Printed circuit board (PCB) electroplating device

Abstract

The utility model belongs to the field of circuit board processing, and particularly relates to a PCB (Printed Circuit Board) electroplating device which comprises an electroplating box, a pair of gas conveying pipes are arranged on the electroplating box in a penetrating manner; the end part of the gas conveying pipe is communicated with a gas conveying box; the gas transmission box is communicated with a plurality of gas outlet pipes; the end part of the rotating shaft is fixedly connected with a connecting assembly; the end part of the connecting assembly is fixedly connected with a fixing assembly; the end part of the connecting rod is fixedly connected with a fixed block; a circuit board is arranged between the fixing assembly and the fixing block, a rotating shaft is fixedly connected to the output end of the motor, a connecting assembly is fixedly connected to the rotating shaft, the fixing assembly is fixedly connected to the end of the connecting assembly, and the fixing block is fixedly connected to the end of the connecting rod, so that the circuit board is driven to rotate when the motor is started; the circuit board is in better contact with electroplating liquid in the electroplating box when rotating, and the situation that the electroplating liquid is not in sufficient contact with the surface of the circuit board when the circuit board is directly placed in the electroplating box for electroplating, and the electroplating work on the surface of the circuit board is affected is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of circuit board processing, and specifically relates to a PCB electroplating device. BACKGROUND

[0002] The PCB electroplating device is widely used in the fields of electronics, communication, computers and automobiles for manufacturing circuit boards with various complex structures. Through the electroplating process, the conductivity, corrosion resistance and reliability of the circuit board can be improved to meet the needs of various high-performance electronic products.

[0003] The principle of electroplating is to deposit a layer of copper on the PCB substrate through electrolysis. During the electroplating process, the PCB substrate is immersed in an electroplating solution containing copper ions and connected to the positive and negative poles of a power supply. When an electric current passes through the electroplating solution, copper ions will gain electrons and be reduced to metallic copper on the PCB substrate, thereby forming a copper layer on the substrate.

[0004] The existing PCB electroplating device generally places the PCB directly in the electroplating tank, then introduces gas into the electroplating tank to complete the electroplating of the PCB. However, in use and observation, it is found that the electroplating solution does not work well on the PCB because the PCB remains stationary during the electroplating process.

[0005] Therefore, a PCB electroplating device is proposed to solve the above problems. SUMMARY

[0006] To make up for the shortcomings of the prior art and solve at least one technical problem raised in the background.

[0007] The technical solution adopted by the utility model to solve its technical problems is as follows: The utility model discloses a PCB electroplating device, which comprises an electroplating tank, a pair of gas conveying pipes are arranged through the electroplating tank, a gas conveying box is connected to the end of the gas conveying pipe, a plurality of gas outlet pipes are connected to the gas conveying box, a motor is fixedly connected to the outer side wall of the electroplating tank, a rotating shaft is fixedly connected to the output end of the motor, the rotating shaft and the electroplating tank are arranged through and connected in rotation, a connecting assembly is fixedly connected to the end of the rotating shaft, a fixing assembly is fixedly connected to the end of the connecting assembly, a connecting rod is rotatably connected to the inner side wall of the electroplating tank, a fixing block is fixedly connected to the end of the connecting rod, and a circuit board is arranged between the fixing assembly and the fixing block. By fixing the rotating shaft to the output end of the motor, fixing the connecting assembly to the rotating shaft, fixing the fixing assembly to the end of the connecting assembly, and fixing the fixing block to the end of the connecting rod, the circuit board can be rotated when the motor is turned on, which can better contact the electroplating solution in the electroplating tank, and the insufficient contact between the electroplating solution and the surface of the circuit board when the circuit board is directly placed in the electroplating tank for electroplating can be reduced, thereby avoiding the influence of the electroplating work on the surface of the circuit board.

