Anti-splashing coating structure of metallized film vacuum evaporation equipment

Abstract

The utility model relates to the field of vacuum evaporation equipment, in particular to an anti-splashing film coating structure of metallized film vacuum evaporation equipment, which is used for vacuum evaporation of metallized films on the surface of a base material and comprises an evaporation box, the base material penetrates through the evaporation box through a traction assembly, a partition plate is horizontally fixed in the evaporation box, and the partition plate is provided with an anti-splashing film coating layer. The vacuum evaporation device has the advantages that vacuum evaporation metallized film operation can be carried out on the two faces of a base material, splashing of boiled and evaporated metal liquid can be effectively prevented, meanwhile, the distance between baffles can be effectively adjusted, and therefore the vacuum evaporation device can be used for vacuum evaporation of metallized films on the two faces of the base material, the work efficiency is improved, and the production cost is reduced. Therefore, the function of adjusting the anti-sputtering range according to the size of the actually needed vacuum evaporation base material is achieved, and the anti-sputtering device is high in flexibility and suitable for popularization.

Description

TECHNICAL FIELD

[0001] The utility model relates to vacuum evaporation equipment field, concretely relates to the anti -spatter coating structure of metallized film vacuum evaporation equipment. BACKGROUND

[0002] The metallized film vacuum evaporation equipment is a kind of equipment for depositing metal film on substrate surface.This technology is widely used in optics, electronics, packaging and other fields.

[0003] Through the retrieval, the vacuum coating evaporation source with anti -spatter function of a kind of of CN222274660U, including evaporation crucible and heating source, its characterized in that, in evaporation crucible inside, the anti -spatter device that prevents liquid evaporation raw material splashing is arranged, the anti -spatter device is horizontally placed in the inside of the liquid evaporation raw material.The utility model discloses by setting the anti -splash device that is horizontally placed in the inside of liquid evaporation raw material, can intervene the bubble generated when boiling, greatly reduce the occurrence of splashing scene, increase the heating power of heating source, improve the film forming speed of vacuum coating equipment, keep the uniformity of film forming.

[0004] Although the above-mentioned utility model patent has anti-splashing function, but its anti-sputtering range cannot be well adjusted according to the size of the substrate required by actual vacuum evaporation, and the flexibility is poor, and further improvement is needed.

[0005] Therefore, it is necessary to invent the anti-splashing coating structure of the metallized film vacuum evaporation equipment. UTILITY MODEL CONTENTS

[0006] Therefore, the utility model provides the anti-splashing coating structure of the metallized film vacuum evaporation equipment to solve the problems proposed in the above background art.

[0007] In order to achieve the above-mentioned purpose, the utility model provides the following technical scheme: the anti-splashing coating structure of the metallized film vacuum evaporation equipment is used for vacuum evaporation of metalized film on the surface of substrate, including evaporation box, the substrate passes through the evaporation box through the traction assembly, the evaporation box is internally fixed with a partition, the evaporation box inner wall bottom and the partition top are both fixed with evaporation source assembly, and the evaporation source assembly side is provided with anti-sputtering assembly.

[0008] Preferably, the traction assembly includes a first traction roller, the first traction roller is rotatably arranged below one side of the evaporation box, and a first guide roller is rotatably connected below the other side of the evaporation box.

[0009] Preferably, the evaporation box is further rotatably connected with a second guide roller and a third guide roller, the second guide roller is located directly above the first guide roller, and the third guide roller is located directly above the first traction roller.

[0010] Preferably, a second traction roller is rotatably connected above the interior of the vapor deposition box. The second traction roller is located directly above the second guide roller, and the substrate passes through the first traction roller, the first guide roller, the second guide roller, the third guide roller, and the second traction roller in sequence.

[0011] Preferably, the evaporation source assembly includes two heat insulation plates, the bottom ends of which are fixed to the bottom of the inner wall of the evaporation chamber and the top of the partition, respectively. A heater is fixed to the top of each heat insulation plate, and an electric heating wire is fixed inside the heater.

[0012] Preferably, each heater has a vapor deposition crucible fixed to its top, each vapor deposition crucible contains molten metal, and each vapor deposition crucible has a heat insulation layer fixed to its side surface.

[0013] Preferably, the anti-splashing assembly includes a bracket, which is symmetrically fixed at the front and rear ends of the vapor deposition chamber. Each end of the bracket is longitudinally fixed with an electric push rod, and the output shaft of each electric push rod is fixed with a connecting plate. Each connecting plate has a baffle fixed on its surface.

