Single-station AA equipment for PCB (printed circuit board) of laser

Abstract

The utility model relates to laser PCB single-station AA equipment which is used for assembling a laser PCB and a machine core base in a machine core assembly. The adjusting base is arranged on the rack; the adjusting base is provided with a machine core jig which is used for placing a machine core assembly; the clamping jaw mechanism is arranged on the adjusting base and used for clamping a laser PCB. The laser detection mechanism is arranged above the clamping jaw mechanism and is used for collecting laser emitted by the laser PCB; the glue dispensing mechanism is arranged on the rack, is located at a position opposite to the clamping jaw mechanism and is used for smearing glue on a glue dispensing position of the laser PCB; the curing mechanism is arranged on the machine core jig and used for curing colloid between the laser PCB and the machine core base after AA is completed. According to the invention, the laser emission point of the laser PCB and the target map position of the movement assembly are subjected to multi-dimensional fine adjustment alignment, so that automatic assembly of the laser PCB and the movement assembly is realized, manual intervention is reduced, the UPH is improved, the repeatability and stability of assembly are ensured, and a powerful guarantee is provided for batch precision assembly.

Description

Technical Field

[0001] This application relates to the field of lidar lens assembly technology, and in particular to a single-station AA device for laser PCB assembly. Background Technology

[0002] Currently, the assembly of this product mainly relies on manual assembly and has not been automated. The machine tool components are placed on a workbench and powered on. The laser PCB then emits an infrared laser. The position of the laser PCB is manually adjusted, and the position of the emitted laser spot on the target image is observed using an infrared camera. After the emitted spot is adjusted to the designated range, the laser PCB is manually soldered to the machine tool base. In this existing technology, the entire assembly process is manual, resulting in high labor costs, low assembly efficiency, low uptime (UPH), and unsuitability for mass production. Utility Model Content

[0003] This application provides a single-station AA equipment for laser PCB, which can realize the automatic alignment, glue application and UV curing of the laser PCB board and the mechanism seat in the mechanism assembly, and realize the automated precision assembly of the two.

[0004] Therefore, this application provides a single-station AA equipment for assembling laser PCB boards and mechanism bases in a mechanism assembly, comprising:

[0005] frame;

[0006] An adjustment base is provided on the frame; the adjustment base is provided with a movement fixture, which is used to place the movement components.

[0007] A gripper mechanism is provided on the adjustment base and is used to grip the laser PCB board;

[0008] A laser detection mechanism is located above the gripper mechanism and is used to collect the laser emitted by the laser PCB board.

[0009] A dispensing mechanism is provided on the frame and located relative to the gripper mechanism, and the dispensing mechanism is used to apply adhesive to the dispensing position of the laser PCB board;

[0010] A curing mechanism is provided on the core fixture and is used to cure the colloid between the laser PCB board and the core fixture after AA is completed.

[0011] As a preferred embodiment of this application, the movement assembly includes:

[0012] A receiving lens is disposed above the laser PCB board and is used to reflect the laser emitted by the laser PCB board;

[0013] A focusing lens is positioned above the receiving lens and is used to emit the laser emitted by the laser PCB board and passed through the receiving lens.

[0014] As a preferred embodiment of this application, the laser detection mechanism includes:

[0015] An adjustable distance module is provided in the gripper mechanism;

[0016] A laser rangefinder is installed in the range adjustment module; the laser rangefinder is used to collect the laser emitted by the laser PCB board.

[0017] The distance adjustment module is used to adjust the relative horizontal position of the laser distance reducer and the mechanism assembly.

[0018] As a preferred embodiment of this application, the dispensing mechanism includes:

[0019] Mounting base, located on the frame;

[0020] A dispensing bucket assembly is mounted on the mounting base;

[0021] The dispensing assembly comprises two components, which are symmetrically arranged on the mounting base and located on both sides of the dispensing bucket assembly.

[0022] As a preferred embodiment of this application, the dispensing assembly includes:

[0023] A first linear module is disposed on the mounting base;

[0024] The first lifting module is located on the first linear module;

[0025] The second linear module is disposed on the first lifting module;

[0026] A dispensing module is located in the second linear module;

[0027] And / or, the dispensing assembly further includes a dispensing vision module disposed on the first linear module.

[0028] As a preferred embodiment of this application, the gripper mechanism includes:

[0029] An adjustment component is provided on the adjustment base;

[0030] A gripper assembly is disposed on the adjustment assembly;

[0031] The gripper assembly is used to hold the laser PCB board.

