Miniature radiator structure

Abstract

The utility model relates to the field of miniature radiators, and discloses a miniature radiator structure which comprises a base body, a plurality of evenly distributed spoilers are arranged in the base body, a cover plate is arranged on the top of the base body, connectors are arranged on the left side and the right side of the top of the cover plate, stacking assemblies are arranged in the spoilers, and the spoilers are arranged in the stacking assemblies. And the stacking assembly is used for forming a complex runner and comprises a plurality of T-shaped turbulent flow blocks which are evenly distributed, one side of each T-shaped turbulent flow block is fixedly connected to one side of the corresponding spoiler, round holes are formed in the left side and the right side of the interior of the cover plate, and the bottoms of the connectors are slidably connected to the interiors of the round holes. According to the utility model, through assembling the joint, the cover plate and the base body, the spoilers are arranged in the cavity of the base body in a mirroring manner to form a complex flow channel, so that the disturbance and heat exchange coefficient of cooling liquid is improved, the efficiency of the radiator is improved, the spoilers designed by stamping parts are convenient for batch production, and the balance between the heat dissipation performance and the light weight is realized at the same time.

Description

Technical Field

[0001] This utility model relates to the field of micro heat sinks, and more particularly to a micro heat sink structure. Background Technology

[0002] A radiator is a device used to absorb, conduct, and release heat. It dissipates excess heat generated by equipment or systems to maintain their normal operating temperature and prevent performance degradation or damage caused by overheating.

[0003] A radiator mainly consists of heat sinks and a heat-conducting base. The heat sink is the core component of the radiator, used to increase the heat dissipation area and thus accelerate the dissipation of heat. The heat-conducting base is the part of the radiator that is in direct contact with the heat source. It is responsible for absorbing heat from the heat source and transferring the heat to other parts of the radiator.

[0004] As electronic devices become increasingly miniaturized and high-performance, the power density of electronic components such as chips continues to increase, generating more and more heat. However, due to the overall size limitations of the device, traditional large heat sinks cannot meet the heat dissipation requirements. Therefore, a micro heat sink structure is proposed to solve the above problems. Utility Model Content

[0005] To overcome the above shortcomings, this utility model provides a miniature heat sink structure, which aims to improve the problem that the existing technology cannot meet the heat dissipation requirements due to the size limitation of the equipment.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A miniature heat sink structure includes a substrate, in which a plurality of uniformly distributed baffles are disposed inside. A cover plate is disposed on the top of the substrate, and connectors are disposed on both the left and right sides of the top of the cover plate. Stacking components are disposed inside the baffles, and the stacking components are used to form complex flow channels.

[0008] As a further description of the above technical solution:

[0009] The stacked assembly includes a plurality of uniformly distributed T-shaped baffles, one side of which is fixedly connected to one side of the baffle plate;

[0010] As a further description of the above technical solution:

[0011] The cover plate has round holes on both the left and right sides inside, and the bottom of the connector is slidably connected to the inside of the round holes.

[0012] As a further description of the above technical solution:

[0013] The base has a step on the top side inside, and the outer periphery of the cover plate is slidably connected to the inside of the step;

[0014] As a further description of the above technical solution:

[0015] The substrate has a cavity inside, and the outer periphery of the baffle is slidably connected to the cavity;

[0016] As a further description of the above technical solution:

[0017] Multiple evenly distributed guide pillars are fixedly connected inside the substrate, and the outer periphery of the guide pillars is slidably connected inside the baffle.

[0018] As a further description of the above technical solution:

[0019] The spoiler is fixedly connected to one side with a plurality of evenly distributed guide holes, and the guide holes are slidably connected to the outer periphery of the guide post.

[0020] As a further description of the above technical solution:

[0021] The connector has multiple evenly distributed mounting holes fixedly connected to its outer periphery.

