Circuit board assembly of atomization device and atomization device

Abstract

The utility model discloses a circuit board assembly of an atomization device and the atomization device. The circuit board assembly comprises a first circuit board and a second circuit board, a first electric connection structure is arranged at the position, close to the second circuit board, of the first circuit board, a second electric connection structure is arranged at the position, close to the first circuit board, of the second circuit board, and the first electric connection structure and the second electric connection structure are mutually inserted to form electric connection. The plane where the first circuit board is located intersects with the plane where the second circuit board is located. Because the first circuit board and the second circuit board are respectively inserted based on the cooperation of the electric connection structures, the fixed connection and the electric connection between the circuit boards in the crossed arrangement state are realized, and the manual operation can be saved and the machine automatic operation is adopted through the insertion structure, so that the production efficiency is improved while the production precision is ensured.

Description

Technical Field

[0001] This utility model relates to the field of electrical connection technology, specifically to a circuit board assembly and an atomizing device. Background Technology

[0002] In the field of electronic atomization device technology, considering functions such as status display, power supply lines, and touch operation, electrical connections and assembly operations of two or more circuit boards are often involved. These circuit boards are often arranged in a crisscross pattern, forming an angle between them. To achieve electrical connections between circuit boards, related technologies typically rely on pads formed on the circuit boards, using jumpers for manual soldering or directly soldering the pads together to form a fixed connection. This method is not only inefficient but also prone to solder material detachment due to the low precision of manual operation, affecting the stability of the electrical connection. Utility Model Content

[0003] The main technical problem this invention addresses is the poor stability of electrical connections between circuit boards and low production efficiency in related technologies.

[0004] To address the aforementioned technical problems, this application provides a circuit board assembly for an atomizing device, comprising:

[0005] A first circuit board and a second circuit board; the first circuit board has a first electrical connection structure near the second circuit board, and the second circuit board has a second electrical connection structure near the first circuit board. The first electrical connection structure and the second electrical connection structure are plugged into each other to form an electrical connection, and the plane of the first circuit board intersects the plane of the second circuit board.

[0006] In one embodiment, one of the first electrical connection structure and the second electrical connection structure is a gold finger, and the other is a socket that matches the gold finger, with the gold finger inserted into the socket to form an electrical connection.

[0007] In one embodiment, the gold fingers are formed on the edge region of the first circuit board and form an integral structure with the first circuit board; the socket is fixedly disposed on the surface of the second circuit board.

[0008] In one embodiment, one of the first electrical connection structure and the second electrical connection structure is a pin group, and the other is a conductive via that matches the pin group; the pin group includes a plurality of conductive pins arranged in an array, and each conductive pin is inserted into the conductive via.

[0009] In one embodiment, one end of the pin assembly is attached to the surface of the second circuit board, and the other end is suspended and extends toward the first circuit board; the conductive via is disposed through the first circuit board.

[0010] In one embodiment, the pin assembly further includes a locking member having a plurality of limiting through holes in a number and position matching the conductive pins; the pin assembly is disposed through the limiting through holes.

[0011] In one embodiment, the inner wall of the conductive via is covered with a conductive coating, and the pin assembly forms an electrical connection with the inner wall of the conductive via through the conductive coating.

[0012] In one embodiment, the first circuit board has a first body portion and a first extension portion and a second extension portion located at the edge of the first body portion. The first extension portion and the second extension portion extend in parallel toward the second circuit board along the plane of the first circuit board, and a preset gap is formed between the first extension portion and the second extension portion. The second circuit board has a second body portion and a third extension portion located at the edge of the second body portion. The third extension portion extends toward the first circuit board along the plane of the second circuit board, and the third extension portion is inserted between the first extension portion and the second extension portion.

[0013] In one embodiment, the third extension further has at least one protrusion that extends along the plane of the second circuit board at the edge of the third extension, and a clamping space for accommodating the first circuit board is formed between the protrusion and the second body portion.

[0014] Based on the same inventive concept, this application also provides an atomizing device, including a housing and the circuit board assembly of the atomizing device described above; the housing forms a receiving chamber, and the circuit board assembly of the atomizing device is located in the receiving chamber.

