Micro projection ray machine DMD heat dissipation device

Abstract

The utility model provides a DMD heat dissipation device of a miniature projection light machine, and relates to the technical field of projection light machines. Comprising a PCB positioning structure, a heat-conducting fin external heat dissipation surface, a micro projection body, and a DMD chip, a heat-conducting pad, a heat-conducting fin, elastic sealing foam and a PCB which are sequentially fixed on the micro projection body through fixing screws, the micro projection body is used for emitting light, the DMD chip is used for generating a corresponding image according to the light and generating heat, the heat conduction pad transmits the heat to the heat conduction sheet, the heat conduction sheet is used for receiving the heat and transmitting the heat to an external heat dissipation surface of the heat conduction sheet, and the elastic sealing foam is used for providing a closed space for the DMD chip. The PCB is used for providing stable electrical connection for the DMD chip, the PCB positioning structure is used for positioning the PCB, and the external heat dissipation surface of the heat-conducting fin is used for conducting heat to the surrounding environment or transferring and conducting the heat to the complete machine heat dissipation module. According to the utility model, the problems of large occupied space and high complexity of an optical machine heat dissipation structure in the prior art are solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a projection light machine technical field, especially a kind of miniature projection light machine DMD heat sink. BACKGROUND

[0002] In the development history of projection light machine technology, miniature DLP (Digital Light Processing) projection light machine has received extensive attention due to its portability and other advantages. Currently, the larger light machines on the market mainly use two heat dissipation methods: one is an independent aluminum heat sink, a spring piece compression connector, and an aluminum sheet compression DMD (Digital Micromirror Device) chip; the other is an independent aluminum heat sink directly compressing the DMD chip. These two heat dissipation structures can effectively meet the heat dissipation needs of large light machines. However, these heat dissipation methods have significant limitations.

[0003] Firstly, the volume is large. The independent aluminum heat sink used in large light machines occupies a large space, and the related connection structure and auxiliary heat dissipation components also require a certain space layout, making it difficult for the entire heat dissipation structure to adapt to the compact design of miniature light machines.

[0004] Secondly, the structure is complex. The addition of components such as spring piece compression connectors helps improve the reliability of heat dissipation contact, but also increases the complexity of the entire heat dissipation system, which cannot be realized in the limited space of miniature light machines.

[0005] In summary, the existing technology has the following shortcomings:

[0006] 1. Large space occupation: The independent aluminum heat sink in the heat dissipation structure of large light machines is bulky and cannot find enough space in miniature light machines. If it is forcibly reduced in size and applied to miniature light machines, it will greatly affect the heat dissipation efficiency.

[0007] 2. High structural complexity: Complex structures such as spring piece compression connectors are too cumbersome for miniature design requirements of miniature light machines, increasing assembly difficulty and causing heat dissipation performance to decline due to space limitations. It is also prone to inaccurate assembly, affecting the overall performance of the light machine.

[0008] 3. Lack of miniaturization adaptability: The heat dissipation design of large light machines does not consider the space and structural simplification needs of miniature light machines, and cannot guarantee heat dissipation effect in the small size of miniature light machines, resulting in insufficient heat dissipation affecting performance or excessive pursuit of heat dissipation increasing the volume of the light machine in the application scenario of miniature light machines. INVENTION CONTENTS

[0009] In order to overcome the prior art, the utility model discloses a kind of DMD heat dissipation devices of micro projection light machine, the utility model solves the problem that the space occupation of light machine heat dissipation structure is large and the complexity is too high in prior art.

[0010] To achieve the above object, the utility model provides the following scheme:

[0011] A kind of DMD heat dissipation device of micro projection light machine, comprising:

[0012] PCB positioning structure, heat dissipation surface of heat conduction sheet and its micro projection body and DMD chip, heat conduction pad, heat conduction sheet, elastic sealing foam and PCB fixed in micro projection body by fixing screw in sequence;

[0013] The heat dissipation surface of heat conduction sheet is connected with the heat conduction sheet, and the PCB positioning structure is connected with the PCB;

[0014] The micro projection body is used to emit light, the DMD chip is used to generate corresponding image according to the light and generate heat, the heat conduction pad is used to transfer the heat to the heat conduction sheet, the heat conduction sheet is used to receive heat and transfer the heat to the heat dissipation surface of heat conduction sheet, the elastic sealing foam is used to provide closed space for DMD chip, the PCB is used to provide stable electrical connection for the DMD chip, the PCB positioning structure is used to position the PCB, and the heat dissipation surface of heat conduction sheet is used to conduct heat to surrounding environment or transfer to whole machine heat dissipation module.

