High-temperature aging device

Abstract

The utility model provides a high-temperature aging device which comprises a high-temperature aging oven which provides constant current for a target material so as to enable the target material to stably emit light; the aging plate is used for bearing a target material and is arranged in the high-temperature aging oven along a direction vertical to the height direction of the high-temperature aging oven; the spectrum testing circuit comprises a collimator, the collimator is arranged in the high-temperature aging oven, and the collimator is movably arranged above the aging plate in the height direction of the high-temperature aging oven and in the direction parallel to the aging plate so as to obtain spectrums of the target materials at different positions. By utilizing the high-temperature aging device provided by the utility model, the spectrums of different target materials at different temperatures can be obtained, so that the junction temperatures of the target materials at different set temperatures of the high-temperature aging oven can be further calculated, and the accuracy of calculating the service life of the target materials can be improved to a great extent.

Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor test technical field especially relates to a high temperature ageing device. BACKGROUND

[0002] When the high-temperature life of the light-emitting laser such as the optical communication edge-emitting laser or the vertical cavity surface emitting laser is calculated, the life test needs to be carried out through designing different ageing experiments. The common technology at present is to carry out the performance LIV test after the device is packaged, and the life experiment conditions are designed according to the performance test results under different temperatures. When the device is aged by using the high-temperature ageing box, there is a certain difference between the junction temperature of the device and the set temperature of the high-temperature ageing box. The difference mainly comes from: (1) there is a deviation between the set temperature of the high-temperature ageing box and the temperature of the ageing board, (2) there is a deviation between the temperature of the ageing board and the temperature of the device tube shell, (3) there is a deviation between the temperature of the device tube shell and the junction temperature of the device. The cumulative difference of the three is generally as high as 10 to 20 DEG C for the light-emitting laser, and is particularly obvious for the high-power laser chip.

[0003] At present, the high-temperature life equipment of the light-emitting laser only has the functions of power-on and temperature-up, and does not have the junction temperature test function, so that the deviation occurs when the device life is calculated by using the set temperature of the high-temperature ageing box. CONTENT OF THE UTILITY MODEL

[0004] The utility model aims at providing a high-temperature ageing device to solve the problem that the deviation is easy to occur when the device life is calculated by using the set temperature of the existing high-temperature ageing box.

[0005] In order to solve the problem, the utility model provides a high-temperature ageing device, which comprises:

[0006] A high-temperature ageing box, which provides a constant current for a target material to make the target material stabilize light emission;

[0007] An ageing board for bearing the target material, which is arranged in the high-temperature ageing box along a direction perpendicular to the height direction of the high-temperature ageing box;

[0008] A spectrum test circuit, which comprises a collimator arranged in the high-temperature ageing box, and the collimator is movably arranged above the ageing board along the height direction of the high-temperature ageing box and along a direction parallel to the ageing board to obtain the spectrum of the target material at different positions.

[0009] Optionally, in the high-temperature ageing device, the high-temperature ageing device further comprises:

[0010] A junction temperature calculation module, which calculates the junction temperature of the target material at different set temperatures of the high-temperature aging oven according to the spectrum of the target material at different temperatures.

[0011] Optionally, in the high-temperature aging device, the high-temperature aging device further comprises a support, which is movably arranged in the high-temperature aging oven along the height direction of the high-temperature aging oven and along the direction parallel to the aging plate, and the collimator is fixed below the support and moves with the movement of the support.

[0012] Optionally, in the high-temperature aging device, the high-temperature aging device further comprises a driving module, and the support moves under the driving of the driving module.

[0013] Optionally, in the high-temperature aging device, the driving module comprises a driving handle and a connecting rod, the driving handle is arranged outside the high-temperature aging oven, the connecting rod penetrates the cabinet of the high-temperature aging oven to connect the driving handle and the support, and the support moves with the rotation and / or movement of the driving handle.

[0014] Optionally, in the high-temperature aging device, the high-temperature aging oven is sequentially arranged with a plurality of bearing planes along the height direction of the high-temperature aging oven, the aging plate is detachably arranged on one of the bearing planes, and the position of the support in the height direction of the high-temperature aging oven is adjusted according to the bearing plane where the aging plate is located.

