Fixing support for heat dissipation of high-power chip

Abstract

The utility model relates to a fixing support for heat dissipation of a high-power chip, which comprises a concave punching support, a bottom insulating sheet, compressed silica gel and a support insulating sheet, the concave punching support is of a plate-shaped structure, a mounting groove is formed in the middle of the concave punching support, the insulating sheet is arranged at the bottom of the mounting groove and attached to the bottom wall of the mounting groove, and the compressed silica gel is arranged in the mounting groove and attached to the bottom wall of the mounting groove. The compression silica gel is located on the bottom insulation sheet, the thickness of the compression silica gel is larger than the concave depth of the installation groove, when the PCBA is clamped by the concave punching support and the radiator, the compression silica gel abuts against the PCBA, pressure is applied in the mode of facing the PCBA, the concave punching support is attached to the back face of the chip PCBA and reinforces the PCBA relative to the radiator, the center of the concave punching support is provided with the compressible silica gel, and when locking is conducted, opposite force is provided, and the compression silica gel is pressed to the PCBA. Therefore, the center of the chip is prevented from deforming towards the back surface due to locking impact force, the force forces the heat-conducting interface material to be compressed, the pressure and the deformation amount are ensured, and the thermal resistance is reduced.

Description

Technical Field

[0001] This application relates to the field of chip heat dissipation technology, and in particular to a mounting bracket for heat dissipation of high-power chips. Background Technology

[0002] A PCB, also known as a printed circuit board, is a provider of electrical connections for electronic components. Its development has a history of over 100 years; its design primarily involves layout design. The main advantages of using PCBs are significantly reduced wiring and assembly errors, improved automation levels, and increased production efficiency. Based on the number of layers, PCBs can be classified as single-sided, double-sided, four-layer, six-layer, and other multi-layer PCBs. Due to the miniaturization of integrated circuits and electronic components, most electronic products now use multi-layer PCBs. PCBA is short for Printed Circuit Board Assembly, meaning the entire process of a bare PCB board undergoing surface mount technology (SMT) or DIP (Dual In-line Package) assembly, abbreviated as PCBA. This is a commonly used notation in China, while the standard notation in Europe and America is PCB'A with an apostrophe, which is considered the official usage.

[0003] A heat sink is a general term for a series of devices used to conduct and release heat. Currently, heat sinks are mainly divided into heating heat sinks and computer heat sinks. Heating heat sinks can be further divided into several types according to their materials and operating modes, while computer heat sinks can be divided into several types according to their uses and installation methods. When high-power chips are operating, a large amount of heat is generated due to the thermal effect of the current. If this heat cannot be dissipated in time, the chip temperature will rise, thus affecting the chip's performance and lifespan. To solve this problem, heat sinks need to be installed on high-power chips and fixed to the PCB board using mounting brackets, allowing the heat sink to dissipate the heat generated by the chip in a timely manner. However, existing mounting bracket structures are not tight enough for the secure installation of the PCBA and heat sink, resulting in unsatisfactory overall heat dissipation efficiency. Utility Model Content

[0004] In view of this, this application proposes a mounting bracket for heat dissipation of high-power chips to improve heat dissipation effect.

[0005] According to one aspect of this application, a mounting bracket for heat dissipation of a high-power chip is provided, comprising: a recessed bracket, a bottom insulating sheet, and a compression silicone pad;

[0006] The punched bracket is a plate-shaped structure with a mounting groove recessed in the middle.

[0007] The bottom insulating sheet is disposed inside the mounting groove and is attached to the bottom wall of the mounting groove;

[0008] The compression silicone is disposed at the bottom of the mounting groove, on the bottom insulating sheet. The thickness of the compression silicone is greater than the recess depth of the mounting groove. When the punched bracket and the heat sink clamp the PCBA, the compression silicone abuts against the PCBA and applies pressure toward the PCBA.

[0009] In one possible implementation, the compressible silicone is fitted into the mounting groove of the punched bracket, with the top of the compressible silicone located outside the mounting groove.

[0010] In one possible implementation, the sidewall of the mounting groove is provided with ventilation holes facing the plate surface of the punched bracket.

[0011] In one possible implementation, the bottom insulating sheet covers the bottom wall of the mounting groove.

