Power supply heat dissipation structure
By introducing coolant channels and a heat dissipation substrate structure made of phase change material into the power supply, the problem of low heat dissipation efficiency under high power density is solved, achieving efficient heat dissipation and extended lifespan of the power supply.
Patent Information
- Application Number
- CN202423192089.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-24
- Publication Date
- 2025-12-26
- Estimated Expiration
- 2034-12-24
AI Technical Summary
Existing power supplies have inefficient heat dissipation structures that cannot meet the heat dissipation requirements under high power density, resulting in a reduced lifespan.
The heat dissipation substrate is equipped with coolant channels and cavities filled with phase change material, combined with parallel heat dissipation pipes and baffles to improve heat dissipation efficiency.
By combining coolant and phase change materials, heat dissipation efficiency is significantly improved, power supply lifespan is extended, and the risk of thermal damage is reduced.
Smart Images
Figure CN223730152U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to power supply technical field especially relates to a power supply heat dissipation structure. BACKGROUND
[0002] In the power supply industry, the power supply miniaturization trend is obvious, the power requirement is high, leads to power density becomes big, heat source concentrates, heat quantity is big, environmental temperature is high, leads to power density sharp increase, heat dissipation difficulty increases.
[0003] At present, the common heat dissipation structure heat dissipation mode is single, and the heat dissipation efficiency is low, so the power supply product cannot meet the present situation, and the service life of the power supply is reduced.
[0004] Summarized above, how to improve the heat dissipation efficiency, and then improve the service life of the power supply is the problem that the present technical personnel in the field urgently solves. UTILITY MODEL CONTENT
[0005] Therefore, the utility model provides a power supply heat dissipation structure, improves the heat dissipation efficiency through the setting of the heat dissipation base plate, and then improves the service life of the power supply.
[0006] To realize the above-mentioned purpose, the utility model provides the following technical scheme:
[0007] A power supply heat dissipation structure, comprising:
[0008] A power supply shell has a containing cavity, and the containing cavity is provided with a circuit board;
[0009] A heat dissipation base plate is arranged in the containing cavity and used for dissipating heat for the circuit board; the heat dissipation base plate is provided with a cavity, the cavity is filled with a phase change material, and the heat dissipation base plate is provided with a liquid inlet channel and a liquid outlet channel in communication, and the liquid inlet opening of the liquid inlet channel and the liquid outlet opening of the liquid outlet channel are arranged on the side wall of the heat dissipation base plate.
[0010] Preferably, the cavity is a hollow cavity arranged in the heat dissipation base plate; a plurality of heat dissipation fins are arranged in the cavity, and the space formed between the adjacent heat dissipation fins is used for filling the phase change material.
[0011] Preferably, each heat dissipation fin is provided with a flow guide groove, so that the spaces between the adjacent heat dissipation fins are in communication.
[0012] Preferably, the number of the flow guide grooves of part of the heat dissipation fins in the plurality of heat dissipation fins is multiple.
[0013] Preferably, the liquid inlet channel is provided with a spoiler and / or the liquid outlet channel is provided with a spoiler.
[0014] Preferably, the heat dissipation substrate is further provided with a first heat dissipation pipeline and a second heat dissipation pipeline arranged in parallel;
[0015] The liquid inlet of the first heat dissipation pipeline and the second heat dissipation pipeline is communicated with the liquid outlet of the liquid inlet channel, and the liquid outlet of the first heat dissipation pipeline and the second heat dissipation pipeline is communicated with the liquid inlet of the liquid outlet channel.
[0016] Preferably, the liquid inlet and the liquid outlet are arranged on the first side wall of the heat dissipation substrate;
[0017] The second side wall of the heat dissipation substrate is provided with a third heat dissipation pipeline, and the side wall of the power supply shell arranged opposite to the second side wall is provided with a fourth heat dissipation pipeline;
[0018] The third heat dissipation pipeline and the fourth heat dissipation pipeline are arranged in parallel;
[0019] The liquid inlet of the third heat dissipation pipeline and the fourth heat dissipation pipeline is communicated with the liquid outlet end of the liquid inlet channel, and the liquid outlet of the third heat dissipation pipeline and the fourth heat dissipation pipeline is communicated with the liquid inlet of the liquid outlet channel.
