Transistor shaping mechanism and shaping equipment

Abstract

The utility model provides a transistor shaping mechanism and shaping equipment, the transistor shaping mechanism comprises a machine body, a first driving assembly, an installation fixing plate and a shaping mold, and the first driving assembly is used for being installed on the machine body; the installation fixing plate is used for being installed on a machine body, the power output end of the first driving assembly is connected to the installation fixing plate, the installation fixing plate is provided with a positioning groove, the positioning groove is used for being installed on a transistor, the shaping die is provided with a via hole and a rounding cavity, the via hole is communicated with the rounding cavity, and the transistor of the positioning groove penetrates through the positioning groove and slides in the rounding cavity. The end part of the transistor is propped against the full circle cavity; the transistor is arranged in the full-circle cavity of the shaping mold, and the end part of the transistor is propped against the inner wall of the full-circle cavity, so that the contact surface of the end part of the transistor has higher roundness due to pressure between the contact surface and the full-circle cavity; the cylinder at the end part of the transistor is more matched with the mounting hole on the equipment, so that the mounting process of the transistor on the equipment is simplified.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of automation, and in particular to a transistor shaping mechanism and a shaping device. BACKGROUND

[0002] At present, with the continuous development of industry, integrated large equipment is needed in various fields, and some large equipment must be equipped with 3DVC transistors to improve the performance of the equipment. At the same time, 3DVC transistors are also needed in high-performance computers to improve the performance of the machine. For this reason, 3DVC transistors have been widely favored in the market in recent years.

[0003] However, in the process of making 3DVC transistors, the bottom plate and the upper plate need to be pressed together, and then copper powder and a heat pipe are combined for sintering, and then the heat pipe is welded using a sintering furnace, and finally a 3DVC transistor is formed. However, after the 3DVC transistor is subjected to the furnace, the 3DVC transistor that comes out may have uneven sintering, which can cause the cylinder at the end of the transistor to be not round enough, and thus when the 3DVC is installed on the equipment in the subsequent process, because the mounting hole of the mounting plate does not match the cylinder at the end of the transistor, it is difficult to install, which affects the overall performance and stability of the equipment, thereby affecting the installation process of the equipment and the work efficiency of the installation. CONTENT OF THE UTILITY MODEL

[0004] The purpose of the present disclosure is to overcome the shortcomings in the prior art, and to provide a transistor shaping mechanism and a shaping device that can improve the roundness of the end of the transistor, and thus make the transistor more convenient and fast to install.

[0005] The purpose of the present disclosure is achieved by the following technical solutions:

[0006] A transistor shaping mechanism, comprising a body, a first driving assembly, a mounting fixed plate, and a shaping die, wherein the first driving assembly is used to be installed on the body;

[0007] The mounting fixed plate is used to be installed on the body, the power output end of the first driving assembly is connected to the mounting fixed plate, and the first driving assembly is used to drive the mounting fixed plate to move towards the shaping die; the mounting fixed plate is provided with a positioning groove, and the positioning groove is used to install a transistor; the shaping die is fixed on the body, and the shaping die is provided with a through hole and a rounding cavity, and the through hole is in communication with the rounding cavity; when the mounting fixed plate moves towards the shaping die to a first predetermined position, the abutting end of the transistor moves into the through hole; when the mounting fixed plate moves towards the shaping die to a second predetermined position, the abutting end of the transistor passes through the through hole and slides in the rounding cavity, and abuts against the peripheral wall of the rounding cavity.

[0008] In one of the embodiments, the shaping mold is provided with a first shaping surface, the first shaping surface is arranged adjacent to the mounting fixed plate, and the through hole is arranged on the first shaping surface.

[0009] In one of the embodiments, a plurality of through holes are arranged on the first shaping surface in a spaced manner, each of the transistors passes through each of the through holes and slides in the circular cavity.

[0010] In one of the embodiments, the shaping mold is further provided with a second shaping surface, the first shaping surface is arranged opposite to the second shaping surface, and the circular cavity penetrates through the first shaping surface and the second shaping surface.

[0011] In one of the embodiments, the mounting fixed plate is provided with a notch near the side wall of the first driving assembly, and the power output end of the first driving assembly is connected to the mounting fixed plate through the notch.

[0012] In one of the embodiments, the first driving assembly includes a first driving cylinder and a first pushing rod, the first pushing rod is connected to the mounting fixed plate through the notch, the first driving cylinder is arranged on the machine body, and the first driving cylinder drives the first pushing rod to move along the direction of the first shaping surface.

[0013] In one of the embodiments, the transistor shaping mechanism further includes a shaping tube and a moving plate, one end of the shaping tube is connected to the end face of the moving plate, the other end of the shaping tube penetrates through the circular cavity through the second shaping surface, and one end of the transistor arranged in the positioning groove penetrates through the circular cavity and abuts against one end of the shaping tube.

