Test board card assembly

Abstract

The utility model relates to a test board card assembly. The test board card assembly comprises a service board, a control board and a liquid cooling board for cooling the service board and the control board. And the liquid cooling plate comprises a first liquid cooling area for cooling the service plate and a second liquid cooling area for cooling the control plate. And a height difference exists between the same side surfaces of the first liquid cooling area and the second liquid cooling area. A first flow channel is arranged in the first liquid cooling area, a second flow channel is arranged in the second liquid cooling area, and a height difference exists between the first flow channel and the second flow channel. A communication channel for communicating the first flow channel with the second flow channel is arranged in the liquid cooling plate, so that cooling liquid flows in the first flow channel and the second flow channel in a communicating manner. According to the test board card assembly provided by the invention, one liquid cooling board simultaneously meets the contact heat dissipation requirements of the service board and the control board, the heat dissipation effect is improved, and the heat dissipation efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor testing, in particular to a test board card assembly. BACKGROUND

[0002] When the test board card is working, the components on the test board card generate a large amount of heat, and the heat needs to be dissipated in time to ensure the normal operation of the test board card, so the test board card needs to be provided with a heat dissipation component for heat dissipation. At present, water-cooled plate heat dissipation is a better heat dissipation mode for test board card heat dissipation due to its high heat dissipation efficiency and compact layout. However, with the increase of the integration of the test board card, the arrangement of the water-cooled plate becomes difficult. For example, at present, some test board cards include a main control board and multiple functional boards, and the multiple functional boards all need to be plugged and matched with the main control board by using an electrical connector, so that the functional boards and the main control board often need to be arranged on different height planes, so that a single water-cooled plate cannot contact and dissipate heat with the functional boards and the main control board at the same time. In view of this problem, in the current technology, the water-cooled plate is usually used to contact and dissipate heat with the functional boards, and a heat pipe heat dissipation plate is used to conduct the heat of the main control board to the water-cooled plate for heat dissipation. However, the heat transfer path of this heat dissipation scheme has a large thermal resistance, and the heat dissipation efficiency is low and the effect is poor. For a high-power test board card, the heat dissipation performance is not ideal.

[0003] In view of this, it is necessary to propose a new technical scheme to overcome the deficiencies in the prior art. CONTENT OF THE INVENTION

[0004] Based on this, the present application provides a test board card assembly to solve the problem that the liquid cooling plate cannot cover the control board, resulting in an unsatisfactory heat dissipation effect on the control board.

[0005] To this end, the present application adopts the following technical scheme: a test board card assembly, comprising a service board, a control board, and a liquid cooling plate for dissipating heat from the service board and the control board, the liquid cooling plate comprising a first liquid cooling area for dissipating heat from the service board and a second liquid cooling area for dissipating heat from the control board, the same side surfaces of the first liquid cooling area and the second liquid cooling area having a height difference, the first liquid cooling area being provided with a first flow channel inside, the second liquid cooling area being provided with a second flow channel inside, the first flow channel and the second flow channel having a height difference, and the liquid cooling plate being provided with a communication passage communicating the first flow channel and the second flow channel, so that the cooling liquid flows in communication in the first flow channel and the second flow channel.

[0006] In some embodiments, the liquid cooling plate comprises an upper layer plate, a middle layer plate, and a lower layer plate, the upper layer plate covering the middle layer plate to form the second liquid cooling area, and the lower layer plate covering the middle layer plate to form the first liquid cooling area.

[0007] In some embodiments, the first flow channel is arranged on a surface of the lower layer plate facing the middle layer plate, and the second flow channel is arranged on a surface of the upper layer plate facing the middle layer plate.

[0008] Alternatively, the first flow channel and the second flow channel are arranged on opposite surfaces of the middle layer plate.

[0009] In some embodiments, the communication passage is arranged on the middle layer plate and penetrates through opposite surfaces of the middle layer plate.

[0010] In some embodiments, the area of the middle layer plate is greater than the area of the upper layer plate and the area of the lower layer plate, and a first concave-convex heat dissipation part is arranged at a region of the middle layer plate that is not covered by the upper layer plate and the lower layer plate, and is used to contact heat dissipation components on the service board and the control board.