[0008] Preferably, the connecting assembly comprises a first sleeve; the first sleeve and the rotating shaft are in fixed connection; a spring is fixedly connected to the inner side wall of the first sleeve; a second sleeve is fixedly connected to the end of the spring; the first sleeve and the second sleeve are in sliding fit, the spring is fixedly connected to the inner side wall of the first sleeve, the second sleeve is fixedly connected to the end of the spring, when different sizes of circuit boards need to be electroplated, the length of the spring is adjusted to fix the circuit board, and different sizes of circuit boards can be better clamped.

[0009] Preferably, the fixing assembly comprises a fixing groove; the fixing groove and the second sleeve are in fixed connection; a plurality of telescopic rods are fixedly connected to the inner side wall of the fixing groove; a fixing plate is fixedly connected to the end of the telescopic rod, the plurality of telescopic rods are fixedly connected to the inner side wall of the fixing groove, the fixing plate is fixedly connected to the end of the telescopic rod, when the telescopic rod is compressed, the circuit board is placed to a specified position, then the fixing plate is loosened, when the telescopic rod resets, the fixing plate is moved to the specified position to clamp and fix the circuit board, and the circuit board can be prevented from shaking and falling during rotation.

[0010] Preferably, a plurality of balls are rotatably connected to the fixing plate; the balls are located between the fixing plate and the circuit board, when the circuit board is placed between a group of fixing plates, the balls are in contact with the surface of the circuit board, and the circuit board can be more smoothly placed between the group of fixing plates.

[0011] Preferably, a sponge block is fixedly connected to the inner side wall of the fixing groove; the sponge block is located between the fixing groove and the circuit board, when the circuit board is placed into the fixing groove, the sponge block protects the edge of the circuit board, and the edge of the circuit board can be prevented from being in contact with the inner side wall of the fixing groove during rotation of the circuit board.

[0012] Preferably, an elastic net is fixedly connected to the fixing plate; the other end of the elastic net and the inner side wall of the fixing groove are in fixed connection; the telescopic rod is located in the elastic net, when the fixing plate moves, the elastic net is stretched to protect the telescopic rod, dust and impurities generated during electroplating can be prevented from falling on the telescopic rod, and the telescopic rod can be prevented from moving and jamming.

[0013] The utility model discloses the beneficial effect lies in:

[0014] 1. The utility model relates to a PCB electroplating device, through the fixed junction of motor output end has the pivot, has the connecting assembly on the pivot, has the fixed assembly and in the fixed block of connecting rod end fixed junction in the connecting assembly end, the motor is driven circuit board rotation when opening, better and the electroplating solution contact of circuit board rotation in the electroplating tank, reduce the electroplating solution and the circuit board surface contact insufficiency when directly placing the circuit board in the electroplating tank and carry out electroplating, influence the electroplating work condition of circuit board surface.

[0015] 2. The utility model relates to a PCB electroplating device, through the fixed junction of first sleeve inner wall has the spring, has the second sleeve in the spring end, when needing to the electroplating of different size circuit board is through the length of spring adjustment realizes the fixed work of circuit board, can better the clamping of different size circuit board. ACCURACY

[0016] In order to more clearly illustrate the utility model embodiment or prior art technical scheme, the following will be to the embodiment or prior art description needed to use the drawing briefly introduced, obviously, the following description in the drawing is only some embodiments of the utility model, for those skilled in the art, under the premise of not paying creative labor, can also obtain other drawings according to these drawings.

[0017] Figure 1 It is the main body schematic diagram of the utility model;

[0018] Figure 2 It is the structure schematic diagram of spring in the utility model;

[0019] Figure 3 It is the structure schematic diagram of ball in the utility model;

[0020] Figure 4 It is the structure schematic diagram of sponge block in the utility model;

[0021] Figure 5 It is the structure schematic diagram of elastic cloth in the utility model.

[0022] Legend: 1, electroplating tank;11, gas pipeline;12, gas box;13, gas pipe;14, motor;15, pivot;16, connecting assembly;17, fixed assembly;18, connecting rod;19, fixed block;110, circuit board;2, first sleeve;21, spring;22, second sleeve;3, fixed groove;31, telescopic rod;32, fixed plate;4, ball;5, sponge block;6, elastic net. SPECIFIC IMPLEMENTATION

[0023] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of the present application.

