Power module
By setting a limiting structure in the power module, including an insulated limiting seat and an insulating colloid, the problem of signal terminal root breakage in a vibration environment, which has not been effectively solved in the prior art, is solved, thus achieving the stability and safety of the signal terminal.
Patent Information
- Application Number
- CN202423321469.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2024-12-05
- Filing Date
- 2024-12-31
- Publication Date
- 2025-12-30
- Estimated Expiration
- 2034-12-31
AI Technical Summary
Existing power modules have a weakness in vibration environments: the root of the signal terminals is prone to breakage, especially after vibration testing. This is a complex problem that existing technologies have failed to effectively address.
By setting a limiting structure, including an insulated limiting seat and an insulating colloid, the root of the signal terminal is covered to limit its displacement and prevent breakage.
It effectively prevents the signal terminal root from breaking under vibration load, improving the vibration resistance of the power module and the product quality and safety performance.
Smart Images
Figure CN223743651U_ABST
Abstract
Description
[0001] The present application claims priority to the Chinese patent application No. 202423000617.1, filed on December 5, 2024, entitled "Power Module", the whole or part of which is incorporated herein by reference. TECHNICAL FIELD
[0002] The utility model relates to the field of packaging technology, especially relates to a power module. BACKGROUND
[0003] With the progress of power electronics technology, power modules develop rapidly, and the complex application scenarios of power modules also put forward higher requirements for the packaging of power modules. In the application environment of new energy vehicles, the complex vibration environment puts forward higher anti-vibration requirements for power modules. Among them, the root of the signal terminal of the power module is the weak point in vibration, and the root fracture of the signal terminal is also a common failure item after vibration test. Therefore, it is urgent to design a power module. SUMMARY
[0004] Therefore, the utility model discloses a kind of power modules, by being provided with limit structure to cover signal terminal, to limit the displacement of signal terminal, to avoid the root fracture of signal terminal.
[0005] The utility model embodiment provides a kind of power module, comprising: second substrate;At least one power module, the power module is located on the second substrate;And limit structure;Wherein, the power module includes: first substrate;Power device, is located in the first surface of the first substrate;Plastic package, covers the first substrate and the power device, the plastic package includes opposite first side and second side and opposite third side and fourth side, the first side and the third side are perpendicular;And signal terminal, is located in the first side of the plastic package, the signal terminal is connected with the power device in the plastic package, the root of the signal terminal is stretched out by the plastic package;Limit structure covers the root of the signal terminal to limit the displacement of signal terminal, the limit structure also includes insulating limit seat, and the limit seat carries the root of the signal terminal.
[0006] In some embodiments, the power module further includes: a first power terminal located at the first side of the plastic package, the first power terminal being electrically connected with the power device in the plastic package;And a second power terminal located at the second side of the plastic package, the second power terminal being electrically connected with the power device in the plastic package.
[0007] In some embodiments, the power module further comprises an insulating layer between the second substrate and the power module, the insulating layer having an opening, the power module passing through the opening of the insulating layer to be on the second substrate, the insulating layer having a distance from the first power terminal, the second power terminal and the signal terminal of the power module to insulate the first power terminal, the second power terminal and the signal terminal of the power module from the second substrate.
[0008] In some embodiments, the limiting structure comprises an insulating glue covering the root of the signal terminal.
[0009] In some embodiments, the insulating glue is solidified at the root of the signal terminal.
[0010] In some embodiments, the power module further comprises an insulating layer between the second substrate and the power module, the insulating layer having an opening, the power module passing through the opening of the insulating layer to be on the second substrate, the insulating glue being adhered to the insulating layer.
[0011] In some embodiments, the insulating glue is adhered to the second substrate.
[0012] In some embodiments, the insulating glue has a comparative tracking index (CTI) greater than or equal to 400 volts.
[0013] In some embodiments, the insulating glue has a temperature resistance greater than or equal to 100 degrees Celsius.