[0020] Preferably, the heat dissipation substrate is detachably arranged in the accommodating cavity.
[0021] Preferably, the inner wall of the accommodating cavity is provided with a limiting boss, and the heat dissipation substrate is provided with a limiting groove which is clamped on the limiting boss.
[0022] Preferably, the heat dissipation substrate is arranged in the accommodating cavity and divides the accommodating cavity into an upper cavity and a lower cavity.
[0023] The upper surface of the heat dissipation substrate is fixed with one circuit board, and the lower surface of the heat dissipation substrate is fixed with another circuit board.
[0024] As can be seen from the above technical solution, the power supply heat dissipation structure provided by the utility model is provided with a cooling liquid channel and a cavity filled with phase change material on the heat dissipation substrate, wherein the power supply shell is cooled by the cooling liquid channel and the phase change material, so that the heat dissipation efficiency of the power supply heat dissipation structure is greatly improved, and the service life of the product is improved. BRIEF DESCRIPTION OF DRAWINGS
[0025] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the drawings needed to be used in the embodiment or the prior art description will be briefly introduced below, and obviously, the drawings in the following description are only some embodiments of the utility model, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.
[0026] Figure 1 The power supply heat dissipation structure three-dimensional schematic view (one circuit board is installed) provided by the embodiment of the utility model;
[0027] Figure 2 The first power supply heat dissipation structure sectional view (one circuit board is installed) provided by the embodiment of the utility model;
[0028] Figure 3 The heat dissipation structure one schematic view of the heat dissipation base plate provided by the embodiment of the utility model;
[0029] Figure 4 The heat dissipation structure another schematic view of the heat dissipation base plate provided by the embodiment of the utility model;
[0030] Figure 5 The first power supply heat dissipation structure sectional view (two circuit boards are installed) provided by the embodiment of the utility model;
[0031] Figure 6 The structure schematic view of the heat dissipation base plate being provided with a limiting recess provided by the embodiment of the utility model;
[0032] Figure 7 The structure schematic view of the power supply shell being provided with a limiting boss provided by the embodiment of the utility model;
[0033] Figure 8 The schematic view of the third heat dissipation pipeline, the fourth heat dissipation pipeline, the liquid inlet channel and the liquid outlet channel cooperation provided by the embodiment of the utility model;
[0034] Figure 9 The schematic view of the first heat dissipation pipeline, the second heat dissipation pipeline, the third heat dissipation pipeline, the fourth heat dissipation pipeline, the liquid inlet channel and the liquid outlet channel cooperation provided by the embodiment of the utility model;
[0035] Figure 10 The second power supply heat dissipation structure sectional view (one circuit board is installed) provided by the embodiment of the utility model;
[0036] Figure 11 The second power supply heat dissipation structure sectional view (two circuit boards are installed) provided by the embodiment of the utility model.
[0037] The meanings of various reference signs in the drawing are as follows:
[0038] 10 is a power supply shell, 11 is a containing cavity, 12 is a fourth heat dissipation pipeline, 13 is an upper cavity, 14 is a lower cavity, 15 is a first cylinder, 16 is a limiting boss;
[0039] 20 is a circuit board, and 21 is a heating device;
[0040] 30 is a heat dissipation base plate, 31 is a cavity, 311 is a heat dissipation fin, 312 is a flow guide groove, 32 is a liquid inlet channel, 322 is a liquid outlet opening, 321 is a liquid inlet opening, 33 is a liquid outlet channel, 34 is a spoiler, 35 is a first heat dissipation pipeline, 36 is a second heat dissipation pipeline, 37 is a third heat dissipation pipeline, 38 is a limiting groove, 391 is a second cylinder, 392 is a third cylinder, and 393 is a thickening boss.