[0032] As a preferred embodiment of this application, the adjustment component includes:

[0033] The first motion module is disposed on the adjustment base and is slidably disposed along the first direction;

[0034] The second motion module is disposed on the first motion module and is slidably disposed along the second direction;

[0035] A rotating module is provided in the second motion module;

[0036] The second lifting module is located on the rotating module and is slidably disposed along a third direction;

[0037] The gripper assembly is located at the movable end of the second lifting module.

[0038] As a preferred embodiment of this application, the adjustment base includes:

[0039] A fixed base is provided on the frame;

[0040] Rotating assembly, the rotating assembly comprising:

[0041] The first sliding module is slidably disposed on the fixed base;

[0042] The second sliding module is slidably disposed on the first sliding module;

[0043] The third lifting module is located on the second sliding module;

[0044] A rotating module is located at the movable end of the third lifting module;

[0045] The mechanism fixture is located at the movable end of the rotating module.

[0046] As a preferred embodiment of this application, the curing mechanism includes:

[0047] There are two UV curing lamps, which are symmetrically arranged on both sides of the mechanism fixture.

[0048] An avoidance and flipping cylinder is provided, with its two ends connected to the UV curing lamp and used to drive the UV curing lamp.

[0049] As a preferred embodiment of this application, a visual height measurement mechanism is also included, which is disposed on the gripper mechanism and used to detect the position of the laser PCB board;

[0050] And / or, it also includes a light source module, which is disposed on the visual height measurement mechanism and located on one side of the laser detection mechanism.

[0051] The beneficial effects of this application are:

[0052] This single-station AA (Adjustment Assembly) equipment for laser PCBs is used to assemble the laser PCB board and the mechanism base in a core assembly. It includes a frame, adjustment base, gripper mechanism, laser detection mechanism, dispensing mechanism, and curing mechanism. The frame serves as the foundation of the entire equipment, ensuring stability during assembly. The adjustment base houses the core assembly fixture for placing and securing the core assembly, ensuring it doesn't shift during adjustment. The gripper mechanism holds the laser PCB board and performs fine-tuning. The laser detection mechanism, located above the gripper mechanism, collects the laser emitted from the laser PCB board; its position can be monitored in real-time using a laser telemetry device, enabling automatic adjustment. The dispensing mechanism, located on the frame relative to the gripper mechanism, applies adhesive to the designated areas on the laser PCB board, controlling the application location and amount of adhesive to avoid inconsistencies that can occur with manual work. The curing mechanism, located on the core fixture, cures the adhesive between the laser PCB board and the core base after AA, ensuring rapid curing, shortening curing time, and improving production efficiency.

[0053] This involves multi-dimensional fine-tuning and alignment of the laser emission point on the laser PCB board with the target image position of the core component, thereby achieving a high-precision laser detection and automatic adjustment mechanism. This improves the measurement accuracy of the lidar, enables automated adjustment and detection, reduces manual intervention, increases UPH (Uptime Per Hour), ensures the repeatability and stability of assembly, and provides a strong guarantee for mass precision assembly. Attached Figure Description

[0054] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0055] Figure 1 A 3D view of a single-station AA laser PCB device;

[0056] Figure 2 for Figure 1 Top view;

[0057] Figure 3 for Figure 1 The main three-dimensional view;

[0058] Figure 4 for Figure 3 Another perspective 3D view;

[0059] Figure 5 for Figure 1 A 3D view of the dispensing mechanism.

[0060] Explanation of reference numerals in the attached figures:

[0061] 1. Frame; 2. Dispensing Mechanism; 21. Dispensing Assembly; 211. First Linear Module; 212. First Lifting Module; 213. Second Linear Module; 214. Dispensing Module; 215. Dispensing Vision Module; 22. Dispensing Bucket Assembly; 23. Mounting Base; 3. Curing Mechanism; 4. Mechanism Assembly; 5. Gripper Mechanism; 51. Gripper Assembly; 52. Adjustment Assembly; 521. First Motion Module; 522. Second Motion Module; 523. Rotation Module; 524. Second Lifting Module; 6. Laser Detection Mechanism; 61. Laser Rangefinder; 62. Adjustment Module; 7. Vision Height Measurement Mechanism; 8. Mechanism Fixture; 9. Adjustment Base; 91. Fixed Base; 92. Rotation Assembly; 921. First Sliding Module; 922. Second Sliding Module; 923. Third Lifting Module; 924. Rotation Module; 10. Light Source Module;