[0015] Optionally, in the high-temperature aging device, the movable distance of the collimator in the height direction of the high-temperature aging oven is not less than one-half of the height of the inner cavity of the high-temperature aging oven.

[0016] Optionally, in the high-temperature aging device, the movement mode of the collimator in the direction parallel to the aging plate is one-dimensional or two-dimensional.

[0017] Optionally, in the high-temperature aging device, the aging plate has a plurality of fixed points, each of the fixed points is used for placing one target material, and the distribution positions of the plurality of fixed points correspond to the plurality of movement points of the collimator in the direction parallel to the aging plate one by one.

[0018] Optionally, in the high-temperature aging device, the spectrum test circuit further comprises a multimode optical fiber and a spectrometer, the spectrometer is located outside the high-temperature aging oven, the multimode optical fiber penetrates the cabinet of the high-temperature aging oven, and the collimator and the spectrometer are connected through the multimode optical fiber.

[0019] In summary, the high-temperature aging device provided by the utility model includes: a high-temperature aging box, the high-temperature aging box provides a target material with a constant current, so that the target material stably emits light; an aging plate for bearing the target material, the aging plate is arranged in the high-temperature aging box along a direction perpendicular to the height direction of the high-temperature aging box; a spectrum test circuit, the spectrum test circuit includes a collimator, the collimator is arranged in the high-temperature aging box, and the collimator is movably arranged above the aging plate along the height direction of the high-temperature aging box and along a direction parallel to the aging plate, so as to obtain the spectrum of the target material at different positions. By using the high-temperature aging device provided by the utility model, the spectrum of the target material at different temperatures can be obtained, so that the junction temperature of the target material at different setting temperatures of the high-temperature aging box can be further calculated, and thus the accuracy of calculating the service life of the target material can be greatly improved. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 The structure diagram of the high-temperature aging device provided by the utility model embodiment is shown in the figure.

[0021] Among them, the following is the explanation of each sign:

[0022] 11-high-temperature aging box; 12-aging plate; 13-collimator; 14-driving module; 15-multimode optical fiber; 16-spectrometer. DETAILED DESCRIPTION

[0023] Generally, the temperature drift coefficient of the emitting laser (sometimes referred to as a device in the following description) is fixed. When the junction temperature of the device changes, the wavelength of the device also changes, and by testing the change of the wavelength, the junction temperature of the device can be deduced.

[0024] Therefore, the utility model aims at providing a kind of high-temperature aging device, the center wavelength of target material is tested in aging process, and the junction temperature of device is accurately tested according to the temperature drift coefficient of device itself, to reduce the error when calculating the service life of device, and the real temperature of target material after packaging can be more accurately obtained, which is beneficial to product packaging in module and use. The target material in the utility model includes edge emitting laser, vertical cavity surface laser and other emitting lasers.

[0025] The high-temperature aging device provided by the utility model is further described in detail below in combination with the drawings and specific embodiments. It should be noted that the drawings are all very simplified and use non-precise proportions, and are only used to facilitate and clearly assist the purpose of describing the embodiments of the utility model. In addition, the structures shown in the drawings are often part of the actual structures. In particular, the emphasis of each drawing needs to be different, and different proportions are sometimes used. It should be recognized that relative terms such as 'above', 'below', 'top', 'bottom', 'above' and 'below' shown in the drawings can be used to describe the relationship between various elements. These relative terms are intended to cover different orientations of the elements in addition to the orientation depicted in the drawings. For example, if the device is inverted with respect to the view in the drawing, the element described as 'above' another element will now be below the element. It should also be understood that, unless specifically described or indicated, the terms 'first','second', 'third' and the like in the description are only used to distinguish various components, elements, steps and the like in the description, and are not used to represent the logical relationship or sequence relationship between the various components, elements, steps and the like.

[0026] Figure 1 The structure diagram of the high-temperature aging device provided by the embodiments of the utility model. As shown in the figure, Figure 1 The high-temperature aging device provided by the embodiments of the utility model comprises:

[0027] The high-temperature aging box 11 provides a constant current to the target material, so that the target material is stable in light;

[0028] The aging plate 12 for carrying the target material is arranged in the high-temperature aging box 11 along a direction perpendicular to the height direction of the high-temperature aging box 11;

[0029] The spectrum test circuit comprises a collimator 13 arranged in the high-temperature aging box 11, and the collimator 13 is movably arranged above the aging plate 12 along the height direction of the high-temperature aging box 11 and along the direction parallel to the aging plate 12, so as to obtain the spectrum of the target material at different positions.