[0015] According to the above embodiments, the circuit board assembly and atomizing device of the atomizing device are connected by the cooperation of the first circuit board and the second circuit board based on the electrical connection structure, thereby realizing the fixed connection and electrical connection between the circuit boards in the cross arrangement state. Moreover, the plug-in structure can eliminate manual operation and adopt machine automation operation, thereby improving production efficiency while ensuring production accuracy. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the circuit board assembly of an atomizing device according to one perspective of an embodiment of this application.

[0017] Figure 2 for Figure 1A schematic diagram of the circuit board assembly of the atomizing device from another perspective.

[0018] Figure 3 for Figure 1 A schematic diagram of the structure of the first circuit board of the circuit board assembly of the atomizing device from one perspective.

[0019] Figure 4 for Figure 3 A schematic diagram of the structure of the first circuit board from another perspective.

[0020] Figure 5 for Figure 1 A schematic diagram of the second circuit board structure of the circuit board assembly of the atomizing device.

[0021] Figure 6 This is a schematic diagram of the circuit board assembly structure of another atomizing device in an embodiment of this application.

[0022] Figure 7 for Figure 6 A schematic diagram of the first circuit board structure of the circuit board assembly of the atomizing device.

[0023] Figure 8 for Figure 6 A schematic diagram of the second circuit board structure of the circuit board assembly of the atomizing device.

[0024] Figure 9 for Figure 6 A schematic diagram of the pin group structure of the circuit board assembly of the atomizing device.

[0025] Explanation of reference numerals in the attached figures:

[0026] 1-First circuit board; 10-First electrical connection structure; 11-Gold finger; 12-Conductive via; 13-First body; 14-First extension; 15-Second extension;

[0027] 2-Second circuit board; 20-Second electrical connection structure; 21-Socket; 22-Pin group; 23-Conductive pin; 24-Locking member; 26-Second body part; 27-Third extension part; 28-Protrusion part. Detailed Implementation

[0028] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. Similar elements in different embodiments are referred to by related similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of the present application. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to the present application are not shown or described in the specification. This is to avoid obscuring the core parts of the present application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.

[0029] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can be rearranged or adjusted in a manner obvious to those skilled in the art. Therefore, the various orders in the specification and drawings are only for the clear description of a particular embodiment and do not imply a necessary order, unless otherwise stated that a particular order must be followed.

[0030] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages).

[0031] To improve the stability of connections between circuit boards and increase the production efficiency of circuit board assemblies, this application provides a circuit board assembly for an atomizing device. Please refer to... Figures 1-4 As shown, the circuit board assembly of the atomizing device includes:

[0032] A first circuit board 1 and a second circuit board 22; a first electrical connection structure 10 is provided on the part of the first circuit board 1 near the part of the second circuit board 22, and a second electrical connection structure 20 is provided on the part of the second circuit board 22 near the part of the first circuit board 1. The first electrical connection structure 10 and the second electrical connection structure 20 are plugged into each other to form an electrical connection, and the plane on which the first circuit board 1 is located intersects the plane on which the second circuit board 22 is located.

[0033] In the assembly structure of an atomizing device, due to space constraints or the electrical requirements of different components, it is often necessary to provide two or more circuit boards for assembly. For example, the circuit board may include a power supply board for connecting the power source and a lamp board for setting the display module. A single circuit board is unlikely to achieve all the required functions simultaneously, so it is often necessary to provide two or more circuit boards to form an electrical connection between them, allowing for the placement of circuit boards at different angles and with different functions. The circuit board assembly of the atomizing device in this application embodiment involves fixed and electrical connections between two or more circuit boards; wherein, the connection method between any two adjacent circuit boards can be implemented based on the connection structure between the first circuit board 1 and the second circuit board 22 in this application embodiment. Therefore, the circuit board assembly of the atomizing device in this application embodiment can be applied to the assembly and connection of three or more circuit boards.

