Compact case structure

Abstract

The utility model discloses a compact case structure, which comprises a case shell, a bearing plate arranged in the case shell, a main board arranged on the front side of the bearing plate, a hollow hole arranged on the bearing plate and corresponding to the main board, and a power supply cabin arranged below the main board, and is characterized in that a hard disk frame is fixedly arranged on one side of the case shell far away from the main board; a computer hard disk is fixedly installed on the side, located in the case, of the hard disk frame, L-shaped frames used for supporting the computer hard disk are symmetrically arranged on the hard disk frame, and a side face heat dissipation assembly is arranged on the side, corresponding to the hollowed-out holes, of the case shell. Air entering the box shell firstly penetrates through the hollowed-out holes and directly acts on the back face of the mainboard, cooling of the mainboard is actively assisted, high-temperature work of the mainboard is avoided, the service life of the mainboard is prolonged, and stable operation of a computer is guaranteed.

Description

TECHNICAL FIELD

[0001] The utility model relates to computer case technical field, concretely is a compact case structure. BACKGROUND

[0002] Computer (computer) commonly known as computer is modern for high speed calculation electron computer machine, can carry out numerical calculation, also can carry out logic calculation, also have storage memory function. It is the modernization intelligent electronic equipment of can follow the program operation, automatic, high speed processing mass data, along with the development of science and technology, the function that commonly used PC mainframe case possesses is more and more powerful, operation ability and information's reading speed are also changing rapidly, but most circumstances, we actually do not need so strong full function, this will produce waste, therefore, compact case emerges as the times require, its inside mainly uses integrated chip, saves a large amount of space and reduces energy consumption.

[0003] However due to compact case internal space is small, after installing various computer hardware, the space that remains is extremely limited, this not only makes air flow path be greatly limited, also affected the size and layout of cooling components such as fan and radiator, cannot accommodate enough or enough big heat dissipation component, leading to airflow is not enough to effectively take away the heat generated by hardware, make the heat dissipation effect be poor, can cause hardware overheating problem, influence computer's performance and stability. UTILITY MODEL CONTENT

[0004] The utility model is to provide a compact case structure to solve the problem raised in the above background art.

[0005] To achieve the above object, the utility model provides the following technical scheme:

[0006] A compact case structure, including the box shell, the box shell is installed with the bearing plate, the front surface of bearing plate is installed with the mainboard, the bearing plate is equipped with the hollow hole corresponding with mainboard, the mainboard below is equipped with the power supply compartment, the box shell is fixedly installed with the hard disk rack on the side away from mainboard, the hard disk rack is fixedly installed with the computer hard disk on the side in the case, the hard disk rack is equipped with the L type frame for supporting computer hard disk on symmetry, the side surface heat dissipation component is equipped on the side corresponding with hollow hole of box shell, and the external air is sucked into the box shell through the side surface heat dissipation component.

[0007] Further, the side surface heat dissipation component includes the air inlet pipe, the air inlet pipe is communicated with the inside of box shell, the air inlet pipe is equipped with fan holder no. 1 on the air inlet, and the center of fan holder no. 1 is hollow to form the air vent, the bottom of fan holder no. 1 is fixedly installed with the heat dissipation fan no. 1 corresponding with air vent, the blowing end of heat dissipation fan no. 1 is towards the direction of air inlet, and a plurality of placing strips are arranged on the air vent, and a plurality of drying agents are placed on the placing strips.

[0008] Further, the air inlet pipe is designed in T shape, a heat conduction plate is threadedly connected to one end of the air inlet pipe away from the fan frame one, the heat conduction plate is installed in the air inlet pipe, a semiconductor refrigeration sheet is installed on the heat conduction plate, the cold surface of the semiconductor refrigeration sheet faces upward, the hot surface of the semiconductor refrigeration sheet faces downward and is attached to the heat conduction plate.

[0009] Further, the bottom of the heat conduction plate is provided with a plurality of heat dissipation fins.