[0014] In some embodiments, the power module comprises a plurality of the power modules, all the power modules being arranged on the second substrate in the same direction, the limiting structure covering the root of the signal terminal of each of the power modules.
[0015] In some embodiments, the power module comprises a plurality of the power modules, all the power modules being arranged on the second substrate in the same direction, the limiting structure covering the root of the signal terminal of the power modules in the same row.
[0016] The utility model embodiment provides a kind of power module, the power module includes second substrate, at least one power module and limiting structure.Wherein, power module includes first substrate, power device, plastic package and signal terminal, power device is located the first surface of substrate, plastic package covers first substrate and power device, plastic package includes opposite first side and second side and opposite third side and fourth side, first side and third side are perpendicular, signal terminal is located the first side of plastic package and is electrically connected with power device in plastic package, the root of signal terminal is stretched out by plastic package inside.Further, the root of signal terminal is covered by limiting structure to limit the displacement of signal terminal, limiting structure also includes insulating limit seat, and limit seat carries the root of signal terminal.Therefore, the root of power module can prevent the breakage of signal terminal under vibration load. BRIEF DESCRIPTION OF DRAWINGS
[0017] The above and other objects, features and advantages of the present application will become more apparent from the following description of the preferred embodiments of the present application taken in conjunction with the accompanying drawings, in which:
[0018] Figure 1 is the schematic diagram of the power module provided by the utility model embodiment;
[0019] Figure 2 is the schematic diagram of the power module provided by the utility model embodiment;
[0020] Figure 3 is the use state schematic diagram of a second substrate provided by the utility model embodiment.
[0021] BRIEF DESCRIPTION OF DRAWINGS
[0022] 11-second substrate;12-insulating layer;2-power module;21-plastic package;22-signal terminal;23-first power end;24-second power end;25-first substrate;26-power device;27-interconnection layer;28-interconnection part;3-limiting structure;31-insulating glue;32-limit seat. DETAILED DESCRIPTION
[0023] The present application is described based on the embodiments below, but the present application is not limited to these embodiments only. In the following detailed description of the present application, some specific details are described in detail. The present application can also be completely understood without the description of these details by those skilled in the art. In order to avoid confusion of the essence of the present application, well-known methods, processes, procedures, elements and circuits are not described in detail.
[0024] In addition, those of ordinary skill in the art should understand that the drawings provided herein are for illustrative purposes only, and the drawings are not necessarily drawn to scale.
[0025] Unless specifically stated otherwise, the terms "mounting", "connected", "connecting", "fixed", "fixedly connected", "connection", "joint", "jointly connected", "soldering", "welding", "connecting" and the like are to be interpreted broadly to encompass not only the direct connection between elements, but also indirect connections (e.g. via a wireless link or via an intermediate element) and / or connections through the interposition of one or more elements. In addition, the term "connected" is not restricted to direct connection but includes, unless otherwise noted, indirect connection (e.g. through an intermediate element).
[0026] For ease of description, spatially relative terms such as "inner", "outer", "beneath", "below", "lower", "above", "upper", and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientations depicted in the figures. For example, if a device is inverted or rotated by 90 degrees, then an element described as "below" or "beneath" another element or feature would then be oriented "above" the other element or feature. Thus, the example term "below" can encompass both an orientation of above and below. The device can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
[0027] Unless the context clearly requires otherwise, throughout the description, the words "comprise", "comprising", and the like are to be construed in an inclusive sense as opposed to an exclusive or exhaustive sense; that is to say, in the sense of "including, but not limited to".
[0028] In the description of the present application, it should be understood that the terms "first", "second" and the like are used to describe purposes only, and should not be understood as indicating or implying relative importance. In addition, in the description of the present application, unless otherwise stated, the meaning of "a plurality of" is two or more.