[0041] 40 is a thermal interface material. DETAILED DESCRIPTION
[0042] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.
[0043] The power supply heat dissipation structure provided in the embodiments of the utility model comprises a power supply shell 10, a circuit board 20, a heat dissipation base plate 30, and a heat dissipation pipeline 40. Figures 1-11 As shown in the drawings, the power supply heat dissipation structure comprises:
[0044] The power supply shell 10 has a containing cavity 11, and the containing cavity 11 is internally provided with the circuit board 20.
[0045] The heat dissipation base plate 30 is arranged in the containing cavity 11 and is used for dissipating heat for the circuit board 20. The heat dissipation base plate 30 is provided with a cavity 31 filled with a phase change material, and the heat dissipation base plate 30 is provided with a liquid inlet channel 32 and a liquid outlet channel 33 in communication. The liquid inlet opening 321 of the liquid inlet channel 32 and the liquid outlet opening 322 of the liquid outlet channel 33 are both arranged on the side wall of the heat dissipation base plate 30.
[0046] In the above technical solution, the cooling liquid sequentially passes through the liquid inlet channel 32 and the liquid outlet channel 33 to dissipate heat for the circuit board 20, and the phase change material in the heat dissipation base plate 30 can absorb the heat energy of the circuit board 20, thereby further improving the heat dissipation efficiency. In the process of phase change of the phase change material at a specific temperature or from a solid state to a liquid state, a large amount of latent heat is absorbed. Of course, the above heat dissipation mode can dissipate heat not only for the circuit board 20 but also for other components of the power supply. In summary, in the technical solution, the cooling liquid channel (i.e., the liquid inlet channel 32 and the liquid outlet channel 33) and the cavity 31 filled with the phase change material are arranged on the heat dissipation base plate 30. The cooling liquid channel and the phase change material are used to dissipate heat for the power supply shell 10, so that the heat dissipation efficiency of the power supply heat dissipation structure is greatly improved, and the service life of the product is improved.
[0047] In one possible implementation, as shown in Figure 3 and Figure 4As shown, the cavity 31 is a hollow cavity arranged inside the heat dissipation substrate 30; a plurality of heat dissipation fins 311 are arranged in the cavity 31, and spaces between adjacent heat dissipation fins 311 are used to fill phase change materials, so that the phase change materials are uniformly arranged on the heat dissipation substrate 30, and the heat dissipation substrate 30 can uniformly dissipate heat. Meanwhile, the arrangement of the heat dissipation fins 311 further improves the heat dissipation efficiency of the power supply heat dissipation structure. In actual application, the heat dissipation fins 311 can be increased according to the heat dissipation amount and heat conduction path requirements, and the direction, thickness and spacing of the heat dissipation fins 311 can be adjusted. As a preferred, the plurality of heat dissipation fins 311 are uniformly and spacedly arranged.
[0048] The above technical solutions are optimized, for example, Figure 3 and Figure 4 Each heat dissipation fin 311 is provided with a flow guide groove 312, so that the spaces between adjacent heat dissipation fins 311 are communicated with each other. In this way, after the phase change material is liquefied, it can flow in the spaces between the heat dissipation fins 311, so as to increase the heat conduction rate and improve the heat dissipation performance. The phase change material includes but is not limited to crystalline hydrated salt, molten salt and metal alloy, etc. As a preferred, the flow guide grooves 312 are arranged along the spacing direction of the heat dissipation fins 311.
[0049] The above technical solutions are further optimized. The number of the flow guide grooves 312 of some of the plurality of heat dissipation fins 311 is multiple. In actual application, the heat dissipation fin 311 provided with multiple flow guide grooves 312 is arranged in a heat concentration area (for example, the bottom of the heat generating device 21 of the circuit board). In this way, after the phase change material is liquefied by absorbing heat, it can flow through the multiple flow guide grooves 312, and then quickly dissipate heat in the heat concentration area.
