Bent fixing clamp for semiconductor packaging
By using a bent semiconductor packaging clamp, the problems of uneven solder flow and high fixture cost in gold-solder sealing are solved, achieving constant clamping force and simplified operation, and adapting to different chip sizes and shapes.
Patent Information
- Application Number
- CN202423161717.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-20
- Publication Date
- 2025-12-30
- Estimated Expiration
- 2034-12-20
AI Technical Summary
In the existing gold-solder sealing process, loose screws fixing the cover plate can cause uneven solder flow, resulting in voids or solder overflow. Furthermore, different chip sizes require specialized fixtures, increasing costs.
A bent semiconductor packaging clamp is used, including a first clamping arm, a second clamping arm, and an elastic element. The bending part and the elastic element provide a constant clamping force, replacing traditional clamping blocks and screws, and adapting to different chip sizes and shapes.
It achieves constant clamping force, reduces fixture costs, adapts to different chip sizes and shapes, simplifies operation, and extends clamping time.
Smart Images
Figure CN223743639U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to semiconductor packaging technology, mainly applied to the back end packaging link of semiconductor packaging process, especially in the sealing or cap process of semiconductor packaging process used fixing tool. BACKGROUND
[0002] Gold tin sealing or gold tin cap process is usually applied to the back end packaging link of semiconductor packaging process, especially in the sealing or cap process, mainly used for ensuring the airtightness and stability of the chip after packaging, preventing moisture or other pollutants from the outside into the package, protecting the function and performance of the chip.
[0003] In general gold tin sealing process, according to the chip shape design gravity block pressure, the periphery is locked by using the cover plate, and at the same time, enough pressure needs to be applied above the cover plate to avoid defects such as solder cavity or solder overflow at the welding interface, but with the melting of the soldering sheet, the screw of the fixed cover plate will be loose, causing uneven stress, thereby affecting the flow of the solder, resulting in problems such as the formation of cavity or solder overflow at the welding surface. In addition, since the gravity block and the jig for placing the chip need to be made according to the size of the chip, different size chips need corresponding jigs and gravity blocks, which costs high.
[0004] Therefore, in order to solve the above problems, a simple and convenient technical scheme is needed. INVENTION CONTENTS
[0005] To solve the above problems, the utility model provides a kind of fixed clamp for bending semiconductor packaging, including first clamping arm, second clamping arm and elastic piece, elastic piece is set between first clamping arm and second clamping arm, provides the clamping force that first clamping arm and second clamping arm end mutually clamps;First clamping arm includes bending part and fixed part, bending part includes outwardly bent first bending section and inwardly bent second bending section with one end connected with first bending section, the other end of second bending section is provided with fixed part, and the semiconductor to be packaged is clamped and fixed by fixed part and second clamping arm.
[0006] Further, the included angle formed between the first bending section and the second bending section is 90-150 degrees.
[0007] Further, the second clamping arm also has a bending part, which includes a third bending section and a fourth bending section, one end of the fourth bending section is connected with the third bending section, and the other end of the fourth bending section is provided with a clamping plane corresponding to the fixed part, and the semiconductor to be packaged is clamped and fixed between the fixed part and the clamping plane
[0008] Further, a flexible pad is provided on the surface of the fixed part that contacts the semiconductor to be packaged.
[0009] Further, the other end of the first clamping arm and the second clamping arm is provided with a force applying part, and the clamping part of the first clamping arm is separated from the second clamping arm after force is applied to the force applying part.
[0010] Further, the elastic member is a torsion spring.
[0011] Further, the elastic member is detachably connected with the first clamping arm or the second clamping arm.
[0012] Further, a fixing lug is arranged at the position where the elastic member is arranged on the first clamping arm and the second clamping arm, and the fixing lug is used for fixing the elastic member.
[0013] Further, the fixing part is U-shaped.
[0014] The chip cover plate fixing clamp has the advantages that:
[0015] 1. The fixed clamp is used to replace the pressing block and the screw pressing, and the complex jig and clamp according to the size of the chip are not needed, and the chip cover plate has constant clamping force through the fixed clamp.
