be absorbed by the wall surface near the cold regions, so as to reduce the temperature rise caused by the heat generated by the coil assembly when working.

[0034] In an alternative implementation, the circulating flow channel has a plurality of shunt branches connected in parallel. The first ends of the shunt branches are connected in communication, and the last ends of the shunt branches are connected in communication. The heat-conducting fluid and the magnetic particles are shunted to the plurality of shunt branches. The heat-conducting fluid after absorbing heat flows along the circulating flow channel and enters different shunt branches, so as to conduct heat to different positions of the temperature uniformizing member, and improve the heat uniformizing and heat dissipating effect.

[0035] In an alternative implementation, the driving section and the coil assembly are arranged close to the edge of the temperature uniformizing member, the circulating flow channel has two shunt branches connected in parallel, and the heat-conducting fluid and the magnetic particles are shunted to the two shunt branches. The heat-conducting fluid after absorbing heat flows along the circulating flow channel and enters different shunt branches, so as to conduct heat to different positions of the temperature uniformizing member.

[0036] In an alternative implementation, the driving section and the coil assembly are arranged close to the middle region of the temperature uniformizing member, the circulating flow channel has two shunt branches connected in parallel, and the heat-conducting fluid and the magnetic particles are shunted to the two shunt branches. The heat-conducting fluid after absorbing heat flows along the circulating flow channel and enters different shunt branches, so as to conduct heat to different positions of the temperature uniformizing member.

[0037] In an alternative implementation, at least part of the circulating flow channel is bent and extended. The use of the bent and extended circulating flow channel facilitates the arrangement of a circulating flow channel with a longer extension length on the temperature uniformizing member, and the heat dissipation is achieved by the flow of the heat-conducting fluid in the circulating flow channel, so as to improve the heat uniformizing and heat dissipating effect.

[0038] In an optional implementation, at least part of the circulation flow channel can extend in an L shape, an S shape, a W shape, or the like.

[0039] In an optional implementation, part of the circulation flow channel extends in a W shape. The heat-absorbed heat-conducting fluid flows along the circulation flow channel, and can conduct heat to different positions of the uniform temperature member, to achieve a better heat-dissipating effect.

[0040] In an optional implementation, the coil assembly is arranged on a circuit board, and the circuit board is arranged on the uniform temperature member. The coil assembly is conveniently arranged on the uniform temperature member, and a predetermined magnetic field is generated by controlling the coil assembly to work by inputting an electrical signal to the circuit board. The circuit board can be arranged on a surface of the uniform temperature member in a thickness direction. The circuit board can be a flexible circuit board or a rigid circuit board.

[0041] In an optional implementation, the heat-dissipating device further includes a battery, the battery is electrically connected to the coil assembly, and the battery is configured to provide electrical energy to the coil assembly.

[0042] In a second aspect, an electronic device is provided. The electronic device includes the heat-dissipating device described above, and the electronic device has a heat source member. Heat of the heat source member can be conducted to the uniform temperature member. The heat source member can be a heat-generating component such as a processor of the electronic device. The heat-dissipating device can be used as a heat-dissipating shell and assembled on the electronic device, so that the heat source member and the uniform temperature member of the electronic device face each other, and heat of the heat source member can be conducted to the uniform temperature member. A better heat-dissipating effect is achieved by using the heat-dissipating device, and the thickness of the heat-dissipating device can be relatively small.

[0043] In an optional implementation, the heat-dissipating device can be used as a heat-dissipating shell of a mobile phone / tablet computer, and can be assembled on a back surface of the mobile phone / tablet computer by using a buckle or the like. The uniform temperature member can be in contact with the back surface of the mobile phone / tablet computer, and heat of a processor of the mobile phone / tablet computer can be conducted to the uniform temperature member. The heat-conducting fluid absorbs heat of the uniform temperature member. Under the magnetic field generated by the coil assembly, the magnetic particles drive the heat-conducting fluid to flow in the circulation flow channel, and heat of the heat-conducting fluid is conducted to different positions of the uniform temperature member and dissipated outward, to achieve a better heat-dissipating effect.

[0044] In a third aspect, an electronic device is provided. The electronic device includes a heat source member and the heat-dissipating device described above. Heat of the heat source member can be conducted to the uniform temperature member. The heat source member can be a heat-generating component such as a processor of the electronic device. The heat-dissipating device is used as a part of the electronic device. The heat source member and the uniform temperature member of the electronic device can face each other, or a heat-conducting structure can be arranged between the heat source member and the uniform temperature member of the electronic device, so that heat of the heat source member can be conducted to the uniform temperature member. A better heat-dissipating effect is achieved by using the heat-dissipating device, and the thickness of the heat-dissipating device can be relatively small. BRIEF DESCRIPTION OF DRAWINGS

[0045] Figure 1(a) and (b) in the figure are schematic diagrams of different VC heat exchange plates in the relevant technologies;

[0046] Figure 2 A perspective front view of the heat spreader provided in the embodiments of this application;

[0047] Figure 3 for Figure 2 Side view of the heat exchanger;

[0048] Figure 4 for Figure 2 A cross-sectional view of the heat equalization device along line HH;

[0049] Figure 5 for Figure 2 A schematic diagram of the coil assembly in the heat spreader;

[0050] Figure 6 for Figure 2 A three-dimensional sectional view of the drive section structure in the heat exchanger;

[0051] Figure 7 Images (a) to (c) are schematic diagrams illustrating the movement of magnetic particles within the driving segment provided in the embodiments of this application. The driving segment structure is... Figure 6 Sectional view along line II; Figure 7 (d) in the text is the corresponding Figure 7 Signal diagrams of coil assemblies (a) to (c) in the diagram;