[0050] In one possible implementation, as shown in Figure 3 The liquid inlet channel 32 is provided with a turbulence plate 34 and / or the liquid outlet channel 33 is provided with a turbulence plate 34. The turbulence plate 34 is arranged in the channel, so as to increase the turbulence ratio of the cooling liquid and improve the heat dissipation performance. As a preferred, the liquid inlet channel 32 and the liquid outlet channel 33 are arranged inside the heat dissipation substrate 30.
[0051] In one possible implementation, as shown in Figure 3 and Figure 4 The heat dissipation substrate 30 is further provided with a first heat dissipation pipeline 35 and a second heat dissipation pipeline 36 arranged in parallel. As a preferred, the length of the first heat dissipation pipeline 35 is consistent with the length of the second heat dissipation pipeline 36.
[0052] The liquid inlets of the first heat dissipation pipeline 35 and the second heat dissipation pipeline 36 are communicated with the liquid outlet of the liquid inlet channel 32, and the liquid outlets of the first heat dissipation pipeline 35 and the second heat dissipation pipeline 36 are communicated with the liquid inlet of the liquid outlet channel 33.
[0053] In the above technical solution, the cooling liquid flows through the parallel first heat dissipation pipeline 35 and the second heat dissipation pipeline 36 through the liquid inlet channel 32 and flows out from the liquid outlet channel 33, and the cooling liquid carries away heat during the flowing process, thereby playing a heat dissipation role; as preferred, the first heat dissipation pipeline 35 and the second heat dissipation pipeline 36 are both curved, so as to increase the heat conduction rate and improve the heat dissipation performance; as preferred, the first heat dissipation pipeline 35 and the second heat dissipation pipeline 36 can be arranged according to the heat generation point distribution, the heat dissipation amount distribution and the heat conduction path, and a plurality of first heat dissipation pipelines 35 and second heat dissipation pipelines 36 can be arranged.
[0054] In one possible implementation, as shown in Figure 4 and Figure 8 the liquid inlet opening 321 and the liquid outlet opening 322 are both arranged on the first side wall of the heat dissipation substrate 30;
[0055] The second side wall of the heat dissipation substrate 30 is provided with a third heat dissipation pipeline 37, and the side wall of the power supply shell 10 opposite to the second side wall is provided with a fourth heat dissipation pipeline 12;
[0056] The third heat dissipation pipeline 37 and the fourth heat dissipation pipeline 12 are arranged in parallel, and as preferred, the length of the third heat dissipation pipeline 37 is consistent with the length of the fourth heat dissipation pipeline 12;
[0057] The liquid inlet of the third heat dissipation pipeline 37 and the fourth heat dissipation pipeline 12 is communicated with the liquid outlet end of the liquid inlet channel 32, and the liquid outlet of the third heat dissipation pipeline 37 and the fourth heat dissipation pipeline 12 is communicated with the liquid inlet of the liquid outlet channel 33.
[0058] In the above technical solution, the cooling liquid flows through the parallel third heat dissipation pipeline 37 and the fourth heat dissipation pipeline 12 through the liquid inlet channel 32 and flows out from the liquid outlet channel 33, and the cooling liquid carries away heat during the flowing process; as preferred, the other side walls of the power supply shell 10 can be provided with heat dissipation pipelines communicated with the liquid inlet channel 32 and the liquid outlet channel 33; further, a plurality of third heat dissipation pipelines 37 and fourth heat dissipation pipelines 12 can be arranged.
[0059] In one technical solution, the cooling liquid flows out from the liquid inlet channel 32 and flows in two ways, one way flows to the parallel first heat dissipation pipeline 35 and the second heat dissipation pipeline 36 and flows out from the liquid outlet channel 33, and the other way flows to the parallel third heat dissipation pipeline 37 and fourth heat dissipation pipeline 12 and flows out from the liquid outlet channel 33, so as to further improve the heat dissipation efficiency of the power supply heat dissipation structure, and in the technical solution, the heat dissipation pipeline is used to reduce the temperature of the power supply shell 10 and establish a temperature gradient with the circuit board 20, so as to transfer the heat of the circuit board 20 to the power supply shell 10, thereby achieving the heat dissipation purpose.