[0016] 2. The bending part of the first clamping arm and the second clamping arm is used to fix the semiconductor package form with special shape.
[0017] 3. The elastic member is detachably connected, different elastic members with different elastic forces can be replaced according to the clamping force, and the elastic member which is aged or has elastic fatigue can also be conveniently replaced. DRAWINGS
[0018] In order to more clearly illustrate the technical scheme in the embodiments of the utility model, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to these drawings without paying creative labor.
[0019] Figure 1 It is a structural schematic view of the first embodiment of the utility model.
[0020] Figure 2 It is a structural schematic view of another embodiment of the utility model.
[0021] REFERENCE NUMERALS
[0022] 1 first clamping arm
[0023] 10 force applying part
[0024] 11 bending part
[0025] 111 first bending section
[0026] 112 second bending section
[0027] 12 fixing portion
[0028] 2 second clamping arm
[0029] 20 force applying portion
[0030] 21 bending portion
[0031] 211 third bending section
[0032] 212 fourth bending section
[0033] 213 clamping plane
[0034] 3 elastic member
[0035] 31 fixing ear DETAILED DESCRIPTION
[0036] The following will demonstrate the embodiments of the present application by specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in the present specification.
[0037] In the following description, reference is made to the accompanying drawings which form a part hereof, and in which it is shown by way of illustration various embodiments of the present application. It is to be understood that other embodiments can be used and structural, electrical, as well as other changes can be made without departing from the spirit and scope of the present disclosure. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the embodiments of the present application are defined only by the appended patent claims. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. Spatially relative terms, such as "upper", "lower", "left", "right", "below", "below", "bottom", "top", and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures.
[0038] While the terms first, second, etc. can be used herein to describe various elements or parameters, these elements or parameters should not be limited by these terms. These terms are only used to distinguish one element or parameter from another element or parameter. For example, a first end can be termed a second end, and similarly, a second end can be termed a first end, without departing from the scope of the various described embodiments. Both the first and the second ends are ends, but they are not the same end unless the context clearly indicates otherwise.
[0039] Furthermore, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises", "comprising", "includes" and / or "including", when used herein, specify the presence of stated features, steps, operations, elements, components, items, and / or groups thereof, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, items, and / or groups thereof. As used herein, the terms "or" and "and / or" are to be interpreted as inclusive, i.e., as meaning one or any combination of the items. Thus, "A, B or C" or "A, B and / or C" means any of the following: A; B; C; A and B; A and C; B and C; A, B and C. This definition applies only when an element, function, step or operation is in some way inherently mutually exclusive.
[0040] Please refer to Figure 1 The utility model provides a kind of fixed clamp for bending-shaped semiconductor package, including first clamping arm 1, second clamping arm 2 and elastic member 3, elastic member 3 is arranged between first clamping arm 1 and second clamping arm 2, provides the clamping force that first clamping arm 1 and second clamping arm 2 end portion mutually clamps, and elastic member 3 is detachably connected with first clamping arm 1 or second clamping arm 2, structurally, the position of first clamping arm 1 and second clamping arm 2 installation elastic member 3 is provided with fixed lug 31, fixed lug 31 is used to fix elastic member 3, elastic member 3 is detachably installed by fixed lug 31, more specifically, elastic member 3 is torsion spring.
[0041] First clamping arm 1 includes bending portion 11 and fixed portion 12, bending portion 11 includes outwardly bent first bending segment 111 and second bending segment 112, one end of which is connected with first bending segment 111 and inwardly bent, the included angle formed between first bending segment 111 and second bending segment 112 is 90-150 degrees, the other end of second bending segment 112 is provided with fixed portion 12, and the fixed portion 12 and the second clamping arm 2 are used to clamp and fix the semiconductor to be packaged. Flexible pad (not shown in the figure) is arranged on the surface of fixed portion 12 in contact with the semiconductor to be packaged. Force applying portion 10, 20 is arranged at the other end of first clamping arm 1 and second clamping arm 2, and fixed portion 12 of first clamping arm 1 is separated from second clamping arm 2 after force is applied to force applying portion 10, 20.