[0052] Figure 8 Figures (a) to (e) are schematic diagrams illustrating the movement of magnetic particles within a drive segment according to another embodiment of this application. The drive segment structure is... Figure 6 Sectional view along line II; Figure 8 (f) in the text is the corresponding Figure 8 Signal diagrams of coil assemblies (a) to (e) in the diagram;

[0053] Figure 9 A side view of a heat spreader provided in another embodiment of this application;

[0054] Figure 10 for Figure 9 A schematic diagram of the coil assembly in the heat spreader;

[0055] Figure 11 A perspective front view of a heat spreader provided in another embodiment of this application;

[0056] Figure 12 for Figure 11 Side view of the heat exchanger;

[0057] Figure 13 for Figure 11a cross-sectional view along line J-J of the heat soaking device of the first embodiment of the present application;

[0058] Figure 14 a perspective view of the heat soaking device of the second embodiment of the present application; Figure 11 a perspective view of the driving section structure in the heat soaking device of the second embodiment of the present application;

[0059] Figure 15 a perspective view of the heat soaking device of the third embodiment of the present application;

[0060] Figure 16 a perspective view of the heat soaking device of the fourth embodiment of the present application.

[0061] BRIEF DESCRIPTION OF DRAWINGS

[0062] 1-VC heat soaking plate; 1a-casing; 1b-vapor passage; 1c-condensate passage;

[0063] 2-VC heat soaking plate; 2a-casing; 2b-vapor passage; 2c-condensate passage;

[0064] 100-heat soaking device;

[0065] 10-heat soaking element; 10a-hot zone; 10b-cold zone; 11-circulation flow channel; 111-driving section; 111a-extension direction; 111b-driving branch; A0-first position; B0-second position; C0-third position; 112-dividing branch;

[0066] 20-coil assembly; A / B / C-electromagnetic coil group; A1 / A2 / B1 / B2 / C1 / C2-electromagnetic coil; 21-circuit board;

[0067] 30-magnetic particles. DETAILED DESCRIPTION

[0068] In order to make the technical problems, technical solutions and beneficial effects of the present application more clear, the present application will be further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not intended to limit the present application. Although the description of the present application will be introduced in combination with some embodiments, this does not mean that the features of the present application are limited to the embodiments. On the contrary, the purpose of introducing the embodiments as the application is to cover other options or modifications that can be extended based on the claims of the present application. In order to provide a deep understanding of the present application, many specific details will be included in the following description. The present application can also be implemented without using these details. In addition, in order to avoid confusion or obscure the focus of the present application, some specific details will be omitted in the description. It should be noted that the embodiments and features in the embodiments of the present application can be combined with each other without conflict.

[0069] It should be noted that, when an element is referred to as being "fixed" or "set" on another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or indirectly connected to the other element.

[0070] It should be understood that, in the description of the embodiments of the present application, it should be noted that, unless otherwise explicitly specified and limited, the terms "mounting", "connecting" should be understood in a broad sense, for example, "connecting" can be detachably connected, or can be non-detachably connected; can be directly connected, or indirectly connected through an intermediate medium. The directions or positional relationships indicated by the terms "length", "width", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like are based on the directions or positional relationships shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and thus cannot be understood as indicating or implying that the device or element indicated must have a particular direction, be constructed and operated in a particular direction, and thus cannot be understood as a limitation on the present application.

[0071] In addition, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise explicitly specified and limited.

[0072] In the embodiments of the present application, "and / or" is only a description of the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B can mean that A exists alone, A and B exist together, and B exists alone. In addition, the character " / " in this paper generally represents that the front and rear associated objects have an "or" relationship.

[0073] In this specification, the reference to "one embodiment" or "some embodiments" and the like means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Therefore, the statements "in one embodiment", "in some embodiments", "in other some embodiments", "in yet some embodiments" and the like appearing in various places in the specification are not necessarily all referring to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized. The terms "comprise", "include", "have" and their variants mean "including but not limited to", unless otherwise specifically emphasized.

[0074] The VC vapor chamber is a heat conduction device based on the principle of phase change heat transfer. The vapor chamber has a vapor passage and a condensate passage inside, and the passages are filled with a working medium. When external heat is conducted to the evaporation area of the vapor chamber, the working medium in the evaporation area absorbs heat and evaporates, and the evaporated vapor working medium quickly diffuses. When the vapor working medium diffuses to the condensation area of the vapor chamber, the working medium will condense and release heat. The liquid working medium after condensation and heat release will return to the evaporation area under the capillary action of the capillary wick and re-evaporate to absorb heat. Thus, a continuous heat conduction cycle is formed.

[0075] In order to realize the gas-liquid circulation in the vapor chamber, the following conditions need to be met: the capillary force of the capillary wick driving the liquid return is greater than the sum of the vapor flow resistance from the evaporation area to the condensation area, the liquid flow resistance from the condensation area to the evaporation area, and the liquid gravity pressure drop. By increasing the capillary force of the capillary wick and reducing the liquid flow resistance, the liquid working medium can return from the condensation area to the evaporation area. By increasing the cross-sectional area of the vapor passage and reducing the vapor flow resistance, the vapor working medium can diffuse from the evaporation area to the condensation area.

