Wafer box for testing and packaging large-diameter circular-ring-shaped silicon wafers

Abstract

The utility model discloses a wafer box for testing and packaging large-diameter annular silicon wafers. The wafer box comprises an upper cover layer, a lower box layer, supporting foam, a fixed supporting column, a pressing piece, a temperature sensor and a temperature displayer. The upper cover layer and the lower box layer are embedded to form a closed film magazine main body structure; the supporting foam is detachably arranged on the lower box layer and is formed by embedding annular foam and cylindrical foam, the cylindrical foam is used for being inserted into the inner circle of the silicon wafer, and the annular foam is arranged at the bottom of the cylindrical foam and is used for bearing the silicon wafer; the plurality of fixed supporting columns are uniformly distributed along the circumferential direction of the lower box layer and are respectively screwed on the lower box layer through threads; one end of the pressing sheet is screwed at the upper end of the fixed pillar through threads, the other end of the pressing sheet is arc-shaped, the top of the pressing sheet is contacted with the peripheral surface of the silicon wafer, and a temperature sensor is arranged at the contact part; the temperature displayer is arranged on the side face of the lower box layer and monitors the temperature of the silicon wafers by receiving signals of the temperature sensor. According to the utility model, the sealing performance and the stability of the silicon wafer in the transfer process can be improved.

Description

Technical Field

[0001] This utility model relates to a test packaging cassette for large-diameter circular silicon wafers, belonging to the field of semiconductor silicon material processing and testing technology. Background Technology

[0002] With the rapid development of society and the economy, smart products are being updated and replaced at an ever-changing pace, leading to an increasing demand for IC-grade silicon wafers used in chip production. In order to meet production needs, the requirements for the size and parameters of silicon wafers are becoming more stringent. As a supporting product, large-size silicon component products are also facing the challenge of continuous updates and replacements in size and parameters.

[0003] In the testing stage after polishing and cleaning large-diameter silicon wafers, the quality and sealing of the packaging cassettes are crucial to determining the wafer's quality. Traditional cassette packaging is primarily designed for IC-grade silicon wafers. For large-size wafers, issues with the sealing and quality of the cassettes during transport can easily affect data testing. Furthermore, changes in ambient temperature and the temperature of the silicon wafer itself can also significantly impact the data.

[0004] The design of this utility model aims to solve the sealing and stability problems of large-diameter annular silicon wafers during transmission or transportation. It uses a clamping plate to position the large-diameter annular silicon wafer and a temperature sensor to monitor the temperature change of the silicon wafer, thus avoiding the impact of contamination, damage, and temperature changes on the detection of the silicon wafer and improving the accuracy of detection of large-size silicon wafers. Utility Model Content

[0005] The purpose of this invention is to provide a wafer cassette for testing and packaging large-diameter circular silicon wafers, thereby improving the sealing and stability of large-diameter silicon wafers during the transfer process.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A test packaging cassette for large-diameter circular silicon wafers includes an upper cover layer, a lower cassette layer, supporting foam, fixing pillars, clamping sheets, a temperature sensor, and a temperature display; wherein...

[0008] The main structure of the film box consists of an upper cover layer and a lower box layer that are fitted together to form a closed box.

[0009] The supporting foam is detachably installed in the lower box layer and is made of interlocking annular foam and cylindrical foam. The cylindrical foam is used to insert into the inner circle of the silicon wafer, and the annular foam is located at the bottom of the cylindrical foam to support the silicon wafer.

[0010] Multiple fixed supports are evenly distributed along the circumference of the lower box layer, and the lower end of each fixed support is screwed to the lower box layer by threads.

[0011] One end of the clamping plate is screwed onto the upper end of the fixed support through a thread, and the other end is arc-shaped with its top contacting the outer peripheral surface of the silicon wafer, and a temperature sensor is provided at the contact point.

[0012] The temperature display is located on the side of the lower housing layer and monitors the temperature of the silicon wafer by receiving signals from the temperature sensor.

[0013] Preferably, both the upper cover layer and the lower box layer are cylindrical and made of epoxy resin.