[0015] Preferably, the material of the heat conduction sheet is copper sheet or graphene sheet.

[0016] The utility model discloses the following technical effects:

[0017] The utility model provides a kind of miniature projection light machine DMD heat sink, comprising: PCB positioning structure, heat conduction sheet external heat dissipation surface and its miniature projection body and DMD chip, heat conduction pad, heat conduction sheet, elastic sealing bubble cotton and PCB fixed in turn on miniature projection body by fixed screw;The heat conduction sheet external heat dissipation surface is connected with the heat conduction sheet, and the PCB positioning structure is connected with the PCB;The miniature projection body is used to emit light, and the DMD chip is used to generate corresponding image according to the light and generate heat, the heat conduction pad is used to transfer the heat to the heat conduction sheet, the heat conduction sheet is used to receive heat and transfer the heat to the heat conduction sheet external heat dissipation surface, the elastic sealing bubble cotton is used to provide closed space for DMD chip, the PCB is used to provide stable electrical connection for the DMD chip, the PCB positioning structure is used to position the PCB, and the heat conduction sheet external heat dissipation surface is used to conduct heat to surrounding environment or transfer to whole machine heat dissipation module.The utility model is designed to replace heat conduction sheet for different power conditions, to ensure the heat dissipation effect under various powers, to simplify and efficient assembly structure, to realize compact assembly and accurate positioning using two screws and PCB board;The heat conduction effect of heat conduction pad between chip and heat conduction sheet, and the sealing and compression function of elastic sealing bubble cotton, by simplifying assembly structure, only using two screws, and with the help of accurate fixing and positioning function of PCB board, without affecting heat dissipation and other performances, the three-dimensional size of light machine is greatly compressed, the strict requirement of space for miniature light machine is met, the miniaturization design goal is realized;The unique design of PCB board can provide accurate positioning and firm fixing for key components inside light machine, ensure the relative position accuracy between components, improve the assembly quality and working reliability of light machine, and reduce the risk of failure caused by component displacement or looseness.Adapting to different power conditions: for the small power and high power running scenes that may occur in miniature light machine, the utility model adopts replaceable heat conduction sheet design, can flexibly select heat conduction material according to actual power demand, realizes optimized heat dissipation under different powers, improves the energy utilization efficiency and adaptability of light machine;The external heat dissipation surface increases the heat dissipation area, and provides structure for external heat transfer, accelerates heat exchange between heat and surrounding air, further improves the heat dissipation efficiency.Using heat conduction sheet made of appropriate heat conduction material (copper or graphene) and combined with the use of heat conduction pad, heat generated by DMD chip can be quickly and effectively conducted away, high-efficiency heat dissipation is realized, and the light machine can maintain stable performance under different power running conditions. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical schemes in the embodiments of the present application or the prior art, the drawings needed in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0019] Figure 1 A micro projection light machine DMD heat dissipation device structure schematic view is provided for the embodiments of the present application.

[0020] Mark explanation:

[0021] 1-micro projection body, 2-DMD chip, 3-heat conduction pad, 4-heat conduction sheet, 5-elastic sealing foam, 6-PCB, 7-fixing screw, 8-PCB positioning structure, 9-heat conduction sheet external heat dissipation surface. Specific implementation

[0022] The technical solutions in the embodiments of the present application will be described clearly and completely in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the protection scope of the present application.

[0023] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the present application will be further described in detail in combination with the drawings and specific embodiments.

[0024] As Figure 1 shown, the present application provides a micro projection light machine DMD heat dissipation device, comprising:

[0025] PCB positioning structure 8, heat conduction sheet external heat dissipation surface 9 and its micro projection body 1 and DMD chip 2, heat conduction pad 3, heat conduction sheet 4, elastic sealing foam 5 and PCB 6 fixed on the micro projection body 1 in turn through fixing screw 7;

[0026] The heat conduction sheet external heat dissipation surface 9 is connected with the heat conduction sheet 4, and the PCB positioning structure 8 is connected with the PCB 6.

[0027] The micro projection body 1 is used to emit light, the DMD chip 2 is used to generate corresponding images according to the light and generate heat, the heat conduction pad 3 is used to transfer the heat to the heat conduction sheet 4, the heat conduction sheet 4 is used to receive heat and transfer the heat to the heat conduction sheet external heat dissipation surface 9, the elastic sealing foam 5 is used to provide a closed space for the DMD chip 2, the PCB 6 is used to provide stable electrical connection for the DMD chip 2, the PCB positioning structure 8 is used to position the PCB 6, and the heat conduction sheet external heat dissipation surface 9 is used to conduct heat to the surrounding environment or transfer heat to the whole machine heat dissipation module.

