Negative pressure demolding device

Abstract

The utility model discloses a negative-pressure demoulding device which comprises an upper pressing plate, a lower pressing plate, a lower pressing plate and a lower pressing plate, the lower pressing plate and the upper pressing plate are oppositely arranged in a spaced mode, a mold is placed on the lower pressing plate, positioning nails are fixed to the mold, a vamp material to be machined is positioned on the mold through the positioning nails, the lower pressing plate is provided with adsorption holes, and the mold covers the adsorption holes; the heating device is fixed on the upper pressing plate and / or the lower pressing plate, so that the upper pressing plate and / or the lower pressing plate has a heat conduction effect under the heating of the heating device; the lifting device is fixed on the upper pressing plate and / or the lower pressing plate, so that the upper pressing plate or the lower pressing plate can relatively move up and down; and after the vamp material to be processed is subjected to hot-pressing welding, when the upper pressing plate ascends, the mold is subjected to vacuum or negative pressure adsorption by the vacuum pump, so that the upper pressing plate is separated from the mold. According to the utility model, the technical defects caused by the existing demolding method can be avoided, and the problem of mold sticking can be solved.

Description

Technical Field

[0001] This utility model relates to the field of shoe upper processing, specifically to a negative pressure demolding device. Background Technology

[0002] In the footwear industry, seamless shoe manufacturing utilizes a hot-melt film to fuse multiple layers of shoe upper materials together. This eliminates the need for sewing, improves product appearance, and increases production efficiency. Existing processing methods involve hot-pressing the shoe upper material to melt and shape it.

[0003] The existing process involves welding via hot pressing, which is a conductive heating method. For example, after a heating device heats the material, heat is conducted from the upper and / or lower pressure plates. The lower pressure plate is used to hold the mold, and the mold has positioning pins to hold the material to be processed on the mold; the upper pressure plate directly adheres and fixes the silicone pad.

[0004] Taking the lower pressure plate heat transfer as an example, heat is conducted from the lower pressure plate to the mold, and the mold then conducts heat to the shoe upper material to be processed. During operation, the upper pressure plate typically presses down, heats and melts the shoe upper material to be processed, then rises again to replace it with another batch of shoe upper material to be processed. The upper pressure plate then presses down again and heats and melts the shoe upper material to be processed. During this repeated process, the positioning pins of the mold are constantly driven into and pulled out of the silicone pad.

[0005] When the positioning pins are driven into the silicone pad, they sometimes stick to the mold, a phenomenon commonly known as "mold sticking." This occurs when the friction between the positioning pins and the silicone pad exceeds the weight of the mold. To allow the positioning pins to be pulled out smoothly and the mold to detach from the silicone pad, a process known as "mold release," the following methods are commonly used:

[0006] 1. Increase the weight of the mold, i.e., add weight to the mold;

[0007] 2. Shorten the length of the positioning pin;

[0008] 3. When applying the mold, use a tool to pry it off manually.

[0009] The following technical defects may occur with the weighted mold:

[0010] 1) Because multi-layer shoe upper materials are heated by heat conduction, and the mold absorbs heat, a heavier mold means that it will absorb more heat, thus consuming more energy.

[0011] 2) Using heavier molds means higher costs.

[0012] 3) The increased weight of the mold also means that operators have to expend more physical strength to move it onto the lower pressure plate.

[0013] The technical drawback of shortening the length of the positioning pins is that shorter positioning pins are not easy to position the upper material, making the upper parts prone to falling off.

[0014] The drawback of manually prying it off with tools is that:

[0015] 1) It will definitely be troublesome, time-consuming and laborious.

[0016] 2) If the lower pressure plate is a sliding table, and the mold does not fall off or falls off with a delay, the sliding table has already slid away, which may cause the mold to fall into the machine.

[0017] 3) Some equipment is equipped with an automatic material handling device. If the mold does not fall into place, the material cannot be automatically handled.

[0018] Each of these current demolding methods has its own technical drawbacks.

[0019] It should be noted that, in order to better understand this utility model, the information disclosed in this background section is only intended to enhance the understanding of the overall background of this utility model, and should not be regarded as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content

[0020] In view of this, in order to solve the above-mentioned technical problems, the purpose of this utility model is to propose a negative pressure demolding device, which can avoid the technical defects caused by the current demolding methods and solve the problem of sticking to the mold.

[0021] The technical solution adopted is as follows:

[0022] A negative pressure demolding device, comprising:

[0023] The upper pressure plate is fixed with a silicone pad.

[0024] A lower pressure plate is arranged opposite to the upper pressure plate at a distance. A mold is placed on the lower pressure plate, and a positioning pin is fixed on the mold. The positioning pin is used to position the shoe upper material to be processed on the mold. The lower pressure plate is provided with suction holes, and the mold covers the suction holes.