[0029] Figure 1 is a schematic view of the power module provided by the embodiment of the present application, as shown in Figure 1 The power module includes a second substrate 11, at least one power module 2 and a limiting structure 3. Optionally, the second substrate 11 is provided as a metal plate. Specifically, Figure 2 is a schematic view of the power module provided by the embodiment of the present application, as shown in Figure 2As shown, the power module 2 is located on the second substrate 11 and comprises a first substrate 25, a power device 26, a plastic package 21, a signal terminal 22, a first power terminal 23, a second power terminal 24, an interconnection layer 27 and an interconnection part 28, the power device 26 is located on a first surface of the first substrate 25, the plastic package 21 covers the first substrate 25 and the power device 26, the plastic package 21 comprises opposite first and third side edges and opposite second and fourth side edges, the first and third side edges are perpendicular, the first power terminal 23 is located on the first side edge of the plastic package 21 and is electrically connected with the power device 26 in the plastic package 21, the second power terminal 24 is located on the second side edge of the plastic package 21 and is electrically connected with the power device 26 in the plastic package 21, and the signal terminal 22 is located on the first side edge of the plastic package 21 and is electrically connected with the power device 26 in the plastic package 21. It should be noted that the interconnection layer 27 is a chip interconnection layer, the power device 26 is arranged on the first substrate 25 through the interconnection layer 27, and the interconnection part 28 is applied to the top chip interconnection. Further, the root of the signal terminal 22 is stretched out of the plastic package 21, the limiting structure 3 covers the root of the signal terminal 22 to limit the displacement of the signal terminal 22, and the root of the signal terminal 22 is prevented from being broken due to being pulled by the displacement of the circuit board. Further, the limiting structure 3 comprises a limiting seat 32 located at the position of the root of the signal terminal 22 to limit the signal terminal 22. Alternatively, the limiting seat 32 is made of acrylic, polyimide, polytetrafluoroethylene or other insulating materials. Therefore, the limiting seat 32 can protect the power module 2 from current leakage or short circuit, and help to improve product quality and safety performance.
[0030] Figure 3 is a use state schematic view of the second substrate provided by the embodiment of the utility model, as Figure 3 As shown, the power module 2 is located on the second substrate 11 and comprises a first substrate 25, a power device 26, a plastic package 21, a signal terminal 22, a first power terminal 23, a second power terminal 24, an interconnection layer 27 and an interconnection part 28, the power device 26 is located on a first surface of the first substrate 25, the plastic package 21 covers the first substrate 25 and the power device 26, the plastic package 21 comprises opposite first and third side edges and opposite second and fourth side edges, the first and third side edges are perpendicular, the first power terminal 23 is located on the first side edge of the plastic package 21 and is electrically connected with the power device 26 in the plastic package 21, the second power terminal 24 is located on the second side edge of the plastic package 21 and is electrically connected with the power device 26 in the plastic package 21, and the signal terminal 22 is located on the first side edge of the plastic package 21 and is electrically connected with the power device 26 in the plastic package 21. It should be noted that the interconnection layer 27 is a chip interconnection layer, the power device 26 is arranged on the first substrate 25 through the interconnection layer 27, and the interconnection part 28 is applied to the top chip interconnection. Further, the root of the signal terminal 22 is stretched out of the plastic package 21, the limiting structure 3 covers the root of the signal terminal 22 to limit the displacement of the signal terminal 22, and the root of the signal terminal 22 is prevented from being broken due to being pulled by the displacement of the circuit board. Further, the limiting structure 3 comprises a limiting seat 32 located at the position of the root of the signal terminal 22 to limit the signal terminal 22. Alternatively, the limiting seat 32 is made of acrylic, polyimide, polytetrafluoroethylene or other insulating materials. Therefore, the limiting seat 32 can protect the power module 2 from current leakage or short circuit, and help to improve product quality and safety performance.
[0031] In an embodiment, the insulating layer 12 is provided as an FR-4 (glass fiber reinforced epoxy resin laminated material) insulating layer or a PI (polyimide) insulating layer. It should be noted that the FR-4 insulating layer has good mechanical strength and electrical performance. It should be noted that the PI insulating layer has excellent high-temperature resistance, electrical insulation and mechanical strength.