[0030] The high-temperature aging device provided by the utility model can obtain the spectrum of different target materials at different temperatures, so as to further calculate the junction temperature of the target material at different setting temperatures of the high-temperature aging box 11, so as to greatly improve the accuracy of calculating the service life of the target material.

[0031] Further, the high-temperature aging device provided by the embodiment further comprises a junction temperature calculation module (not shown) configured to calculate the junction temperature of the target material at different set temperatures of the high-temperature aging box 11 according to the spectrum of the target material at different temperatures.

[0032] Optionally, the junction temperature calculation module is communicatively connected with the spectrum testing circuit or integrated with the spectrum testing circuit. In addition to the collimator 13, the spectrum testing circuit in the embodiment can further comprise a multimode optical fiber 15 and a spectrometer 16, the spectrometer 16 is located outside the high-temperature aging box 11, the multimode optical fiber 15 is arranged through the high-temperature aging box 11, and the collimator 13 and the spectrometer 16 are connected through the multimode optical fiber 15. The junction temperature calculation module can be communicatively connected with the spectrometer 16 or integrated with the spectrometer 16. After the spectrometer 16 acquires the spectrum of the target material at different positions, the relevant information is transmitted to the junction temperature calculation module, so that the junction temperature calculation module calculates the junction temperature of the target material at different set temperatures of the high-temperature aging box 11 according to the spectrum of the target material at different temperatures.

[0033] In order to facilitate the movement of the collimator 13, preferably, the high-temperature aging device provided by the embodiment further comprises a support (not shown). The support is movably arranged in the high-temperature aging box 11 along the height direction of the high-temperature aging box 11 and along the direction parallel to the aging plate 12. The collimator 13 is fixed below the support and moves with the movement of the support. Generally, the high-temperature aging box 11 is vertically arranged on the ground, so the support can be understood as being movably arranged in the vertical direction and the horizontal direction in general cases.

[0034] The support can be arranged in the high-temperature aging box 11 by any suitable manner. For example, one of the support and the high-temperature aging box 11 is provided with a guide groove, and the other is provided with a guide rail. The guide rail is embedded in the guide groove and moves along the extension path of the guide groove, so as to realize the relative movement between the support and the high-temperature aging box 11. For example, the opposite two side walls of the high-temperature aging box 11 are provided with first grooves along the height direction of the high-temperature aging box 11, and the top wall of the high-temperature aging box 11 is provided with second grooves with a specific extension path in the horizontal direction. The support is provided with protrusions matched in shape with the first grooves and the second grooves, respectively, and extends into the first grooves and the second grooves, respectively, so that the support can move along the extension path of the first grooves and the extension path of the second grooves, respectively. In some other embodiments, the support can also be movably arranged in the high-temperature aging box 11 by other manners, which are not particularly limited in the present application.

[0035] The movement of the bracket can be driven by a driving module 14. In this embodiment, the driving module 14 includes a driving handle and a connecting rod. The driving handle is arranged outside the high-temperature aging box 11, and the connecting rod penetrates the box body of the high-temperature aging box 11 to connect the driving handle and the bracket. The bracket moves along with the rotation and / or movement of the driving handle. In other embodiments, the driving module 14 can also be arranged inside the high-temperature aging box 11. By arranging a corresponding control program, the driving module 14 can be controlled to move and drive the bracket to move.

[0036] In this embodiment, the box body of the high-temperature aging box 11 is provided with a through hole for the penetration of the connecting rod and the multi-mode optical fiber 15. Preferably, the through holes for the penetration of the connecting rod and the multi-mode optical fiber 15 are located at different side walls of the high-temperature aging box 11 to avoid interference between different arrangements. In order to facilitate penetration, the aperture of the through hole for the penetration of the connecting rod should be larger than the diameter of the connecting rod, and the aperture of the through hole for the penetration of the multi-mode optical fiber 15 should be larger than the diameter of the multi-mode optical fiber 15. In order to maintain the stability of the temperature inside the high-temperature aging box 11, heat insulation cotton can be used to cover each through hole.