[0062] Y-axis: First direction; X-axis: Second direction; Z-axis: Third direction. Detailed Implementation

[0063] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0064] like Figures 1 to 5 As shown, this application provides a single-station AA (Adjustment Assembly) device for laser PCBs, used to assemble a laser PCB board and a mechanism base in a mechanism assembly 4. The device includes a frame 1, an adjusting base 9, a gripper mechanism 5, a laser detection mechanism 6, a dispensing mechanism 2, and a curing mechanism 3. The adjusting base 9 is located on the frame 1. The adjusting base 9 has a mechanism fixture 8 for placing the mechanism assembly 4. The gripper mechanism 5 is located on the adjusting base 9 and is used to grip the laser PCB board. The laser detection mechanism 6 is located above the gripper mechanism 5 and is used to collect the laser emitted by the laser PCB board. The dispensing mechanism 2 is located on the frame 1 and is positioned opposite to the gripper mechanism 5, and is used to apply adhesive to the dispensing area of ​​the laser PCB board. The curing mechanism 3 is located on the mechanism fixture 8 and is used to cure the adhesive between the laser PCB board and the mechanism base after AA is completed.

[0065] This single-station AA laser PCB assembly machine is used to assemble the laser PCB board and the mechanism base in the mechanism assembly 4. It includes a frame 1, an adjustment base 9, a gripper mechanism 5, a laser detection mechanism 6, a dispensing mechanism 2, and a curing mechanism 3. The frame 1 serves as the basic structure of the entire machine, ensuring stability during assembly. The adjustment base 9 has a mechanism fixture 8 for placing and fixing the mechanism assembly 4, ensuring that the mechanism assembly 4 does not shift during adjustment. The gripper mechanism 5 is used to hold the laser PCB board and perform fine adjustments. The laser detection mechanism 6 is located above the gripper mechanism 5 and is used to collect the laser emitted from the laser PCB board. The position of the laser emission point can be monitored in real time via a laser telemetry device 61, enabling automatic adjustment. The dispensing mechanism 2 is located on the frame 1, opposite to the gripper mechanism 5, and is used to apply adhesive to the dispensing points on the laser PCB board, thereby controlling the application position and amount of adhesive and avoiding inconsistent adhesive application that may occur during manual operation. The curing mechanism 3, mounted on the core fixture 8, is used to cure the adhesive between the laser PCB board and the core fixture after AA (Alteration and Reinforcement) is completed. This ensures rapid curing of the adhesive, shortens curing time, and improves production efficiency. Specifically, by performing multi-dimensional fine-tuning and alignment of the laser emission point on the laser PCB board with the target image position on the core assembly 4, a high-precision laser detection and automatic adjustment mechanism is achieved. This improves the measurement accuracy of the lidar, enables automated adjustment and detection, reduces manual intervention, increases UPH (Uptime Per Hour), ensures the repeatability and stability of assembly, and provides strong support for mass precision assembly.

[0066] Furthermore, the mechanism assembly 4 includes a receiving lens and an emitting focusing lens; the receiving lens is disposed above the laser PCB board and is used to reflect the laser emitted by the laser PCB board; the emitting focusing lens is disposed above the receiving lens, further focusing and emitting the laser beam reflected by the receiving lens, ensuring that the laser beam can be accurately emitted from the laser PCB board and reach the expected target position.

[0067] Furthermore, the laser detection mechanism 6 includes a distance adjustment module 62 and a laser rangefinder 61; the distance adjustment module 62 is disposed on the gripper mechanism 5; the laser rangefinder 61 is disposed on the distance adjustment module 62; the laser rangefinder 61 is used to collect the laser emitted by the laser PCB board; wherein, the distance adjustment module 62 is used to adjust the relative horizontal position of the laser rangefinder 61 and the mechanism assembly 4. More specifically, by adjusting the relative horizontal position between the laser rangefinder 61 and the mechanism assembly 4 through the distance adjustment module 62, this adjustment mechanism ensures that the laser rangefinder 61 maintains the optimal distance and angle with the mechanism assembly 4 during each acquisition process, thereby improving the quality and consistency of the obtained laser beam, thus enhancing the detection accuracy and significantly improving the detection precision and reliability.