[0014] Preferably, the vapor deposition box has symmetrically arranged strip-shaped through holes at the front and rear ends, the baffles extend longitudinally through the strip-shaped through holes, the baffles are symmetrically distributed on the front and rear sides of the vapor deposition crucible, and the bottom of the baffles is in contact with the top of the vapor deposition crucible.

[0015] The beneficial effects of this utility model are: by using the evaporation box, traction component, partition, evaporation source component and anti-splashing component in combination, vacuum evaporation metallization film operation can be performed on both sides of the substrate, and the boiling and evaporating molten metal can be effectively prevented from splashing. At the same time, the spacing of the baffles can be effectively adjusted, so as to realize the function of adjusting the anti-splashing range according to the actual size of the substrate to be vacuum evaporated. It is highly flexible and suitable for promotion. Attached Figure Description

[0016] Figure 1 This is a structural sectional view in the front view direction provided by this utility model;

[0017] Figure 2 This is a side view of the structure provided by this utility model;

[0018] Figure 3 for Figure 2 Enlarged view of the structure at point A in the image;

[0019] Figure 4 A side view of the structure provided for this utility model.

[0020] In the figure: 1. Substrate; 2. Evaporation box; 3. First traction roller; 4. First guide roller; 5. Second guide roller; 6. Third guide roller; 7. Second traction roller; 8. Partition plate; 9. Heat insulation plate; 10. Heater; 11. Electric heating wire; 12. Evaporation crucible; 13. Molten metal; 14. Insulation layer; 15. Support; 16. Electric push rod; 17. Connecting plate; 18. Baffle; 19. Strip-shaped through hole. Detailed Implementation

[0021] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0022] Please refer to the appendix. Figures 1-4 The anti-splash coating structure of the metallization thin film vacuum evaporation equipment provided by this utility model is used to vacuum evaporate metallization thin film on the surface of substrate 1. It includes a evaporation box 2. The substrate 1 passes through the evaporation box 2 through the traction component. A partition 8 is horizontally fixed inside the evaporation box 2. An evaporation source component is fixed at the bottom of the inner wall of the evaporation box 2 and at the top of the partition 8. An anti-splash component is provided on the side of the evaporation source component.

[0023] The traction assembly includes a first traction roller 3, which is rotatably disposed below one side of the vapor deposition chamber 2. A first guide roller 4 is rotatably connected to the lower side of the other side of the vapor deposition chamber 2. A second guide roller 5 and a third guide roller 6 are also rotatably connected inside the vapor deposition chamber 2. The second guide roller 5 is located directly above the first guide roller 4, and the third guide roller 6 is located directly above the first traction roller 3. A second traction roller 7 is also rotatably connected to the upper part of the vapor deposition chamber 2, and the second traction roller 7 is located directly above the second guide roller 5. The substrate 1 passes through the first traction roller 3, the first guide roller 4, the second guide roller 5, the third guide roller 6, and the second traction roller 7 in sequence. Specifically, under the action of the first traction roller 3 and the second traction roller 7, the substrate 1 can be moved inside the vapor deposition chamber 2. Under the guidance of the first guide roller 4, the second guide roller 5, and the third guide roller 6, the direction of movement of the substrate 1 inside the vapor deposition chamber 2 can be changed. With the use of the partition plate 8 and the evaporation source assembly, vacuum vapor deposition of metallized thin films can be performed on both sides of the substrate 1.

[0024] The evaporation source assembly includes two heat insulation plates 9. The bottom ends of the two heat insulation plates 9 are fixed to the bottom of the inner wall of the evaporation tank 2 and the top of the partition plate 8, respectively. A heater 10 is fixed to the top of each heat insulation plate 9. An electric heating wire 11 is fixed inside the heater 10. An evaporation crucible 12 is fixed to the top of each heater 10. A liquid metal 13 is placed inside each evaporation crucible 12. A heat insulation layer 14 is fixed to the side surface of each evaporation crucible 12. It should be noted that the liquid metal 13 can be made of liquid evaporation materials such as copper or aluminum, and the heat insulation layer 14 can be made of ceramic fiber materials, etc. Specifically, when the electric heating wire 11 is activated, the heater 10 heats the evaporation crucible 12, causing the liquid metal 13 to boil and evaporate, thereby performing vacuum evaporation metallization film operation on the surface of the substrate 1.