[0060] In one possible implementation, as shown in Figure 2As shown, the accommodating cavity 11 is mounted and fixed to the circuit board 20 through the first fixing structure, and thus arranged, the circuit board 20 can be better fixed, as preferred, the first fixing structure includes a plurality of first cylinders 15 arranged on the upper surface of the bottom of the accommodating cavity 11, and the top surface of the first cylinder 15 is used to fix the circuit board 20; of course, the first cylinder 15 can quickly transfer heat to the heat dissipation base plate 30.
[0061] In a possible embodiment, as shown in Figure 6 and Figure 7 As shown, the heat dissipation base plate 30 is detachably arranged in the accommodating cavity 11. In the technical solution, the heat dissipation base plate can be designed as a separate heat dissipation base plate, which is separately detached and replaced, and different phase change heat dissipation structures and liquid cooling heat dissipation structures are designed according to the heat dissipation amount and heat conduction path requirements, and the separate heat dissipation base plate is replaced according to different working conditions of the power supply, so that the use of the power supply heat dissipation structure is more extensive; in addition, according to the heat generation area distribution of the circuit board 20, the heat dissipation base plate 30 can be made of a material with higher thermal conductivity, reducing product cost, flexibly controlling product weight, and the detachable heat dissipation base plate can be made of a material different from the circuit board shell.
[0062] The above technical solution is optimized, the inner wall of the accommodating cavity 11 is provided with a limiting boss 16, the heat dissipation base plate 30 is provided with a limiting groove 38, the limiting groove 38 is connected with the limiting boss 16, so that the heat dissipation base plate 30 and the accommodating cavity 11 are detachable, and the disassembly speed is improved; in addition, the connection between the heat dissipation base plate 30 and the accommodating cavity 11 also includes but is not limited to screw thread fastening connection, welding or cold pressing, etc.
[0063] In a possible embodiment, as shown in Figure 5 The heat dissipation base plate 30 is arranged in the accommodating cavity 11 and divides it into an upper cavity 13 and a lower cavity 14,
[0064] The upper surface of the heat dissipation base plate 30 is fixed with a circuit board 20, and the lower surface of the heat dissipation base plate 30 is fixed with another circuit board 20, the heat dissipation base plate 30 is arranged in the accommodating cavity 11, and the two circuit boards 20 can be cooled at the same time.
[0065] The above technical solution is optimized, as shown in Figure 5 In order to better fix the circuit board 20, the upper surface of the heat dissipation base plate 30 is fixed with a circuit board 20 through a second cylinder 391, and the upper surface of the heat dissipation base plate 30 is fixed with another circuit board 20 through a third cylinder 392, and further, the second cylinder 391, the third cylinder 392 and the heat dissipation base plate 30 are integrally formed.
[0066] The technical features mentioned above, the technical features mentioned below, and the technical features shown in the drawings alone can be combined with each other arbitrarily, as long as the technical features combined are not contradictory to each other. All feasible combinations of features are explicitly described herein. Any one of the multiple sub-features contained in the same sentence can be applied independently, and does not have to be applied together with other sub-features.
[0067] The present solution will be further described below in combination with specific embodiments:
[0068] In an embodiment, a power supply heat dissipation structure includes a power supply shell 10 and a heat dissipation substrate 30. Hollow cavities can be provided with heat dissipation fins 311 according to heat dissipation and heat conduction path requirements, thereby increasing the heat conduction rate and improving the heat dissipation performance. The liquid cooling heat dissipation structure (including an inlet liquid passage 32 and an outlet liquid passage 33) is a hollow pipeline structure. The hollow pipeline structure can be provided with turbulence vanes 34 according to heat dissipation and heat conduction path requirements, thereby increasing the turbulence ratio of the refrigerant and improving the heat dissipation performance. In Figure 1 For convenience of marking, one opening is marked as an outlet liquid opening 322, and the other is marked as an inlet liquid opening 321. In actual use, the positions marked in the figure can be interchanged (i.e., the position marked as the inlet liquid opening 321 is the outlet liquid opening, and the position marked as the inlet liquid opening 321 is the outlet liquid opening). In Figure 3 , the markings of the inlet liquid passage 32 and the outlet liquid passage 33 are the same as above.