[0028] Specifically, when the DLP projection light machine works, the micro projection body 1 will hit the light on the DMD chip 2, the DMD chip 2 generates heat under the light, the temperature will affect the reliability and performance of the DMD chip 2, and in severe cases, the DMD chip 2 can be directly damaged; in the structure, the heat of the DMD chip 2 is conducted to the heat conduction sheet 4 (material can be changed, copper sheet for small power and graphene sheet for large power) through the heat conduction pad 3. The heat conduction sheet 4 utilizes the material advantage to conduct heat to the external heat dissipation surface and dissipate to the surrounding environment for heat dissipation; or the external heat dissipation surface is transferred to the whole machine heat dissipation module, which meets the larger power heat dissipation demand; in addition to heat dissipation, dustproof sealing is also a necessary condition to ensure the stable work of the projection engine, the elastic sealing foam 5 is pressed to provide a closed space for the DMD chip 2, which meets the dustproof demand, at the same time, the elastic sealing foam 5 under pressure also provides a more stable connection for the DMD chip 2 and the PCB 6 board, which ensures that the heat conduction sheet 4 and the DMD chip always maintain close contact, the PCB 6 board is positioned horizontally through the unique positioning structure, and all structures are attached to the light machine body by two screws to provide stable support; the whole structure ensures that the heat conduction path is unobstructed and reduces the interference of external factors on the heat dissipation and light machine performance; and provides a stable and clean working environment for the light machine inside, which also meets the volume demand of the micro light machine.

[0029] Specifically, due to the independent aluminum heat sink and the complex connecting structure, the large optical machine heat dissipation structure cannot meet the space limitation requirement of the micro optical machine, and the high-efficiency heat dissipation and component fixing and positioning in the extremely small space are successfully realized through the optimization design of the utility model, the three-dimensional size of the optical machine is extremely compressed, and the miniaturization is truly realized; the large optical machine heat dissipation system is designed for high-power operation, and the adaptability to the small-power working condition is poor, and the utility model can flexibly select the copper or graphene heat conduction sheet 4 according to the actual power requirement of the optical machine, the copper sheet is used for heat dissipation under the low power, the external heat conduction link path is provided for assisting under the high power, and the external heat conduction can be flexibly adjusted; the utility model adopts the simplified assembly structure, and only two screws and the PCB 6 plate are used for realizing the positioning and fixing, the assembly error and the fault risk are reduced, and the overall reliability of the optical machine is improved; the PCB 6 plate of the utility model has the specially designed accurate positioning structure (such as the No. 9 PCB 6 positioning structure), and the accurate installation and fixing of the internal components of the optical machine can be ensured, and the stable performance of the optical machine is ensured.

[0030] The various embodiments in the specification are described in a progressive manner, and each embodiment focuses on the difference from other embodiments, and the same or similar parts between various embodiments can be referred to each other.

[0031] The principle and implementation mode of the utility model are described by applying specific examples in the specification, and the above embodiment description is only used for helping to understand the method and core idea of the utility model; meanwhile, according to the idea of the utility model, the specific implementation mode and application range will be changed by the general technical personnel in the field. In conclusion, the content of the specification should not be understood as the limitation of the utility model.

Claims

1. A micro projection light engine DMD heat dissipation device, characterized in that, Comprise: PCB positioning structure, heat conduction sheet external heat dissipation surface, micro projection body and DMD chip, heat conduction pad, heat conduction sheet, elastic sealing foam and PCB fixed on the micro projection body by fixing screws in turn; The heat conduction sheet external heat dissipation surface is connected with the heat conduction sheet, and the PCB positioning structure is connected with the PCB; The micro projection body is used for emitting light, the DMD chip is used for generating corresponding images according to the light and generating heat, the heat conduction pad is used for transmitting the heat to the heat conduction sheet, the heat conduction sheet is used for receiving heat and transmitting the heat to the heat conduction sheet external heat dissipation surface, the elastic sealing foam is used for providing a closed space for the DMD chip, the PCB is used for providing stable electrical connection for the DMD chip, the PCB positioning structure is used for positioning the PCB, and the heat conduction sheet external heat dissipation surface is used for conducting heat to the surrounding environment or transferring to the whole machine heat dissipation module.

2. The DMD heat sink device for a micro projection light machine according to claim 1, wherein, The material of the heat conduction sheet is copper sheet or graphene sheet.

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