[0024] The specific embodiments are given below.

[0025] As Figures 1 to 5 shown, the PCB electroplating device provided by the embodiment of the present application comprises an electroplating box 1; a pair of gas conveying pipes 11 are arranged through the electroplating box 1; a gas conveying box 12 is connected to the end of the gas conveying pipe 11; a plurality of gas outlet pipes 13 are connected to the gas conveying box 12; a motor 14 is fixedly connected to the outer wall of the electroplating box 1; a rotating shaft 15 is fixedly connected to the output end of the motor 14; the rotating shaft 15 and the electroplating box 1 are arranged through and rotationally connected; a connecting assembly 16 is fixedly connected to the end of the rotating shaft 15; a fixing assembly 17 is fixedly connected to the end of the connecting assembly 16; a connecting rod 18 is rotationally connected to the inner wall of the electroplating box 1; a fixing block 19 is fixedly connected to the end of the connecting rod 18; a circuit board 110 is arranged between the fixing assembly 17 and the fixing block 19; the circuit board 110 to be electroplated is placed between the fixing assembly 17 and the fixing block 19 for fixation, and then gas is injected into the gas conveying pipe 11, the gas enters the gas conveying box 12 through the gas conveying pipe 11 and is finally sprayed out from the gas outlet pipe 13, the sprayed gas drives the electroplating solution in the electroplating box 1 to flow, and the flowing electroplating solution electroplates the circuit board 110; when the circuit board 110 is electroplated, the motor 14 is started, and when the motor 14 is started, the rotating shaft 15 is rotated, and when the rotating shaft 15 is rotated, the connecting assembly 16 fixedly connected to the end of the rotating shaft 15 is rotated, and when the connecting assembly 16 is rotated, the fixing assembly 17 is rotated, and when the fixing assembly 17 is rotated, the circuit board 110 is rotated, and when the circuit board 110 is rotated, more electroplating solution contacts the surface of the circuit board 110; by fixing the rotating shaft 15 to the output end of the motor 14, fixing the connecting assembly 16 to the rotating shaft 15, fixing the fixing assembly 17 to the end of the connecting assembly 16, and fixing the fixing block 19 to the end of the connecting rod 18, when the motor 14 is started, the circuit board 110 is rotated, and when the circuit board 110 is rotated, the circuit board 110 is better contacted with the electroplating solution in the electroplating box 1, and the problem that the electroplating solution is not fully contacted with the surface of the circuit board 110 when the circuit board 110 is directly placed in the electroplating box 1 for electroplating is solved, and the electroplating work on the surface of the circuit board 110 is affected.

[0026] As Figure 2As shown, the connecting assembly 16 comprises a first sleeve 2; the first sleeve 2 and the rotating shaft 15 are in fixed connection; the inner wall of the first sleeve 2 is fixedly connected with a spring 21; the end of the spring 21 is fixedly connected with a second sleeve 22; the first sleeve 2 and the second sleeve 22 are in sliding fit; when the circuit board 110 of different sizes needs to be electroplated, the spring 21 is compressed towards the motor 14; when the spring 21 is compressed, the second sleeve 22 enters the inside of the first sleeve 2; when the circuit board 110 is placed, the second sleeve 22 moves towards the motor 14 under the elastic force of the spring 21; when the second sleeve 22 moves to the specified position, the fixing assembly 17 fixes the circuit board 110; by fixing the spring 21 on the inner wall of the first sleeve 2 and fixing the second sleeve 22 at the end of the spring 21, when different sizes of circuit boards 110 need to be electroplated, the length of the spring 21 is adjusted to realize the fixing work of the circuit board 110, which can better clamp the circuit board 110 of different sizes.