[0010] Further, a hollow fan frame two is fixedly installed below the heat conduction plate, a heat dissipation fan two is installed on the fan frame two, and the blowing end of the heat dissipation fan two faces the heat conduction plate.

[0011] Further, at least one air outlet is arranged between the heat conduction plate and the fan frame two.

[0012] Further, handles are arranged on both sides of the heat dissipation fins.

[0013] The utility model discloses the beneficial effect:

[0014] The utility model occupies small, and the internal structure is compact, through the side surface heat dissipation subassembly, the outside air is inhaled into the box shell inside, and the air that enters the box shell inside first passes through the hollow hole, directly acts on the back of mainboard, and actively helps mainboard cooling, avoids the high temperature work of mainboard, prolongs the life of mainboard and guarantees the stable operation of computer, then through the air of box shell rear -end fan is extracted, and the air extraction will cool the electronic components that pass through, thereby improved the heat dissipation efficiency of the box shell inside, guarantee the use performance and stability of computer.

[0015] The other features and advantages of the utility model will be described in detail in the subsequent specific embodiment part. ACCURATE DRAWINGS

[0016] Figure 1 The overall structure of the utility model Figure 1 .

[0017] Figure 2 The overall structure of the utility model Figure 2 .

[0018] Figure 3 The explosion of the utility model Figure 1 .

[0019] Figure 4 The explosion of the utility model Figure 2 .

[0020] Figure 5 The side surface heat dissipation subassembly explosion map of the utility model.

[0021] Figure 6 The utility model discloses a side surface heat dissipation subassembly cross section view.

[0022] Reference signs: 1, box shell, 2, bearing plate, 3, power supply compartment, 4, hard disk frame, 5, computer hard disk, 6, side surface heat dissipation subassembly, 21, mainboard, 22, hollow hole, 41, L type frame, 61, air inlet pipe, 62, air outlet, 63, fan frame one, 64, heat conduction plate, 65, fan frame two, 631, air vent, 632, heat dissipation fan one, 633, placement strip, 634, desiccant, 641, semiconductor refrigeration piece, 642, heat dissipation fin, 643, handle, 651, heat dissipation fan two, DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model.

[0024] Please refer to Figures 1-6 ;

[0025] The utility model provides a compact case structure, including the box shell 1, the box shell 1 is installed with the bearing plate 2, the front surface of bearing plate 2 is installed with mainboard 21, is equipped with the hollow hole 22 of corresponding mainboard 21 on bearing plate 2, the heat dissipation space of mainboard 21 is maximized, is equipped with power supply compartment 3 below mainboard 21, to ensure good heat dissipation performance, the front end and rear end of box shell 1 are provided with a plurality of heat dissipation holes, and are installed with fan in the position corresponding heat dissipation hole, the front baffle of box shell 1 is installed, and the front baffle is equipped with a plurality of strip air inlet at the lower end, the fan located at the front end of the case is responsible for inhaling external air, and directly blows to the inside of the case to help the cooling of internal electronic components, and the fan at the rear end rapidly discharges the hot air after absorbing heat outside the case, to prevent the accumulation of hot air from causing temperature rise, considering that modern power supply equipment usually has a fan, the case is also provided with additional heat dissipation holes at the rear end close to the power supply compartment 3, allowing the fan inside the power supply to effectively discharge the heat generated, improving the heat dissipation effect of the power supply, the side of the box shell 1 away from the mainboard 21 is fixedly installed with a hard disk rack 4 by screws, the hard disk rack 4 is fixedly installed with a computer hard disk 5 on one side in the case, the computer hard disk 5 is located inside the box shell 1, to maximize the use of the remaining space inside the box shell 1, the hard disk rack 4 is symmetrically provided with an L-shaped bracket 41 for supporting the computer hard disk 5, further enhancing the stability of the hard disk, the side of the box shell 1 corresponding to the hollow hole is provided with a side heat dissipation assembly 6, external air is sucked into the inside of the box shell 1 through the side heat dissipation assembly 6, the air entering the inside of the box shell 1 first passes through the hollow hole 22, directly acting on the back of the mainboard 21, actively helping the mainboard 21 to cool down, avoiding high-temperature work of the mainboard 21, prolonging the service life of the mainboard 21 and ensuring the stable operation of the computer, and then the air inside the box shell 1 is extracted by the rear fan of the box shell 1, the air extraction will cool the electronic components passing through, thereby improving the heat dissipation efficiency inside the box shell 1, ensuring the use performance and stability of the computer.

