High-efficiency plasma cleaning equipment for semiconductor chip

Abstract

The utility model relates to the technical field of plasma cleaning, and discloses high-efficiency semiconductor chip plasma cleaning equipment which comprises a bottom plate, the top of the bottom plate is fixedly connected with a fixing seat, the top of the fixing seat is fixedly connected with a first motor, the driving end of the first motor is fixedly connected with a rotating plate, and the rotating plate is fixedly connected with a second motor. A pushing rod is rotatably connected to the right side of the rotating plate, a limiting plate is rotatably connected to the left side of the fixing base, a sliding groove is formed in the top of the bottom plate, a semiconductor chip is slidably connected to the interior of the sliding groove, and a conveying assembly used for conveying the semiconductor chip is arranged at the top of the bottom plate; the top of the bottom plate is provided with a cleaning assembly used for cleaning the semiconductor chip. According to the chip cleaning device, the first motor is started to rotate to drive the pushing rod to generate regular pushing actions, chips are pushed regularly and accurately, the problem of repeated cleaning caused by uneven cleaning due to inaccurate feeding positions is solved, and the cleaning efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of plasma cleaning, especially relates to high -efficient semiconductor chip plasma cleaning equipment. BACKGROUND

[0002] Semiconductor chip is the core component of modern electronic technology, it is a kind of integrated circuit that a large number of semiconductor devices (such as transistor, diode, capacitor, resistance etc.) are integrated on a small semiconductor material substrate, and is widely used in electronic equipment. Almost all modern electronic equipment cannot do without semiconductor chip. In smart phone, chip is its core component, controls the various functions of mobile phone, from communication function, display function to running various application programs. In computer field, whether it is personal computer or server, the performance of CPU chip determines the computing speed and processing capacity of computer. In the manufacturing process of semiconductor chip, chip surface is easy to contaminate various organic matters, and after cleaning, the leakage current of chip can be reduced, and the electrical performance and reliability of chip can be improved.

[0003] The conventional plasma cleaner in the prior art is under the action of high-frequency electric field or radio frequency electric field, the gas is ionized to form plasma, the active species in the plasma and the pollutants on the chip surface occur reduction reaction, the metal oxide is reduced to metal, and the ions in the plasma accelerate under the action of electric field and impact the chip surface, to produce physical bombardment. This physical bombardment can remove stubborn pollutants, particles and the like on the chip surface.

[0004] But the semiconductor chip plasma cleaning equipment in the prior art usually needs simple clamp to load semiconductor chip to the same position, due to the uncertainty of simple clamp operation, usually causes that the loading position is not the same, cleaning is not accurate, needs to be repeatedly placed and cleaned, influences work efficiency, for this, high-efficiency semiconductor chip plasma cleaning equipment is proposed to solve the above problems. Utility model content

[0005] In order to make up for the above shortage, the utility model provides high-efficiency semiconductor chip plasma cleaning equipment, aims at improving the problem of low cleaning efficiency in the prior art.

[0006] In order to realize the above purpose, the utility model adopts the following technical scheme:

[0007] High -efficient semiconductor chip plasma cleaning equipment, including the bottom plate, the top of the bottom plate is fixedly connected with the fixed seat, the top of the fixed seat is fixedly connected with motor one, the drive end of motor one is fixedly connected with the rotating plate, the right side of the rotating plate is rotatably connected with the push rod, the left side of the fixed seat is rotatably connected with the limiting plate, the top of the bottom plate is provided with a sliding slot, the inside of the sliding slot is slidably connected with a semiconductor chip, the top of the bottom plate is provided with a conveying assembly for conveying the semiconductor chip, the top of the bottom plate is provided with a cleaning assembly for cleaning the semiconductor chip, the inside of the bottom plate is provided with a fixing assembly for fixing the semiconductor chip.

[0008] As a further description of the above technical solutions:

[0009] One side of the limiting plate is rotatably connected outside the push rod, and the outside of the push rod is in contact with the outside of the semiconductor chip.

[0010] As a further description of the above technical solutions:

[0011] The conveying assembly comprises a conveying frame, the inside of the conveying frame is rotatably connected with a conveying belt, and the bottom of the conveying belt is in contact with the top of the bottom plate.