[0012] In one possible implementation, there are multiple vent holes, spaced apart circumferentially along the mounting groove.

[0013] In one possible implementation, the top of the sidewall of the mounting groove is rounded.

[0014] One possible implementation also includes: a support insulating sheet;

[0015] The corner of the punching bracket has a horizontally extending fixing plate, and there are two or more fixing plates;

[0016] The bracket insulating sheet is a hollow plate-like structure with mounting plates extending horizontally from its corners. The position and number of the mounting plates match the fixed plate.

[0017] In one possible implementation, the bracket insulating sheet matches the punched and recessed bracket, and the hollow structure of the bracket insulating sheet corresponds to the mounting groove of the punched and recessed bracket.

[0018] The fixing plate of the punched bracket, the mounting plate of the bracket insulating sheet, the PCB board and the heat sink are sequentially bolted together.

[0019] In one possible implementation, the cross-sectional area of ​​the support insulating sheet is greater than the cross-sectional area of ​​the punched and recessed support.

[0020] In one possible implementation, the punched bracket, the bottom insulating sheet, and the compressed silicone are symmetrically structured.

[0021] The beneficial effects of the high-power chip heat dissipation fixing bracket in the embodiments of this application are as follows: the recessed bracket is attached to the back of the chip PCB, which reinforces the PCB relative to the heat sink, and the center of the recessed bracket is provided with compressible silicone, which provides a reverse force when locked, ensuring that the center of the chip will not deform to the back due to the locking impact force. The force forces the thermal interface material to compress, which ensures the pressure and deformation amount and reduces the thermal resistance.

[0022] Other features and aspects of this application will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0023] The accompanying drawings, which are included in and form part of this specification, illustrate exemplary embodiments, features, and aspects of this application together with the specification and serve to explain the principles of this application.

[0024] Figure 1 An exploded view of a mounting bracket for heat dissipation of a high-power chip according to an embodiment of this application is shown.

[0025] Figure 2 This is a side view of a mounting bracket for heat dissipation of a high-power chip according to an embodiment of this application.

[0026] Figure 3 An exploded view of the bracket, PCBA, and heat sink installation according to an embodiment of this application is shown. Detailed Implementation

[0027] Various exemplary embodiments, features, and aspects of this application will now be described in detail with reference to the accompanying drawings. The same reference numerals in the drawings denote elements that have the same or similar functions. Although various aspects of the embodiments are shown in the drawings, they are not necessarily drawn to scale unless specifically indicated otherwise.

[0028] It should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model or simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0029] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0030] The term “exemplary” as used herein means “serving as an example, embodiment, or illustration.” Any embodiment illustrated herein as “exemplary” is not necessarily to be construed as superior to or better than other embodiments.

[0031] Furthermore, to better illustrate this application, numerous specific details are provided in the following detailed embodiments. Those skilled in the art should understand that this application can be implemented without certain specific details. In some instances, methods, means, components, and circuits well-known to those skilled in the art have not been described in detail in order to highlight the main points of this application.

[0032] like Figure 1 , Figure 2 and Figure 3 As shown, the high-power chip heat dissipation fixing bracket of this application embodiment includes: a high-power chip heat dissipation fixing bracket, suitable for fixing PCBA 500 with heat sink 600, characterized in that it includes: a punched bracket 100, a bottom insulating sheet 200 and a compression silicone 300. The punched bracket 100 is a plate-shaped structure with a mounting groove 110 recessed in the middle. The bottom insulating sheet 200 is disposed at the bottom of the mounting groove 110 and attached to the bottom wall of the mounting groove 110. The compression silicone 300 is disposed inside the mounting groove 110 and located on the insulating sheet 200. The thickness of the compression silicone 300 is greater than the recess depth of the mounting groove 110. When the punched bracket 100 and heat sink 600 clamp the PCBA 500, the compression silicone 300 abuts against the PCBA 500 and applies pressure towards the PCBA 500.

