Power module

Abstract

The embodiment of the utility model discloses a power module. The power module comprises a second substrate, at least two power modules and a limiting structure. Wherein the power module comprises a first substrate, a power device, a plastic package body, a first power end, a second power end and a signal terminal, the plastic package body wraps the first substrate and the power device, the first power end, the second power end and the signal terminal are electrically connected with the power device, and the root of the signal terminal extends out of the plastic package body. Further, two adjacent power modules are arranged on the second substrate in a staggered manner according to opposite directions, and the limiting structure is located at the root of the signal terminal to limit the displacement of the signal terminal. Therefore, the power module can prevent the roots of the signal terminals from being broken under the vibration load.

Description

[0001] The present application claims priority to the Chinese patent application No. 202423000617.1, filed on December 5, 2024, entitled "Power Module", the whole or part of which is incorporated herein by reference. TECHNICAL FIELD

[0002] The utility model relates to the packaging technical field, especially relates to a power module. BACKGROUND

[0003] With the progress of power electronics technology, power modules develop rapidly, and the complex application scenarios of power modules also put forward higher requirements for the packaging of power modules. In the application environment of new energy vehicles, the complex vibration environment puts forward higher anti-vibration requirements for power modules. Among them, the root of the signal terminal of the power module is the weak point in the vibration, and the root fracture of the signal terminal is also a common failure item after the vibration test. Therefore, it is urgent to design a power module. SUMMARY

[0004] Therefore, the utility model discloses a kind of power modules, by setting limit structure to limit the displacement of signal terminal, to avoid the root fracture of signal terminal.

[0005] The utility model embodiment provides a kind of power module, comprising: second substrate;At least two power modules, the power module is located on the second substrate;And limit structure;Wherein, the power module includes: first substrate;Power device, is located in the first surface of the first substrate;Plastic package, covers the first substrate and the power device, the plastic package includes opposite first side and second side and opposite third side and fourth side, the first side and the third side are perpendicular;Signal terminal, located in the first side of the plastic package, the signal terminal is connected with the power device in the plastic package, the root of the signal terminal is by the plastic package and stretches out;First power end, located in the first side of the plastic package, the first power end is connected with the power device in the plastic package;And second power end, located in the second side of the plastic package, the second power end is connected with the power device in the plastic package;Adjacent two power modules are staggered in opposite directions on the second substrate, and the limit structure is located at the root of the signal terminal to limit the displacement of the signal terminal.

[0006] In some embodiments, the limit structure covers the root of the signal terminal.

[0007] In some embodiments, further comprising an insulating layer between the second substrate and the power module, the insulating layer having an opening, the power module passing through the opening of the insulating layer to be on the second substrate, the insulating layer having a distance from the first power terminal, the second power terminal and the signal terminal of the power module to insulate the first power terminal, the second power terminal and the signal terminal of the power module from the second substrate.

[0008] In some embodiments, the limiting structure is an insulating glue covering the root of the signal terminal.

[0009] In some embodiments, the insulating glue is solidified at the root of the signal terminal.

[0010] In some embodiments, further comprising an insulating layer between the second substrate and the power module, the insulating layer having an opening, the power module passing through the opening of the insulating layer to be on the second substrate, the insulating layer having a distance from the first power terminal, the second power terminal and the signal terminal of the power module to insulate the first power terminal, the second power terminal and the signal terminal of the power module from the second substrate, the insulating glue being adhered to the insulating layer.

[0011] In some embodiments, the insulating glue is adhered to the second substrate.

[0012] In some embodiments, the insulating glue has a comparative tracking index (CTI) greater than or equal to 400 volts.

[0013] In some embodiments, the insulating glue has a temperature resistance greater than or equal to 100 degrees Celsius.

[0014] In some embodiments, the limiting structure comprises an insulating limiting seat, the limiting seat bearing the root of the signal terminal.