[0012] As a further description of the above technical solutions:

[0013] The cleaning assembly comprises a gantry, the inside of the gantry is fixedly connected outside the bottom plate, the front side of the gantry is fixedly connected with a sliding rail, the outside of the sliding rail is slidably connected with an electric sliding block, and the front side of the electric sliding block is fixedly connected with a plasma nozzle.

[0014] As a further description of the above technical solutions:

[0015] The fixing assembly comprises two rotating shafts, the outside of the two rotating shafts is fixedly connected inside the bottom plate, and the outside of the rotating shaft is rotatably connected with a clamping piece.

[0016] As a further description of the above technical solutions:

[0017] The inside of the bottom plate is fixedly connected with motor two, the drive end of motor two is fixedly connected with a rotating disc, and the top of the rotating disc is rotatably connected with two connecting strips.

[0018] As a further description of the above technical solutions:

[0019] The far side of the two connecting strips is rotatably connected with the proximal side of the two clamping pieces, respectively, and the material of the clamping piece is rubber.

[0020] As a further description of the above technical solutions:

[0021] The bottoms of the two card pieces are in contact with the top of the semiconductor chip.

[0022] This utility model has the following beneficial effects:

[0023] 1. In this utility model, the drive end of the motor rotates, causing one end of the rotating plate to generate circumferential motion, which in turn drives the push rod to generate relative motion through the other end. The push rod is limited by the limiting plate, thereby causing the push rod to generate regular pushing motion, pushing the semiconductor chip to the bottom of the subsequent cleaning equipment. This achieves regular chip pushing, reduces the problem of repeated cleaning caused by uneven cleaning due to inaccurate feeding position, and improves cleaning efficiency.

[0024] 2. In this utility model, the drive end of the second motor drives the turntable to rotate, thereby causing the two connecting bars to move relative to each other, pushing the bottom of the two clips and causing them to rotate. The buckle at the top fixes the semiconductor chip to the bottom of the cleaning assembly, effectively preventing the chip from shifting, shaking or falling off due to plasma impact, airflow disturbance or other factors, thus ensuring the cleaning effect and quality. Attached Figure Description

[0025] Figure 1 This is a perspective view of the high-efficiency semiconductor chip plasma cleaning equipment proposed in this utility model.

[0026] Figure 2 for Figure 1 Enlarged view of point A in the middle;

[0027] Figure 3 This is a schematic diagram of the base plate structure of the high-efficiency semiconductor chip plasma cleaning equipment proposed in this utility model.

[0028] Figure 4 for Figure 3 Enlarged view of point B in the middle.

[0029] Legend:

[0030] 1. Base plate; 2. Transport frame; 3. Transport belt; 4. Gantry frame; 5. Slide rail; 6. Electric slider; 7. Plasma nozzle; 8. Fixed base; 9. Motor 1; 10. Rotating plate; 11. Limiting plate; 12. Push rod; 13. Slide groove; 14. Semiconductor chip; 15. Motor 2; 16. Turntable; 17. Connecting strip; 18. Rotating shaft; 19. Clamping device. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0032] Reference Figures 1 to 2 One embodiment of this utility model is a high-efficiency semiconductor chip plasma cleaning device, which includes a base plate 1. The base plate 1 is made of a sturdy and flat cast iron metal material, which has good mechanical strength and stability and can provide a stable and reliable support foundation for other components of the entire device. A fixed base 8 is fixedly connected to the top of the base plate 1. The fixed base 8 is cuboid in shape and made of the same material as the base plate 1, providing an installation foundation for subsequent structures. A motor 9 is fixedly connected to the top of the fixed base 8. The housing of the motor 9 is made of metal, which has good heat dissipation performance. It plays a key power source role in the pushing process of the semiconductor chip 14, ensuring the accuracy and stability of chip pushing. A rotating plate 10 is fixedly connected to the drive end of the motor 9. When the rotating plate 10 drives the motor 9 to rotate, it generates relative rotation, driving the other end to make a circular motion. A push rod 12 is rotatably connected to the right side of the rotating plate 10. The push rod 12 is in a special "7" shape. It is connected to the rotating plate 10 at one end, generating relative motion and pushing the semiconductor chip 14 to slide. A limit plate 11 is rotatably connected to the left side of the fixed base 8. The limit plate 11 is rectangular in shape and acts as a limit and rotation fulcrum for the push rod 12, providing support for its special motion trajectory.

