Circuit board reflow soldering furnace device

Abstract

The utility model discloses a circuit board reflow soldering furnace device which comprises a base and a conveying mechanism, the conveying mechanism is arranged in the base, a receiving table is arranged at the right end of the base, a partition plate is arranged on the edge of the upper surface of the receiving table, a rubber pad is arranged on the upper surface of the receiving table, and the conveying mechanism is arranged in the base. A control screen is arranged on the upper surface of the left end of the base, a welding furnace and a cooling furnace are arranged on the upper surface of the base, an alarm lamp is arranged on the upper surface of the welding furnace, a welding mechanism is arranged in the welding furnace, and the welding mechanism comprises a first motor, a first rotating shaft, first fan blades and a heating pipe. And a cooling mechanism is arranged in the cooling furnace, the cooling mechanism comprises a second motor, a second rotating shaft, second fan blades and a mounting frame, and temperature sensors are arranged in the welding furnace and the cooling furnace. Through the structure, cooling of the circuit board can be accelerated, the cooling time is saved, and the production efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of circuit board reflow soldering technology, and in particular to a circuit board reflow oven apparatus. Background Technology

[0002] In current circuit board manufacturing, reflow ovens are typically used in reflow soldering processes to solder circuit components onto the circuit board. An internal heating circuit in the reflow oven heats air or nitrogen to a sufficiently high temperature, which is then blown onto the circuit board with the components attached. This causes the solder on both sides of the components to melt and bond to the motherboard. The advantages of this reflow soldering process are that the temperature is easy to control, oxidation can be avoided during the soldering process, and manufacturing costs are easier to control.

[0003] According to prior art, a search revealed a Chinese patent for "Circuit Board Reflow Oven Equipment" with application number "CN202320794907.4". This patent is mainly beneficial for realizing the timely collection of circuit boards to avoid accidental burns caused by high temperatures.

[0004] However, the aforementioned existing technologies still have drawbacks. The finished circuit boards need to be cooled by themselves, which is very time-consuming and leads to low production efficiency and slow production progress. Utility Model Content

[0005] The purpose of this invention is to provide a circuit board reflow oven device that can accelerate the cooling of circuit boards, save cooling time, and increase production efficiency.

[0006] To achieve the above objectives, a circuit board reflow oven device is provided, including a base and a conveying mechanism. The conveying mechanism is disposed inside the base. A receiving platform is disposed at the right end of the base. A partition is disposed at the edge of the upper surface of the receiving platform. A rubber pad is disposed on the upper surface of the receiving platform. A control panel is disposed on the upper surface of the left end of the base. A soldering furnace and a cooling furnace are disposed on the upper surface of the base.

[0007] An alarm light is provided on the upper surface of the welding furnace, and handles are provided on the front surfaces of the welding furnace and the cooling furnace. A welding mechanism is provided inside the welding furnace, and a cooling mechanism is provided inside the cooling furnace.

[0008] According to the circuit board reflow oven apparatus, the conveying mechanism includes a shaft, a roller, and a conveyor belt, wherein the conveyor belt is a stainless steel conveyor belt.

[0009] According to the circuit board reflow oven apparatus, the welding mechanism includes a first motor, a first rotating shaft, a first fan blade, and a heating tube.

[0010] According to the circuit board reflow oven device, the first motor is disposed inside the oven, the output end of the first motor is fixedly connected to the first rotating shaft, the surface of the first rotating shaft is provided with the first fan blade, and the heating tube is disposed inside the oven and located below the first fan blade.

[0011] According to the circuit board reflow oven apparatus, the cooling mechanism includes a second motor, a second rotating shaft, a second fan blade, and a mounting bracket.

[0012] According to the circuit board reflow oven device, the mounting bracket is fixedly installed on the inner upper surface of the cooling oven, the second motor is disposed inside the mounting bracket, the output end of the second motor is fixedly connected to the second rotating shaft, and the surface of the second rotating shaft is provided with a second fan blade.

[0013] According to the circuit board reflow oven apparatus described above, temperature sensors are installed inside both the soldering oven and the cooling oven.

[0014] According to the circuit board reflow oven device, the temperature sensor, heating tube, first motor, and second motor are electrically connected to the control panel.