[0026] In the embodiment, the side heat dissipation assembly 6 includes an air inlet pipe 61, which is in communication with the inside of the box shell 1, and guides air into the inside of the box shell 1 through the air inlet pipe 61, the air inlet of the air inlet pipe 61 is provided with a fan holder 63, the center of the fan holder 63 is hollow to form an air vent 631, the bottom of the fan holder 63 is fixedly installed with a heat dissipation fan 632 corresponding to the air vent 631, the blowing end of the heat dissipation fan 632 faces the air inlet direction, air is sucked in through the heat dissipation fan 632, a plurality of placement strips 633 are arranged at intervals on the air vent 631, and a plurality of drying agents 634 are placed on the placement strips 633, the drying agents 634 can effectively absorb the moisture contained in the air entering the air inlet pipe 61, ensure that the air entering the case remains dry, avoid damage to computer hardware caused by moisture, and improve the service life of the hardware, and the drying agents 634 on the surface can be replaced.

[0027] In this embodiment, the air inlet pipe 61 is designed in T shape, and the air inlet pipe 61 is threadedly connected with the heat conduction plate 64 away from one end of the fan frame 163. The heat conduction plate 64 seals the lower part of the air inlet pipe 61, preventing the air blown by the first cooling fan 632 from being directly discharged from the lower part of the air inlet pipe 61. The heat conduction plate 64 is provided with a semiconductor refrigeration fin 641, and the cold face of the semiconductor refrigeration fin 641 faces upward, and the hot face faces downward. The hot face of the semiconductor refrigeration fin 641 is attached to the heat conduction plate 64. The air blown by the first cooling fan 632 directly blows to the cold face of the semiconductor refrigeration fin 641, which can effectively reduce the air temperature. The cooled air then enters the box shell 1 inside along the air inlet pipe 61, further improving the cooling effect of the box. The heat conduction plate 64 is responsible for quickly conducting the heat generated by the hot face of the semiconductor refrigeration fin 641, preventing the heat from accumulating on the hot face of the refrigeration fin and causing damage due to overheating. This not only ensures the cooling effect inside the box, but also ensures the stable operation of the semiconductor refrigeration fin 641. In addition, the heat conduction plate 64 is installed in the air inlet pipe 61, avoiding accidental contact of human skin with the heat conduction plate 64 that has absorbed a large amount of heat and causing burns.

[0028] In this embodiment, the bottom of the heat conduction plate 64 is provided with a plurality of heat dissipation fins 642, which can effectively disperse the heat on the heat conduction plate 64 and increase the heat dissipation area, thereby accelerating the heat dissipation of the heat conduction plate 64 and the heat dissipation fins 642.

[0029] In this embodiment, the air inlet pipe 61 is fixedly installed with a hollow fan frame 165 below the heat conduction plate 64, and the fan frame 165 is installed with a cooling fan 651. The blowing end of the cooling fan 651 faces the heat conduction plate 64, which can directly blow air to the heat conduction plate 64 and the heat dissipation fins 642 at the bottom of the heat conduction plate 64, thereby accelerating the heat dissipation efficiency of the heat conduction plate 64 and the heat dissipation fins 642.

[0030] In order to avoid the accumulation of heat after the air blown by the cooling fan 651 exchanges heat with the heat conduction plate 64, at least one air outlet 62 is provided between the heat conduction plate 64 and the fan frame 165 of the air inlet pipe 61. The air exchanged by the heat conduction plate 64 can be quickly discharged from the air inlet pipe 61, ensuring that the heat will not accumulate inside.