[0011] In some embodiments, a second concave-convex heat dissipation part is arranged on the exposed surface of the upper layer plate and / or the lower layer plate.

[0012] In some embodiments, two communication passages are arranged at intervals, the first flow channel is arranged in two parts, and the second flow channel is a continuous flow channel, which is in communication with the two parts of the first flow channel through the two communication passages.

[0013] In some embodiments, a liquid inlet and a liquid outlet are arranged on the lower layer plate, the liquid inlet is in communication with one of the two parts of the first flow channel, and the liquid outlet is in communication with the other part of the first flow channel.

[0014] In some embodiments, the service board includes two pieces arranged on opposite surfaces of the first liquid cooling area, and the control board includes one piece arranged on a surface of the second liquid cooling area; wherein a heat conduction plate is arranged on a side of the service board and the control board away from the liquid cooling plate, respectively, to sandwich the service board and the control board between the heat conduction plate and the liquid cooling plate, the heat conduction plate is connected and fixed with the liquid cooling plate, and a heat conduction interface material is arranged between edges of the two.

[0015] In some embodiments, a first heat conduction plate is arranged on a side of the service board away from the liquid cooling plate, and the first heat conduction plate covers the service board; and / or,

[0016] a second heat conduction plate is arranged on a side of the control board away from the liquid cooling plate, and the second heat conduction plate covers the control board.

[0017] In the test board assembly provided in the application, the liquid cooling plate includes a first liquid cooling area for dissipating heat of the service board and a second liquid cooling area for dissipating heat of the control board, and the same side surfaces of the first liquid cooling area and the second liquid cooling area have a height difference to adapt to contact and dissipate heat with the circuit boards at different heights respectively; wherein the first liquid cooling area is internally provided with a first flow channel, the second liquid cooling area is internally provided with a second flow channel, the first flow channel and the second flow channel have a height difference, and the liquid cooling plate is internally provided with a communication channel communicating the first flow channel and the second flow channel, so that the cooling liquid flows in the first flow channel and the second flow channel in communication, that is, the flow channels at different heights are communicated and controlled, so that one liquid cooling plate can simultaneously meet the contact heat dissipation requirements of the service board and the control board, improve the heat dissipation effect, and improve the heat dissipation efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor.

[0019] Figure 1 It is a perspective exploded view of an embodiment of the test board assembly of the application.

[0020] Figure 2 It is a perspective exploded view of another view of an embodiment of the test board assembly of the application.

[0021] Figure 3 It is a perspective assembly view of the liquid cooling plate in an embodiment of the test board assembly of the application.

[0022] Figure 4 It is a perspective exploded view of the liquid cooling plate in an embodiment of the test board assembly of the application.

[0023] Figure 5 It is a perspective exploded view of another view of the liquid cooling plate in an embodiment of the test board assembly of the application.

[0024] The element reference numbers are as follows: 100, test board assembly; 1, liquid cooling plate; 101, first liquid cooling area; 102, second liquid cooling area; 11, middle layer plate; 110, upper surface; 111, first concave-convex heat dissipation part; 112, communication channel; 114, lower surface; 12, upper layer plate; 121, second flow channel; 13, lower layer plate; 131, first flow channel; 1311, first section; 1312, second section; 132, liquid inlet; 133, liquid outlet; 135, second concave-convex heat dissipation part; 2, service board; 3, control board; 4, first heat conduction plate; 5, second heat conduction plate. DETAILED DESCRIPTION

[0025] To make the above objectives, features and advantages of the present application more clear, the specific embodiments of the present application will be described in detail below with reference to the drawings. Numerous specific details will be set forth in the following description in order to provide a thorough understanding of the present application. However, it will be appreciated by those skilled in the art that the present application can be practiced in a variety of ways beyond the specific details set forth in the description below, which are presented for purposes of example and explanation and not for limitation of the present application.