[0042] Please refer to Figure 2For another embodiment of the utility model, in this embodiment, the difference from the first embodiment is that the second clamping arm 2 also has a bending part 21, the bending part 21 includes a third bending segment 211 and a fourth bending segment 212, one end of the fourth bending segment 212 is connected with the third bending segment 211, the other end of the fourth bending segment 212 is provided with a clamping plane 213, the clamping plane 213 corresponds with the fixed part 12, and the semiconductor to be packaged is clamped and fixed between the fixed part 12 and the clamping plane 213.
[0043] The utility model discloses a fixed clamp is replaced traditional briquetting and screw pressure, do not order make complicated fixture and clamp according to chip size, through fixed clamp can make chip cover plate have constant clamping force, can reduce the cost of making fixture, and convenient for operating personnel operation, a great deal of shorten the time of fixed chip. In addition, through the design of the bending part, the semiconductor packaging type of special shape can be fixed better, at the same time, the elastic member is detachable connection, can replace the elastic member of different elasticity according to the size of clamping force, also convenient for replacing the elastic member of aging or elastic fatigue.
[0044] In the utility model, unless another definite provision and limitation, for example, can be fixed connection, also can be detachable connection, or be integrated;Can be mechanical connection, also can be electric connection;Can be directly connected, also can be indirectly connected through intermediate medium, can be the intercommunication of two elements or the interaction of two elements, unless another definite limitation, for the ordinary skill of ordinary skill in the art, can understand the concrete meaning of the above-mentioned term in the utility model according to specific circumstances.
[0045] The above is the preferred embodiment of the utility model, it should be pointed out, for the ordinary skill of ordinary skill in the art, under the premise of not departing from the principle of the utility model, can also make a number of improvements and refinements, these improvements and refinements also should be considered the protection scope of the utility model.
Claims
1. A fixing clamp for a bent semiconductor package comprising a first clamping arm, a second clamping arm, and a resilient member provided between the first clamping arm and the second clamping arm to provide a clamping force with which the end portions of the first clamping arm and the second clamping arm are clamped to each other, characterized in that ； The first clamping arm comprises a bending part and a fixing part, the bending part comprises a first bending segment which is outwardly bent and a second bending segment which is inwardly bent and connected with the first bending segment at one end, and the other end of the second bending segment is provided with the fixing part, and the semiconductor to be packaged is clamped and fixed by the fixing part and the second clamping arm.
2. The fixing clamp for a bent semiconductor package according to claim 1, wherein The included angle between the first bending segment and the second bending segment is 90-150 degrees.
3. The fixing clamp for a bent semiconductor package according to claim 1, wherein The second clamping arm also has a bending part, the bending part comprises a third bending segment and a fourth bending segment, one end of the fourth bending segment is connected with the third bending segment, and the other end of the fourth bending segment is provided with a clamping plane corresponding to the fixing part, and the semiconductor to be packaged is clamped and fixed between the fixing part and the clamping plane.
4. The fixing clamp for a bent semiconductor package according to any one of claims 1 to 3, wherein A flexible pad is arranged on the surface of the fixing part which is in contact with the semiconductor to be packaged.
5. The fixing clamp for a bent semiconductor package according to claim 1, wherein The other end of the first clamping arm and the second clamping arm is provided with a force applying part, and the fixing part of the first clamping arm is separated from the second clamping arm after the force applying part is applied with force.
6. The fixing clamp for a bent semiconductor package according to claim 1, wherein The elastic member is a torsion spring.
7. The fixing clamp for a bent semiconductor package according to claim 1, wherein The elastic member is detachably connected with the first clamping arm or the second clamping arm.
8. The fixing clamp for a bent semiconductor package according to claim 1, wherein A fixing lug is arranged at the position where the first clamping arm and the second clamping arm are installed with the elastic member, and the fixing lug is used for fixing the elastic member.
9. The fixing clamp for a bent semiconductor package according to claim 1, wherein The fixing part is U-shaped.