[0076] Referring to (a) in FIG. Figure 1 In the related art, a VC vapor chamber 1 adopts a gas-liquid passage out-of-plane manner. A plurality of vapor passages 1b are arranged side by side in the upper layer area in a shell 1a, and a capillary wick is arranged as a condensate passage 1c in the lower layer area in the shell 1a. The vapor passage 1b and the condensate passage 1c do not interfere with each other, and have good heat transfer performance. The thickness D1 of the VC vapor chamber 1 is relatively thick, and cannot meet the light and thin requirements.

[0077] Referring to (b) in FIG. Figure 1 In the related art, another VC vapor chamber 2 adopts a gas-liquid passage coplanar manner. A plurality of vapor passages 2b and a plurality of condensate passages 2c are alternately arranged in a shell 2a, which can reduce the thickness D2 of the VC vapor chamber 2. However, in a space-compact scenario, after the thickness of the VC vapor chamber 2 is made very thin, the working medium flow resistance becomes large, and liquid plugs are easily formed in the vapor passage 2b, which hinders the vapor flow and cannot realize good gas-liquid circulation return. It also inhibits the liquid evaporation phase change, resulting in poor heat transfer performance of the ultra-thin vapor chamber.

[0078] Referring to FIG. Figures 2 to 4 The embodiment of the present application provides a heat equalizing device 100, which comprises a heat equalizing piece 10 and a coil assembly 20. The inside of the heat equalizing piece 10 has a circulating flow channel 11, and the circulating flow channel 11 is filled with a heat-conducting fluid and magnetic particles 30. The circulating flow channel 11 has a driving section 111. The coil assembly 20 is arranged on the heat equalizing piece 10 and is arranged opposite to the driving section 111. The magnetic field generated by the coil assembly 20 is used to drive the magnetic particles 30 in the driving section 111 to move along the extension direction 111a of the driving section 111.

[0079] The heat equalizing device 100 provided by the embodiments of the present application is filled with heat-conducting fluid and magnetic particles 30 in the circulating flow channel 11 of the heat equalizing member 10. The coil assembly 20 is arranged on the heat equalizing member 10 and opposite to the driving section 111 of the circulating flow channel 11. The coil assembly 20 generates a magnetic field at the position of the driving section 111, so that the magnetic particles 30 in the driving section 111 move along the extension direction 111a of the driving section 111. The magnetic particles 30 can drive the heat-conducting fluid to flow, so that the heat-conducting fluid circulates in the circulating flow channel 11. External heat is conducted to the heat equalizing member 10. The heat-conducting fluid near the external heat can absorb the heat conducted to the heat equalizing member 10 from the external heat. The heat-absorbed heat-conducting fluid flows along the circulating flow channel 11 to conduct heat to different positions of the heat equalizing member 10. The heat is released from the different positions of the heat equalizing member 10 to the outside. The heat-released heat-conducting fluid is transmitted to the external heat to absorb heat again. The heat-conducting fluid circulates in the circulating flow channel 11, so that a better heat equalizing and radiating effect is achieved. Figure 3 、 Figure 5 In the thickness direction of the heat equalizing device 100, the size of the circulating flow channel 11 and the wall thickness of the heat equalizing member 10 can be set to be smaller, so that the thickness D100 of the heat equalizing device 100 can be set to be smaller. The heat equalizing device 100 is particularly suitable for heat equalizing and radiating of thin and light electronic devices.

[0080] In some embodiments, referring to Figures 2 to 4 , the heat equalizing member 10 is in a plate shape. The plate-shaped heat equalizing member 10 is compact in structure and can be set to a smaller thickness D100, so that the heat equalizing device 100 can be applied in a compact space. The heat equalizing member can be in different shapes such as a rectangle.

[0081] In order to describe the direction and position of the heat equalizing device 100, the thickness direction of the heat equalizing member 10 is defined as the Z direction, and the two directions perpendicular to the thickness direction of the heat equalizing member 10 are defined as the X direction and the Y direction.

[0082] In some embodiments, referring to Figure 2 , the heat equalizing member 10 can be a non-magnetic member. The heat equalizing member 10 is made of a non-magnetic material with good heat-conducting effect, such as aluminum, copper, nickel-silver alloy, plastic, rubber, etc. The magnetic field generated by the coil assembly 20 can penetrate the wall of the heat equalizing member 10 to enter the inside of the driving section 111, so that the magnetic particles 30 in the driving section 111 are driven by the magnetic field of the coil assembly 20 to move along the extension direction 111a of the driving section 111.

[0083] In some embodiments, referring to Figure 2 , the heat equalizing member 10 can include a first plate member and a second plate member. The first plate member has a concave flow channel, and the second plate member is fixed to one side of the first plate member with the concave flow channel. The first plate member and the second plate member enclose the circulating flow channel 11. The first plate member and the second plate member can be sealed and connected by welding or the like. The heat equalizing member 10 is made of the first plate member and the second plate member, which is easy to make and assemble.

[0084] In some embodiments, referring to Figure 2 , the temperature equalizing member 10 can be a three-dimensional printed structure. The three-dimensional structure of the temperature equalizing member 10 is achieved by a 3D printer for rapid prototyping.

[0085] In some embodiments, referring to Figure 2 , the heat-conducting fluid can be a conventional heat transfer medium, such as water, alcohol, oil, etc. The heat-conducting fluid near the external heat source can absorb the heat conducted to the temperature equalizing member 10 from the external heat source, and the heat-absorbed heat-conducting fluid flows along the circulation flow channel 11 to conduct heat to different positions of the temperature equalizing member 10, and the heat is released from different positions of the temperature equalizing member 10 to the outside, and the heat-released heat-conducting fluid is transported to the vicinity of the external heat source to absorb heat again. The heat-conducting fluid circulates in the circulation flow channel 11 to achieve better heat equalization and dissipation effect.

