Micro hot plate based on MEMS technology
By applying micro-heating technology in MEMS, the problems of uneven heating and structural instability in traditional micro-heat plates have been solved. This has resulted in a more uniform and structurally stable micro-heat plate, thus improving the application effect of the sensor.
Patent Information
- Application Number
- CN202520081436.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-14
- Publication Date
- 2025-12-30
- Estimated Expiration
- 2035-01-14
AI Technical Summary
Traditional heating plates suffer from uneven heating and structural instability during the heating process, which leads to inconsistent responses from the various sensors in the gas-sensitive sensor array and affects system performance.
The micro hot plate, based on MEMS technology, uses a single-crystal silicon substrate and a silicon dioxide insulating layer, combined with heating and testing electrodes made of platinum material. It is arranged using Hilbert fractal curves and serpentine curves, intersecting and connected to the electrode pins through a supporting cantilever beam, and is installed in a mounting socket.
It achieves uniform heating and a stable structure of the micro-hot plate, reduces power consumption, improves testing efficiency and installation convenience, and reduces replacement costs.
Smart Images
Figure CN223744925U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the MEMS technical field, concretely relates to a micro hot plate based on MEMS technology. BACKGROUND
[0002] Now, along with the rapid development of China's industrialization, the various environmental problems intensify. As a big problem of environmental pollution, the state also attaches more and more importance to and proposes a series of policy support. With the human perception of smell more and more strong, people urgently need to identify the perceived gas, and the gas sensor that can perceive unknown gas emerges as the times require, and with more and more demand, the application is more and more extensive.
[0003] Electronic nose, artificial olfactory system, is through simulating biological olfactory function, perception, analysis, identification and judgment to the measured gas, and the gas sensor system with intelligent identification ability can better identify the type and concentration of gas. Gas sensor array is the core component of electronic nose, and the sensor array composed of different gas sensors can be used to simulate the human olfactory function and convert the odor into an easy-to-measure electrical signal. However, the traditional discrete gas sensor has the disadvantages of large volume, high power consumption and difficult integration, which limits its application. With the development of integrated and miniaturized gas sensor, higher requirements are put forward for the heating plate.
[0004] The heating uniformity of the heating plate is crucial to the performance of the gas sensor. However, due to the limitations of materials, process and other factors, the existing heating plate has the problems of uneven heating and unstable structure during the heating process, which leads to inconsistent response of each sensor in the sensor array and affects the overall performance of the system. SUMMARY
[0005] The utility model discloses a micro hot plate based on MEMS technology can improve the thermal uniformity on the basis of guaranteeing the structure stability of micro hot plate, optimize the installation mode, so that the micro hot plate array can be replaced at any time, and the cost is reduced.
[0006] In order to achieve the above object, the utility model adopts the following technical scheme:
[0007] The utility model provides a micro hot plate based on MEMS technology, including monocrystalline silicon substrate, the monocrystalline silicon substrate is inserted in the inside of the installation socket, be provided with silica insulation layer on the monocrystalline silicon substrate, be provided with heating electrode and test electrode on the silica insulation layer, the heating electrode and test electrode are connected with electrode pin.
[0008] The utility model further improves, the heating electrode adopts platinum material and is arranged in hilbert fractal curve.
[0009] The further improvement of the utility model lies in that the test electrode is made of platinum material and arranged in a serpentine curve.
[0010] The further improvement of the utility model lies in that the heating electrode and the test electrode are connected with external circuit through electrode pins.
[0011] The further improvement of the utility model lies in that the heating electrode and the test electrode are cross arranged, and the test electrode is arranged above the heating electrode.
[0012] The further improvement of the utility model lies in that a gas sensitive material layer is sputtered on the test electrode.
[0013] The further improvement of the utility model lies in that a slot is arranged inside the mounting socket, and the single crystal silicon substrate is inserted into the slot.
[0014] The further improvement of the utility model lies in that the mounting socket is welded on the sensor.
[0015] The further improvement of the utility model lies in that the heating electrode and the test electrode are connected with the electrode pins through the supporting cantilever beam.
[0016] The further improvement of the utility model lies in that the supporting cantilever beam is at an angle of 45° with four sides of the heating area and the test area.
[0017] Compared with the prior art, the utility model has the following beneficial effects:
[0018] The utility model provides a micro hot plate based on MEMS technology, single crystal silicon substrate is provided with a silicon dioxide insulation layer, not only can let the running speed of the internal circuit of the device improve, can also reduce the electric leakage, reduce the power consumption, the silicon dioxide insulation layer is provided with a heating electrode and a test electrode, realizes the quick, even heating of the micro hot plate and the real time monitoring to temperature and gas, the overall design simplifies the installation mode, improves the test efficiency, in addition the micro hot plate composed of single crystal silicon substrate, silicon dioxide insulation layer, heating electrode and test electrode is inserted in the inside of the mounting socket, so that the micro hot plate array can be replaced at any time, reduces the cost.