[0031] In this embodiment, the heat conduction plate 64 is provided with a handle 643 on both sides of the heat dissipation fin 642, which is convenient for users to easily rotate the heat conduction plate 64 by grabbing the handle 643. The heat conduction plate 64 can be easily screwed into or out of the air inlet pipe 61, greatly simplifying the installation and disassembly process, and facilitating daily maintenance and cleaning.

[0032] It is apparent for a person skilled in the art that the present application is not limited to the details of the above-described exemplary embodiments, but that it can be implemented in other concrete forms without departing from the spirit or the essential characteristics of the present application. Therefore, the embodiments should be considered as exemplary and non-limiting, the scope of the present application being defined by the claims appended hereto rather than by the above description, and all the changes which fall within the meaning and the scope of the equivalent elements of the claims are intended to be embraced therein. Any reference signs in the claims should not be construed as limiting the claims to the figures in which the reference signs are used.

[0033] Furthermore, it should be understood that although the present specification describes exemplary embodiments, not every embodiment contains only one independent technical solution, and the present specification is described in this way only for the sake of clarity, and a person skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other implementations that a person skilled in the art can understand.

Claims

1. A compact case structure, comprising a case shell (1), a bearing plate (2) is installed in the case shell (1), a mainboard (21) is installed on the front face of the bearing plate (2), a hollow hole (22) corresponding to the mainboard (21) is arranged on the bearing plate (2), and a power supply compartment (3) is arranged below the mainboard (21), characterized in that, The hard disk frame (4) is fixedly installed on one side of the case (1) away from the main plate (21), the computer hard disk (5) is fixedly installed on one side of the hard disk frame (4) in the case, the L-shaped frame (41) for supporting the computer hard disk (5) is symmetrically arranged on the hard disk frame (4), the side surface heat dissipation assembly (6) is arranged on the side of the case (1) corresponding to the hollow hole (22), and external air is sucked into the inside of the case (1) through the side surface heat dissipation assembly (6).

2. The compact chassis structure of claim 1, wherein The side surface heat dissipation assembly (6) comprises an air inlet pipe (61), the air inlet pipe (61) is in communication with the inside of the case (1), a fan frame one (63) is arranged on the air inlet of the air inlet pipe (61), the fan frame one (63) is hollow in the center to form an air vent (631), a heat dissipation fan one (632) corresponding to the air vent (631) is fixedly installed at the bottom of the fan frame one (63), the blowing end of the heat dissipation fan one (632) faces the air inlet, and a plurality of placing strips (633) are arranged at intervals on the air vent (631) and a plurality of drying agents (634) are placed on the placing strips (633).

3. The compact chassis structure of claim 2, wherein The air inlet pipe (61) is designed in a T-shaped mode, a heat conduction plate (64) is threadedly connected to one end of the air inlet pipe (61) away from the fan frame one (63), the heat conduction plate (64) is installed in the air inlet pipe (61), a semiconductor refrigeration sheet (641) is installed on the heat conduction plate (64), the cold surface of the semiconductor refrigeration sheet (641) faces upward, the hot surface of the semiconductor refrigeration sheet (641) faces downward and is attached to the heat conduction plate (64).

4. The compact chassis structure of claim 3, wherein The bottom of the heat conduction plate (64) is provided with a plurality of heat dissipation fins (642).

5. The compact chassis structure of claim 4, wherein The air inlet pipe (61) is fixedly installed with a hollow fan frame two (65) below the heat conduction plate (64), the heat dissipation fan two (651) is installed on the fan frame two (65), and the blowing end of the heat dissipation fan two (651) faces the heat conduction plate (64).

6. The compact chassis structure of claim 5, wherein At least one air outlet (62) is arranged between the heat conduction plate (64) and the fan frame two (65) of the air inlet pipe (61).

7. The compact chassis structure of claim 6, wherein The heat conduction plate (64) is provided with handles (643) on both sides of the heat dissipation fins (642).

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