[0069] In a second embodiment, the heat dissipation pipeline structure is arranged in the heat dissipation substrate 30 and can also be arranged in the power supply shell 10, such as the side wall of the accommodating cavity 11, to enhance the overall heat exchange rate of the power supply shell and improve the heat dissipation performance. As a preferred arrangement, the heat dissipation substrate 30 and the circuit board 20 are arranged in close contact, the length of the short heat conduction path is reduced, the heat conduction rate is increased, and the heat dissipation performance is improved.
[0070] In a third embodiment, the heat dissipation substrate 30 can be designed as a separate heat dissipation substrate. Different materials are selected according to the product weight and heat dissipation requirements, to meet the requirements of lightweight and high power density, while meeting the design requirements of miniaturization. One or more heat dissipation substrates 30 are arranged on the outside of the power supply shell to assist in heat dissipation of the heat source.
[0071] In the fourth embodiment, the wall thickness of the heat dissipation fin 311 is preferably 1.5 mm, the wall thickness between the cavity 31 and the liquid inlet channel 32 or the liquid outlet channel 33 is greater than or equal to 4 mm, the wall thickness between the outer side wall of the heat dissipation substrate 30 and the liquid inlet channel 32 or the liquid outlet channel 33 is greater than or equal to 4 mm, the heat dissipation substrate 30 can be optionally made of high thermal conductivity red copper as the base material (for the purpose of improving the heat dissipation efficiency), and the surface is subjected to the overall nickel plating surface treatment process (for the purpose of avoiding the electric power corrosion in the actual use process), so as to improve the heat dissipation efficiency and avoid the electric power corrosion caused by the potential difference between different metals.
[0072] In the fifth embodiment, as shown in Figure 10 and Figure 11 , the circuit board 20 itself is distributed with a plurality of heat generating devices 21, the design idea of the refrigerant channel in the heat dissipation substrate 30 is to closely contact all the heat generating devices 21, and the design idea of the phase change material is to cover all the heat generating devices 21; wherein some heat generating devices 21 of the circuit board 20 are low in height (it can be understood that the distance between the heat dissipation substrate 30 and the heat generating device 21 is large), the heat dissipation substrate 30 is provided with a thickened boss 393, the thickened boss 393 is used for cooperating with the heat generating device 21 which is low in height, so as to reduce the height distance between the heat dissipation substrate and the heat generating device 21; in addition, the gap between the heat generating device 21 and the heat dissipation substrate 30 is filled with the heat conductive interface material 40, so as to reduce the interface thermal resistance and enhance the heat dissipation effect; it also needs to be explained that a plurality of heat dissipation pipelines can be arranged according to the arrangement position of the heat generating device 21.
[0073] The working process of the technical solution is as follows:
[0074] When the power supply product works, the circuit board 20 continuously generates heat, and the phase change material absorbs a large amount of latent heat in the process of changing from solid to liquid at a specific temperature; when it is necessary to improve the continuous heat dissipation effect of the power supply body, the cooling liquid sequentially passes through the liquid inlet channel 32 and the liquid outlet channel 33 to dissipate heat for the circuit board 20, so as to effectively improve the heat dissipation effect of the power supply, prolong the service life and reduce the risk of thermal damage.
[0075] Compared with the prior art, the technical solution has the beneficial effects that:
[0076] 1. Integrated design, through the liquid cooling / phase change two heat dissipation modes, the various heat dissipation requirements such as long time high power work and extremely short time high power work are met, the space and cost are saved;
[0077] 2. The phase change cavity is sealed, the liquid cooling channel can be surface treated, the maintenance is convenient, and the maintenance cost is low.