[0033] Reference Figure 1The top of the base plate 1 has a sliding groove 13, which is a rectangular groove with polished sides to reduce friction for subsequent sliding and ensure stable sliding within the groove. A semiconductor chip 14 is slidably connected inside the groove 13. The semiconductor chip 14 is a thin-film integrated circuit chip, the size of which depends on the specific application and process requirements, typically having a very small thickness and a regular rectangular shape. The chip surface has complex circuit patterns and structures that need to be precisely processed during plasma cleaning. The top of the base plate 1 is equipped with a transport assembly for transporting the semiconductor chip 14, reducing the workload of manual loading. The top of the base plate 1 is also equipped with a cleaning assembly for cleaning the semiconductor chip 14. Plasma cleaning removes these potentially conductive impurities, reducing leakage current and improving the chip's electrical performance and reliability. The base plate 1 is equipped with a fixing component for fixing the semiconductor chip 14. The fixing component can improve the stability and quality of cleaning. One side of the limiting plate 11 is rotatably connected to the outside of the push rod 12. The limiting plate 11 limits the push rod 12 and completes the reciprocating pushing action. The outside of the push rod 12 is in contact with the outside of the semiconductor chip 14. The push rod 12 contacts the semiconductor chip 14 and pushes it to slide regularly for cleaning.

[0034] Reference Figure 1 The transport component includes a transport frame 2, which is a frame structure made of stainless steel and provides mounting points for the internal transport structure. The transport frame 2 is rotatably connected to a transport belt 3, which is usually composed of rollers and rubber tracks. Through the reciprocating rotation of the tracks, the semiconductor chip 14 is transported to the surface of the base plate 1. The bottom of the transport belt 3 is in contact with the top of the base plate 1.

[0035] Reference Figure 1 The cleaning assembly includes a gantry 4, which is internally and fixedly connected to the outside of the base plate 1. The gantry 4 has a "gate"-shaped structure and is welded from sturdy aluminum alloy. A slide rail 5 is fixedly connected to the front of the gantry 4. The slide rail 5 is typically a long, narrow track with good wear resistance and straightness, driving the subsequent structure to slide and clean. An electric slider 6 is slidably connected to the outside of the slide rail 5. The main function of the electric slider 6 is to drive the plasma nozzle 7 to move horizontally along the slide rail 5. According to the pre-set cleaning program, it stays at different positions for different times to achieve targeted cleaning of different areas on the surface of the semiconductor chip 14. The plasma nozzle 7 is fixedly connected to the front of the electric slider 6. The working principle of the plasma nozzle 7 is to use a high-frequency electric field or radio frequency electric field to ionize the introduced gas molecules, generating a large number of active particles such as electrons, ions, and free radicals. These active particles are ejected at high speed at the nozzle, reacting chemically and physically with contaminants on the chip surface, thereby achieving cleaning of the chip surface.

[0036] Reference Figures 3 to 4 The fixing component includes two rotating shafts 18, which are externally fixed to the inside of the base plate 1. The rotating shafts 18 are cylindrical in shape and their surfaces are finely polished, giving them good smoothness and wear resistance. A clamp 19 is rotatably connected to the outside of the rotating shaft 18. The overall shape is similar to a long lever. By rotating, the semiconductor chip 14 can be fixed to the surface of the base plate 1. A second motor 15 is fixedly connected inside the base plate 1. The second motor 15 is used to provide power to the fixed structure. A turntable 16 is fixedly connected to the drive end of the second motor 15. The main function of the turntable 16 is to convert the rotational motion of the second motor 15 into the linear motion of the subsequent structure. Two connecting strips 17 are rotatably connected to the top of the turntable 16. The far side of the two connecting strips 17 is rotatably connected to the near side of the two clamps 19. The main function of the connecting strips 17 is to act as an intermediate link for power transmission, converting the rotational motion of the turntable 16 into the rotational motion of the clamps 19. The clamps 19 are made of rubber. The bottom of the two clamps 19 contacts the top of the semiconductor chip 14. The rubber clamps 19 can adaptively adjust according to the surface shape and contour of the semiconductor chip 14 to form a good contact interface. Through friction, the semiconductor chip 14 is firmly fixed to the base plate 1, reducing damage to the semiconductor chip 14.