[0025] A heating device, which is fixed to an upper pressure plate and / or a lower pressure plate, so that the upper pressure plate and / or the lower pressure plate have a heat conduction function under the heating of the heating device;

[0026] A lifting device, which is fixed on an upper pressure plate and / or a lower pressure plate, allows the upper or lower pressure plate to move up and down relative to each other, and generates heat pressure on the shoe upper material to be processed in conjunction with a heating device;

[0027] A vacuum pump, which is connected to the adsorption hole, is used to separate the upper pressure plate from the mold when the upper pressure plate rises after the shoe upper material to be processed is hot-pressed and fused.

[0028] Furthermore, the upper pressure plate is detachably connected to an intermediate plate, the intermediate plate fixing the silicone pad; or the upper pressure plate uses another vacuum pump to vacuum-adsorb the silicone pad.

[0029] Furthermore, a flexible sealing ring is provided around the mold.

[0030] Furthermore, both the vacuum pump and the lifting device are connected to a controller, which controls the opening and closing of the vacuum pump and the lifting device.

[0031] Furthermore, the vacuum pump is electrically connected to a solenoid valve, and the solenoid valve is electrically connected to a controller.

[0032] Furthermore, the lower pressure plate is a sliding table.

[0033] Furthermore, an adsorption groove is provided on the lower pressure plate, and the adsorption hole communicates with the adsorption groove; the mold covers the adsorption groove.

[0034] Furthermore, the vacuum pump is replaced by a negative pressure generator.

[0035] Furthermore, the heating device is replaced by a high-frequency machine, and the high-frequency heating of the high-frequency machine replaces the heat conduction heating of the heating device.

[0036] The beneficial effects of this utility model are as follows:

[0037] Because a vacuum pump is used and connected to the bottom of the mold, after the shoe upper material to be processed is hot-pressed and fused, the mold is vacuumed or vacuumed by the vacuum pump when the upper platen rises. This causes the upper platen to separate from the processed shoe upper material. The vacuum pump generates negative pressure, creating an adsorption force on the mold. This adsorption force is much greater than the frictional force generated by the silicone pad and the positioning pins, thus easily demolding and solving the problem of mold sticking. Moreover, only a short-term vacuum or negative pressure adsorption using a vacuum pump is needed, thus avoiding the technical defects of current demolding methods. This negative pressure demolding device can use lighter molds, does not require shortening the length of the positioning pins, and avoids the need to manually pry them off with tools. Attached Figure Description

[0038] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0039] Figure 1 This is a schematic diagram of a negative pressure demolding device according to Example 1.

[0040] Figure 2 This is a schematic diagram of a negative pressure demolding device according to Example 2.

[0041] Figure 3 This is a schematic diagram of a negative pressure demolding device according to Example 5.

[0042] In the diagram, the serial numbers and their corresponding features are as follows:

[0043] 1-Heating device; 2-Upper pressure plate; 3-Lower pressure plate; 4-Mold; 5-Material; 6-Positioning pin; 7-Lifting device; 8-Silicone pad; 9-Vacuum pump; 10-Intermediate plate; 11-Flexible sealing ring; 12-Controller; 13-High frequency machine. Detailed Implementation

[0044] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model. Example 1

[0045] See Figure 1 As shown, a negative pressure demolding device includes an upper pressure plate 2, a lower pressure plate 3, a heating device 1, a lifting device 7, and a vacuum pump 9.

[0046] The upper pressure plate 2 has a silicone pad fixed to it; the silicone pad is made of insulating and thermally conductive silicone; the upper pressure plate 2 can directly bond the silicone pad 8.

[0047] A lower pressure plate 3 is positioned opposite the upper pressure plate at a distance. A mold is placed on the lower pressure plate, and positioning pins are fixed on the mold to position the shoe upper material to be processed. The lower pressure plate has adsorption holes, and the mold covers these adsorption holes. There can be one or more adsorption holes, depending on the actual needs. As a specific embodiment, an adsorption groove can be provided on the lower pressure plate, with the adsorption holes communicating with the adsorption groove; the mold covers the adsorption groove.

[0048] A heating device 1 is fixed to an upper pressure plate and / or a lower pressure plate, enabling the upper and / or lower pressure plates to conduct heat under the heating of the heating device; in this embodiment, a heating device 4 is fixed to the lower pressure plate 2. This heating device includes, but is not limited to, hot kerosene or a heating pipe. This heating device turns the lower pressure plate into a heating plate, thereby enabling the heating of the shoe upper material to be processed.