[0037] The movement of the collimator 13 in the height direction of the high-temperature aging box 11 is one-dimensional, and the movement of the collimator 13 in the direction parallel to the aging plate 12 can be one-dimensional or two-dimensional. When the movement is one-dimensional, the corresponding guide groove is linear, and when the movement is two-dimensional, the corresponding guide groove is curved or has linear segments in two orthogonal directions.

[0038] Preferably, the aging plate 12 has a plurality of fixed point positions, each of which is used to place a target material. The distribution positions of the plurality of fixed point positions correspond one-to-one to a plurality of movement points of the collimator 13 in the direction parallel to the aging plate 12. Specifically, the plurality of fixed point positions can be arranged at equal unit distances. In this way, when the collimator 13 moves the unit distance, it can be known that the collimator 13 is located above which target material. This is conducive to alignment and improves the accuracy of data, and is also conducive to the accurate correspondence of data.

[0039] In the embodiment, the high-temperature aging box 11 is sequentially provided with a plurality of bearing planes along the height direction of the high-temperature aging box 11, and the aging plate 12 is detachably arranged on one of the bearing planes. The position of the bracket in the height direction of the high-temperature aging box 11 is adjusted according to the bearing plane on which the aging plate 12 is arranged, so that the spectrum of the target material carried by the aging plate 12 can be captured by the spectrum testing circuit.

[0040] Specifically, the side wall of the high-temperature aging box 11 can be provided with a mounting groove in a direction perpendicular to the high-temperature aging box 11, and the mounting groove forms the bearing plane. The aging plate 12 is arranged in the mounting groove in a plug-in manner.

[0041] Preferably, the movable distance of the collimator 13 in the height direction of the high-temperature aging box 11 is not less than one-half of the height of the inner cavity of the high-temperature aging box 11, so that the spectrum of the target material on the aging plate 12 with different heights can be acquired as much as possible.

[0042] The step of testing the junction temperature of the target material by using the high-temperature aging device provided in the embodiment can be as follows:

[0043] (1) Insert the aging plate carrying the target material into the high-temperature aging box, and close the door of the box.

[0044] (2) Set the program, apply a constant current to the target material, and make the target material emit light stably.

[0045] (3) Drive the bracket to move, so that the collimator is located above one of the target materials.

[0046] (4) Set the temperature Ta1 of the high-temperature aging box, stabilize for a period of time, and read the spectrum Wp1 by using the spectrometer.

[0047] (5) Drive the bracket to move, so that the collimator is located above different target materials, and read the Wp1 of different target materials.

[0048] (6) Set the temperature Ta2 of the high-temperature aging box, stabilize for a period of time, and read the spectrum Wp2.

[0049] (7) Drive the bracket to move, so that the collimator is located above different target materials, and read the Wp2 of different target materials.

[0050] (8) Set the temperature Ta3 of the high-temperature aging box, stabilize for a period of time, and read the spectrum Wp3.

[0051] (9) Drive the bracket to move, so that the collimator is located above different target materials, and read the Wp3 of different target materials.

[0052] (10) Set the high-temperature aging box Ta4, stabilize for a period of time, read the spectrum Wp4;

[0053] (11) Drive the bracket to move, so that the collimator stays above different target materials, and read Wp4 of the different target materials;

[0054] (12) Set the high-temperature aging box Ta5, stabilize for a period of time, read the spectrum Wp5;

[0055] (13) Drive the bracket to move, so that the collimator stays above different target materials, and read Wp5 of the different target materials

[0056] (14) Set the high-temperature aging box Ta6, stabilize for a period of time, read the spectrum Wp6;

[0057] (15) Drive the bracket to move, so that the collimator stays above different target materials, and read WP6 of the different target materials;

[0058] (16) According to the collected spectrum data of different materials at different temperatures, the junction temperature of the target material at different high-temperature aging box setting temperatures is calculated.

[0059] The number of spectrum data obtained at different temperatures can be adjusted according to actual needs.