[0037] Working Principle: First, the operator uses conveyor belt 3 to regularly transport the semiconductor chips 14 into the chute 13 at the top of the base plate 1. Then, by turning on the power switch of motor 9, the drive end rotates, causing one end of the rotating plate 10 to move in a circular motion. This, in turn, causes the push rod 12 to move relative to the chip. The limit plate 11 limits the push rod 12, thus causing it to perform a regular pushing motion, pushing the semiconductor chips 14 to the bottom of the subsequent cleaning equipment. This regular pushing of the chips, with precise control over the force and rhythm, ensures that the chips are accurately delivered to the bottom of the subsequent cleaning equipment. This reduces the problem of uneven cleaning and repeated cleaning caused by inaccurate manual loading, improving cleaning efficiency.

[0038] Secondly, when the semiconductor chip 14 slides to the bottom of the cleaning assembly, the power switch of motor 2 15 is turned on. The drive end drives the turntable 16 to rotate, thereby causing the two connecting bars 17 to move relative to each other. This pushes the bottom of the two clips 19, causing the clips 19 to rotate. The top clips fix the semiconductor chip 14 to the bottom of the cleaning assembly. Finally, the switch of plasma nozzle 7 is turned on to perform plasma cleaning on the semiconductor chip 14. This effectively prevents the chip from shifting, shaking, or falling off due to plasma impact, airflow disturbance, or other factors during the plasma cleaning process. It ensures that the chip is in a stable state during cleaning, allowing the plasma nozzle to perform uniform, comprehensive, and high-quality cleaning on the chip surface, thus improving the cleaning quality.

[0039] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A high efficiency plasma cleaning apparatus for semiconductor chips comprising a base plate (1), characterized in that: The top of the bottom plate (1) is fixedly connected with a fixing seat (8), the top of the fixing seat (8) is fixedly connected with a motor one (9), the driving end of the motor one (9) is fixedly connected with a rotating plate (10), the right side of the rotating plate (10) is rotatably connected with a push rod (12), the left side of the fixing seat (8) is rotatably connected with a limiting plate (11), the top of the bottom plate (1) is provided with a sliding groove (13), the inside of the sliding groove (13) is slidably connected with a semiconductor chip (14), the top of the bottom plate (1) is provided with a conveying assembly for conveying the semiconductor chip (14), the top of the bottom plate (1) is provided with a cleaning assembly for cleaning the semiconductor chip (14), and the inside of the bottom plate (1) is provided with a fixing assembly for fixing the semiconductor chip (14).

2. The high efficiency semiconductor wafer plasma cleaning apparatus of claim 1, wherein: The limiting plate (11) is rotatably connected to the outside of the push rod (12), and the outside of the push rod (12) is in contact with the outside of the semiconductor chip (14).

3. The high efficiency semiconductor wafer plasma cleaning apparatus of claim 1 wherein: The conveying assembly comprises a conveying frame (2), and the inside of the conveying frame (2) is rotatably connected with a conveying belt (3), and the bottom of the conveying belt (3) is in contact with the top of the bottom plate (1).

4. The high efficiency semiconductor wafer plasma cleaning apparatus of claim 1, wherein: The cleaning assembly comprises a gantry (4), the inside of the gantry (4) is fixedly connected to the outside of the bottom plate (1), the front side of the gantry (4) is fixedly connected with a sliding rail (5), the outside of the sliding rail (5) is slidably connected with an electric sliding block (6), and the front side of the electric sliding block (6) is fixedly connected with a plasma nozzle (7).

5. The high efficiency semiconductor wafer plasma cleaning apparatus of claim 1, wherein: The fixing assembly comprises two rotating shafts (18), the outside of the two rotating shafts (18) is fixedly connected to the inside of the bottom plate (1), and the outside of the rotating shaft (18) is rotatably connected with a clamping piece (19).

6. The high efficiency semiconductor wafer plasma cleaning apparatus of claim 5, wherein: The inside of the bottom plate (1) is fixedly connected with a motor two (15), the driving end of the motor two (15) is fixedly connected with a rotating disc (16), and the top of the rotating disc (16) is rotatably connected with two connecting strips (17).

7. The high efficiency semiconductor wafer plasma cleaning apparatus of claim 6, wherein: The far sides of the two connecting strips (17) are rotatably connected to the proximal sides of the two clamping pieces (19), respectively, and the material of the clamping piece (19) is rubber.

8. The high efficiency semiconductor wafer plasma cleaning apparatus of claim 7, wherein: The bottom of the two clamping pieces (19) is in contact with the top of the semiconductor chip (14).

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