[0086] In some embodiments, referring to Figure 2 , the magnetic particles 30 can be magnetic particles of iron, nickel, cobalt, etc. The magnetic particles 30 can be nano magnetic particles, such as about 10 nanometers. The magnetic particles 30 can be prepared by conventional grinding method, debonding method, thermal decomposition method, etc. The magnetic particles 30 and the heat-conducting fluid can be mixed in a certain proportion to have good heat transfer efficiency and good flow stability.

[0087] In some embodiments, referring to Figures 2 to 5 , the coil assembly 20 includes at least three electromagnetic coil groups (A, B, C) arranged in sequence along the extension direction 111a of the driving section 111. The driving section 111 has a plurality of positions (such as first position A0, second position B0 and third position C0) arranged in sequence along the extension direction 111a of the driving section 111, and each position is provided with an electromagnetic coil group (A, B, C).

[0088] The magnetic field is formed at the position corresponding to the energized electromagnetic coil group (A, B, C), and the magnetic particles 30 at the adjacent position are attracted into the predetermined position by the magnetic field. By sequentially energizing the three or more electromagnetic coil groups (A, B, C), and de-energizing the adjacent electromagnetic coil group when energizing any one electromagnetic coil group, a magnetic field with varying magnetic field strength is formed at multiple positions in sequence, and the magnetic field at each position drives the magnetic particles 30 located in the driving section 111 to move a small distance in sequence, so that a part of the magnetic particles 30 pass through the driving section 111 once. By sequentially energizing the electromagnetic coil groups (A, B, C) in the above manner, the magnetic particles 30 at different positions in the circulation flow channel 11 continuously pass through the driving section 111, and the heat-conducting fluid is driven to flow by the magnetic particles 30, realizing the circulation flow of the heat-conducting fluid.

[0089] The heat soaking device 100 adopts active magnetic fluid driving, has high thermal cycle efficiency, is quiet and noiseless, and has good user experience. Each electromagnetic coil group (A, B, C) receives alternating current and can generate an alternating magnetic field. Under the action of the alternating magnetic field, the magnetic particles 30 move to stir the heat-conducting fluid, thereby improving the thermal conductivity and heat conduction capacity of the heat-conducting fluid.

[0090] The at least three electromagnetic coil groups (A, B, C) arranged in sequence can be connected with the controller, and the controller controls the multiple electromagnetic coil groups (A, B, C) to be powered on. The input signal of the electromagnetic coil group (A, B, C) can be a triangular wave, a rectangular wave, a square wave, a sawtooth wave, or a sine wave, and the same type of wave can be selected as the input signal.

[0091] For example, referring to Figure 6 , Figure 7 The coil assembly 20 has three electromagnetic coil groups (A, B, C) arranged in sequence along the extension direction 111a of the driving section 111, and the three electromagnetic coil groups are powered on in sequence, and the adjacent electromagnetic coil group is powered off when any one electromagnetic coil group is powered on. The three electromagnetic coil groups (A, B, C) sequentially form a magnetic field, which can sequentially drive the magnetic particles 30 in the driving section 111 to move along the extension direction 111a of the driving section 111, and the magnetic particles 30 can drive the heat-conducting fluid to flow.

[0092] For example, the coil assembly 20 has five electromagnetic coil groups arranged in sequence along the extension direction 111a of the driving section 111, and the five electromagnetic coil groups are powered on in sequence, and the adjacent electromagnetic coil group is powered off when any one electromagnetic coil group is powered on. The five electromagnetic coil groups sequentially form a magnetic field, which can sequentially drive the magnetic particles 30 in the driving section 111 to move along the extension direction 111a of the driving section 111, and the magnetic particles 30 can drive the heat-conducting fluid to flow.

[0093] In some embodiments, referring to Figures 3 to 5 The temperature uniformizing piece 10 is in the form of a plate, and the at least one electromagnetic coil group has two electromagnetic coils, and the two electromagnetic coils are respectively arranged on opposite sides of the driving section 111 in the thickness direction (Z direction) of the temperature uniformizing piece 10, and the two electromagnetic coils generate magnetic fields in the same direction. The two electromagnetic coils in the same electromagnetic coil group are powered on, which can form a magnetic field with a larger magnetic field strength at the corresponding position of the electromagnetic coil group, which is beneficial to forming a larger electromagnetic driving force on the magnetic particles 30 in the driving section 111 to drive the magnetic particles 30 to move in the driving section 111, and the heat-conducting fluid is driven to flow by the magnetic particles 30.

[0094] For example, the three electromagnetic coil groups (A, B, C) arranged in sequence along the extension direction 111a of the driving section 111 each have two electromagnetic coils, which are respectively arranged on opposite sides of the driving section 111 in the thickness direction (Z direction) of the temperature uniforming member 10, and the two electromagnetic coils generate magnetic fields in the same direction. For example, the electromagnetic coil group A has electromagnetic coils A1 and A2, which have the same N-pole orientation and the same S-pole orientation when energized, i.e., the electromagnetic coils A1 and A2 generate magnetic fields in the same direction. The electromagnetic coil group B has electromagnetic coils B1 and B2. The electromagnetic coil group C has electromagnetic coils C1 and C2.

[0095] In some embodiments, referring to Figure 4 , In some embodiments, referring to Figure 6 , the temperature uniforming member 10 is in the form of a plate, and the at least one electromagnetic coil group (A / B / C) has two electromagnetic coils, which are connected in parallel. That is, the first ends of the two electromagnetic coils are connected, and the second ends of the two electromagnetic coils are connected. When the same electromagnetic coil group is energized, the two electromagnetic coils receive the same-phase electric signals, and the two electromagnetic coils can generate magnetic fields in the same direction to drive the magnetic particles 30 to move, which is easy to control the electromagnetic coil group. For example, the two electromagnetic coils A1 and A2 in the electromagnetic coil group A are connected in parallel.