[0014] Preferably, three fixed support pillars are provided, evenly distributed along the circumference of the lower box layer.

[0015] Preferably, the clamping sheet has at least a rubber layer covering its arcuate portion.

[0016] Preferably, the upper cover layer has a diameter of 430-440mm, a height of 5-7mm, and a cover thickness of 2-3mm.

[0017] Preferably, the lower box layer has a diameter of 400-440mm, a height of 15-18mm, and a box thickness of 2-3mm.

[0018] Preferably, the diameter of the annular foam in the supporting foam is 428-438mm, the inner diameter is 280-289mm, and the foam thickness is 2-5mm; the diameter of the cylindrical foam is 280-289mm, and the height is 20-25mm.

[0019] Preferably, the clamping plate has a length of 80-85mm and a width of 2-3mm.

[0020] The advantages of this utility model are:

[0021] This invention relates to a wafer cassette for testing and packaging large-diameter circular silicon wafers. It uses clamping plates to position the large-diameter circular silicon wafer and a temperature sensor to monitor temperature changes in the wafer. This prevents contamination, damage, and temperature variations from affecting the test results, thereby improving the accuracy of testing large-size silicon wafers. The supporting foam is an embedded, detachable type, which not only effectively prevents damage to the silicon wafer during handling but also allows for adaptation to changes in wafer size by replacing the central cylindrical foam. This invention is easy to assemble and install, and is convenient and quick to operate, making it popular with operators. Attached Figure Description

[0022] Figure 1 This is a three-dimensional view of the test packaging cassette for large-diameter circular annular silicon wafers according to this utility model.

[0023] Figure 2 This is a top view of the lower layer of the test packaging cassette for large-diameter circular silicon wafers according to this utility model. Detailed Implementation

[0024] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but this does not imply any limitation on the scope of protection of the present invention.

[0025] like Figure 1 , Figure 2 As shown, the large-diameter circular annular silicon wafer test packaging cassette of this utility model includes an upper cover layer 1, a lower cassette layer 2, supporting foam 3, fixing pillars 4, a clamping sheet 5, a temperature sensor 6, and a temperature display 7. The upper cover layer 1 and the lower cassette layer 2 are fitted together to form a closed cassette main structure. For a direct view of the cassette structure, Figure 1 The display shows the state before the upper cover layer 1 and the lower box layer 2 are fitted together. After fitting together, the upper cover layer 1 and the lower box layer 2 can be completely closed. The upper cover layer 1 is cylindrical and made of epoxy resin, primarily used to seal the wafer cassette. The lower box layer 2 is also cylindrical and made of epoxy resin, primarily used to support the silicon wafer. The supporting foam 3 is composed of stacked and inlaid annular and cylindrical foams, detachably installed in the lower box layer. The diameter of the cylindrical foam is the same as the inner diameter of the silicon wafer. The cylindrical foam is inserted into the inner circle of the large-diameter annular silicon wafer, facilitating wafer positioning and adapting to changes in wafer size by adjusting the foam diameter; the annular foam supports the silicon wafer. Three fixing pillars 4 are evenly distributed at three positions along the circumference of the lower box layer. Each fixing pillar has threads at both ends, with the lower end screwed tightly onto the lower box layer via the threads.

[0026] One end of the clamping plate 5 is screwed onto the upper end of the fixing support 4, while the other end is arc-shaped with its top in direct contact with the outer peripheral surface of the silicon wafer. The clamping plate 5 is wrapped with a rubber layer at least in the arc-shaped portion, elastically fixing the silicon wafer in place and preventing scratches. A temperature sensor 6 is located at the contact point between the clamping plate and the silicon wafer (i.e., the top of the arc-shaped portion). This temperature sensor is quadrilateral and without sharp edges to avoid damaging the silicon wafer. The temperature sensor 6 corresponds to a temperature display 7 located on the outside of the lower housing layer, transmitting temperature signals to the temperature display 7 to monitor changes in the silicon wafer temperature.