[0068] Furthermore, the dispensing mechanism 2 includes a mounting base 23, a dispensing bucket assembly 22, and a dispensing assembly 21. The mounting base 23 is located on the frame 1 to ensure the stability and fixation of the entire dispensing mechanism 2. The dispensing bucket assembly 22 is located on the mounting base 23 and is used to store and provide the adhesive required for dispensing to meet the needs of the dispensing operation. The dispensing assembly 21 consists of two components, which are symmetrically arranged on the mounting base 23 and located on both sides of the dispensing bucket assembly 22. This allows the two sets of triaxial dispensing assemblies 21 to perform dispensing work independently, while simultaneously dispensing the laser PCB board at the dispensing position, achieving symmetry and uniformity in the dispensing process, thereby improving the overall quality and efficiency of the dispensing operation.

[0069] Furthermore, the dispensing assembly 21 includes a first linear module 211, a first lifting module 212, a second linear module 213, and a dispensing module 214; the first linear module 211 is disposed on the mounting base 23; the first lifting module 212 is disposed on the first linear module 211; the second linear module 213 is disposed on the first lifting module 212; the dispensing module 214 is disposed on the second linear module 213; the dispensing assembly 21 also includes a dispensing vision module 215, which is disposed on the first linear module 211. Further detailed, the first linear module 211 is fixedly mounted on the base; the first lifting module 212 is positioned above the first linear module 211 and is capable of vertical movement; the second linear module 213 is disposed above the first lifting module 212 and is responsible for horizontal movement; the dispensing module 214 is mounted at the end of the second linear module 213 and is responsible for the actual dispensing operation. In addition, the dispensing assembly 21 also includes a dispensing vision module 215, which is also mounted on the first linear module 211 for visual monitoring and calibration of the dispensing process. Specifically, through the combination of the first linear module 211, the first lifting module 212, and the second linear module 213, the dispensing module 214 can be extended to different directions and angles, allowing it to flexibly apply adhesive to the dispensing positions on the laser PCB board. In this way, the entire dispensing mechanism 2 can not only efficiently complete the dispensing task but also ensure the accuracy and quality of the dispensing.

[0070] Furthermore, the gripper mechanism 5 includes an adjustment component 52 and a gripper component 51; the adjustment component 52 is disposed on the adjustment base 9; the gripper component 51 is disposed on the adjustment component 52; wherein, the gripper component 51 is used to grip the laser PCB board. In a further detailed description, the adjustment component 52 is mounted on the adjustment base 9, and the gripper component 51 is disposed at a corresponding position on the adjustment component 52. These two components work together, with the gripper component 51 responsible for gripping and fixing the laser PCB board. After ensuring that the laser PCB board is stably and firmly fixed, the adjustment component 52 on the gripper component 51 can be adjusted to achieve six-end adjustment of the laser PCB board, ensuring that the laser emission point on the laser PCB board is aligned with the target image position of the core assembly 4, thereby effectively reducing the difference in pitch angle and straightness.

[0071] Furthermore, the adjustment assembly 52 includes a first motion module 521, a second motion module 522, a rotation module 523, and a second lifting module 524; the first motion module 521 is disposed on the adjustment base 9 and is slidably disposed along a first direction, which is defined as the Y-axis direction; the second motion module 522 is disposed on the first motion module 521 and is slidably disposed along a second direction, which is defined as the X-axis direction; the rotation module 523 is disposed on the second motion module 522; the second lifting module 524 is disposed on the rotation module 523 and is capable of sliding along a third direction perpendicular to the first two directions, which is defined as the Z-axis direction; wherein, the gripper assembly 51 is disposed on the movable end of the second lifting module 524. To describe in further detail, the first motion module 521, the second motion module 522, the rotation module 523, and the second lifting module 524 enable six-end adjustment of the laser PCB board, ensuring that the laser emission point of the laser PCB board is aligned with the target image position of the mechanism assembly 4, thereby effectively reducing differences in pitch angle and straightness. This adjustment ensures that the laser PCB board is adjusted to the optimal AA position, guaranteeing that the laser PCB board is always in the optimal detection position for optimal working condition. Furthermore, it allows the gripper assembly 51 to more easily grasp and manipulate the laser PCB board, improving operational convenience and accuracy.