[0022] This utility model has the following beneficial effects:

[0023] 1. In this utility model, the baffles are arranged in a mirror image within the cavity of the substrate through precise positioning and assembly of the connector, cover plate and substrate, forming a complex flow channel. This causes the coolant to generate greater turbulence during flow, increasing the heat transfer coefficient and effectively improving the heat transfer efficiency of the radiator. At the same time, the baffle design using stamped parts is conducive to rapid mass production and achieves a good balance between heat dissipation performance and lightweight.

[0024] 2. In this utility model, the baffle is designed as a stamped part, which facilitates rapid mass production and reduces production costs. At the same time, by stacking the baffles to form a complex flow channel, the structure is lightweight and the overall heat sink achieves a lightweight design, which is suitable for the heat dissipation needs of micro devices. Attached Figure Description

[0025] Figure 1 This is a three-dimensional schematic diagram of a miniature heat sink structure proposed in this utility model;

[0026] Figure 2 This is a schematic diagram of the structure of the substrate of a micro heat sink structure proposed in this utility model;

[0027] Figure 3 This is a schematic diagram of the baffle plate of a miniature heat sink structure proposed in this utility model;

[0028] Figure 4 This is a schematic diagram of the T-shaped baffle block of a micro heat sink structure proposed in this utility model.

[0029] Legend:

[0030] 1. Connector; 2. Cover plate; 21. Round hole; 3. Baffle; 31. T-shaped baffle block; 32. Guide hole; 4. Base; 41. Step; 42. Cavity; 43. Guide post; 44. Mounting hole. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0032] Reference Figure 1 - Figure 3 This utility model provides an embodiment of a miniature heat sink structure, including a base 4. The base 4 serves as the main structure of the heat sink, supporting a cover plate 2 and baffles 3, forming a closed cavity for fluid flow and heat dissipation. The base 4 is made of 003 aluminum, which has strong corrosion resistance and good thermal conductivity, ensuring structural stability and providing good heat conduction. Multiple evenly distributed baffles 3 are arranged inside the base 4 to increase fluid turbulence, forming complex flow paths and thus improving heat dissipation efficiency. The baffles 3 are made of 4343 composite aluminum, which has excellent thermal conductivity and good corrosion resistance, effectively conducting heat in the heat sink while ensuring proper brazing. The substrate 4 is not easily deformed during the process. A cover plate 2 is provided on the top of the substrate 4. The cover plate 2 is used to close the top of the substrate 4, support the connector 1, and together with the substrate 4, form a fluid cavity to ensure that the fluid flows inside the radiator according to the set flow channel. The material is 4343 aluminum alloy, which, combined with 3003 aluminum, can improve weldability and corrosion resistance, while maintaining good thermal conductivity. Connectors 1 are provided on the left and right sides of the top of the cover plate 2. Connectors 1 are used to connect the inlet and outlet of the external cooling fluid to ensure that the fluid can enter the radiator and flow out. The material is 3003 aluminum, which has good corrosion resistance and high thermal conductivity. It is suitable for the part of the radiator that needs to be in contact with the fluid for a long time, and can ensure stable connection and heat dissipation effect.

[0033] Reference Figure 2 - Figure 4 The baffle 3 has a stacking assembly inside, which is used to form a complex flow channel. The stacking assembly includes multiple uniformly distributed T-shaped baffle blocks 31. The T-shaped baffle blocks 31 increase the turbulence of the fluid by forming local vortices, which further improves the heat dissipation efficiency. One side of the T-shaped baffle block 31 is fixedly connected to one side of the baffle 3.