[0015] In some embodiments, the limiting structure is at the root of the signal terminal and the first power terminal to limit the displacement of the signal terminal and the first power terminal.

[0016] In some embodiments, the limiting structure covers the root of the signal terminal and the first power terminal to limit the displacement of the signal terminal and the first power terminal.

[0017] In some embodiments, the limiting structure has a width at the signal terminal greater than a width at the first power terminal.

[0018] In some embodiments, the limiting structure fully covers the root of the signal terminal.

[0019] In some embodiments, the limiting structure semi-covers the root of the signal terminal.

[0020] Embodiments of the utility model provide a kind of power module, the power module includes second substrate, at least two power modules and limiting structure. Among them, power module includes first substrate, power device, plastic package, first power terminal, second power terminal and signal terminal, plastic package covers first substrate and power device, first power terminal, second power terminal and signal terminal are electrically connected with power device, the root of signal terminal is stretched out from plastic package.Further, two adjacent power modules are staggered on second substrate according to opposite direction, limiting structure covers the root of signal terminal to limit the displacement of signal terminal. Therefore, the root of power module can prevent the root of signal terminal from breaking under vibration load. BRIEF DESCRIPTION OF DRAWINGS

[0021] The above and other objects, features and advantages of the present application will become more apparent from the following description of embodiments of the present application taken in conjunction with the accompanying drawings, in which:

[0022] Figure 1 It is the schematic diagram of the first power module provided by the utility model embodiment;

[0023] Figure 2 It is the schematic diagram of the second power module provided by the utility model embodiment;

[0024] Figure 3 It is the schematic diagram of the power module provided by the utility model embodiment.

[0025] Explanation of the drawings:

[0026] 11-second substrate;12-insulating layer;2-power module;21-plastic package;22-signal terminal;23-first power terminal;24-second power terminal;25-first substrate;26-power device;27-interconnection layer;28-interconnection;3-limiting structure;31-insulating glue;32-limiting seat;321-bearing part;322-side stop part. DETAILED DESCRIPTION

[0027] The present application is described based on the embodiments below, but the present application is not limited to these embodiments only. In the following detailed description of the present application, some specific details are described in detail. The present application can also be completely understood without the description of these details by those skilled in the art. In order to avoid confusion of the essence of the present application, well-known methods, processes, flows, elements and circuits are not described in detail.

[0028] Furthermore, those skilled in the art will appreciate that the drawings provided herein are diagrammatic and are not drawn to scale unless specifically stated.

[0029] Unless specifically stated otherwise, and as can be apparent from the disclosure, the use of terms such as "installing", "connecting", "connecting", "fixing", and the like, are used in their broadest possible context and can represent a variety of arrangements of steps or placement of elements in an arrangement. For example, it can be a fixed connection or a detachable connection, or it can be integrated; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be an internal connection of two elements or an interaction relationship between two elements, unless specifically limited. The specific meaning of the above terms in this application can be understood according to the specific circumstances by those skilled in the art.

[0030] For ease of description, spatially relative terms such as "inner", "outer", "below", "lower", "bottom", "top", "upper", and the like, are used herein for describing the relationship of one element or feature to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, an element described as "below" or "beneath" the other element or feature would then be oriented "above" the other element or feature. Thus, the example term "below" can encompass both an orientation of above and below. The device can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein should be interpreted accordingly.

[0031] Unless the context clearly requires otherwise, throughout the description, the words "comprise", "comprising", and the like are to be construed in an inclusive sense as opposed to an exclusive or exhaustive sense; that is to say, in the sense of "including, but not limited to".

[0032] In the description of the present application, it should be understood that the terms "first", "second" and the like are used only for the purpose of description and should not be understood as indicating or implying relative importance. In addition, in the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise stated.