[0034] To achieve a seamless electrical and fixed connection between the first circuit board 1 and the second circuit board 22 at an angle, a first electrical connection structure 10 is provided on the first circuit board 1, and a second electrical connection structure 20 is provided on the second circuit board 22. The first electrical connection structure 10 and the second electrical connection structure 20 are electrically connected by plugging in. Both the first circuit board 1 and the second circuit board 22 are plate-shaped structures, and their respective planes intersect, indicating that a certain angle is formed between them. This angle can be any angle other than 0° or 180°, such as 30°, 45°, 60°, 90°, etc. Since the first electrical connection structure 10 and the second electrical connection structure 20 are electrically connected by plugging in, after the first circuit board 1 and the second circuit board 22 are manufactured, a fixed and electrical connection can be directly formed by plugging in, reducing manual operation and allowing for automated operation. This improves production efficiency while ensuring production accuracy. The first electrical connection structure 10 and the second electrical connection structure 20 are connected by plugging in, including but not limited to plugging in the gold finger 11 and the socket 21, or plugging in the pin group 22 and the conductive through hole 12, etc. In order to ensure the stability of the electrical connection, one of the first electrical connection structure 10 and the second electrical connection structure 20 can be provided with an elastic conductive structure such as a spring to ensure the stability of the connection.

[0035] In some alternative embodiments, please refer to Figures 3-5As shown, taking the gold finger 11 and socket 21 as an example, one of the first electrical connection structure 10 and the second electrical connection structure 20 is the gold finger 11, and the other is the socket 21 that matches the gold finger 11. The gold finger 11 is inserted into the socket 21 to form an electrical connection. This connection means that the gold finger 11 is inserted into the socket 21 to form both an electrical connection and a fixed connection. The gold finger 11 is part of a circuit board with several conductive contacts. In fact, it is a copper-clad board with a layer of gold plated on it through an electroplating process. Utilizing the strong oxidation resistance of gold, the internal circuit is protected from corrosion. Therefore, it has strong conductivity and is not prone to signal loss. At the same time, gold has strong ductility, which can increase the contact area between the contacts under appropriate pressure, thereby reducing contact resistance and improving signal transmission efficiency. The socket 21 is provided with conductive springs corresponding to each conductive contact on the gold finger 11. By inserting the gold finger 11 into the socket 21, the electrical connection and fixed connection between the conductive contacts and the conductive clamp can be realized, thereby realizing the electrical connection and fixed connection between the first circuit board 1 and the second circuit board 22.

[0036] In some alternative embodiments, the gold fingers 11 can be directly formed on the edge area of ​​the first circuit board 1, forming an integral structure with the first circuit board 1; the socket 21 is fixedly disposed on the surface of the second circuit board 22. The gold fingers 11 can be formed by cutting the first circuit board 1 after copper plating and gold plating; in this structure, the first circuit board 1 is generally flat, and the gold fingers 11 extend directly along the assembly direction between the first circuit board 1 and the second circuit board 22 and connect with the socket 21, which can simultaneously complete the fixed insertion and electrical connection between the first circuit board 1 and the second circuit board 22. The socket 21 is disposed on the second circuit board 22 and can be a surface mount type socket 21, directly mounted on the surface of the second circuit board 22, with the disposed surface opposite to the gold fingers 11. In this embodiment, the gold fingers 11 can be 14-pin, 10-pin, etc., and can be set according to specific product requirements. It can be an existing product specification or a custom-made one.

[0037] In addition, the electrical connection between the gold finger 11 and the socket 21 through plugging facilitates later maintenance. If the circuit board needs to be replaced, the connection between the gold finger 11 and the socket 21 can be directly disconnected by plugging and unplugging. Compared with the connection formed by soldering, this greatly improves the convenience of disassembly and assembly.

[0038] In some alternative embodiments, please refer to Figures 6-8The first electrical connection structure 10 and the second electrical connection structure 20 can each be a pin group 22, and the other can be a conductive via 12 that matches the pin group 22. The pin group 22 includes a plurality of arrayed conductive pins 23, each conductive pin 23 being inserted into the conductive via 12. The conductive via 12 can be directly formed on the circuit board, while the pin group 22 can be fixed to the surface of the circuit board by means of mounting. Since the pin group 22 is fixed to the surface of the circuit board by mounting, the corresponding circuit board does not need to have conductive holes, nor does it need to have a large spacing between the conductive holes to ensure insulation, which would affect the number and range of conductive pins 23. Therefore, in this embodiment, the number of conductive pins 23 assembled by mounting can be set to be more, or the same number of conductive pins 23 can be set on a smaller circuit board. At the other end, the conductive pin 23 is inserted into the conductive through hole 12. The inner wall of the conductive through hole 12 is formed into a conductive structure by means of copper plating or other methods. Therefore, the conductive pin 23 can form an electrical connection with the inner wall of the conductive through hole 12 by contact, or the pin assembly 22 can be connected to the conductive through hole 12 by a conductive connecting material to form an electrical connection. For example, in this embodiment, one end of the pin assembly 22 is attached and fixed to the surface of the second circuit board 22, and the other end is suspended and extends toward the first circuit board 1; the conductive through hole 12 is provided through the first circuit board 1. That is to say, the pin assembly 22 can be formed as a second electrical connection structure 20 on the second circuit board 22, and the corresponding conductive through hole 12 is formed as a first electrical connection structure 10 on the first circuit board 1.