[0015] This utility model has the following beneficial effects:

[0016] 1. Compared with the prior art, the circuit board reflow oven device is equipped with a first motor, a first rotating shaft, a first fan blade and a heating tube. When the conveying mechanism transports the circuit board into the oven, the heating tube starts to heat. At the same time, the first motor starts and drives the first rotating shaft to start rotating. The first fan blade set on the surface of the first rotating shaft rotates together, generating airflow to blow the heat generated by the heating tube evenly onto the surface of the circuit board to complete the reflow soldering of the circuit board.

[0017] 2. Compared with the prior art, the circuit board reflow oven device is equipped with a second motor, a second rotating shaft, a second fan blade and a mounting bracket. The conveying mechanism transports the soldered circuit board into the interior of the cooling oven. The second motor starts and drives the second rotating shaft to start rotating. At the same time, the second fan blade set on the surface of the second rotating shaft also rotates together, generating airflow to carry away the temperature on the circuit board and complete the cooling of the circuit board.

[0018] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0020] Figure 1This is a three-dimensional front view of a circuit board reflow oven apparatus according to the present invention;

[0021] Figure 2 This is a top view of a circuit board reflow oven apparatus according to the present invention;

[0022] Figure 3 This is a right sectional view of a circuit board reflow oven apparatus according to the present invention;

[0023] Figure 4 This utility model relates to a circuit board reflow oven device. Figure 3 Enlarged view of point A.

[0024] Legend:

[0025] 1. Base; 2. Conveying mechanism; 201. Shaft; 202. Roller; 203. Conveyor belt; 3. Welding furnace; 4. Cooling furnace; 5. Receiving platform; 6. Rubber pad; 7. Control panel; 8. Handle; 9. Alarm light; 10. Welding mechanism; 1001. First motor; 1002. First rotating shaft; 1003. First fan blade; 1004. Heating tube; 11. Cooling mechanism; 1101. Second motor; 1102. Second rotating shaft; 1103. Second fan blade; 1104. Mounting bracket; 12. Temperature sensor. Detailed Implementation

[0026] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0027] Reference Figure 1-4 This utility model provides a circuit board reflow oven device, which includes a base 1 and a conveying mechanism 2. The conveying mechanism 2 is disposed inside the base 1 and includes a shaft 201, a roller 202 and a conveyor belt 203, which is a stainless steel conveyor belt.

[0028] A receiving platform 5 is provided at the right end of the base 1. A partition is provided on the edge of the upper surface of the receiving platform 5. A rubber pad 6 is provided on the upper surface of the receiving platform 5 to buffer the impact of the circuit board falling on the receiving platform 5 and prevent the circuit board from being damaged. A control panel 7 is provided on the upper surface of the left end of the base 1. A welding furnace 3 and a cooling furnace 4 are provided on the upper surface of the base 1. An alarm light 9 is provided on the upper surface of the welding furnace 3. A handle 8 is provided on the front surface of the welding furnace 3 and the cooling furnace 4.

[0029] The welding furnace 3 is equipped with a welding mechanism 10, which includes a first motor 1001, a first rotating shaft 1002, a first fan blade 1003, and a heating tube 1004. The first motor 1001 is located inside the welding furnace 3, and the output end of the first motor 1001 is fixedly connected to the first rotating shaft 1002. The surface of the first rotating shaft 1002 is provided with the first fan blade 1003. The heating tube 1004 is located inside the welding furnace 3 and below the first fan blade 1003. The heating tube 1004 has a back-and-forth bending structure, which can make the circuit board heat evenly during the welding process and prevent local heating that could damage the circuit board.

[0030] In the above structure, when the conveying mechanism 2 transports the circuit board into the welding furnace 3, the heating tube 1004 starts heating, and at the same time the first motor 1001 starts and drives the first rotating shaft 1002 to start rotating. The first fan blade 1003 set on the surface of the first rotating shaft 1002 rotates together, generating airflow to blow the heat generated by the heating tube 1004 evenly onto the surface of the circuit board to complete the reflow soldering of the circuit board.

[0031] The cooling furnace 4 is equipped with a cooling mechanism 11, which includes a second motor 1101, a second rotating shaft 1102, a second fan blade 1103, and a mounting frame 1104. The mounting frame 1104 is fixedly installed on the inner upper surface of the cooling furnace 4. The second motor 1101 is located inside the mounting frame 1104. The output end of the second motor 1101 is fixedly connected to the second rotating shaft 1102. The surface of the second rotating shaft 1102 is provided with the second fan blade 1103.