[0049] A lifting device 7 is fixed to the upper pressure plate and / or the lower pressure plate, allowing the upper or lower pressure plate to move relative to each other vertically, and generating heat pressure on the shoe upper material to be processed in conjunction with a heating device. In this embodiment, a lifting device 5 is provided on the upper pressure plate 1. Many structures can be implemented for the lifting device, such as those driven by a cylinder or motor.

[0050] Vacuum pump 9 is connected to the adsorption hole. When the shoe upper material to be processed is hot-pressed and fused, the mold is adsorbed by vacuum or negative pressure by the vacuum pump when the upper pressure plate rises, so that the upper pressure plate is separated from the mold.

[0051] Taking the pressing of the lower pressure plate as an example, when the upper pressure plate 2 presses down and heats and melts the shoe upper material 5 to be processed, the positioning pin 6 is inserted into the silicone pad 8. Then, when the upper pressure plate 2 rises, the positioning pin 6 pulls out of the silicone pad 8. At this time, the mold 4 is vacuumed or vacuumed by the vacuum pump 9. The vacuum pump 9 generates a vacuum or negative pressure, which creates an adsorption force on the mold 4. This adsorption force is much greater than the frictional force generated between the silicone pad 8 and the positioning pin 6, thus easily demolding the upper pressure plate 2 and separating it from the processed shoe upper material 5, solving the problem of mold sticking.

[0052] Vacuum adsorption force can be estimated using the following formula:

[0053] F=P·S

[0054] Where F is the adsorption force; P is the vacuum degree; and S is the surface area of ​​the mold being adsorbed.

[0055] The basic principle is: the higher the vacuum level, the greater the adsorption force.

[0056] Generally, vacuum adsorption generates approximately 1 kg of adsorption force per 1 cm² of mold; for example, a 20cm x 30cm shoe upper mold can generate 600 kg of adsorption force. Even without a complete vacuum, just a slight negative pressure, such as 0.1 kg, can generate an adsorption force of 60 kg for the same 20cm x 30cm shoe upper mold. The weight of a 20cm x 30cm shoe upper mold is less than 0.5 kg. This significantly increases the adsorption force, far exceeding the friction between the silicone pad and the positioning pins, thus facilitating easy demolding.

[0057] In a preferred embodiment, the lower pressure plate is a slide table. This slide table includes a processing position and a material preparation position adjacent to the processing position, with the processing position vertically opposite to the upper pressure plate. The slide table located at the processing position can slide towards the material preparation position, and vice versa. When the slide table is in the material preparation position, it facilitates the operator placing the shoe upper to be processed. During processing, the slide table is pushed to the processing position, vertically opposite to the upper pressure plate. In this embodiment, the slide table is equipped with suction holes, and a vacuum pump is connected to these suction holes.

[0058] In one specific implementation, a flexible sealing ring 11 is provided around the mold 4. This reduces air leakage and allows the vacuum pump to only draw in the mold.

[0059] In one specific implementation, both the vacuum pump 9 and the lifting device 7 are connected to a controller 12, which controls the opening and closing of the vacuum pump 9 and the motor 7. This allows for automatic control, such as controlling the opening and closing of the vacuum pump and the motor. Specifically, the controller can control the motor to open, causing the upper pressure plate to press down and heat the material to be processed. When the upper pressure plate rises, the controller controls the vacuum pump to open, causing the mold to be vacuumed or subjected to negative pressure, thus separating the upper pressure plate from the processed material.

[0060] In one specific implementation, the vacuum pump is electrically connected to a solenoid valve, and the solenoid valve is electrically connected to a controller. Thus, the controller uses the solenoid valve to control the opening and closing of the vacuum pump.

[0061] In summary, by employing a vacuum pump connected to the bottom of the mold, after the shoe upper material to be processed is hot-pressed and fused, the mold is vacuumed or vacuumed by the vacuum pump when the upper platen rises. This causes the upper platen to separate from the processed shoe upper material. The vacuum pump generates negative pressure, creating an adsorption force on the mold. This adsorption force is much greater than the frictional force generated by the silicone pad and the positioning pins, thus easily demolding and solving the problem of mold sticking. Moreover, only a short-term vacuum or negative pressure adsorption using a vacuum pump is needed, thus avoiding the technical defects of current demolding methods. This negative pressure demolding device can use lighter molds, does not require shortening the length of the positioning pins, and avoids the need for manual prying with tools. Example 2