[0026] It is to be noted that when an element or layer is referred to as being "on" or "connected to" another element or layer, it can be directly on or connected to the other element or layer, or intervening elements or layers can be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements or layers present. The use of the terms "on" and "connected to" in the present description are to be construed in the broadest sense and can include over, under, or adjacent.

[0027] In addition, the terms "first", "second", etc. are used herein only to describe various elements, but do not imply or suggest relative importance or a quantity of the indicated elements. Thus, the features defined with "first", "second" can include at least one of the features explicitly or implicitly. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly specified.

[0028] In the present application, unless otherwise explicitly specified and limited, the "on", "under", "above" and "over" of a first feature to a second feature can be that the first feature is directly in contact with the second feature, or the first feature is indirectly in contact with the second feature through an intermediate medium. Moreover, the "on", "above" and "over" of a first feature to a second feature can be that the first feature is directly above or obliquely above the second feature, or only means that the first feature is horizontally higher than the second feature. The "under", "below" and "under" of a first feature to a second feature can be that the first feature is directly below or obliquely below the second feature, or only means that the first feature is horizontally lower than the second feature.

[0029] Unless otherwise defined, all technical and scientific terms used in the present application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application is only for the purpose of describing specific embodiments and is not intended to limit the present application. The term "and / or" used in the description of the present application includes any and all combinations of one or more of the associated listed items.

[0030] Please refer to Figures 1 to 5As shown, the application provides a test board card assembly 100. The test board card assembly 100 comprises a service board 2, a control board 3 and a liquid cooling board 1 for dissipating heat from the service board 2 and the control board 3. The liquid cooling board 1 comprises a first liquid cooling area 101 for dissipating heat from the service board 2 and a second liquid cooling area 102 for dissipating heat from the control board 3. The first liquid cooling area 101 and the second liquid cooling area 102 have a height difference between their same-side surfaces. The first liquid cooling area 101 is internally provided with a first flow channel 131 and the second liquid cooling area 102 is internally provided with a second flow channel 121. The first flow channel 131 and the second flow channel 121 have a height difference. The liquid cooling board 1 is internally provided with a communication passage 112 for communicating the first flow channel 131 and the second flow channel 121, so that the cooling liquid can flow in the first flow channel 131 and the second flow channel 121 in communication.

[0031] In the test board card assembly 100 provided by the application, the liquid cooling board 1 comprises the first liquid cooling area 101 and the second liquid cooling area 102 with a height difference, so that multiple circuit boards at different heights can be in contact with the liquid cooling board 1 for heat dissipation. The flow channels in the first liquid cooling area 101 and the second liquid cooling area 102 are communicated through the communication passage 112, so that the cooling liquid can flow in the first flow channel 131 and the second flow channel 121 in communication, i.e. the flow channels at different heights are communicated and controlled, so that one liquid cooling board 1 can simultaneously meet the contact heat dissipation requirements of the service board 2 and the control board 3, improve the heat dissipation effect and improve the heat dissipation efficiency.

[0032] Please refer to Figures 3 to 5 As shown, in the embodiment, the liquid cooling board 1 comprises an upper layer board 12, a middle layer board 11 and a lower layer board 13. The upper layer board 12 and the lower layer board 13 are located on opposite sides of the middle layer board 11. The area of the middle layer board 11 is greater than the area of the upper layer board 12 and also greater than the area of the lower layer board 13. In other words, the upper layer board 12 and the lower layer board 13 each only cover a part of the middle layer board 11, and the middle layer board 11 has an exposed part compared with the upper layer board 12 and the lower layer board 13. In the embodiment, the upper layer board 12, the middle layer board 11 and the lower layer board 13 are welded and fixed as a whole, for example, by vacuum brazing. Of course, in other embodiments, the three layer boards can also be connected in other sealing ways, as long as the cooling liquid inside can not leak.