[0096] For example, referring to Figure 5 , the two electromagnetic coils of the same electromagnetic coil group (A / B / C) have the same winding direction / spiral direction. When the same electromagnetic coil group (A / B / C) is energized, the two electromagnetic coils receive the same-phase electric signals, and the two electromagnetic coils can generate magnetic fields in the same direction to drive the magnetic particles 30 to move.

[0097] In some embodiments, referring to Figures 2 to 6 , the temperature uniforming member 10 is in the form of a plate, and the coil assembly 20 includes three electromagnetic coil groups (A, B, C) arranged in sequence along the extension direction 111a of the driving section 111, each electromagnetic coil group has two electromagnetic coils, which are respectively arranged on opposite sides of the driving section 111 in the thickness direction (Z direction) of the temperature uniforming member 10, and the two electromagnetic coils generate magnetic fields in the same direction, and the two electromagnetic coils are connected in parallel.

[0098] The driving section 111 has a first position A0, a second position B0, and a third position C0 arranged in sequence along the extension direction 111a of the driving section 111. The three electromagnetic coil groups (A, B, C) are respectively arranged one-to-one with the first position A0, the second position B0, and the third position C0.

[0099] Electromagnetic coil group A has electromagnetic coils A1 and A2, which are respectively located at the first position A0 on opposite sides of the thickness direction (Z direction) of the temperature equalization element 10. Electromagnetic coils A1 and A2 are wound in the same direction, and when the same electrical signal is applied to electromagnetic coils A1 and A2, magnetic fields in the same direction can be generated at the first position A0.

[0100] Electromagnetic coil assembly B includes electromagnetic coils B1 and B2. Electromagnetic coils B1 and B2 are respectively located at the second position B0 on ​​opposite sides of the thickness direction (Z direction) of the temperature equalization element 10. Electromagnetic coils B1 and B2 are wound in the same direction, and when the same electrical signal is applied to electromagnetic coils B1 and B2, magnetic fields in the same direction can be generated at the second position B0.

[0101] The electromagnetic coil assembly C includes electromagnetic coils C1 and C2. Electromagnetic coils C1 and C2 are respectively located at the third position C0 on opposite sides of the thickness direction (Z direction) of the temperature equalization element 10. Electromagnetic coils C1 and C2 are wound in the same direction, and when the same electrical signal is applied to electromagnetic coils C1 and C2, magnetic fields in the same direction can be generated at the third position C0.

[0102] See Figure 7 In steps (a) to (d), electromagnetic coil groups (A, B, C) are energized sequentially. When any one electromagnetic coil group is energized, the adjacent electromagnetic coil group is de-energized, meaning there is a phase difference between the input signals of adjacent electromagnetic coil groups. This allows magnetic fields to be sequentially formed at positions A0, B0, and C0. When a magnetic field is formed at any position, there is no magnetic field at adjacent positions. The three magnetic fields corresponding to positions A0, B0, and C0 sequentially drive the magnetic particles 30 a short distance, causing some of the magnetic particles 30 to pass through the driving section 111. By continuously energizing the electromagnetic coil groups (A, B, C) in this manner, the magnetic particles 30 at different positions within the circulation channel 11 continuously pass through the driving section 111, driving the flow of the heat-conducting fluid and achieving its circulation. Figure 7 In (a) to (c), the arrows on the circulating channel 11 indicate the flow direction of the heat-conducting fluid and the magnetic particles 30.

[0103] For example, see Figure 7 In steps (a) to (d), during the process from t0 to t3, the electromagnetic coil groups (A, B, C) are energized sequentially, and the adjacent electromagnetic coil groups are de-energized when any one electromagnetic coil group is energized.

[0104] like Figure 7 As shown in (a), during the process from t0 to t1, the electromagnetic coil group A is energized, and a magnetic field is formed at the first position A0. The magnetic particles 30 outside the driving section 111 and near the first position A0 are magnetically attracted, so that the magnetic particles 30 are attracted into the first position A0.

[0105] As shown in (b) of FIG. 1, during t1 to t2, the electromagnetic coil group B is energized to form a magnetic field at the second position B0, and the magnetic particles 30 near the second position B0 are magnetically attracted to the second position B0, so that the magnetic particles 30 at the first position A0 are attracted into the second position B0. Figure 7 As shown in (c) of FIG. 1, during t2 to t3, the electromagnetic coil group C is energized to form a magnetic field at the third position C0, and the magnetic particles 30 near the third position C0 are magnetically attracted to the third position C0, so that the magnetic particles 30 at the second position B0 are attracted into the third position C0.

[0106] Figure 7 As shown in (d) of FIG. 1, during t3 to t4, the electromagnetic coil group A is energized to form a magnetic field at the first position A0, and the magnetic particles 30 near the first position A0 are magnetically attracted to the first position A0, so that the magnetic particles 30 at the third position C0 are attracted into the first position A0.

[0107] The heat-conducting fluid is driven by the magnetic particles 30 to flow along the routes of the first position A0, the second position B0, and the third position C0. The process of t0 to t3 is repeated to continuously drive the magnetic particles 30 at different positions in the circulation flow channel 11 through the driving section 111.