[0033] Figure 1 is a schematic view of a first power module provided by an embodiment of the present application, Figure 2 is a schematic view of a second power module provided by an embodiment of the present application, in combination with Figure 1 and Figure 2 As shown in the figures, the power module includes a second substrate 11, at least two power modules 2 and a limiting structure 3. Optionally, the second substrate 11 is provided as a metal plate. Specifically, Figure 3 is a schematic view of a power module provided by an embodiment of the present application, as Figure 3As shown in the figure, the power module 2 is located on the second substrate 11 and comprises a first substrate 25, a power device 26, a plastic package 21, a signal terminal 22, a first power terminal 23, a second power terminal 24, an interconnection layer 27 and an interconnection part 28, the power device 26 is located on a first surface of the first substrate 25, the plastic package 21 covers the first substrate 25 and the power device 26, the plastic package 21 comprises opposite first and third side edges and opposite second and fourth side edges, the first and third side edges are perpendicular, the first power terminal 23 is located on the first side edge of the plastic package 21 and is electrically connected with the power device 26 in the plastic package 21, the second power terminal 24 is located on the second side edge of the plastic package 21 and is electrically connected with the power device 26 in the plastic package 21, and the signal terminal 22 is located on the first side edge of the plastic package 21 and is electrically connected with the power device 26 in the plastic package 21. It should be noted that the interconnection layer 27 is a chip interconnection layer, the power device 26 is arranged on the first substrate 25 through the interconnection layer 27, and the interconnection part 28 is applied to the top chip interconnection. Further, the root of the signal terminal 22 is extended out of the plastic package 21, two adjacent power modules 2 are staggered in opposite directions on the second substrate 11, and the limiting structure 3 is located at the root of the signal terminal 22 to limit the displacement of the signal terminal 22, so as to prevent the root of the signal terminal 22 from being broken due to the displacement of the circuit board. Alternatively, the limiting structure 3 covers the root of the signal terminal 22 to limit the displacement of the signal terminal 22.

[0034] As shown in the figure, Figure 1 The power module further comprises an insulating layer 12. Specifically, the insulating layer 12 is located between the second substrate 11 and the power module 2. It is easy to understand that the insulating layer 12 is provided with an opening, so that the power module 2 can pass through the opening on the insulating layer 12 and be arranged on the second substrate 11. Further, the insulating layer 12 is spaced apart from the first power terminal 23, the second power terminal 24 and the signal terminal 22 of the power module 2 by a certain distance, so that the first power terminal 23, the second power terminal 24 and the signal terminal 22 of the power module 2 are insulated from the second substrate 11.

[0035] In an embodiment, the insulating layer 12 is provided as an FR-4 (glass fiber reinforced epoxy resin laminate) insulating layer or a PI (polyimide) insulating layer. It should be noted that the FR-4 insulating layer has good mechanical strength and electrical performance. It should be noted that the PI insulating layer has excellent high temperature resistance, electrical insulation and mechanical strength.

[0036] As shown in the figure, Figure 1As shown, in an embodiment, the limiting structure 3 comprises an insulating glue 31. Specifically, the insulating glue 31 wraps the root of the signal terminal 22, so as to limit the displacement of the signal terminal 22 in a vibrating environment, and thus prevent the root of the signal terminal 22 from being broken. Further, the insulating glue 31 is solidified at the root of the signal terminal 22 to ensure the limiting effect on the signal terminal 22. Alternatively, as shown in FIG. 2, the insulating glue 31 is disposed at the root of the signal terminal 22 by means of dispensing. It should be noted that the dispensing of the insulating glue 31 by means of the dispensing equipment can accurately control the flow and position of the glue, and thus help improve the product quality and production efficiency. Figure 1 As shown, each power module 2 has two or more signal terminals 22, and the insulating glue 31 wraps the root of each signal terminal 22 to prevent any signal terminal 22 from being broken due to vibration. Alternatively, the insulating glue 31 is disposed at the root of the signal terminal 22 by means of dispensing. It should be noted that the dispensing of the insulating glue 31 by means of the dispensing equipment can accurately control the flow and position of the glue, and thus help improve the product quality and production efficiency.