[0019] Further, the heating electrode is made of platinum material and arranged in a Hilbert fractal curve, platinum is a good conductive material, has excellent conductivity, so that the platinum electrode can effectively transfer current in the heating process, generates the required heat, the heating electrode arranged in the Hilbert fractal curve can more evenly distribute heat, so as to improve the thermal uniformity of the whole micro hot plate.
[0020] Further, the test electrode is made of platinum material and arranged in a serpentine curve. Platinum electrode shows extremely high stability in electrochemical reaction and is not easy to corrode or oxidize. Such stability makes platinum electrode suitable for long-time running test and application, and can maintain the stability of its performance, thereby ensuring the accuracy and reliability of test results. In addition, the serpentine curve design endows the test electrode with excellent flexibility, so that it can adapt to various complex environments and irregular shapes, reduces the installation difficulty, improves the use convenience, and makes the test electrode more flexible in various test scenes. BRIEF DESCRIPTION OF DRAWINGS
[0021] The drawings described herein are for the purpose of illustrating the embodiments of the present application and are not intended to limit the scope of the present application in any way. In addition, the shapes and proportions of the components in the drawings are only illustrative and are used to help understand the present application, and are not specifically limited to the shapes and proportions of the components.
[0022] Figure 1 It is a schematic diagram of the micro-hotplate three-dimensional structure of the present application;
[0023] Figure 2 It is a schematic diagram of the heating electrode working plane structure of the present application;
[0024] Figure 3 It is a schematic diagram of the test electrode working plane structure of the present application;
[0025] Figure 4 It is a schematic diagram of the micro-hotplate mounting socket structure of the present application.
[0026] Wherein: 1, single crystal silicon substrate; 2, silicon dioxide insulating layer; 3, electrode pin; 4, heating electrode; 5, support cantilever beam; 6, test electrode; 7, mounting socket; 8, slot. DETAILED DESCRIPTION
[0027] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme of the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.
[0028] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.
[0029] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0030] In the description of the embodiments of this utility model, it should be noted that if terms such as "upper," "lower," "horizontal," or "inner" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the utility model product is in use, they are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the utility model. Furthermore, terms such as "first" and "second" are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0031] Furthermore, the use of the term "horizontal" does not imply that the component must be absolutely horizontal, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.
[0032] In the description of the embodiments of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0033] The present invention will now be described in further detail with reference to the accompanying drawings:
[0034] like Figures 1 to 4 As shown, this utility model embodiment provides a micro hot plate based on MEMS technology, including a single crystal silicon substrate 1, a silicon dioxide insulating layer 2, electrode pins 3, a heating electrode 4, a supporting cantilever beam 5, a test electrode 6, a mounting socket 7, and a slot 8. The single crystal silicon substrate 1 is provided with a silicon dioxide insulating layer 2, and the heating electrode 4 and the test electrode 6 are provided on the silicon dioxide insulating layer 2. The mounting socket 7 has a slot 8 at its center, and the single crystal silicon substrate 1 is inserted into the slot 8.
[0035] It should be noted that, since the working temperature of the micro-hotplate is very high, the material of the substrate needs to be resistant to high temperature and can withstand the thermal stress brought by high temperature. Silicon material is easy to obtain in nature, and due to its high melting point and stable mechanical properties, it has very small deformation under high temperature conditions. At the same time, due to the development of MEMS technology, the processing technology of silicon substrate is currently very mature, and the processing cost is low, so single crystal silicon is selected as the substrate material of the micro-hotplate.
[0036] In this embodiment, SiO2 material is used as the support layer, because the two ends of the substrate are generally oxidized with a layer of SiO2 in production, so selecting SiO2 material as the support layer has the following advantages:
[0037] 1. The substrate itself will be oxidized with a layer of SiO2, so directly selecting SiO2 as the material of the support layer can reduce a process, directly generate the required thickness through thermal oxidation, and save costs;
[0038] 2. The parasitic capacitance in the circuit can be reduced, which can not only improve the running speed of the internal circuit of the device, but also reduce the leakage and power consumption;
[0039] 3. The SiO2 as the support layer also serves as an insulating layer, which can effectively eliminate the latch-up effect and prevent circuit failure.
[0040] As shown in Figure 2 and Figure 3 , the electrode pin 3 connects the heating electrode 4 and the test electrode 6 through the support cantilever beam 5, the heating electrode 4 and the test electrode 6 are arranged on the silicon dioxide insulating layer 2 in a cross manner, and the test electrode 6 is located above the heating electrode 4; the heating electrode 4 is made of Pt material and arranged on the silicon dioxide insulating layer 2 in a Hilbert fractal curve to improve the thermal uniformity. At the same time, Pt has good conductivity and good linearity of the resistance temperature coefficient, which can not only be used as a heating resistor, but also as a temperature measuring electrode to realize precise temperature control.