[0108] In some embodiments, the flow direction of the magnetic particles 30 and the heat-conducting fluid can be changed by adjusting the energizing sequence of the electromagnetic coil groups. The electromagnetic coil groups (C, B, A) are sequentially energized, and the adjacent electromagnetic coil group is de-energized when any one of the electromagnetic coil groups is energized, i.e., there is a phase difference between the input signals of the adjacent electromagnetic coil groups. In this way, the magnetic fields are sequentially formed at the third position C0, the second position B0, and the first position A0, and there is no magnetic field at the adjacent position when the magnetic field is formed at any one of the positions. The three magnetic fields corresponding to the third position C0, the second position B0, and the first position A0 sequentially drive the magnetic particles 30 to move a small distance, so that a part of the magnetic particles 30 reversely pass through the driving section 111. The electromagnetic coil groups (C, B, A) are sequentially energized in the above manner, and the magnetic particles 30 at different positions in the circulation flow channel 11 continuously reversely pass through the driving section 111, so that the heat-conducting fluid is reversely driven by the magnetic particles 30 to realize the circulation flow of the heat-conducting fluid.

[0109] In some embodiments, the flow speed of the magnetic particles 30 and the heat-conducting fluid can be adjusted by adjusting the signal duty cycle of the electromagnetic coil groups. The duty cycle is the ratio of the energizing time to the total time in one pulse cycle. The input signals of the three electromagnetic coil groups have the same waveform, the same frequency, and the same amplitude, and there is a certain phase difference between the input signals of the adjacent electromagnetic coil groups. The input signal of the electromagnetic coil group B has a phase delay compared to the input signal of the electromagnetic coil group A. The input signal of the electromagnetic coil group C has a phase delay compared to the input signal of the electromagnetic coil group B. The greater the signal duty cycle of the electromagnetic coil group, the shorter the time interval for forming a magnetic field at the same position, and the faster the flow speed of the magnetic particles 30 and the heat-conducting fluid.

[0110] For example,​Figure 7 In the embodiments shown in (a) to (d), the signal duty cycle of the electromagnetic coil group (A, B, C) is 1 / 3, the time interval between the formation of the magnetic field at the same position is relatively long, and the flow velocity of the magnetic particles 30 and the heat-conducting fluid is relatively slow.

[0111] exist Figure 8 In the embodiments shown in (a) to (f), the signal duty cycle of the electromagnetic coil groups (A, B, C) is 1 / 2, the time interval between the formation of magnetic fields at the same location is short, and the flow velocity of the magnetic particles 30 and the heat-conducting fluid is fast. Figure 8 In (a) to (e), the arrows on the circulating channel 11 indicate the flow direction of the heat-conducting fluid and the magnetic particles 30.

[0112] like Figure 8 As shown in (a), during the process from t0 to t1, the electromagnetic coil group A is energized, and a magnetic field is formed at the first position A0. The magnetic particles 30 outside the driving section 111 and near the first position A0 are magnetically attracted, so that the magnetic particles 30 are attracted into the first position A0.

[0113] like Figure 8 As shown in (b), during the process from t1 to t2, the electromagnetic coil group B is energized, forming a magnetic field at the second position B0, which magnetically attracts the magnetic particles 30 near the second position B0, causing the magnetic particles 30 at the first position A0 to be attracted into the second position B0.

[0114] like Figure 8 As shown in (c), during the process from t2 to t3, energizing the electromagnetic coil group C creates a magnetic field at the third position C0, magnetically attracting magnetic particles 30 near the third position C0, causing magnetic particles 30 at the second position B0 to be attracted into the third position C0. Simultaneously, energizing the electromagnetic coil group A creates a magnetic field at the first position A0, magnetically attracting magnetic particles 30 outside the driving section 111 and near the first position A0, causing another portion of magnetic particles 30 to be attracted into the first position A0.

[0115] The magnetic particles 30 drive the heat-conducting fluid to flow along the paths of the first position A0, the second position B0, and the third position C0. For example... Figure 8 As shown in (d) and (e), the process from t1 to t3 is repeated, so that the magnetic particles 30 at different positions in the circulation channel 11 continuously pass through the drive section 111. Moreover, while the magnetic field at the third position C0 attracts the magnetic particles 30 at the second position B0, the magnetic field at the first position A0 attracts another part of the magnetic particles 30 outside the drive section 111, which can increase the flow velocity of the magnetic particles 30 and the heat-conducting fluid.

[0116] In some embodiments, see Figure 9 , Figure 10The temperature uniformizing member 10 is in the form of a plate, and at least one of the electromagnetic coil groups (A, B, C) has one electromagnetic coil, which is arranged on one side of the driving section 111 in the thickness direction (Z direction) of the temperature uniformizing member 10. When one electromagnetic coil of the electromagnetic coil group is energized, a magnetic field is formed at the corresponding position of the electromagnetic coil group, and a certain electromagnetic driving force is formed on the magnetic particles 30 in the driving section 111, so that the magnetic particles 30 move in the driving section 111, and the heat-conducting fluid is driven to flow by the magnetic particles 30.

[0117] For example, three electromagnetic coil groups (A, B, C) are arranged in sequence along the extension direction 111a of the driving section 111, and each of the electromagnetic coil groups has one electromagnetic coil, which can be arranged on one side of the driving section 111 in the thickness direction (Z direction) of the temperature uniformizing member 10. For example, the electromagnetic coil group A has the electromagnetic coil A1, the electromagnetic coil group B has the electromagnetic coil B1, and the electromagnetic coil group C has the electromagnetic coil C1.