[0039] In some alternative embodiments, to improve the connection stability between the pin assembly 22 and the conductive via 12, the pin assembly 22 forms an electrical connection with the inner wall of the conductive via 12 through a conductive coating. The conductive connecting material can be pre-coated onto the conductive via 12, so that when the pin assembly 22 is inserted into the conductive via 12, the pin assembly 22 forms an electrical connection with the conductive via 12 through the conductive connecting material; alternatively, the conductive coating can be applied after the pin assembly 22 and the conductive via 12 are inserted to enhance the conductive connection effect.

[0040] In some alternative embodiments, please refer to Figure 9To lock the relative positions of the conductive pins 23 in the pin assembly 22 and to limit the insertion of the conductive pins 23 into the conductive through-holes 12, the pin assembly 22 may also include a locking member 24. The locking member 24 has a number and position of limiting through-holes that match the conductive pins 23. The pin assembly 22 passes through the limiting through-holes. The locking member 24 has a plurality of limiting through-holes arranged in an array, each limiting through-hole corresponding to a conductive pin 23, thereby fixing the relative positions of the conductive pins 23 in the pin assembly 22, so that the conductive pins 23 are properly matched with the conductive through-holes 12. Moreover, the locking member 24 can also limit the depth of the pin assembly 22 inserted into the conductive through-holes 12, that is, limit the insertion depth of the pin assembly 22.

[0041] To improve the stability of electrical connections between circuit boards, please refer to... Figures 3-5 , Figure 7 and Figure 8 As shown, in some optional embodiments, in addition to the electrical connection formed by the insertion between the first electrical connection structure 10 and the second electrical connection structure 20, the first circuit board 1 and the second circuit board 22 can also be connected by a snap-fit ​​structure to restrict the relative position between the first circuit board 1 and the second circuit board 22 and prevent changes in their relative positions. Specifically, to realize the snap-fit ​​structure between the first circuit board 1 and the second circuit board 22, the first circuit board 1 has a first body portion 13, and a first extension portion 14 and a second extension portion 15 located at the edge of the first body portion 13. The first extension portion 14 and the second extension portion 15 extend parallel to the second circuit board 22 along the plane of the first circuit board 1, and a preset gap is formed between the first extension portion 14 and the second extension portion 15. The second circuit board 22 has a second body portion 26, and a third extension portion 27 located at the edge of the second body portion 26. The third extension portion 27 extends towards the first circuit board 1 along the plane of the second circuit board 22, and the third extension portion 27 is inserted between the first extension portion 14 and the second extension portion 15. The first extension 14 and the second extension 15 have a preset gap, which means that there is a receiving space between the first extension 14 and the second extension 15. Correspondingly, the third extension 27 is inserted between the first extension 14 and the second extension 15. Therefore, the first extension 14 and the second extension 15 cooperate with each other to clamp the second extension 15, which restricts the relative displacement between the first circuit board 1 and the second circuit board 22, especially restricts the displacement of the first circuit board 1 along the connection direction between the first extension 14 and the second extension 15. This effectively reduces the possibility of the first circuit board 1 and the second circuit board 22 separating from each other, thereby protecting the stability of the electrical connection between the first circuit board 1 and the second circuit board 22.

[0042] In some alternative embodiments, to further enhance the connection between the first circuit board 1 and the second circuit board 22, the third extension 27 further has at least one protrusion 28. The protrusion 28 extends along the plane of the second circuit board 22 from the edge of the third extension 27, and a clamping space for accommodating the first circuit board 1 is formed between the protrusion 28 and the second body portion 26. The clamping space formed between the protrusion 28 and the second body portion 26 can clamp the first circuit board 1 from the thickness direction, which can further limit the angle of relative movement between the first circuit board 1 and the second circuit board 22, thereby further improving the connection stability between the first circuit board 1 and the second circuit board 22.