[0027] As shown in Figure 3 , the fixing assembly 17 comprises a fixing groove 3; the fixing groove 3 and the second sleeve 22 are in fixed connection; a plurality of telescopic rods 31 are fixedly connected on the inner wall of the fixing groove 3; the end of the telescopic rod 31 is fixedly connected with a fixing plate 32; when the circuit board 110 needs to be fixed, the circuit board 110 is placed between a pair of fixing plates 32; when the circuit board 110 is placed, the fixing plate 32 is loosened; at this time, the fixing plate 32 moves towards the circuit board 110 under the action of the telescopic rod 31; at this time, a pair of fixing plates 32 clamp and fix the circuit board 110; by fixing a plurality of telescopic rods 31 on the inner wall of the fixing groove 3 and fixing a fixing plate 32 at the end of the telescopic rod 31, when the telescopic rod 31 is compressed, the circuit board 110 is placed at the specified position and then the fixing plate 32 is loosened; when the telescopic rod 31 resets, the fixing plate 32 moves to the specified position to clamp and fix the circuit board 110, reducing the shaking and falling of the circuit board 110 during rotation.

[0028] As shown in Figure 4 , a plurality of balls 4 are rotatably connected on the fixing plate 32; the balls 4 are located between the fixing plate 32 and the circuit board 110; when the circuit board 110 needs to be fixed, the circuit board 110 is placed between a group of fixing plates 32; when the circuit board 110 is placed between a group of fixing plates 32, the balls 4 contact the surface of the circuit board 110; by rotatably connecting a plurality of balls 4 on the fixing plate 32, when the circuit board 110 is placed between a group of fixing plates 32, the balls 4 contact the surface of the circuit board 110, which can make the circuit board 110 more smoothly enter between a group of fixing plates 32.

[0029] As shown in Figure 5As shown, a sponge block 5 is fixedly attached to the inner wall of the fixing groove 3. The sponge block 5 is located between the fixing groove 3 and the circuit board 110. When the circuit board 110 is placed inside the fixing groove 3, the edge of the circuit board 110 contacts the sponge block 5. At this time, the sponge block 5 protects the edge of the circuit board 110. By fixing the sponge block 5 to the inner wall of the fixing groove 3, the edge of the circuit board 110 is protected when the circuit board 110 is placed inside the fixing groove 3, reducing the possibility of damage to the circuit board 110 caused by contact between the edge of the circuit board 110 and the inner wall of the fixing groove 3 when the circuit board 110 rotates.

[0030] like Figure 5 As shown, an elastic mesh 6 is fixedly connected to the fixing plate 32; the other end of the elastic mesh 6 is fixedly connected to the inner wall of the fixing groove 3; the telescopic rod 31 is located inside the elastic mesh 6. When the telescopic rod 31 moves, it drives the elastic mesh 6 to move accordingly. When the telescopic rod 31 clamps the circuit board 110, the elastic mesh 6 is stretched. By fixing the elastic mesh 6 to the fixing plate 32, the elastic mesh 6 is stretched when the fixing plate 32 moves, which protects the telescopic rod 31 and reduces the amount of dust and impurities generated during the electroplating process falling onto the telescopic rod 31, thus preventing the telescopic rod 31 from moving and getting stuck.