[0033] Please refer to Figure 4 and Figure 5 As shown, in the embodiment, the middle layer board 11 is substantially a rectangular plate, and of course in other embodiments it can also be other shapes. The middle layer board 11 has an upper surface 110 and a lower surface 114 opposite to the upper surface 110. The middle layer board 11 is provided with a first concave-convex heat dissipation part 111 at the area on the opposite surfaces which is not covered by the upper layer board 12 and the lower layer board 13, for contacting the heat dissipation components on the service board 2 and the control board 3. As shown, Figure 4As shown, a portion of the upper surface 110 is provided with the first concave-convex heat dissipation part 111, and another portion is a substantially flat plane. The portion of the upper surface 110 provided with the first concave-convex heat dissipation part 111 is the portion exposed to the upper layer plate 12, i.e., the portion forming the first liquid cooling area 101. The portion of the upper surface 110 provided with the first concave-convex heat dissipation part 111 is in contact with the heat dissipation components on the service board 2 for heat dissipation. The portion of the upper surface 110 not provided with the first concave-convex heat dissipation part 111, i.e., the portion of the flat plane of the upper surface 110, is covered by the upper layer plate 12 to form the second liquid cooling area 102. As shown in the figure, Figure 5 As shown, similar to the upper surface 110, a portion of the lower surface 114 is provided with the first concave-convex heat dissipation part 111, and another portion is a substantially flat plane. Moreover, the portion of the lower surface 114 provided with the first concave-convex heat dissipation part 111 is arranged in a staggered manner with the portion of the upper surface 110 provided with the first concave-convex heat dissipation part 111, and the portion of the lower surface 114 that is a flat plane is arranged in a staggered manner with the portion of the upper surface 110 that is a flat plane. In other words, the first concave-convex heat dissipation part 111 on the lower surface 114 is arranged directly below the portion of the upper surface 110 that is a flat plane, and the portion of the lower surface 114 that is a flat plane is arranged directly below the first concave-convex heat dissipation part 111 on the upper surface 110. The portion of the lower surface 114 provided with the first concave-convex heat dissipation part 111 is the portion exposed to the lower layer plate 13, i.e., the portion forming the second liquid cooling area 102. The portion of the lower surface 114 provided with the first concave-convex heat dissipation part 111 is used to contact the heat dissipation components on another service board 2 for heat dissipation. The portion of the lower surface 114 not provided with the first concave-convex heat dissipation part 111, i.e., the portion that is a substantially flat plane, is covered by the lower layer plate 13 to form the second liquid cooling area 102. The heat dissipation components on the control board 3 and the service board 2 include circuit components with large heat generation, such as chips, power devices, inductors, capacitors, etc.

[0034] The middle layer plate 11 is provided with a communication passage 112 penetrating through the opposite surfaces of the middle layer plate 11. That is, the communication passage penetrates through the upper surface 110 and the lower surface 114 of the middle layer plate 11. The communication passage 112 is arranged at the boundary between the first liquid cooling area 101 and the second liquid cooling area 102 to allow the cooling liquid to flow between the first liquid cooling area 101 and the second liquid cooling area 102. In this embodiment, the communication passage 112 is specifically two through holes vertically penetrating through the middle layer plate 11, and the two through holes have a spacing therebetween. One of the two through holes is used for the cooling liquid to flow from the first liquid cooling area 101 to the second liquid cooling area 102, and the other is used for the cooling liquid to flow from the second liquid cooling area 102 back to the first liquid cooling area 101. In this embodiment, the communication passage 112 vertically penetrates through the middle layer plate 11 in the up-down direction, and the first liquid cooling area 101 and the second liquid cooling area 102 have a certain overlap at the boundary. In other embodiments, the communication passage 112 can also be arranged to extend obliquely.