[0033] In this embodiment, when the heat sink 600 is tightened, it will press against the heat dissipation chip on the PCBA 500. The PCB used in the PCBA is a non-rigid material, which is easily deformed and will bend and deform to the back. The thermal interface material will be relatively soft and will compress in thickness. However, without the compressible silicone 300 on the back to provide an upward force after compression, the compression ratio and pressure will be worse, especially for larger chips. When the span of the four fixing holes 121 around the chip needs to be increased, the bottom deformation will be more severe. The contact thermal resistance is closely related to the pressure and the amount of deformation. The tighter, more compact, and more uniform the compression, the lower the thermal resistance. The thinner the thermal interface material after compression, the better. Therefore, the PCBA 500 at the bottom of the chip needs to deform as little as possible and the force should be more uniform. The recessed bracket 100 is attached to the back of the chip PCB, which is equivalent to reinforcing the PCB. There is compressible silicone in the center, which provides a reverse force when locking, ensuring that the center of the chip will not deform to the back due to the locking impact. The force forces the thermal interface material to compress, ensuring the pressure and deformation, and reducing the thermal resistance.

[0034] Specifically, the punched bracket 100 has a plate-like structure, and its material can be a metal or alloy or other high-strength material to better apply pressure. A mounting groove 110 is recessed in the middle of the punched bracket 100 for mounting and fixing the bottom insulating sheet 200 and the compression silicone 300. The bottom insulating sheet 200 is located at the bottom of the mounting groove 110 and is attached to the bottom wall of the mounting groove 110. The insulating sheet 200 can be made of insulating materials such as plastic or rubber to prevent short circuits between the punched bracket 100 and the PCBA 500. The bottom insulating sheet 200 can cover the entire bottom wall of the mounting groove 110 to ensure insulation effectiveness. The compression silicone 300 is disposed inside the mounting groove 110, located on the insulating sheet 200. The compression silicone 300 is an elastic material that can deform under pressure, thereby providing pressure on the PCBA 500. The thickness of the compression silicone 300 is greater than the recess depth of the mounting groove 110, so as to ensure that when the punched bracket 100 and the heat sink 600 clamp the PCBA 500, the compression silicone 300 can abut against the PCB board 500 and apply a counterforce against the PCBA 500 in a way that is directed towards the PCBA 500, forcing the thermal interface material to be compressed more evenly and tightly, thereby reducing thermal resistance.

[0035] It should be noted that this greatly reduces the thermal resistance on the heat conduction path of the heat sink chip. According to the heat dissipation formula, temperature rise ΔT (°C) = thermal resistance R * power P. When the heat sink 600 and the chip are determined, the lower the contact thermal resistance on the path, the better, especially for high power.

[0036] In one specific embodiment, the compressible silicone 300 matches the mounting groove 110 and is embedded in the mounting groove 110 of the punched bracket 100, with the top of the compressible silicone 3003 located outside the mounting groove 110. When the punched bracket 100 and the heat sink 600 clamp the PCB board 500, the compressible silicone 300 can fully contact the PCB board 500, providing the PCB board 500 with a larger area of ​​counterforce against the heat sink 600, thus providing better fixation and heat dissipation.

[0037] In one specific embodiment, the sidewall of the mounting groove 110 facing the plate surface of the recessed bracket 100 is provided with a vent hole 130. The vent hole 130 allows the gas inside the mounting groove 110 to be discharged in time when it is at high temperature, preventing damage to the device from high temperature and high pressure.

[0038] Furthermore, in this specific embodiment, there can be multiple vent holes 130, which are spaced apart circumferentially along the mounting groove 110 to further improve the ventilation effect.

[0039] In one specific embodiment, the top of the sidewall of the mounting groove 110 is rounded. This prevents the top of the sidewall of the mounting groove 110 from scratching or damaging the PCB board 500 or operators during installation and removal. Furthermore, the rounded corners on the top of the sidewall of the mounting groove 110 also facilitate the placement and removal of the compression silicone 300.

[0040] The punched bracket 100 and the compressed silicone 300 effectively fix the PCB board 500 and the heat sink 600, while also providing good heat dissipation. Furthermore, this fixing bracket has a simple structure, is easy to manufacture and install, and can adapt to PCB boards 500 and heat sinks 600 of different specifications and sizes, greatly improving the convenience and flexibility of practical use.

[0041] In one specific embodiment, the mounting bracket for heat dissipation of high-power chips further includes a bracket insulating sheet 400 to improve the stability and safety of the mounting bracket. Specifically, the structure of the bracket insulating sheet 400 is the same as that of the recessed bracket 100, both being plate-shaped structures. The bracket insulating sheet 400 is a hollow plate-shaped structure, and its material can be an insulating material, such as plastic or rubber.

