Heat dissipation structure suitable for power device

Abstract

The utility model relates to a heat dissipation structure suitable for power devices, comprising a PCB mainboard, one side of the PCB mainboard is provided with a heat dissipation area, the heat dissipation area is internally connected with a plurality of power devices, the lower part of the PCB mainboard is connected with a connecting column, the bottom of the connecting column is connected with a fixing plate, a gap is arranged between the fixing plate and the PCB mainboard, and the power devices are connected with the PCB mainboard. A heat dissipation connecting block is connected in the interval, the bottom of the heat dissipation connecting block is in contact connection with the fixing plate, the top of the heat dissipation connecting block is in contact with a pin of the power device, the area of the heat dissipation connecting block is larger than or equal to that of the heat dissipation area, and the bottom of the fixing plate is connected with heat dissipation fins. According to the utility model, the cost can be reduced while the heat dissipation is realized.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of heat dissipation structure suitable for power device. BACKGROUND

[0002] In variable frequency technology, it needs to be composed of upper and lower bridge structure by power device, and control chip controls the on-off of power device (IGBT or MOS tube) according to algorithm, to control the output to variable frequency motor.

[0003] With the increase of motor power, the current passing through power device also increases, resulting in more and more heat generated on power device. Currently, two heat dissipation methods are mainly used:

[0004] Power module packaged by manufacturer is used. The manufacturer will package 6 power devices and other devices into a complete module, and has designed heat dissipation PAD and mounting hole. This way, the design is simple, the processing is convenient, and the heat dissipation mechanism is also simpler. However, the price is generally high, which is not conducive to large-scale application.

[0005] Discrete power devices (MOS tube or IGBT) are used, and then each device is fixed on the heat dissipation fin or heat dissipation aluminum plate through a screw. This structure can effectively reduce the cost, but the processing technology is complex, and it is only suitable for manual assembly. The cost is high, the torque of the screw during installation will affect the heat dissipation effect, and the flatness and processing requirements of the heat sink are also relatively high. Otherwise, the consistency of the device operation cannot be effectively controlled.

[0006] In view of the above defects, the present design person actively researches and innovates to create a new structure of heat dissipation structure suitable for power device, so as to make it more useful in industry. CONTENT OF THE UTILITY MODEL

[0007] To solve the above technical problems, the purpose of the utility model is to provide a heat dissipation structure suitable for power device.

[0008] To achieve the above purpose, the utility model adopts the following technical solutions:

[0009] A heat dissipation structure suitable for power device, comprising a PCB mainboard, a heat dissipation area is provided on one side of the PCB mainboard, a plurality of power devices are connected in the heat dissipation area, a connecting column is connected below the PCB mainboard, a fixed plate is connected to the bottom of the connecting column, a gap is provided between the fixed plate and the PCB mainboard, a heat dissipation connecting block is connected in the gap, the bottom of the heat dissipation connecting block is connected with the fixed plate, the top of the heat dissipation connecting block is in contact with the pin of the power device, and the area of the heat dissipation connecting block is greater than or equal to the area of the heat dissipation area, and the bottom of the fixed plate is connected with a heat dissipation fin.

[0010] Preferably, the heat dissipation structure for power device, the heat dissipation connecting block is connected on the fixed plate through fixing screw.

[0011] Preferably, the heat dissipation structure for power device, the fixed plate is the fixed plate of aluminum material.

[0012] Preferably, the heat dissipation structure for power device, the heat dissipation area of power device is attached on the circuit layer of PCB mainboard through SMT process.

[0013] Preferably, the heat dissipation structure for power device, the circuit layer comprises insulating layer and metal base layer from top to bottom.

[0014] Preferably, the heat dissipation structure for power device, the top of heat dissipation connecting block is contacted with PCB mainboard through heat conduction layer.

[0015] By the above scheme, the heat dissipation structure for power device has at least the following advantages:

[0016] The heat dissipation structure for power device can solve the heat dissipation problem of power device, can improve heat dissipation, can simplify installation work, and can achieve the purposes of skill heat dissipation and cost reduction.

[0017] The above description is only a summary of the technical scheme of the heat dissipation structure for power device, in order to more clearly understand the technical means of the heat dissipation structure for power device, and can be implemented according to the content of the specification, the following will be described in detail with the preferred embodiment of the heat dissipation structure for power device and the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical scheme of the embodiment of the heat dissipation structure for power device, the following will briefly introduce the drawings needed to be used in the embodiment, it should be understood that the following drawings only show some embodiments of the heat dissipation structure for power device, therefore should not be regarded as the limitation to the scope, for the ordinary skilled person in the art, without paying the creative labor, other related drawings can also be obtained according to these drawings.