[0032] In the above structure, the conveying mechanism 2 transports the soldered circuit board into the cooling furnace 3. The second motor 1101 starts and drives the second rotating shaft 1102 to start rotating. At the same time, the second fan blade 1103 set on the surface of the second rotating shaft 1102 also rotates together, generating airflow to carry away the temperature on the circuit board and complete the cooling of the circuit board.

[0033] Temperature sensors 12 are installed inside both the welding furnace 3 and the cooling furnace 4. The temperature sensors 12, heating tubes 1004, first motor 1001 and second motor 1101 are electrically connected to the control panel 7.

[0034] With the above structure, the control panel 7 can start the heating tube 1004, the first motor 1001 and the second motor 1101 by detecting the temperature sensor 12.

[0035] Working principle: The circuit board to be soldered is placed on the conveyor belt 203. When the conveyor belt 203 transports the circuit board into the soldering furnace 3, the heating tube 1004 starts heating. At the same time, the first motor 1001 starts and drives the first rotating shaft 1002 to start rotating. The first fan blade 1003 set on the surface of the first rotating shaft 1002 also rotates together, generating airflow to blow the heat generated by the heating tube 1004 evenly onto the surface of the circuit board to complete the reflow soldering of the circuit board. Then the conveyor belt 203 transports the soldered circuit board into the cooling furnace 3. The second motor 1101 starts and drives the second rotating shaft 1102 to start rotating. At the same time, the second fan blade 1103 set on the surface of the second rotating shaft 1102 also rotates together, generating airflow to carry away the heat from the circuit board, completing the cooling of the circuit board. Finally, the processed circuit board is transported by the conveyor belt 203 to the receiving table 5, waiting for the staff to collect it.

[0036] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A circuit board reflow soldering furnace apparatus characterized by comprising: It includes base (1) and conveying mechanism (2), the conveying mechanism (2) is arranged inside the base (1), the right end of the base (1) is provided with receiving table (5), the edge of the upper surface of the receiving table (5) is provided with baffle, the upper surface of the receiving table (5) is provided with rubber pad (6), the left end upper surface of the base (1) is provided with control screen (7), the upper surface of the base (1) is provided with welding furnace (3) and cooling furnace (4); The upper surface of the welding furnace (3) is provided with alarm lamp (9), the front end surface of the welding furnace (3) and cooling furnace (4) is provided with handle (8), the inside of the welding furnace (3) is provided with welding mechanism (10), the inside of the cooling furnace (4) is provided with cooling mechanism (11).

2. The circuit board reflow soldering apparatus of claim 1 wherein, The conveying mechanism (2) includes shaft rod (201), roller (202) and conveyor belt (203), the conveyor belt (203) is stainless steel conveyor belt.

3. The circuit board reflow soldering apparatus of claim 1 wherein, The welding mechanism (10) includes first motor (1001), first rotating shaft (1002), first fan blade (1003) and heating pipe (1004).

4. The circuit board reflow soldering apparatus of claim 3 wherein, The first motor (1001) is arranged in the inside of the welding furnace (3), the output end of the first motor (1001) is fixedly connected with the first rotating shaft (1002), the surface of the first rotating shaft (1002) is provided with the first fan blade (1003), the heating pipe (1004) is arranged in the inside of the welding furnace (3) and is located below the first fan blade (1003).

5. The circuit board reflow soldering apparatus of claim 1 wherein, The cooling mechanism (11) includes second motor (1101), second rotating shaft (1102), second fan blade (1103) and mounting bracket (1104).

6. The circuit board reflow soldering apparatus of claim 5 wherein, The mounting bracket (1104) is fixedly installed on the inside upper surface of the cooling furnace (4), the second motor (1101) is arranged in the inside of the mounting bracket (1104), the output end of the second motor (1101) is fixedly connected with the second rotating shaft (1102), the surface of the second rotating shaft (1102) is provided with the second fan blade (1103).

7. The circuit board reflow soldering apparatus of claim 1 wherein, The inside of the welding furnace (3) and the cooling furnace (4) is provided with temperature sensor (12).

8. The circuit board reflow soldering apparatus of claim 7 wherein, The temperature sensor (12), heating pipe (1004), first motor (1001) and second motor (1101) are electrically connected with control screen (7).

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