[0027] This utility model discloses a wafer cassette for testing and packaging large-diameter circular silicon wafers. The typical dimensions of each part of the cassette are as follows: the upper cover layer has a diameter of 430-440 mm, a height of 5-7 mm, and a cover thickness of 2-3 mm. The lower cassette layer has a diameter of 400-440 mm, a height of 15-18 mm, and a cassette thickness of 2-3 mm. The supporting foam includes a circular foam with a diameter of 428-438 mm, an inner diameter of 280-289 mm, and a foam thickness of 2-5 mm; and a cylindrical foam with a diameter of 280-289 mm and a height of 20-25 mm. The clamping sheet has a length of 80-85 mm and a width of 2-3 mm.

[0028] According to the above-mentioned large-diameter annular silicon wafer test packaging cassette of this utility model, the large-diameter annular silicon wafer is positioned by a clamping plate, and the temperature change of the silicon wafer is monitored by a temperature sensor. This avoids the impact of contamination, damage, and temperature changes on the test results, thereby improving the accuracy of testing large-size silicon wafers. The supporting foam adopts an embedded and detachable type, which not only effectively avoids damage to the silicon wafer during handling, but also allows for the replacement of the central cylindrical foam to accommodate changes in silicon wafer size. This utility model is easy to assemble in terms of structure, convenient and quick to install, and easy to operate, making it popular with operators.

Claims

1. A cassette for large diameter circular silicon wafer test packaging, characterized by, The utility model relates to a silicon wafer storage box, including upper cover layer, lower box layer, support bubble cotton, fixed pillar, compression sheet, temperature sensor, temperature display, wherein, The upper cover layer and the lower box layer are embedded to form a closed box main structure; The support bubble cotton is detachably arranged on the lower box layer and is embedded by a circular ring bubble cotton and a cylindrical bubble cotton, the cylindrical bubble cotton is used for inserting into the inner circle of the silicon wafer, and the circular ring bubble cotton is arranged at the bottom of the cylindrical bubble cotton and is used for bearing the silicon wafer; A plurality of fixed pillars are uniformly distributed along the circumferential direction of the lower box layer, and the lower end of each fixed pillar is screwed to the lower box layer through a thread; One end of the compression sheet is screwed to the upper end of the fixed pillar through a thread, the other end is arc-shaped, the top of the other end is in contact with the outer circumferential surface of the silicon wafer, and a temperature sensor is arranged at the contact position; The temperature display is arranged on the side of the lower box layer and monitors the temperature of the silicon wafer by receiving the signal of the temperature sensor.

2. The cassette for large diameter circular silicon wafer test packaging according to claim 1, wherein The upper cover layer and the lower box layer are both cylindrical and are made of epoxy resin.

3. The cassette for large diameter circular ring-shaped silicon wafer test packaging according to claim 1 or 2, wherein The fixed pillar is provided with three fixed pillars and is uniformly distributed along the circumferential direction of the lower box layer.

4. The cassette for large diameter circular ring-shaped silicon wafer test packaging according to claim 1 or 2, wherein The arc-shaped part of the compression sheet is covered with a rubber layer.

5. The cassette for large diameter circular ring silicon slice test packaging according to claim 2, wherein, The diameter of the upper cover layer is 430-440mm, the height is 5-7mm, the thickness of the cover body is 2-3mm.

6. The cassette for large diameter circular ring silicon wafer test packaging according to claim 5, wherein The diameter of the lower box layer is 400-440mm, the height is 15-18mm, and the thickness of the box body is 2-3mm.

7. The cassette for large diameter circular ring silicon wafer test packaging according to claim 5, wherein The diameter of the circular ring bubble cotton in the support bubble cotton is 428-438mm, the inner diameter is 280-289mm, the thickness of the bubble cotton is 2-5mm, the diameter of the cylindrical bubble cotton is 280-289mm, and the height is 20-25mm.

8. The cassette for large diameter circular ring silicon wafer test packaging according to claim 5, wherein, The length of the compression sheet is 80-85mm, and the width is 2-3mm.

Images