[0041] As shown in Figure 3 , the test electrode 6 is made of Pt material and arranged on the silicon dioxide insulating layer 2 in a serpentine curve, and the test electrode 6 is sputtered with a gas-sensitive material for measuring its resistance, and then converted into an electrical signal output.
[0042] Preferably, the heating electrode 4 and the test electrode 6 are connected with the electrode pin 3 through the support cantilever beam 5, and the electrode pin 3 is used for connecting with an external circuit.
[0043] The support cantilever beam 5 is at a 45° angle with the four sides of the heating area and the test area to support the entire heating area and the test area.
[0044] As shown in Figure 4As shown, the micro hot plate composed of the single crystal silicon substrate 1, the silicon dioxide insulation layer 2, the heating electrode 4 and the test electrode 6 is inserted into the slot 8 inside the mounting socket 7, the mounting socket 7 is welded on the sensor, and the micro hot plate array can be replaced at any time, and one sensor can be used for multiple purposes.
[0045] Method of use
[0046] In use, the micro hot plate mounting socket 7 is welded to the sensor, and the micro hot plate to be used is inserted into the mounting socket 7 (according to the gas to be tested, the micro hot plate with the corresponding gas sensitive material is selected). The heating electrode 4 and the test electrode 6 of the micro hot plate are respectively led out two electrode pins 3 and connected with the corresponding external circuit, after the connection of the electrode pins 3 is completed, the sensor signal converter is connected to the system, so as to convert the analog signal output by the sensor into a digital signal, and then the analog signal is read and processed through the computer end, the sensor signal is transmitted to the computer end through the connected sensor signal converter, and the data is stored, analyzed and judged.
[0047] Many embodiments and many applications other than those provided in the foregoing examples will be apparent from consideration of the foregoing description with reference to the accompanying drawings. It is therefore contemplated to cover all modifications of this present teaching falling within the scope of the claims hereinafter appended. It is intended, therefore, to be limited only by the scope of the appended claims and all there equivalents thereof. For purposes of completeness, all articles and references including patents and publications, are incorporated by reference herein. The omission of any aspect of the subject matter disclosed herein from any claim does not preclude that aspect from being claimed in any other claim, unless the omission is expressly recited in the claim from which it is omitted.
[0048] The above is a further detailed description of the present application, and the specific embodiments of the present application should not be limited to the above. For ordinary skilled in the art to which the present application belongs, without departing from the concept of the present application, a number of simple deductions or substitutions can be made, which should be regarded as falling within the scope of the present application determined by the claims.
Claims
1. A micro hotplate based on MEMS technology, characterized by, The application relates to a single crystal silicon substrate (1) which is inserted into a mounting socket (7), wherein a silicon dioxide insulating layer (2) is arranged on the single crystal silicon substrate (1), and a heating electrode (4) and a test electrode (6) are arranged on the silicon dioxide insulating layer (2), and the heating electrode (4) and the test electrode (6) are connected with electrode pins (3).
2. The micro-hotplate based on MEMS technology according to claim 1, characterized in that, The heating electrode (4) is made of platinum and arranged in a Hilbert fractal curve.
3. The micro-hotplate based on MEMS technology according to claim 1, characterized in that, The test electrode (6) is made of platinum and arranged in a serpentine curve.
4. The micro-hotplate based on MEMS technology according to claim 1, characterized in that, The heating electrode (4) and the test electrode (6) are connected with an external circuit through the electrode pins (3).
5. The micro-hotplate based on MEMS technology according to claim 1, characterized in that, The heating electrode (4) and the test electrode (6) are arranged in a cross manner, and the test electrode (6) is arranged above the heating electrode (4).
6. The micro-hotplate based on MEMS technology according to claim 1, characterized in that, A gas sensitive material layer is sputtered on the test electrode (6).
7. The micro-hotplate based on MEMS technology according to claim 1, characterized in that, The mounting socket (7) is internally provided with a slot (8), and the single crystal silicon substrate (1) is inserted into the slot (8).
8. The micro-hotplate based on MEMS technology according to claim 1, characterized in that, The mounting socket (7) is welded on a sensor.
9. The micro-hotplate based on MEMS technology according to claim 1, characterized in that, The heating electrode (4) and the test electrode (6) are connected with the electrode pins (3) through a supporting cantilever beam (5).
10. The micro-hotplate based on MEMS technology according to claim 9, characterized in that, The supporting cantilever beam (5) is at a 45-degree angle with four sides of a heating area and a test area.