[0034] Reference Figure 2 - Figure 4 The cover plate 2 has round holes 21 on both the left and right sides inside. The round holes 21 are used to provide connection interfaces with external fluid pipes, serving as the fluid inlet and outlet. The bottom of the connector 1 is slidably connected inside the round holes 21. The top side of the base 4 has a step 41 inside, which supports the cover plate 2. The outer periphery of the cover plate 2 is slidably connected inside the step 41. The base 4 has a cavity 42 inside, which provides flow space for the fluid and ensures that the fluid can exchange heat inside. The outer periphery of the baffle 3 is slidably connected inside the cavity 42. Multiple evenly distributed guide posts 43 are fixedly connected inside the base 4. The guide posts 43 cooperate with the guide holes 32 on the baffle 3. The guide post 43 is used to accurately position the baffle 3, ensuring precise alignment of each layer of baffle 3. It is made of 3003 aluminum and can ensure the stability and durability of the guide post 43 during use, while maintaining the consistency of the overall structure. The outer periphery of the guide post 43 is slidably connected to the inside of the baffle 3. Multiple evenly distributed guide holes 32 are fixedly connected to one side of the baffle 3. The guide holes 32 are slidably connected to the outer periphery of the guide post 43. Multiple evenly distributed mounting holes 44 are fixedly connected to the outer periphery of the connector 1. The mounting holes 44 are used to install and fix the external structure of the heat sink, ensuring its stability in the equipment or system. It is made of 3003 aluminum and can provide sufficient mechanical support.

[0035] Working principle: During operation, the bottom of the miniature radiator is in direct contact with the heat source and is fixed in a suitable position through the mounting hole 44. The heat generated by the heat source is transferred to the entire interior of the radiator through the bottom of the radiator. The coolant enters the miniature radiator from the connector 1 at one end and flows through the complex flow channel formed by the baffle 3 inside. Due to the complex design of the flow channel, the coolant is disturbed, which increases the heat transfer coefficient and thus effectively improves the heat dissipation efficiency. The coolant carries away the heat inside the radiator and then flows out of the miniature radiator from the connector 1 at the other end, forming a cyclic heat exchange process and continuously maintaining the heat dissipation effect of the equipment.

[0036] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A micro heat spreader structure comprising a base (4), characterized in that: The base body (4) is internally provided with a plurality of uniformly distributed spoilers (3), the top of the base body (4) is provided with a cover plate (2), the top of the cover plate (2) is provided with a joint (1) on the left and right sides, the spoiler (3) is internally provided with a stacking assembly for forming a complex flow channel, the stacking assembly comprises a plurality of uniformly distributed T-shaped spoiler blocks (31), one side of the T-shaped spoiler block (31) is fixedly connected to one side of the spoiler (3), the cover plate (2) is internally provided with a circular hole (21) on the left and right sides, the bottom of the joint (1) is slidably connected inside the circular hole (21), the top side of the base body (4) is internally provided with a step (41), the outer periphery of the cover plate (2) is slidably connected inside the step (41), the base body (4) is internally provided with a cavity (42), and the outer periphery of the spoiler (3) is slidably connected inside the cavity (42).

2. The micro heat spreader structure of claim 1, wherein: The base body (4) is internally provided with a plurality of uniformly distributed spoilers (3), the top of the base body (4) is provided with a cover plate (2), the top of the cover plate (2) is provided with a joint (1) on the left and right sides, the spoiler (3) is internally provided with a stacking assembly for forming a complex flow channel, the stacking assembly comprises a plurality of uniformly distributed T-shaped spoiler blocks (31), one side of the T-shaped spoiler block (31) is fixedly connected to one side of the spoiler (3), the cover plate (2) is internally provided with a circular hole (21) on the left and right sides, the bottom of the joint (1) is slidably connected inside the circular hole (21), the top side of the base body (4) is internally provided with a step (41), the outer periphery of the cover plate (2) is slidably connected inside the step (41), the base body (4) is internally provided with a cavity (42), and the outer periphery of the spoiler (3) is slidably connected inside the cavity (42).

3. The micro heat spreader structure of claim 2, wherein: The spoiler (3) is fixedly connected on one side with a plurality of uniformly distributed guide holes (32), and the guide holes (32) are slidably connected outside the guide columns (43).

4. The micro heat spreader structure of claim 1, wherein: The outer periphery of the joint (1) is fixedly connected with a plurality of uniformly distributed mounting holes (44).

Images