[0019] Figure 1 It is the structural schematic diagram of the heat dissipation structure for power device. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical scheme and advantages of the embodiment of the present application more clear, the technical scheme in the embodiment of the present application will be clearly and completely described below, combined with the drawings in the embodiment of the present application, obviously, the described embodiment is a part of the embodiment of the present application, not all the embodiments. The components of the embodiment of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0021] Therefore, the following detailed description of embodiments of the application provided in the drawings is not intended to limit the scope of the application claimed, but merely represents selected embodiments of the application. Based on the embodiments in the application, all other embodiments obtained by those of ordinary skill in the art without creative labor are within the scope of protection of the application.

[0022] Embodiments

[0023] As Figure 1 shown, a heat dissipation structure suitable for power devices includes a PCB mainboard 1, one side of the PCB mainboard 1 is provided with a heat dissipation area, a plurality of power devices 2 are connected in the heat dissipation area, a connecting column 3 is connected below the PCB mainboard 1, a fixed plate 4 is connected at the bottom of the connecting column 3, a spacing 9 is arranged between the fixed plate 4 and the PCB mainboard 1, a heat dissipation connecting block 6 is connected in the spacing 9, the bottom of the heat dissipation connecting block 6 is in contact with the fixed plate 4, the top of the heat dissipation connecting block 6 is in contact with the pins of the power device 2, and the area of the heat dissipation connecting block 6 is greater than or equal to the area of the heat dissipation area, and the bottom of the fixed plate 4 is connected with a heat dissipation fin 8.

[0024] The heat dissipation connecting block 6 in the utility model is connected on the fixed plate 4 through the fixed screw 7, and the corresponding heat dissipation connecting block can be replaced as needed to match the current power device.

[0025] The fixed plate 4 in the utility model is an aluminum fixed plate, which can improve heat conduction and thus improve heat dissipation efficiency.

[0026] The heat dissipation area of the power device 2 in the utility model is attached to the circuit layer of the PCB mainboard 1 through an SMT process, wherein the circuit layer includes an insulating layer and a metal base layer from top to bottom. The SMT process simplifies installation and also ensures heat dissipation of the power device.

[0027] The top of the heat dissipation connecting block 6 in the utility model is in contact with the PCB mainboard 1 through a heat conduction layer, which ensures that the heat of the power device can be quickly conducted to the heat dissipation connecting block, achieving rapid heat dissipation.

[0028] The working principle of the utility model is as follows:

[0029] In specific work, when the power device is working, the heat generated during device operation is quickly conducted to the metal base layer through the insulating layer, and then the heat is transferred to the heat dissipation connecting block by the metal base layer, and finally the heat is transferred to the outside through the heat dissipation fin by the heat dissipation connecting block, thereby achieving heat dissipation of the device.

[0030] It should be noted that like reference numerals and characters refer to like elements throughout the following figures and description, and thus, once certain terminologies are defined in one figure, they do not need to be further defined and explained in the subsequent figures.

[0031] In the description of the present application, it should be noted that the terms "vertical", "horizontal", "inner", "outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly placed when the product of the application is used, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0032] In addition, the terms "horizontal", "vertical", etc. do not mean that the components must be absolutely horizontal or vertical, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0033] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "set", "mount", "connected", "connected" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication between two elements inside. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0034] The above is only the preferred embodiment of the present application, and is not used to limit the present application, and it should be pointed out that for ordinary skilled in the art, without departing from the technical principles of the present application, a number of improvements and modifications can be made, and these improvements and modifications should be considered as the protection scope of the present application.

Claims

1. A heat dissipation structure suitable for power devices, comprising a PCB mainboard (1), one side of the PCB mainboard (1) is provided with a heat dissipation area, a plurality of power devices (2) are connected in the heat dissipation area, characterized in that: The lower part of the PCB mainboard (1) is connected with a connecting column (3), the bottom of the connecting column (3) is connected with a fixing plate (4), a space (9) is arranged between the fixing plate (4) and the PCB mainboard (1), a heat dissipation connecting block (6) is connected in the space (9), the bottom of the heat dissipation connecting block (6) is connected with the fixing plate (4), the top of the heat dissipation connecting block (6) is in contact with the pin of the power device (2), meanwhile the area of the heat dissipation connecting block (6) is greater than or equal to the area of the heat dissipation area, the bottom of the fixing plate (4) is connected with a heat dissipation fin (8).

2. The heat dissipation structure for power devices according to claim 1, wherein: The heat dissipation connecting block (6) is connected on the fixing plate (4) through a fixing screw (7).

3. The heat dissipation structure for power devices according to claim 1 or 2, characterized in that: The fixing plate (4) is an aluminum fixing plate.

4. The heat dissipation structure for power devices according to claim 1, wherein: The heat dissipation area of the power device (2) is attached on the circuit layer of the PCB mainboard (1) through an SMT process.

5. The heat dissipation structure for power devices according to claim 4, wherein: The circuit layer comprises an insulating layer and a metal base layer from top to bottom.

6. The heat dissipation structure for power devices according to claim 1, wherein: The top of the heat dissipation connecting block (6) is in contact with the PCB mainboard (1) through a heat conduction layer.

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