[0118] In some embodiments, referring to Figures 11 to 14 The driving section 111 has a plurality of driving branches 111b arranged in parallel and side by side, and the coil assembly 20 is arranged opposite to the plurality of driving branches 111b. The plurality of driving branches 111b are connected in parallel, that is, the first ends of the plurality of driving branches 111b are connected in communication, and the ends of the plurality of driving branches 111b are connected in communication. Figure 11 The arrows on the circulating flow channel 11 indicate the flow directions of the heat-conducting fluid and the magnetic particles 30.

[0119] By using the plurality of driving branches 111b, the heat-conducting fluid and the magnetic particles 30 are divided into different driving branches 111b. When the coil assembly 20 is energized, the coil assembly 20 can form a relatively uniform electromagnetic driving force at the corresponding positions of the driving branches 111b, so that the magnetic particles 30 are uniformly dispersed in the different driving branches 111b, and the magnetic particles 30 are better driven to move in the driving branches 111b, and the heat-conducting fluid is driven to flow by the magnetic particles 30.

[0120] In some embodiments, referring to Figures 2 to 4 The driving section 111 can be arranged as a single channel, so that the heat-conducting fluid and the magnetic particles 30 pass through the single channel. A magnetic field is formed at the corresponding positions of the electromagnetic coil groups (A, B, C), and a certain electromagnetic driving force is formed on the magnetic particles 30 in the driving section 111, so that the magnetic particles 30 move in the driving section 111, and the heat-conducting fluid is driven to flow by the magnetic particles 30.

[0121] In some embodiments, referring to Figure 2The temperature equalizing member 10 has spaced apart hot zones 10a and cold zones 10b. The hot zones 10a are located near a heat source (not shown) and the drive section 111 is located near the cold zones 10b. The hot zones 10a of the temperature equalizing member 10 are locations near and absorbing heat from the outside, and can be different locations of the temperature equalizing member 10. The hot zones 10a and the cold zones 10b are relative. The temperature of the cold zones 10b is lower than the temperature of the hot zones 10a.

[0122] The drive section 111 is located near the cold zones 10b and away from the hot zones 10a, i.e. the coil assembly 20 is located near the cold zones 10b and away from the hot zones 10a. The heat generated by the coil assembly 20 in operation can be absorbed by the wall near the cold zones 10b, reducing the temperature rise caused by the heat generated by the coil assembly 20 in operation.

[0123] In some embodiments, referring to Figure 2 The circulation flow channel 11 has a plurality of parallel shunt branches 112. The first ends of the shunt branches 112 are connected, and the ends of the shunt branches 112 are connected. The heat-conducting fluid and the magnetic particles 30 are shunted to the plurality of shunt branches 112. The heat-absorbed heat-conducting fluid flows along the circulation flow channel 11 and enters different shunt branches 112, and can conduct heat to different locations of the temperature equalizing member 10, improving the heat equalizing and heat dissipating effect.

[0124] Exemplarily, referring to Figure 2 The drive section 111 and the coil assembly 20 are located near the edge of the temperature equalizing member 10, and the circulation flow channel 11 has two parallel shunt branches 112, and the heat-conducting fluid and the magnetic particles 30 are shunted to the two shunt branches 112. The arrows on the circulation flow channel 11 indicate the flow direction of the heat-conducting fluid and the magnetic particles 30. The heat-absorbed heat-conducting fluid flows along the circulation flow channel 11 and enters different shunt branches 112, and can conduct heat to different locations of the temperature equalizing member 10.

[0125] Exemplarily, referring to Figure 15 The drive section 111 and the coil assembly 20 are located near the middle region of the temperature equalizing member 10, and the circulation flow channel 11 has two parallel shunt branches 112, and the heat-conducting fluid and the magnetic particles 30 are shunted to the two shunt branches 112. The arrows on the circulation flow channel 11 indicate the flow direction of the heat-conducting fluid and the magnetic particles 30. The heat-absorbed heat-conducting fluid flows along the circulation flow channel 11 and enters different shunt branches 112, and can conduct heat to different locations of the temperature equalizing member 10.

[0126] In some embodiments, referring to Figure 2At least a portion of the circulating flow channel 11 is bent and extended. The bent and extended circulating flow channel 11 facilitates the provision of a longer extended circulating flow channel 11 on the heat exchanger 10, enabling heat dissipation through the flow of heat-conducting fluid within the circulating flow channel 11 and improving heat dissipation efficiency. At least a portion of the circulating flow channel 11 can be bent and extended in L-shape, S-shape, W-shape, or similar patterns.

[0127] For example, see Figure 16 The circulating channel 11 extends in a W-shape. Arrows on the circulating channel 11 indicate the flow direction of the heat-conducting fluid and the magnetic particles 30. The heat-conducting fluid, after absorbing heat, flows along the circulating channel 11, transferring heat to different locations on the heat spreader 10, achieving a better heat dissipation effect. Figure 16 In the diagram, the arrows on the circulating channel 11 indicate the flow direction of the heat-conducting fluid and the magnetic particles 30.

[0128] In some embodiments, see Figures 2 to 5 The coil assembly 20 is disposed on the circuit board 21, which in turn is disposed on the heat spreader 10. This arrangement facilitates the placement of the coil assembly 20 on the heat spreader 10. By inputting an electrical signal to the circuit board 21, the coil assembly 20 is controlled to generate a predetermined magnetic field. The circuit board 21 can be disposed on the thickness-direction surface of the heat spreader 10. The circuit board 21 can be a flexible circuit board or a rigid circuit board.

[0129] In some embodiments, the heat spreader 100 further includes a battery (not shown), which is electrically connected to the coil assembly 20, and the battery is used to provide electrical energy to the coil assembly 20.