[0072] Furthermore, the adjustment base 9 includes a fixed base 91 and a rotating assembly 92 disposed on the fixed base 91; the fixed base 91 is disposed on the frame 1; the rotating assembly 92 includes a first sliding module 921, a second sliding module 922, a third lifting module 923, and a rotating module 924; the first sliding module 921 is slidably disposed on the fixed base 91; the second sliding module 922 is slidably disposed on the first sliding module 921; the third lifting module 923 is disposed on the second sliding module 922; the rotating module 924 is disposed on the movable end of the third lifting module 923; wherein, the mechanism fixture 8 is disposed on the movable end of the rotating module 924 to facilitate the adjustment of the mechanism assembly 4. Further detailed description: through the coordinated operation of the first sliding module 921, the second sliding module 922, the third lifting module 923, and the rotating module 924, the flexibility and freedom of optical path adjustment can be greatly improved. During operation, the user simply places the mechanism assembly 4 on the mechanism fixture 8, and then uses the sliding module, the third lifting module 923, and the rotating module 924 for fine-tuning to easily complete the six-axis adjustment of the mechanism assembly 4. This ensures that the laser beam emitted by the mechanism is precisely aligned with the axis of the rotating reflector, effectively reducing deviations in pitch angle and straightness caused by improper installation. This adjustment method ensures that the mechanism assembly 4 is adjusted to the optimal AA position, guaranteeing that it is always in the best detection position, thus achieving optimal working condition.

[0073] Furthermore, the curing mechanism 3 includes a UV curing lamp and a reversing cylinder; there are two UV curing lamps, symmetrically arranged on both sides of the mechanism fixture 8; the two ends of the reversing cylinder are respectively connected to the UV curing lamps and are used to drive the UV curing lamps. Specifically, after the dispensing mechanism 2 completes its dispensing task, the reversing cylinder drives the UV curing lamp to flip to a pre-set appropriate working position, and the UV curing lamp irradiates the adhesive joint between the fixing post on the laser PCB board and the mechanism seat, causing the adhesive to cure rapidly. This process ensures that the adhesive can be fully cured, thereby greatly improving the tightness of the bond between the laser PCB board and the mechanism seat.

[0074] Furthermore, a visual height measurement mechanism 7 is included. This mechanism is located on the gripper mechanism 5 and is used to detect the position of the laser PCB board. Specifically, the visual height measurement mechanism 7 moves out from its initial position to perform visual imaging and laser height measurement on the laser PCB board pre-fixed on the mechanism assembly 4. Through this process, the posture of the gripper assembly 51 holding the laser PCB board can be compensated and adjusted to ensure that the laser-emitted spot reaches its optimal state.

[0075] Furthermore, a light source module 10 is included, which is disposed on the visual height measurement mechanism 7 and located on one side of the laser detection mechanism 6. The main function of the light source module 10 is to provide illumination for the visual height measurement mechanism 7 to perform visual imaging and laser height measurement of the laser PCB board, enabling more accurate determination of the laser PCB board's position and further improving the accuracy of the gripper assembly 51 in holding the laser PCB board. In addition, it can provide appropriate illumination during the dispensing process, further improving the accuracy and efficiency of the dispensing module 214 in applying adhesive to the dispensing area on the laser PCB board.

[0076] The operation flow of this laser PCB single-station AA equipment:

[0077] (1) The laser PCB board is pre-fixed to the core base with silicone glue. The core assembly 4 is manually placed into the core fixture 8, and the wires are fastened and inserted.

[0078] (2) The mechanism fixture 8 moves to the top visual position, the top visual height measurement mechanism 7 moves out, and performs visual photography and laser height measurement on the laser PCB board pre-fixed on the mechanism assembly 4. The posture of the six-axis gripper assembly 51 holding the laser PCB board is adjusted according to the visual height measurement result.

[0079] (3) The laser rangefinder 61 collects the light spot emitted by the laser PCB board, calculates and analyzes the clarity and center position of the light spot, and feeds it back to the six-axis gripper mechanism 5 to further adjust the posture of the laser PCB board so that the light spot is optimal and the posture of the laser PCB board reaches the predetermined value before AA is performed.

[0080] (4) AA is completed. The dispensing mechanism 2 moves to the four positioning posts of the laser PCB board and the core assembly 4 and dispenses glue according to the set path. The two sets of three-axis dispensing mechanisms 2 dispense glue to the fixing posts on both sides of the laser PCB board respectively.

[0081] (5) After the dispensing is completed, the UV mechanism on the mechanism fixture 8 is flipped to the working position and irradiates the glue joint between the laser PCB board fixing post and the mechanism seat for UV curing.

[0082] (6) After curing is completed, the six-axis gripper assembly 51 releases the laser PCB board, the base 9 is adjusted to move to the unloading position, the power cord is manually pulled out, and the finished product is taken away.