[0035] Please continue to seeFigure 4 The lower layer plate 13 covers the planar portion of the lower surface 114 of the middle layer plate 11, and a first flow channel 131 is formed between the two. In the present embodiment, the first flow channel 131 is provided on the surface of the lower layer plate 13 facing the middle layer plate 11; in other embodiments, the first flow channel 131 can also be provided on the lower surface 114 of the middle layer plate 11. The first flow channel 131 is a groove structure provided on the lower layer plate 13, and a plurality of fin structures, turbulence structures, etc. can be provided in the first flow channel 131 to increase the heat exchange area and enhance the heat exchange performance. The overall flow direction of the first flow channel 131 can be provided as a curved, circuitous structure to increase the cooling liquid flow path and enhance the heat exchange performance. In the present embodiment, the first flow channel 131 is provided in two parts, i.e. the first flow channel 131 includes a first section 1311 and a second section 1312, and the first section 1311 and the second section 1312 are not directly connected. In the present embodiment, the first section 1311 is relatively short and extends in a substantially straight line, and the second section 1312 is relatively long and extends in a circuitous manner. The lower layer plate 13 is provided with an inlet 132 and an outlet 133, the inlet 132 is connected to one of the two parts of the first flow channel 131, and the outlet 133 is connected to the other of the two parts of the first flow channel 131. In the present embodiment, the inlet 132 is connected to the outer end of the first section 1311, the outlet 133 is connected to the outer end of the second section 1312, the inner end of the first section 1311 is connected to one of the two connection channels 112, and the inner end of the second section 1312 is connected to the other of the two connection channels 112. In the present embodiment, the inlet 132 and the outlet 133 are provided on the same end of the same component, i.e. the lower layer plate 13, which facilitates the arrangement of the cooling liquid circulation system and the connection of the pipelines.

[0036] Please refer to Figure 5 The surface of the lower layer plate 13 facing away from the middle layer plate 11, i.e. the surface opposite to the surface provided with the first flow channel 131, is provided with a second concave-convex heat dissipation portion 135. The surface of the lower layer plate 13 provided with the second concave-convex heat dissipation portion 135 is the exposed surface of the lower layer plate 13. In some embodiments, when the service board 2 has two boards, the surface of the lower layer plate 13 is used to contact and dissipate heat with one of the service boards 2, and the second concave-convex heat dissipation portion 135 is used to contact and dissipate heat with the components on the service board 2 that need to be cooled, so as to enhance the heat dissipation effect.

[0037] Please continue to refer to Figure 5As shown, the upper layer plate 12 covers the planar portion of the upper surface 110 of the middle layer plate 11, and a second flow channel 121 is formed between the two. In the present embodiment, the second flow channel 121 is provided on the surface of the upper layer plate 12 facing the middle layer plate 11; in other embodiments, the second flow channel 121 can also be provided on the upper surface 110 of the middle layer plate 11. The second flow channel 121 is a groove structure provided on the upper layer plate 12, and a plurality of fin structures, turbulence structures, etc. can be provided therein to increase the heat exchange area and enhance the heat exchange performance. The overall flow direction of the second flow channel 121 can be provided as a curved, circuitous structure to increase the cooling liquid flow path and enhance the heat exchange performance. In the present embodiment, the second flow channel 121 is a continuous flow channel, and the second flow channel 121 is in communication with the two portions of the first flow channel 131 through two communication passages 112, respectively. Specifically, the continuous flow channel has two end portions, and the two end portions are in communication with the two communication passages 112, respectively, so that the second flow channel 121 and the first flow channel 131 form a complete flow channel.

[0038] When the cooling liquid is provided into the liquid cooling plate 1, the cooling liquid is input into the first section 1311 of the first flow channel 131 from the liquid inlet 132, passes through the inner side end of the first section 1311 into the second flow channel 121 through the communication passage 112; the cooling liquid flows in the second flow channel 121 from one end to the other end, and then passes through the communication passage 112 into the second section 1312 of the first flow channel 131; the cooling liquid flows in the second section 1312 of the first flow channel 131 to the outer side end of the second section 1312, and flows out of the liquid cooling plate 1 from the liquid outlet 133. The heat dissipation of the circuit board arranged on the first liquid cooling area 101 and the second liquid cooling area 102 is achieved. In the present embodiment, the exposed surface of the upper layer plate 12 is not arranged with components that need to be cooled, and thus the exposed surface of the upper layer plate 12 is planar and is not provided with the second concave-convex heat dissipation portion 135. In other embodiments, the exposed surface of the upper layer plate 12 can also be provided with the second concave-convex heat dissipation portion 135 to cool the components arranged thereon.