[0042] The punched bracket 100 has four horizontally extending fixing plates 120 at its corners. The bracket insulating sheet 400 is a hollow plate structure with mounting plates 410 extending horizontally at its corners. The position and number of mounting plates 410 match the fixing plates 120. The mounting plates 410 at the corners of the bracket insulating sheet 400 match the fixing plates 120 of the punched bracket 100, thus completing the sequential bolt connection of the fixing plates 120 of the punched bracket 100, the mounting plates 410 of the bracket insulating sheet 400, the PCB board 500, and the heat sink 600.

[0043] In this specific embodiment, the hollow structure of the bracket insulating sheet 400 corresponds to the mounting groove 110 of the punched bracket 100, which facilitates the compression silicone 300 located inside the mounting groove 110 to pass through the hollow structure of the bracket insulating sheet 400 and abut against the PCB board 500.

[0044] In one specific embodiment, the cross-sectional area of ​​the bracket insulating sheet 400 is larger than the cross-sectional area of ​​the punched bracket 100 to prevent the tolerance from not completely covering the bottom of the bracket and to ensure insulation.

[0045] Among them, the punched bracket 100, the bottom insulating sheet 200 and the compressed silicone 300 are symmetrical structures.

[0046] The various embodiments of this application have been described above. These descriptions are exemplary and not exhaustive, nor are they limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principles, practical application, or improvement of the technology in the market, or to enable others skilled in the art to understand the embodiments disclosed herein.

Claims

1. A fixed support for heat dissipation of a high-power chip, suitable for fixing a PCBA with a heat sink, characterized in that, The utility model relates to a PCBA fixing device, including: The punch concave support, bottom insulating sheet and compression silica gel; The punch concave support is plate structure, and the middle position is recessed with installation groove; The bottom insulating sheet sets up in the bottom of installation groove, and is attached with the bottom wall of installation groove; The compression silica gel sets up in the inside of installation groove, is located on the bottom insulating sheet, the thickness of compression silica gel is greater than the recess depth of installation groove, and when the punch concave support and radiator hold PCBA, compression silica gel and PCBA abut, and the way of pressure towards PCBA.

2. The fixed support for heat dissipation of a high-power chip according to claim 1, characterized in that, The compression silica gel matches with the installation groove, and is embedded in the installation groove of punch concave support, and the top end of compression silica gel is located in the outside of installation groove.

3. The fixed support for heat dissipation of a high-power chip according to claim 1, characterized in that, The side wall of installation groove is towards the plate surface direction of punch concave support, and is provided with air hole.

4. The fixed support for heat dissipation of a high-power chip according to any one of claims 1 to 3, characterized in that, The bottom insulating sheet is spread in the bottom wall of installation groove.

5. The fixed support for heat dissipation of a high-power chip according to claim 3, characterized in that, The air hole is multiple, and is arranged along the circumference of installation groove.

6. The fixed support for heat dissipation of a high-power chip according to claim 5, characterized in that, The top of side wall of installation groove is rounded.

7. The fixed support for heat dissipation of a high-power chip according to any one of claims 1 to 3, characterized in that, Also including: Support insulating sheet; The corner position of punch concave support extends horizontally with fixed plate, and the fixed plate is more than two; The support insulating sheet is hollow plate structure, and the corner position extends horizontally with mounting plate, and the position and quantity of mounting plate match with fixed plate.

8. The fixed support for heat dissipation of a high-power chip according to claim 7, characterized in that, The support insulating sheet matches with punch concave support, and the hollow structure of support insulating sheet corresponds with the installation groove of punch concave support; The fixed plate of punch concave support, the mounting plate of support insulating sheet, PCBA and radiator are sequentially bolted.

9. The fixed support for heat dissipation of a high-power chip according to claim 8, characterized in that, The cross-sectional area of support insulating sheet is greater than the cross-sectional area of punch concave support.

10. The fixed support for heat dissipation of a high-power chip according to claim 1, wherein, The punch concave support, bottom insulating sheet and compression silica gel are symmetrical structure.

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