[0037] In an embodiment, the insulating glue 31 is bonded with the insulating layer 12. It should be easily understood that the insulating glue 31 has good adhesion with the insulating material, so as to enhance the bonding strength between the insulating glue 31 and the insulating layer 12, and thus ensure the limiting effect of the insulating glue 31 on the root of the signal terminal 22.

[0038] In an embodiment, the insulating glue 31 is bonded with the second substrate 11. That is, in the case where the second substrate 11 is not provided with the insulating layer 12, the insulating glue 31 can also achieve the insulating function and the limiting function on the signal terminal 22 by being bonded with the second substrate 11.

[0039] It should be easily understood that the insulating glue 31 can protect the power module 2 from current leakage or short circuit, and thus help improve the product quality and safety performance. Alternatively, the insulating glue 31 comprises epoxy resin glue, pressure-sensitive glue, UV-cured glue or other glue.

[0040] In an embodiment, the insulating glue 31 has a CTI (Comparative Tracking Index) value greater than or equal to 400 volts. It should be noted that the CTI value refers to the highest voltage value at which the surface of a solid insulating material can withstand 50 drops of electrolyte without forming a leakage trace under the combined action of an electric field and electrolyte. That is, the CTI value is an index for evaluating the ability of the insulating material to resist arc strike, and the higher the CTI value, the higher the resistance of the insulating material to tracking, the better the insulating property, and the higher the safety performance. Therefore, the insulating glue 31 helps improve the product quality and safety performance.

[0041] In an embodiment, the insulating glue 31 is a heat-resistant glue. It is to be noted that the insulating glue 31 can withstand a temperature greater than or equal to an upper limit of a temperature that the signal terminal 22 can reach. Alternatively, the insulating glue 31 can withstand a temperature greater than or equal to 100 degrees Celsius. That is, the insulating glue 31 can maintain its physical and chemical properties unchanged at a high temperature, thereby ensuring the bonding strength and stability, and effectively preventing the root of the signal terminal 22 from being broken due to the deterioration of the insulating glue 31.

[0042] As shown in Figure 2 In an embodiment, the limiting structure 3 includes an insulating limiting seat 32. Specifically, the limiting seat 32 is located below the signal terminal 22 to carry the root of the signal terminal 22. Thus, the power module 2 can prevent the root of the signal terminal 22 from being broken due to the displacement of the circuit board under the action of the limiting seat 32.

[0043] Alternatively, the limiting seat 32 is made of acrylic, polyimide, polytetrafluoroethylene or other insulating materials. Thus, the limiting seat 32 can protect the power module 2 from current leakage or short circuit, which helps to improve the product quality and safety performance.

[0044] In combination with Figure 1 and Figure 2 As shown, two adjacent power modules 2 are staggered in opposite directions on the second substrate 11, that is, the first side edge of one power module 2 and the second side edge of the adjacent power module 2 are located on the same side. Further, each power module 2 is provided with a limiting structure 3. Exemplarily, each power module 2 is respectively provided with an insulating glue 31 and / or a limiting seat 32 at the signal terminal 22.

[0045] In an embodiment, the limiting structure 3 is located at the roots of the signal terminal 22 and the first power terminal 23 to limit the displacement of the signal terminal 22 and the first power terminal 23. Alternatively, the limiting structure 3 covers the roots of the signal terminal 22 and the first power terminal 23 to limit the displacement of the signal terminal 22 and the first power terminal 23. Alternatively, the limiting structure 3 has a width greater at the signal terminal 22 than at the first power terminal 23.

[0046] In an embodiment, the limiting structure 3 fully covers the root of the signal terminal 22, that is, the insulating glue 31 fully covers the root of the signal terminal 22. In another embodiment, the limiting structure 3 partially covers the root of the signal terminal 22, that is, the insulating glue 31 covers part of the root of the signal terminal 22 and exposes part of the root of the signal terminal 22.