[0014] In one of the embodiments, the transistor shaping mechanism further includes a second driving assembly, the second driving assembly includes a second driving cylinder and a second pushing rod, the second driving cylinder is arranged on the machine body, the second pushing rod is connected to the side wall of the moving plate, and the second driving cylinder acts on the pushing rod to drive the power output end of the pushing rod to move the moving plate towards the second shaping surface.

[0015] A shaping device includes the transistor shaping mechanism of any one of the above embodiments.

[0016] Compared with the prior art, the present disclosure has at least the following advantages:

[0017] The first drive assembly drives the mounting fixed plate to move towards the shaping mold by connecting the power output end of the first drive assembly to the mounting fixed plate, and the shaping mold is welded to the machine body, the mounting fixed plate is provided with a positioning groove, the positioning groove is used for mounting the transistor, so that the transistor can be arranged on the mounting fixed plate through the positioning groove, and a through hole and a rounding cavity are arranged in the side wall of the shaping mold close to the mounting fixed plate and are communicated with each other. When the first drive assembly drives the mounting fixed plate to move close to the shaping mold, the transistor mounted on the mounting fixed plate is driven to move, so that the mounting fixed plate drives the transistor to move to the first predetermined position of the shaping mold, and when the transistor moves to the first predetermined position, the abutting end of the transistor moves into the through hole. When the transistor reaches the first predetermined position, the first drive assembly continues to drive the transistor on the mounting fixed plate to slide in the rounding cavity, so that the transistor reaches the second predetermined position. When the transistor reaches the second predetermined position, the transistor in the rounding cavity abuts against the inner wall of the rounding cavity. In the process of sliding in the rounding cavity, the end of the transistor abuts against the inner wall of the rounding cavity, so that the abutting end of the transistor is more rounded, and then when the transistor is installed on the equipment in the subsequent process, because the cylinder of the abutting end of the transistor is more matched with the mounting hole on the equipment, the installation process of the transistor on the equipment is simplified, and the situation that the transistor cannot be installed on the mounting hole of the equipment due to the insufficient rounding of the cylinder of the end of the transistor is avoided. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some of the embodiments of the present disclosure, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0019] Figure 1 The structure diagram of the transistor shaping mechanism of an embodiment of the present disclosure;

[0020] Figure 2 The sectional view of the transistor shaping mechanism of an embodiment of the present disclosure;

[0021] Figure 3 The structure diagram of the transistor shaping mechanism of an embodiment of the present disclosure; Figure 2 The local enlarged view shown in A in FIG. 4.

[0022] Reference numerals: 10, transistor shaping mechanism; 100, body; 200, first drive assembly; 210, first drive cylinder; 220, first push rod; 300, mounting plate; 310, positioning groove; 320, notch; 400, shaping mold; 410, first shaping surface; 420, through hole; 430, rounding cavity; 440, second shaping surface; 500, transistor; 600, shaping tube; 700, moving plate; 800, second drive assembly; 810, second drive cylinder; 820, second push rod. Detailed Implementation

[0023] To facilitate understanding of this disclosure, a more complete description will be given below with reference to the accompanying drawings, which illustrate preferred embodiments of the present disclosure. However, this disclosure can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure.

[0024] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0026] To better understand the technical solutions and beneficial effects of this disclosure, the following detailed description is provided in conjunction with specific embodiments:

[0027] like Figures 1 to 3 As shown, a transistor shaping mechanism 10 of one embodiment includes a body 100, a first driving component 200, a mounting plate 300, and a shaping mold 400; the first driving component 200 is used to be mounted on the body 100.

[0028] In the embodiment, the mounting fixed plate 300 is used to be mounted on the machine body 100, the power output end of the first driving assembly 200 is connected to the mounting fixed plate 300, and the first driving assembly 200 is used to drive the mounting fixed plate 300 to move towards the shaping mold 400; the mounting fixed plate 300 is provided with a positioning groove 310, and the positioning groove 310 is used to mount the transistor 500; the shaping mold 400 is fixed on the machine body 100, the shaping mold 400 is provided with a through hole 420 and a rounding cavity 430, and the through hole 420 and the rounding cavity 430 are in communication; when the mounting fixed plate 300 moves to the first predetermined position towards the shaping mold 400, the abutting end of the transistor 500 moves into the through hole 420; when the mounting fixed plate 300 moves to the second predetermined position towards the shaping mold 400, the abutting end of the transistor 500 passes through the through hole 420 and slides in the rounding cavity 430, and abuts against the peripheral wall of the rounding cavity 430.