[0043] In this embodiment of the application, the first circuit board 1 and the second circuit board 22 can be a power supply board and a lamp board, respectively. The power supply board can form contacts required by various components in the atomizing device, such as power supply contacts for the atomizing core, power supply contacts for the pneumatic switch, etc. The lamp board can form a display module for decoration or indication, such as a decorative lamp group, a liquid crystal display module, etc., which can be used to display the remaining power or the remaining aerosol base mass.

[0044] According to the circuit board assembly and atomizing device in the embodiments of this application, since the first circuit board 1 and the second circuit board 22 are connected by an electrical connection structure, a fixed connection and electrical connection are realized in the cross arrangement state between the circuit boards. Moreover, the plug-in structure can eliminate manual operation and adopt automated machine operation, thereby improving production efficiency while ensuring production accuracy.

[0045] In addition, this application embodiment also provides an atomizing device, which includes a housing and a circuit board assembly of the atomizing device in the above embodiment; wherein, the housing may specifically form a receiving chamber, and the circuit board assembly of the atomizing device is located in the receiving chamber.

[0046] The circuit board assembly of the atomizing device can be fixedly connected to the housing, for example, by snapping it onto the inner wall of the housing, or it can be fixedly connected to other components of the atomizing device, such as the power supply board being fixedly connected to the battery.

[0047] The above-described specific examples are for illustrative purposes only and are not intended to limit the scope of this invention. Those skilled in the art to which this invention pertains can make various simple deductions, modifications, or substitutions based on the concept of this invention.

Claims

1. A circuit board assembly for an atomization device, the circuit board assembly comprising: The application relates to an electric circuit board assembly. The first electric connection structure and the second electric connection structure are one of a gold finger and a socket matched with the gold finger, and the gold finger is inserted into the socket to form an electric connection.

2. The circuit board assembly of the atomizing device of claim 1, wherein, The gold finger is formed on the edge area of the first electric circuit board and is integrated with the first electric circuit board; and the socket is fixedly arranged on the surface of the second electric circuit board.

3. The circuit board assembly of an atomizing device of claim 2, wherein, The first electric connection structure and the second electric connection structure are one of a pin group and a conductive through hole matched with the pin group; the pin group comprises a plurality of arrayed conductive pins, and each conductive pin is inserted into the conductive through hole.

4. The circuit board assembly of the atomizing device of claim 1, wherein, One end of the pin group is fixedly attached to the surface of the second electric circuit board, and the other end is suspended and extends towards the first electric circuit board; and the conductive through hole is arranged through the first electric circuit board.

5. The circuit board assembly of an atomizing device of claim 4, wherein, The pin group further comprises a locking member, and the locking member is formed with a plurality of limiting through holes matched in number and position with the conductive pins; and the pin group is arranged through the limiting through holes.

6. The circuit board assembly of the atomizing device of claim 5, wherein, The inner wall of the conductive through hole is coated with a conductive coating, and the pin group is electrically connected with the inner wall of the conductive through hole through the conductive coating.

7. The circuit board assembly of an atomizing device of claim 4, wherein, The first electric circuit board has a first body part, and a first extension part and a second extension part located at the edge of the first body part; the first extension part and the second extension part extend in parallel towards the second electric circuit board along the plane of the first electric circuit board, and a preset gap is formed between the first extension part and the second extension part; the second electric circuit board has a second body part, and a third extension part located at the edge of the second body part; the third extension part extends towards the first electric circuit board along the plane of the second electric circuit board, and the third extension part is inserted between the first extension part and the second extension part.

8. The circuit board assembly of any one of claims 1-7, wherein, The third extension part further has at least one protruding part extending along the plane of the second electric circuit board at the edge of the third extension part, and a clamping space for accommodating the first electric circuit board is formed between the protruding part and the second body part.

9. The circuit board assembly of an atomizing device of claim 8, wherein, The application relates to an electric circuit board assembly comprising a housing and an atomization device as claimed in any one of claims 1-9; the housing is formed with a containing chamber, and the electric circuit board assembly of the atomization device is arranged in the containing chamber.

10. An atomising device characterised in that, ​

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