[0031] Working principle: the circuit board 110 that needs to carry out electroplating work is placed between the fixed assembly 17 and the fixed block 19 for fixing, then the gas inside the gas conveying pipe 11 is injected, the gas enters the gas conveying box 12 inside through the gas conveying pipe 11 and is finally sprayed out from the gas outlet pipe 13, the sprayed gas drives the electroplating solution inside the electroplating box 1 to flow, the flowing electroplating solution carries out electroplating on the circuit board 110, the motor 14 is started when the circuit board 110 is electroplated, the rotating shaft 15 is driven to rotate when the motor 14 is started, the connecting assembly 16 fixed at the end of the rotating shaft 15 is driven to rotate when the rotating shaft 15 rotates, the fixed assembly 17 is driven to rotate when the connecting assembly 16 rotates, the circuit board 110 is driven to rotate when the fixed assembly 17 rotates, more electroplating solution contacts the surface of the circuit board 110 when the circuit board 110 rotates, the spring 21 is compressed towards the motor 14 when different sizes of circuit boards 110 need to be electroplated, the second sleeve 22 enters the first sleeve 2 when the spring 21 is compressed, the second sleeve 22 moves towards the original motor 14 under the elastic force of the spring 21 when the circuit board 110 is placed, the fixed assembly 17 fixes the circuit board 110 when the second sleeve 22 moves to the specified position, the circuit board 110 is placed between a pair of fixed plates 32 when the circuit board 110 needs to be fixed, the fixed plates 32 are loosened when the circuit board 110 is placed, at this time the fixed plates 32 move towards the circuit board 110 under the action of the telescopic rod 31, at this time a pair of fixed plates 32 clamps and fixes the circuit board 110, the circuit board 110 is placed into a group of fixed plates 32 when the circuit board 110 needs to be fixed, the ball 4 contacts the surface of the circuit board 110 when the circuit board 110 is placed into a group of fixed plates 32, the circuit board 110 edge contacts the sponge block 5 when the circuit board 110 is placed into the fixed groove 3, at this time the sponge block 5 protects the circuit board 110 edge, the elastic net 6 is stretched when the telescopic rod 31 moves, the telescopic rod 31 is protected by the elastic net 6 fixed on the fixed plate 32, which can reduce the dust and impurities generated during electroplating from falling on the telescopic rod 31, causing the telescopic rod 31 to move and jam.

[0032] The basic principle, main features and advantages of the present application are shown and described above. Those skilled in the art should understand that the present application is not limited by the above embodiments, and the above embodiments and descriptions in the specification are only to illustrate the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application.

Claims

1. A PCB plating device comprising a plating tank (1); characterized in that: The electroplating tank (1) is provided with a pair of gas supply pipes (11) penetrating through; the end of the gas supply pipe (11) is communicated with a gas supply box (12); the gas supply box (12) is communicated with a plurality of gas outlet pipes (13); the outer side wall of the electroplating tank (1) is fixedly connected with a motor (14); the output end of the motor (14) is fixedly connected with a rotating shaft (15); the rotating shaft (15) and the electroplating tank (1) are penetratingly arranged and rotationally connected; the end of the rotating shaft (15) is fixedly connected with a connecting assembly (16); the end of the connecting assembly (16) is fixedly connected with a fixing assembly (17); the inner side wall of the electroplating tank (1) is rotationally connected with a connecting rod (18); the end of the connecting rod (18) is fixedly connected with a fixed block (19); the fixing assembly (17) and the fixed block (19) are provided with a circuit board (110).

2. The PCB plating device of claim 1, wherein: The connecting assembly (16) comprises a first sleeve (2); the first sleeve (2) and the rotating shaft (15) are in fixed connection; the inner side wall of the first sleeve (2) is fixedly connected with a spring (21); the end of the spring (21) is fixedly connected with a second sleeve (22); the first sleeve (2) and the second sleeve (22) are in sliding fit.

3. The PCB plating device of claim 2, wherein: The fixing assembly (17) comprises a fixed groove (3); the fixed groove (3) and the second sleeve (22) are in fixed connection; the inner side wall of the fixed groove (3) is fixedly connected with a plurality of telescopic rods (31); the end of the telescopic rod (31) is fixedly connected with a fixed plate (32).

4. The PCB plating device of claim 3, wherein: A plurality of rolling balls (4) are rotationally connected on the fixed plate (32); the rolling balls (4) are located between the fixed plate (32) and the circuit board (110).

5. The PCB plating apparatus of claim 4, wherein: The inner side wall of the fixed groove (3) is fixedly connected with a sponge block (5); the sponge block (5) is located between the fixed groove (3) and the circuit board (110).

6. The PCB plating device of claim 5, wherein: The fixed plate (32) is fixedly connected with an elastic net (6); the other end of the elastic net (6) and the inner side wall of the fixed groove (3) are in fixed connection; the telescopic rod (31) is located inside the elastic net (6).

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