[0130] This application provides an electronic device that uses the aforementioned heat dissipation device 100. The electronic device has a heat source (not shown), and the heat from the heat source can be conducted to the heat spreader 10. The heat source can be a heat-generating component such as a processor of the electronic device. The heat dissipation device 100 can serve as a heat sink and be assembled on the electronic device, so that the heat source and the heat spreader 10 face each other, and the heat from the heat source can be conducted to the heat spreader 10. The heat dissipation device 100 achieves a better heat dissipation effect, and the thickness D100 of the heat dissipation device 100 can be set to be relatively small.

[0131] For example, the heat dissipation device 100 can be configured as a heat dissipation shell for a mobile phone / tablet, and can be assembled to the back of the mobile phone / tablet using a snap-fit ​​method. The heat dissipation element 10 can contact the back of the mobile phone / tablet, and the heat from the processor of the mobile phone / tablet can be conducted to the heat dissipation element 10. The heat-conducting fluid absorbs the heat from the heat dissipation element 10. Under the magnetic field generated by the coil assembly 20, the magnetic particles 30 drive the heat-conducting fluid to flow in the circulation channel 11, conducting the heat of the heat-conducting fluid to different positions of the heat dissipation element 10 and dissipating heat outward, achieving a better heat dissipation effect.

[0132] The electronic device provided by the embodiments of the present application comprises a heat source member (not shown in the figure) and the above-mentioned heat equalizing device 100, and the heat of the heat source member can be conducted to the heat equalizing member 10. The heat source member can be a heat generating element such as a processor of the electronic device. The heat equalizing device 100 is part of the electronic device. The heat source member of the electronic device and the heat equalizing member 10 can face each other, or a heat conducting structure (such as heat conducting gel) can be arranged between the heat source member of the electronic device and the heat equalizing member 10, so that the heat of the heat source member can be conducted to the heat equalizing member 10. The heat equalizing device 100 can achieve a better heat equalizing and radiating effect, and the thickness D100 of the heat equalizing device 100 can be set to be smaller.

[0133] For the above two electronic devices, the electronic device can be a mobile phone, a tablet computer, a notebook computer, an ultra-mobile personal computer, an electronic book reader, a netbook, a personal digital assistant, a wearable device, an augmented reality (AR) device, a virtual reality (VR) device, a television, a drone, a sports camera, a driving recorder, a vehicle-mounted device, a robot, etc.

[0134] When confirming the heat equalizing device 100 and the electronic device of the embodiments of the present application, it can be analyzed by disassembling the machine, and it is confirmed that the heat equalizing device 100 comprises the heat equalizing member 10 and the coil assembly 20, the inside of the heat equalizing member 10 has the circulating flow channel 11, and the circulating flow channel 11 is filled with heat conducting fluid and magnetic particles 30.

[0135] Finally, it should be noted that: the above is only a specific implementation of the present application, but the protection scope of the present application is not limited to this, any change or replacement within the technical scope disclosed in the present application should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A soaking device, characterized by The application relates to a temperature equalizing device and a coil assembly. The temperature equalizing device has a circulating flow channel in the interior, which is filled with heat-conducting fluid and magnetic particles; the circulating flow channel has a driving section. The coil assembly is arranged on the temperature equalizing device and is arranged opposite the driving section; the magnetic field generated by the coil assembly is used to drive the magnetic particles in the driving section to move along the extension direction of the driving section. The temperature equalizing device is plate-shaped.

2. The soaking device according to claim 1, characterized in that And / or, the temperature equalizing device is a non-magnetic conductive device. The coil assembly comprises at least three electromagnetic coil groups arranged in sequence along the extension direction of the driving section.

3. The soaking device according to claim 1 or 2, characterized in that When the temperature equalizing device is plate-shaped, at least one electromagnetic coil group has two electromagnetic coils, which are arranged on opposite sides of the driving section in the thickness direction of the temperature equalizing device, and the directions of the magnetic fields generated by the two electromagnetic coils are the same.

4. The soaking device according to claim 3, characterized in that Or, when the temperature equalizing device is plate-shaped, at least one electromagnetic coil group has one electromagnetic coil, which is arranged on one side of the driving section in the thickness direction of the temperature equalizing device. When the temperature equalizing device is plate-shaped and at least one electromagnetic coil group has two electromagnetic coils, the two electromagnetic coils are connected in parallel.

5. The soaking device according to claim 4, characterized in that The driving section has a plurality of driving branches which are connected in parallel and arranged side by side, and the coil assembly is arranged opposite the plurality of driving branches.

6. The soaking device according to any one of claims 1 to 5, characterized in that The temperature equalizing device has a hot area and a cold area which are spaced apart, the hot area is arranged close to a heat source, and the driving section is arranged close to the cold area.

7. The soaking device according to any one of claims 1 to 6, characterized in that And / or, the circulating flow channel has a plurality of shunt branches which are connected in parallel. And / or, at least part of the circulating flow channel is bent and extended. The coil assembly is arranged on a circuit board, and the circuit board is arranged on the temperature equalizing device.

8. The soaking device according to any one of claims 1 to 7, characterized in that The electronic device adopts the temperature equalizing device according to any one of claims 1 to 8, and the electronic device has a heat source, and the heat of the heat source can be conducted to the temperature equalizing device.

9. An electronic device, comprising: The electronic device comprises a heat source and the temperature equalizing device according to any one of claims 1 to 8, and the heat of the heat source can be conducted to the temperature equalizing device.

10. An electronic device, comprising: ​