[0039] Please refer again to Figure 1 and Figure 2 As shown, in the present embodiment, the service board 2 includes two pieces, which are arranged on the opposite surfaces of the first liquid cooling area 101, and the control board 3 includes one piece, which is arranged on one surface of the second liquid cooling area 102. Specifically, one of the two pieces of the service board 2 is in contact with the surface area of the upper surface 110 of the middle layer plate 11 on which the first concave-convex heat dissipation portion 111 is arranged, and the other piece is in contact with the surface of the lower layer plate 13 on which the second concave-convex heat dissipation portion 135 is arranged. One piece of the control board 3 is in contact with the surface area of the lower surface 114 of the middle layer plate 11 on which the first concave-convex heat dissipation portion 111 is arranged.

[0040] Further, the service board 2 and the control board 3 are respectively provided with a heat conduction plate on the side facing away from the liquid cooling plate 1, so as to sandwich the service board 2 and the control board 3 between the heat conduction plate and the liquid cooling plate 1. The heat conduction plate is connected and fixed with the liquid cooling plate 1, and a heat conduction interface material is arranged between the edges of the heat conduction plate and the liquid cooling plate 1. The heat conduction plate is locked with the liquid cooling plate 1 by screw connection. Specifically, in the embodiment, the first heat conduction plate 4 is arranged on the side of the service board 2 facing away from the liquid cooling plate 1, and the first heat conduction plate 4 covers the service board 2. The second heat conduction plate 5 is arranged on the side of the control board 3 facing away from the liquid cooling plate 1, and the second heat conduction plate 5 covers the control board 3. The first heat conduction plate 4 and the liquid cooling plate 1 sandwich the service board 2 therebetween, and the edges are connected by the heat conduction interface material, so that the service board 2 is surrounded by the heat conduction plate, the liquid cooling plate 1 and the heat conduction interface material and other heat dissipation components. The second heat conduction plate 5 and the liquid cooling plate 1 sandwich the control board 3 therebetween, and the edges are connected by the heat conduction interface material, so that the control board 3 is surrounded by the heat conduction plate, the liquid cooling plate 1 and the heat conduction interface material and other heat dissipation components. In this way, the heat dissipation effect is better. In the embodiment, the first heat conduction plate 4 and the second heat conduction plate 5 are heat pipe heat conduction plates in which heat pipes are embedded.

[0041] In the embodiment, the liquid cooling plate 1 is provided with a through hole at the junction of the first liquid cooling area 101 and the second liquid cooling area 102. The service board 2 arranged above the liquid cooling plate 1 is electrically connected with the control board 3 arranged below the liquid cooling plate 1 through the through hole by an electrical connector. The service board 2 arranged below the liquid cooling plate 1 is electrically connected with the control board 3 by an electrical connector.

[0042] As can be known from the above description of the specific embodiments, in the test board assembly 100 provided in the application, the liquid cooling plate 1 includes the first liquid cooling area 101 for dissipating heat from the service board 2 and the second liquid cooling area 102 for dissipating heat from the control board 3. The same side surfaces of the first liquid cooling area 101 and the second liquid cooling area 102 have a height difference, so as to adapt to contact and dissipate heat from the circuit boards at different heights. The first liquid cooling area 101 is internally provided with a first flow channel 131, and the second liquid cooling area 102 is internally provided with a second flow channel 121. The first flow channel 131 and the second flow channel 121 have a height difference, and the liquid cooling plate 1 is internally provided with a communication passage 112 communicating the first flow channel 131 and the second flow channel 121, so that the cooling liquid flows in the first flow channel 131 and the second flow channel 121 in communication, that is, the flow channels at different heights are communicated and controlled, so that one liquid cooling plate 1 can simultaneously meet the contact heat dissipation requirements of the service board 2 and the control board 3, improve the heat dissipation effect, and improve the heat dissipation efficiency.

[0043] The technical features of the above embodiments can be combined in any manner. To make the description concise, not all possible combinations of the technical features in the above embodiments are described, but as long as the combinations of the technical features do not exist, they should be considered as the scope of the present application.