[0062] Referring to Embodiment 1, unlike Embodiment 1, the upper pressure plate in this embodiment does not directly adhere the silicone pad 8. In this embodiment, the silicone pad is fixed to the intermediate plate, which is detachably connected to the upper pressure plate. Further reference can be made to a device for quickly replacing a silicone pad disclosed by the applicant in patent document CN211968480U. An intermediate plate is provided, serving as a support between the upper and lower sections. Specifically, the intermediate plate is detachably connected to the upper heating plate via a snap-fit ​​mechanism, and securely holds the insulating thermally conductive silicone pad below. The intermediate plate and the insulating thermally conductive silicone pad are a single unit. While the insulating thermally conductive silicone pad is difficult to disassemble, the intermediate plate is easily and quickly disassembled. Thus, when the insulating thermally conductive silicone pad needs to be replaced, the intermediate plate and the insulating thermally conductive silicone pad can be disassembled together as a single unit, and then replaced with a new intermediate plate and insulating thermally conductive silicone pad. This utility model may appropriately reference the content of CN211968480U. Example 3

[0063] Referring to Embodiment 2, the difference is that in this embodiment, the upper pressure plate uses another vacuum pump to vacuum-adhere the silicone pad. This way, when the silicone pad needs to be replaced, there's no need to carefully push the pull end of the snap fastener connection to avoid burns; simply stop the vacuum pump's suction, and the silicone pad will directly desorb and fall off. A new silicone pad can then be vacuum-adhere again, improving the efficiency of silicone pad replacement and thus increasing production efficiency. Simultaneously, it greatly enhances safety performance, avoiding the risks of burns and pressure sores. Example 4

[0064] Referring to Example 1, the difference is that in this example, a negative pressure generator is used instead of the vacuum pump in Example 1.

[0065] That is, the negative pressure generator is connected to the adsorption hole. When the shoe upper material to be processed is hot-pressed and fused, the mold is adsorbed by the negative pressure generator when the upper pressure plate rises, causing the upper pressure plate to separate from the mold.

[0066] For example, a negative pressure generator with model number CV-10 / 15 / 20 / 25HS can be used. Example 5

[0067] Referring to Example 1, the difference from Example 1 is that... Figure 3 As shown, in this embodiment, a high-frequency generator 13 is used instead of a heating device 1, and the high-frequency heating of the high-frequency generator replaces the heat conduction heating of the heating device.

[0068] The detailed descriptions listed above are merely specific descriptions of feasible embodiments of the present utility model, and are not intended to limit the scope of protection of the present utility model. All equivalent embodiments or modifications made without departing from the spirit of the present utility model should be included within the scope of protection of the present utility model.

Claims

1. A negative pressure demolding device characterized by, The utility model relates to a shoe upper material hot-pressing device, which comprises: an upper pressing plate with silica gel pads fixed thereon; a lower pressing plate oppositely arranged at a distance from the upper pressing plate, a mold being placed on the lower pressing plate, the mold being fixed with positioning nails for positioning the shoe upper material to be processed on the mold, the lower pressing plate being provided with suction holes, the mold covering the suction holes; a heating device fixed on the upper pressing plate and / or the lower pressing plate, the upper pressing plate and / or the lower pressing plate having a heat conduction effect under the heating of the heating device; a lifting device fixed on the upper pressing plate and / or the lower pressing plate, the upper pressing plate or the lower pressing plate being capable of moving up and down relative to each other and generating hot pressing on the shoe upper material to be processed under the cooperation of the heating device; a vacuum pump in communication with the suction holes, the mold being adsorbed by the vacuum pump under vacuum or negative pressure when the shoe upper material to be processed is hot-pressed and welded, the upper pressing plate being separated from the mold when the upper pressing plate is lifted up.

2. The negative pressure demolding apparatus according to claim 1, characterized by The upper pressing plate is detachably connected with an intermediate plate, the intermediate plate being fixed with silica gel pads; or the upper pressing plate is vacuum adsorbed with another vacuum pump.

3. The negative pressure demolding apparatus according to claim 1, characterized by A flexible sealing ring is arranged around the mold.

4. The negative pressure demolding apparatus according to claim 1, wherein The vacuum pump and the lifting device are both connected with a controller, the vacuum pump and the lifting device being controlled to be turned on or turned off by the controller.

5. The negative pressure demolding apparatus according to claim 4, wherein The vacuum pump is electrically connected with a solenoid valve, the solenoid valve being electrically connected with the controller.

6. The negative pressure demolding apparatus according to claim 1, wherein The lower pressing plate is a sliding table.

7. The negative pressure demolding apparatus according to claim 1, wherein A suction groove is arranged on the lower pressing plate, the suction holes being in communication with the suction groove; the mold covers the suction groove.

8. The negative pressure demolding apparatus according to claim 1, wherein The vacuum pump is replaced with a negative pressure generator.

9. The negative pressure demolding apparatus according to claim 1, wherein The heating device is replaced with a high-frequency machine, the high-frequency heating of the high-frequency machine replacing the heat conduction heating of the heating device.

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