[0083] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0084] The above description describes specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A laser PCB single station AA apparatus for assembling a laser PCB board with a movement seat in a movement assembly (4), characterized in that, The utility model relates to a kind of laser module automatic assembly machine, including: Rack (1); Adjusting base (9) is equipped in the rack (1);The adjusting base (9) is equipped with movement core fixture (8), and the movement core fixture (8) is used to place movement core assembly (4); Clamping jaw mechanism (5) is equipped in the adjusting base (9), and is used to clamp the laser PCB board; Laser detection mechanism (6) is equipped above the clamping jaw mechanism (5), and is used to collect the laser emitted by the laser PCB board; Dispensing mechanism (2) is equipped in the rack (1), and is located in the opposite position of the clamping jaw mechanism (5), and the dispensing mechanism (2) is used to the dispensing site of the laser PCB board with glue; Curing mechanism (3) is equipped in the movement core fixture (8), and is used to cure the glue between the laser PCB board and the movement core seat after completing AA.

2. The laser PCB single station AA apparatus of claim 1, wherein, The movement core assembly (4) includes: Receiving lens is equipped above the laser PCB board, and is used to reflect the laser emitted by the laser PCB board; Emission focusing mirror is equipped above the receiving lens, and is used to emit the laser emitted by the laser PCB board and the receiving lens.

3. The laser PCB single station AA apparatus of claim 1, wherein, The laser detection mechanism (6) includes: Distance adjustment module (62) is equipped in the clamping jaw mechanism (5); Laser distance measuring instrument (61) is equipped in the distance adjustment module (62);The laser distance measuring instrument (61) is used to collect the laser emitted by the laser PCB board; Wherein, the distance adjustment module (62) is used to adjust the relative horizontal position of the laser distance measuring instrument (61) and the movement core assembly (4).

4. The laser PCB single station AA apparatus of claim 1, wherein, The dispensing mechanism (2) includes: Mounting base (23) is equipped in the rack (1); Dispensing barrel assembly (22) is equipped in the mounting base (23); Dispensing assembly (21), the number of the dispensing assembly (21) is equipped with two, two the dispensing assembly (21) is symmetrically equipped in the mounting base (23), and is respectively located on both sides of the dispensing barrel assembly (22).

5. The laser PCB single station AA apparatus of claim 4, wherein, The dispensing assembly (21) includes: First linear module (211) is equipped in the mounting base (23); First lifting module (212) is equipped in the first linear module (211); Second linear module (213) is equipped in the first lifting module (212); Dispensing module (214) is equipped in the second linear module (213); And / or, the dispensing assembly (21) further includes dispensing vision module (215) equipped in the first linear module (211).

6. The laser PCB single station AA apparatus of claim 1, wherein, The clamping jaw mechanism (5) includes: Adjusting assembly (52) is equipped in the adjusting base (9); Clamping jaw assembly (51) is equipped in the adjusting assembly (52); Wherein, the clamping jaw assembly (51) is used to clamp the laser PCB board.

7. The laser PCB single station AA apparatus of claim 6, wherein, The adjusting assembly (52) includes: First movement module (521) is equipped in the adjusting base (9), and is slidably arranged along first direction; Second movement module (522) is equipped in the first movement module (521), and is slidably arranged along second direction; Rotary module (523) is equipped in the second movement module (522). A second lifting module (524) is arranged in the rotating module (523) and is slidably arranged along a third direction; The clamping jaw assembly (51) is arranged at a movable end of the second lifting module (524).

8. The laser PCB single station AA apparatus of claim 1, wherein, The adjusting base (9) comprises: A fixed base (91) is arranged in the rack (1); A rotating assembly (92) comprises: A first sliding module (921) is slidably arranged in the fixed base (91); A second sliding module (922) is slidably arranged in the first sliding module (921); A third lifting module (923) is arranged in the second sliding module (922); A rotating module (924) is arranged at a movable end of the third lifting module (923); The machine core jig (8) is arranged at a movable end of the rotating module (924).

9. The laser PCB single station AA apparatus of claim 1, wherein, The curing mechanism (3) comprises: Two UV curing lamps are symmetrically arranged on both sides of the machine core jig (8); A position-avoiding overturning air cylinder is connected to the UV curing lamps at both ends and is used to drive the UV curing lamps.

10. The laser PCB single station AA apparatus of claim 1, wherein, A visual height measuring mechanism (7) is arranged in the clamping jaw mechanism (5) and is used to detect the position of the laser PCB; And / or, a light source module (10) is arranged in the visual height measuring mechanism (7) and is located on one side of the laser detection mechanism (6).

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