[0025] The anti-splash assembly includes a bracket 15, which is symmetrically fixed at the front and rear ends of the vapor deposition chamber 2. Each end of the bracket 15 is longitudinally fixed with an electric push rod 16. The output shaft of each electric push rod 16 is fixed with a connecting plate 17, and each connecting plate 17 has a baffle 18 fixed to its surface. The vapor deposition chamber 2 has symmetrically opened strip-shaped through holes 19 at its front and rear ends. The baffle 18 longitudinally penetrates the strip-shaped through holes 19 and is symmetrically distributed on the front and rear sides of the vapor deposition crucible 12. The bottom of the baffle 18 is in contact with the top of the vapor deposition crucible 12. Specifically, under the action of the baffle 18, the phenomenon of splashing can be effectively prevented when the molten metal 13 in the vapor deposition crucible 12 boils and evaporates. Furthermore, when the electric push rod 16 is running, it can drive the baffle 18 to move linearly back and forth through the connecting plate 17, thereby controlling the spacing between the baffles 18. This allows for adjustment of the anti-splash range according to the actual size of the substrate 1 to be vacuum vaporized, providing high flexibility.

[0026] It should be noted that the electronic components involved in this utility model, such as the electric heating wire and the electric push rod, are all electrically connected to an external main controller and 220V AC mains power. The main controller can be an existing technology device such as a computer for control.

[0027] The above description is merely a preferred embodiment of this utility model. Any person skilled in the art can modify this utility model or modify it into an equivalent technical solution using the technical solution described above. Therefore, any simple modifications or equivalent substitutions made based on the technical solution of this utility model are within the scope of protection claimed by this utility model.

Claims

1. A splash-proof coating structure for a vacuum evaporation equipment for metallizing thin films, used for vacuum evaporation of metallized thin films onto the surface of a substrate (1), comprising an evaporation chamber (2), characterized in that: The substrate (1) passes through the evaporation box (2) through the traction assembly, the evaporation box (2) is internally fixed with a partition plate (8), the evaporation source assembly is fixed on the bottom of the inner wall of the evaporation box (2) and the top of the partition plate (8), and the splash-proof assembly is arranged on the side of the evaporation source assembly.

2. The anti-splashing coating structure of the vacuum evaporation equipment for the metalized thin film according to claim 1, characterized in that: The traction assembly comprises a first traction roller (3) rotatably arranged below one side of the evaporation box (2), and a first guide roller (4) rotatably connected below the other side of the evaporation box (2).

3. The anti-splashing coating structure of the vacuum evaporation equipment for metallized film according to claim 2, characterized in that: The evaporation box (2) is further rotatably connected with a second guide roller (5) and a third guide roller (6), the second guide roller (5) is located directly above the first guide roller (4), and the third guide roller (6) is located directly above the first traction roller (3).

4. The anti-sputtering coating structure of the vacuum evaporation apparatus for metallizing thin film according to claim 3, wherein: The evaporation box (2) is further rotatably connected with a second traction roller (7) above, the second traction roller (7) is located directly above the second guide roller (5), and the substrate (1) sequentially passes through the first traction roller (3), the first guide roller (4), the second guide roller (5), the third guide roller (6) and the second traction roller (7).

5. The anti-splashing coating structure of the vacuum evaporation apparatus for metallizing thin film according to claim 1, wherein: The evaporation source assembly comprises two heat insulation plates (9), the bottom ends of the two heat insulation plates (9) are fixed on the bottom of the inner wall of the evaporation box (2) and the top of the partition plate (8) respectively, the top of the heat insulation plate (9) is fixed with a heater (10), and the inside of the heater (10) is fixed with an electric heating wire (11).

6. The anti-sputtering coating structure of the vacuum evaporation apparatus for metallizing thin film according to claim 5, wherein: The top of the heater (10) is fixed with an evaporation crucible (12), the evaporation crucible (12) is placed with a metal liquid (13), and the side surface of the evaporation crucible (12) is fixed with a heat preservation layer (14).

7. The anti-sputtering coating structure of the vacuum evaporation apparatus for metallizing thin film according to claim 6, wherein: The splash-proof assembly comprises a bracket (15) fixed symmetrically on the front and rear ends of the evaporation box (2), the end of the bracket (15) is fixed with an electric push rod (16) longitudinally, the output shaft of the electric push rod (16) is fixed with a connecting plate (17), and the surface of the connecting plate (17) is fixed with a baffle (18).

8. The anti-sputtering coating structure of the vacuum evaporation apparatus for metallizing thin film according to claim 7, wherein: The front and rear ends of the evaporation box (2) are symmetrically provided with a strip-shaped through hole (19), the baffle (18) longitudinally penetrates the strip-shaped through hole (19), the baffles (18) are symmetrically distributed on the front and rear sides of the evaporation crucible (12), and the bottom of the baffle (18) is attached to the top of the evaporation crucible (12).

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