[0032] As Figure 1As shown, in an embodiment, the limiting structure 3 comprises an insulating glue 31. Specifically, the insulating glue 31 coats the root of the signal terminal 22, so as to limit the displacement of the signal terminal 22 in a vibrating environment, and thus prevent the root of the signal terminal 22 from being broken. Further, the insulating glue 31 is solidified at the root of the signal terminal 22 to ensure the limiting effect on the signal terminal 22. Alternatively, as shown in FIG. 2, the insulating glue 31 is disposed at the root of the signal terminal 22 by means of dispensing. Figure 1 As shown, each power module 2 has two or more signal terminals 22, and the insulating glue 31 coats the root of each signal terminal 22 to avoid any signal terminal 22 from being broken due to vibration. Alternatively, the insulating glue 31 is disposed at the root of the signal terminal 22 by means of dispensing. It should be noted that the dispensing of the insulating glue 31 by means of automatic dispensing with a dispensing device can accurately control the flow and position of the glue, which helps to improve product quality and production efficiency.
[0033] In an embodiment, the limiting seat 32 is located at the position of the root of the signal terminal 22 to limit the signal terminal 22, and the insulating glue 31 is bonded to the root of the signal terminal 22 and the limiting seat 32, respectively. That is, the limiting seat 32 cooperates with the insulating glue 31 to limit the signal terminal 22, so as to prevent the root of the signal terminal 22 from being broken due to the displacement of the circuit board. It should be easily understood that, when the limiting seat 32 is assembled with the signal terminal 22, the insulating glue 31 can be bonded to the root of the signal terminal 22 and the limiting seat 32 by means of dispensing. Thus, the limiting seat 32 cooperates with the insulating glue 31 to improve the limiting effect of the limiting structure 3, and thus helps to limit the displacement of the signal terminal 22 in a vibrating environment to prevent the root of the signal terminal 22 from being broken.
[0034] In an embodiment, the insulating glue 31 is bonded to the insulating layer 12. It should be easily understood that the insulating glue 31 has good adhesion to the insulating material, so as to enhance the bonding strength between the insulating glue 31 and the insulating layer 12, and thus ensure the limiting effect of the insulating glue 31 on the root of the signal terminal 22.
[0035] In an embodiment, the insulating glue 31 is bonded to the second substrate 11. That is, in the case where the second substrate 11 is not provided with the insulating layer 12, the insulating glue 31 can also achieve the insulating function and the limiting function on the signal terminal 22 by being bonded to the second substrate 11.
[0036] It should be easily understood that the insulating glue 31 can protect the power module 2 from current leakage or short circuit, and thus helps to improve product quality and safety performance. Alternatively, the insulating glue 31 comprises epoxy resin glue, pressure-sensitive glue, UV-cured glue or other glue.
[0037] In an embodiment, the insulation gel 31 has a CTI (Comparative Tracking Index) value greater than or equal to 400 volts. It should be noted that the CTI value refers to the highest voltage value at which a solid insulating material surface can withstand 50 drops of electrolyte without forming a leakage trace under the combined action of an electric field and electrolyte. That is, the CTI value is an index for evaluating the ability of an insulating material to resist arc strikes, and the higher the CTI value, the higher the electrical trace resistance of the insulating material, and the higher the safety performance. Thus, the insulation gel 31 helps to improve product quality and safety performance.
[0038] In an embodiment, the insulation gel 31 is a heat-resistant gel. It should be noted that the insulation gel 31 can withstand a temperature greater than or equal to the upper limit of the temperature that the signal terminal 22 can reach. Alternatively, the insulation gel 31 can withstand a temperature greater than or equal to 100 degrees Celsius. That is, the insulation gel 31 can maintain its physical and chemical properties unchanged at high temperatures, thereby ensuring the bonding strength and stability, and thus effectively preventing the root of the signal terminal 22 from breaking due to deterioration of the insulation gel 31.