[0047] The utility model embodiment provides a kind of power module, and the power module includes second substrate, at least two power modules and limiting structure. Among them, power module includes first substrate, power device, plastic package, first power end, second power end and signal terminal, plastic package covers first substrate and power device, first power end, second power end and signal terminal are electrically connected with power device, and the root of signal terminal is by plastic package inside and is stretched out.Further, two power modules according to opposite direction staggered arrangement with second substrate, and the root of signal terminal is covered by limiting structure to limit the displacement of signal terminal. Thus, the root of power module can prevent the breakage of signal terminal under vibration load.

[0048] The above is only the preferred embodiment of the present application, and is not used to limit the present application. For those skilled in the art, the present application can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application.

Claims

1. A power module, characterized by Comprise: a second substrate; at least two power modules, the power modules being located on the second substrate; and a limiting structure; wherein the power module comprises: a first substrate; a power device located on a first surface of the first substrate; a plastic package covering the first substrate and the power device, the plastic package comprising opposite first and third sides and opposite second and fourth sides, the first and third sides being perpendicular; a signal terminal located on the first side of the plastic package, the signal terminal being electrically connected to the power device in the plastic package, a root of the signal terminal being extended out of the plastic package; a first power terminal located on the first side of the plastic package, the first power terminal being electrically connected to the power device in the plastic package; and a second power terminal located on the second side of the plastic package, the second power terminal being electrically connected to the power device in the plastic package; two adjacent power modules are staggered in opposite directions on the second substrate, and the limiting structure is located at the root of the signal terminal to limit the displacement of the signal terminal. The limiting structure covers the root of the signal terminal.

2. The power module of claim 1, wherein, Further comprising an insulating layer between the second substrate and the power module, the insulating layer having an opening, the power module passing through the opening of the insulating layer to be located on the second substrate; the insulating layer has a certain distance from the first power terminal, the second power terminal and the signal terminal of the power module to insulate the first power terminal, the second power terminal and the signal terminal of the power module from the second substrate.

3. The power module of claim 1, wherein, The limiting structure is:

4. The power module of claim 1, wherein, an insulating gel covering the root of the signal terminal. The insulating gel is solidified at the root of the signal terminal.

5. The power module of claim 4, wherein, Further comprising an insulating layer between the second substrate and the power module, the insulating layer having an opening, the power module passing through the opening of the insulating layer to be located on the second substrate; the insulating layer has a certain distance from the first power terminal, the second power terminal and the signal terminal of the power module to insulate the first power terminal, the second power terminal and the signal terminal of the power module from the second substrate; 6. The power module of claim 4, wherein, The insulating gel is bonded to the insulating layer. The insulating gel is bonded to the second substrate.

7. The power module of claim 4, wherein, The comparative tracking index (CTI) of the insulating gel is greater than or equal to 400 volts.

8. The power module of claim 4, wherein, The insulating gel is resistant to temperatures greater than or equal to 100 degrees Celsius.

9. The power module of claim 4, wherein, The limiting structure comprises:

10. The power module of any one of claims 1-8, wherein, an insulating limiting seat bearing the root of the signal terminal. The limiting structure is located at the root of the signal terminal and the first power terminal to limit the displacement of the signal terminal and the first power terminal.

11. The power module of claim 1, wherein, The limiting structure covers the root of the signal terminal and the first power terminal to limit the displacement of the signal terminal and the first power terminal.

12. The power module of claim 11, wherein, The width of the limiting structure at the signal terminal is greater than that at the first power terminal.

13. The power module of claim 11, wherein, The limiting structure fully covers the root of the signal terminal.

14. The power module of claim 1, wherein, ​ 15. The power module of claim 1, wherein, The limiting structure semi-wraps the root of the signal terminal.

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