[0078] The various embodiments in the specification are described in a progressive manner, and each embodiment focuses on the difference from other embodiments. The same or similar parts of each embodiment can be mutually referred to.
[0079] The above description of disclosed embodiments enables one of ordinary skill in the art to make or use the application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein can be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A power supply heat dissipation structure, characterized by comprising: The utility model relates to a power supply shell (10) with containing cavity (11) is installed with circuit board (20) in containing cavity (11), heat dissipation base plate (30) is arranged in containing cavity (11) for the heat dissipation of circuit board (20), heat dissipation base plate (30) is equipped with cavity (31), and cavity (31) is filled with phase change material, and heat dissipation base plate (30) has the liquid inlet channel (32) and liquid outlet channel (33) of intercommunication, and the liquid inlet opening (321) of liquid inlet channel (32) and the liquid outlet opening (322) of liquid outlet channel (33) are all set up in the side wall of heat dissipation base plate (30). The cavity (31) is a hollow cavity arranged inside the heat dissipation base plate (30); a plurality of heat dissipation fins (311) are arranged in the cavity (31), and the space between adjacent heat dissipation fins (311) is used to fill the phase change material. Each of the heat dissipation fins (311) is provided with a flow guide groove (312) to make the space between adjacent heat dissipation fins (311) communicate with each other.
2. The power supply heat dissipation structure according to claim 1, wherein The number of the flow guide grooves (312) of some of the heat dissipation fins (311) in the plurality of heat dissipation fins (311) is multiple.
3. The power supply heat dissipation structure according to claim 2, wherein The liquid inlet channel (32) is provided with a spoiler (34) and / or the liquid outlet channel (33) is provided with a spoiler (34).
4. The power supply heat dissipation structure according to claim 3, wherein The heat dissipation base plate (30) is further provided with a first heat dissipation pipeline (35) and a second heat dissipation pipeline (36) arranged in parallel; 5. The power supply heat dissipation structure according to claim 1, wherein The liquid inlet of the first heat dissipation pipeline (35) and the second heat dissipation pipeline (36) communicates with the liquid outlet of the liquid inlet channel (32), and the liquid outlet of the first heat dissipation pipeline (35) and the second heat dissipation pipeline (36) communicates with the liquid inlet of the liquid outlet channel (33).
6. The power supply heat dissipation structure of claim 1, wherein The liquid inlet opening (321) and the liquid outlet opening (322) are both arranged on the first side wall of the heat dissipation base plate (30); The second side wall of the heat dissipation base plate (30) is provided with a third heat dissipation pipeline (37), and the side wall of the power supply shell (10) opposite to the second side wall is provided with a fourth heat dissipation pipeline (12); 7. The power supply heat dissipation structure of claim 1, wherein The third heat dissipation pipeline (37) and the fourth heat dissipation pipeline (12) are arranged in parallel; The liquid inlet of the third heat dissipation pipeline (37) and the fourth heat dissipation pipeline (12) communicates with the liquid outlet end of the liquid inlet channel (32), and the liquid outlet of the third heat dissipation pipeline (37) and the fourth heat dissipation pipeline (12) communicates with the liquid inlet of the liquid outlet channel (33). The heat dissipation base plate (30) is detachably arranged in the containing cavity (11). The inner wall of the containing cavity (11) is provided with a limiting boss (16), and the heat dissipation base plate (30) is provided with a limiting groove (38) which is clamped on the limiting boss (16).
8. The power supply heat dissipation structure of claim 1, wherein, The heat dissipation base plate (30) is arranged in the containing cavity (11) and divides it into an upper cavity (13) and a lower cavity (14).
9. The power supply heat dissipation structure according to claim 8, wherein 10. The power supply heat dissipation structure of claim 1, wherein, The heat-dissipating substrate (30) has one of the circuit boards (20) fixed on the upper surface and another of the circuit boards (20) fixed on the lower surface.