[0044] The above-described embodiments are merely illustrative of several embodiments of the present application, which are described in more detail and in a specific manner, but should not be construed as limiting the scope of the patent application. It should be noted that for those skilled in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.

Claims

1. A test board card assembly, comprising: The liquid cooling plate (1) includes a business board (2), a control board (3) and a liquid cooling plate (1) for dissipating heat from the business board (2) and the control board (3), the liquid cooling plate (1) includes a first liquid cooling area (101) for dissipating heat from the business board (2) and a second liquid cooling area (102) for dissipating heat from the control board (3), the same side surface of the first liquid cooling area (101) and the second liquid cooling area (102) has a height difference, the first flow channel (131) is arranged inside the first liquid cooling area (101), the second flow channel (121) is arranged inside the second liquid cooling area (102), the first flow channel (131) and the second flow channel (121) have a height difference, and the liquid cooling plate (1) is provided with a communication channel (112) communicating the first flow channel (131) and the second flow channel (121), so that the cooling liquid flows in the first flow channel (131) and the second flow channel (121).

2. The test board card assembly of claim 1, wherein, The liquid cooling plate (1) includes an upper layer plate (12), a middle layer plate (11) and a lower layer plate (13), the upper layer plate (12) covers the middle layer plate (11) to form the second liquid cooling area (102), and the lower layer plate (13) covers the middle layer plate (11) to form the first liquid cooling area (101).

3. The test board card assembly of claim 2, wherein, The first flow channel (131) is arranged on the surface of the lower layer plate (13) facing the middle layer plate (11), and / or the second flow channel (121) is arranged on the surface of the upper layer plate (12) facing the middle layer plate. Alternatively, the first flow channel (131) and the second flow channel (121) are arranged on the opposite surfaces of the middle layer plate (11).

4. The test board card assembly of claim 2, wherein, The communication channel (112) is arranged on the middle layer plate (11), and the communication channel (112) penetrates through the opposite surfaces of the middle layer plate (11).

5. The test board card assembly of claim 2, wherein, The area of the middle layer plate (11) is greater than the area of the upper layer plate (12) and the area of the lower layer plate (13), and the first concave-convex heat dissipation part (111) is arranged at the region of the opposite surfaces of the middle layer plate (11) which is not covered by the upper layer plate (12) and the lower layer plate (13) to contact the heat dissipation components on the business board (2) and the control board (3).

6. The test board card assembly of claim 5, wherein, The exposed surface of the upper layer plate (12) and / or the lower layer plate (13) is provided with a second concave-convex heat dissipation part (135).

7. The test board card assembly of claim 2, wherein, The communication channel (112) is arranged at intervals, the first flow channel (131) is arranged in two parts, the second flow channel (121) is a continuous flow channel, and the second flow channel (121) communicates with the two parts of the first flow channel (131) through the two communication channels (112).

8. The test board card assembly of claim 7, wherein, The lower layer plate (13) is provided with an inlet (132) and an outlet (133), the inlet (132) communicates with one of the two parts of the first flow channel (131), and the outlet (133) communicates with the other part of the first flow channel (131).

9. The test board card assembly of claim 1 or 2, wherein, The service board (2) includes two blocks arranged on two opposite surfaces of the first liquid cooling area (101), and the control board (3) includes one block arranged on a surface of the second liquid cooling area (102); wherein one side of the service board (2) and the control board (3) away from the liquid cooling plate (1) is respectively provided with a heat conduction plate, so that the service board (2) and the control board (3) are clamped between the heat conduction plate and the liquid cooling plate (1), the heat conduction plate is connected and fixed with the liquid cooling plate (1), and a heat conduction interface material is arranged between edges of the heat conduction plate and the liquid cooling plate (1).

10. The test board card assembly of claim 1, wherein, One side of the service board (2) away from the liquid cooling plate (1) is provided with a first heat conduction plate (4), and the first heat conduction plate (4) covers the service board (2); and / or, One side of the control board (3) away from the liquid cooling plate (1) is provided with a second heat conduction plate (5), and the second heat conduction plate (5) covers the control board (3).

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