[0039] In an embodiment, the power module includes a plurality of power modules 2, and all the power modules 2 are arranged on the second substrate 11 in the same direction. The limiting structure 3 covers the roots of the signal terminals 22 of each power module 2, that is, the roots of the signal terminals 22 of each power module 2 are respectively limited by one insulation gel 31 and one limiting seat 32.
[0040] In an embodiment, the power module includes a plurality of power modules 2, and all the power modules 2 are arranged on the second substrate 11 in the same direction. The limiting structure 3 covers the roots of the signal terminals 22 of the power modules 2 in the same row, that is, the roots of the signal terminals 22 of the power modules 2 in the same row are jointly limited by one insulation gel 31 and one limiting seat 32.
[0041] The utility model embodiment provides a kind of power module, which comprises second substrate, at least one power module and limiting structure. Wherein, power module includes first substrate, power device, plastic package and signal terminal, power device is located in the first surface of substrate, plastic package covers first substrate and power device, plastic package includes opposite first side and second side and opposite third side and fourth side, first side and third side are perpendicular, signal terminal is located in the first side of plastic package and is electrically connected with power device in plastic package, the root of signal terminal is stretched out from inside plastic package. Further, limiting structure covers the root of signal terminal to limit the displacement of signal terminal, limiting structure also includes insulating limiting seat, and limiting seat carries the root of signal terminal. Thus, power module can prevent the root of signal terminal from breaking under vibration load.
[0042] The above description is only the preferred embodiment of the present application, and is not intended to limit the present application. The present application can have various modifications and changes for those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A power module, characterized by The power module comprises: a first substrate; a power device on a first surface of the first substrate; a plastic package covering the first substrate and the power device, the plastic package comprising opposite first and third side edges and opposite second and fourth side edges, the first and third side edges being perpendicular; and a signal terminal on the first side edge of the plastic package, the signal terminal being electrically connected to the power device in the plastic package, a root of the signal terminal extending out of the plastic package; the limiting structure covering the root of the signal terminal to limit displacement of the signal terminal, the limiting structure further comprising an insulating limiting seat carrying the root of the signal terminal. The power module further comprises: a first power terminal on the first side edge of the plastic package, the first power terminal being electrically connected to the power device in the plastic package; and a second power terminal on the second side edge of the plastic package, the second power terminal being electrically connected to the power device in the plastic package. Further comprising an insulating layer between the second substrate and the power module, the insulating layer having an opening, the power module passing through the opening on the insulating layer to be on the second substrate; the insulating layer being spaced apart from the first and second power terminals and the signal terminal of the power module to insulate the first and second power terminals and the signal terminal of the power module from the second substrate. The limiting structure comprises:
2. The power module of claim 1, wherein, an insulating adhesive covering the root of the signal terminal. The insulating adhesive is solidified on the root of the signal terminal. Further comprising an insulating layer between the second substrate and the power module, the insulating layer having an opening, the power module passing through the opening on the insulating layer to be on the second substrate; the insulating adhesive being bonded to the insulating layer.
3. The power module of claim 2, wherein, The insulating adhesive is bonded to the second substrate.
4. The power module of claim 1, wherein, The insulating adhesive has a comparative tracking index (CTI) greater than or equal to 400 volts. The insulating adhesive has a temperature resistance greater than or equal to 100 degrees Celsius.
5. The power module of claim 4, wherein, The power module comprises a plurality of the power modules, all the power modules being arranged on the second substrate in the same direction, the limiting structure covering the root of the signal terminal of each of the power modules.
6. The power module of claim 4, wherein, The power module comprises a plurality of the power modules, all the power modules being arranged on the second substrate in the same direction, the limiting structure covering the root of the signal terminal of the power modules in the same row.
7. The power module of claim 4, wherein, 8. The power module of claim 4, wherein, 9. The power module of claim 4, wherein, 10. The power module of any one of claims 1-9, wherein, 11. The power module of any one of claims 1-9, wherein,