[0060] The high-temperature aging device provided in the embodiment can measure the junction temperature of different laser diode chips, which is particularly important for high-power edge-emitting laser diode chips, and greatly improves the accuracy of calculating the device lifetime. Specifically, the high-temperature aging device provided in the embodiment has the following advantages:

[0061] (1) The device lifetime calculated from the device junction temperature tested by the high-temperature aging device provided in the embodiment is higher than the device lifetime calculated from the high-temperature aging box setting temperature, and is closer to the real lifetime of the device;

[0062] (2) The device junction temperature tested by the high-temperature aging device provided in the embodiment, and the client application conditions, can design effective module end aging conditions, and improve the module reliability screening capability;

[0063] (3) The performance test machine of the device is subject to the TEC temperature control function, and the maximum temperature of the machine is generally 100℃, which cannot effectively study the performance change of the device at higher temperatures. The temperature of the high-temperature aging box is generally set to a high temperature of 150℃, and the high-temperature aging box junction temperature testing device provided in the embodiment can obtain the performance change trend of the device at high temperature, which is beneficial to more electrical analysis of the device in the research and development stage;

[0064] (4) The device junction temperature tested by the high-temperature aging device provided in the embodiment is beneficial to device failure analysis.

[0065] It should be noted that although the present application has been disclosed with the preferred embodiments as above, the above embodiments are not intended to limit the present application. For any skilled person in the art, many possible changes and modifications or equivalent embodiments of equivalent changes can be made to the technical solutions of the present application by using the disclosed technical content without departing from the scope of the technical solutions of the present application. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present application, which does not depart from the content of the technical solutions of the present application, still belongs to the protection scope of the technical solutions of the present application.

Claims

1. A high temperature aging device characterized by, The high-temperature aging device comprises: a high-temperature aging box, which provides a constant current to a target material so as to stabilize light emission of the target material; an aging plate for carrying the target material, which is arranged in the high-temperature aging box in a direction perpendicular to the height direction of the high-temperature aging box; a spectrum testing circuit, which comprises a collimator arranged in the high-temperature aging box and movably arranged above the aging plate in the height direction of the high-temperature aging box and in a direction parallel to the aging plate, so as to obtain the spectrum of the target material at different positions.

2. The high temperature aging apparatus of claim 1, wherein The high-temperature aging device further comprises: a junction temperature calculation module, which calculates the junction temperature of the target material at different setting temperatures of the high-temperature aging box according to the spectrum of the target material at different temperatures.

3. The high temperature aging apparatus of claim 1, wherein The high-temperature aging device further comprises a support movably arranged in the high-temperature aging box in the height direction of the high-temperature aging box and in the direction parallel to the aging plate, and the collimator is fixed below the support and moves with the movement of the support.

4. The high temperature aging apparatus of claim 3, wherein The high-temperature aging device further comprises a driving module, and the support moves under the driving of the driving module.

5. The high temperature aging apparatus of claim 4, wherein The driving module comprises a driving handle arranged outside the high-temperature aging box and a connecting rod penetrating the box body of the high-temperature aging box to connect the driving handle and the support, and the support moves with the rotation and / or movement of the driving handle.

6. The high temperature aging apparatus of claim 3, wherein The high-temperature aging box is sequentially arranged with a plurality of carrying planes in the height direction of the high-temperature aging box, the aging plate is detachably arranged in one of the carrying planes, and the position of the support in the height direction of the high-temperature aging box is adjusted according to the carrying plane where the aging plate is arranged.

7. The high temperature aging apparatus of claim 6, wherein The movable distance of the collimator in the height direction of the high-temperature aging box is not less than one-half of the height of the inner cavity of the high-temperature aging box.

8. The high temperature aging apparatus of claim 1, wherein The movement mode of the collimator in the direction parallel to the aging plate is one-dimensional or two-dimensional.

9. The high temperature aging apparatus of claim 1, wherein The aging plate has a plurality of fixed points, each of which is used to place one target material, and the distribution positions of the plurality of fixed points correspond to the plurality of movement points of the collimator in the direction parallel to the aging plate one by one.

10. The high temperature aging apparatus of claim 1, wherein The spectrum testing circuit further comprises a multimode optical fiber and a spectrometer, the spectrometer is located outside the high-temperature aging box, the multimode optical fiber is arranged penetrating the box body of the high-temperature aging box, and the collimator and the spectrometer are connected through the multimode optical fiber.

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