[0029] It can be understood that, by mounting the mounting fixed plate 300 on the machine body 100, and connecting the power output end of the first driving assembly 200 to the mounting fixed plate 300, the first driving assembly 200 drives the mounting fixed plate 300 to move towards the shaping mold 400; the shaping mold 400 is welded on the machine body 100, the mounting fixed plate 300 is provided with a positioning groove 310, and the positioning groove 310 is used to mount the transistor 500, so that the transistor 500 can be arranged on the mounting fixed plate 300 through the positioning groove 310, and the side wall of the shaping mold 400 close to the mounting fixed plate 300 is provided with a through hole 420 and a rounding cavity 430 in communication; when the first driving assembly 200 drives the mounting fixed plate 300 to move close to the shaping mold 400, the transistor 500 mounted on the mounting fixed plate 300 is driven to move, so that the mounting fixed plate 300 drives the transistor 500 to move to the first predetermined position of the shaping mold 400, and when moving to the first predetermined position, the abutting end of the transistor 500 moves into the through hole 420; when the transistor 500 reaches the first predetermined position, the first driving assembly 200 continues to drive the transistor 500 on the mounting fixed plate 300 to slide in the rounding cavity 430, so that the transistor 500 reaches the second predetermined position; when the transistor 500 reaches the second predetermined position, the transistor 500 in the rounding cavity 430 abuts against the inner wall of the rounding cavity 430, and in the process of sliding in the rounding cavity 430, the end of the transistor 500 abuts against the inner wall of the rounding cavity 430, so that the abutting end of the transistor 500 is more rounded, thereby simplifying the installation process of the transistor 500 on the equipment, and avoiding the case that the transistor 500 cannot be installed on the mounting hole of the equipment because the end of the transistor 500 is not rounded enough.

[0030] In combination Figure 1 With Figure 2 As shown, further, the shaping mold 400 is provided with a first shaping surface 410, the first shaping surface 410 is provided adjacent to the mounting fixed plate 300, and the via hole 420 is provided on the first shaping surface 410. It can be understood that when the first shaping mold 400 is provided with the first shaping surface 410, and the first shaping surface 410 is provided adjacent to the mounting fixed plate 300, when the first driving assembly 200 drives the mounting fixed plate 300 to approach the first shaping surface 410, the transistor 500 located on the mounting fixed plate 300 will pass through the via hole 420 provided on the first shaping surface 410 and slide into the whole cavity 430. In a specific embodiment, the bottom of the whole cavity 430 is provided with a pressure sensor, which can monitor the contact pressure between the end of the transistor 500 and the cavity wall in real time. When the detected pressure value exceeds the preset threshold value, the first driving assembly 200 automatically triggers a reverse rollback action to prevent overpressure from causing plastic deformation of the transistor 500.

[0031] In combination Figure 1 With Figure 2 As shown, in one embodiment, a plurality of via holes 420 are provided on the first shaping surface 410, and each transistor 500 corresponds to each via hole 420 and slides in the whole cavity 430. It can be understood that when the first shaping surface 410 is provided with a plurality of via holes 420, and each via hole 420 is provided on the first shaping surface 410, when the first driving assembly 200 drives the transistor 500 to approach the first shaping surface 410, the crystal column of the transistor 500 will pass through the via hole 420 provided on the first shaping surface 410, and then the crystal column will slide in the whole cavity 430 through the via hole 420.

[0032] In combination Figure 2 With Figure 3 As shown, in one embodiment, the shaping mold 400 is further provided with a second shaping surface 440, the first shaping surface 410 and the second shaping surface 440 are oppositely arranged, and the whole cavity 430 penetrates the first shaping surface 410 and the second shaping surface 440. It can be understood that the second shaping surface 440 is arranged on the side surface of the shaping mold 400, the first shaping surface 410 and the second shaping surface 440 are oppositely arranged, the whole cavity 430 penetrates the first shaping surface 410 and the second shaping surface 440, and the second shaping surface 440 is provided with a second via hole 420. The shaping tube 600 can be arranged in the whole cavity 430 through the second via hole 420, and the end of the shaping tube 600 is controlled to change the circular area, so that when the end of the transistor 500 and the shaping tube 600 is pushed, the end of the transistor 500 can reach the required roundness when it is mounted on the device.

[0033] Combination Figure 1 and Figure 2 As shown, in one embodiment, the mounting plate 300 has a notch 320 on its side wall near the first drive assembly 200, and the power output end of the first drive assembly 200 is connected to the mounting plate 300 through the notch 320. It can be understood that the notch 320 on the side wall of the mounting plate 300 near the first drive assembly 200, and the connection of the power output end of the first drive assembly 200 to the mounting plate 300 through the notch 320, allows the power output end of the first drive assembly 200 to drive the mounting plate 300 to move towards the first shaping surface 410. The mounting plate 300 also has a positioning groove 310, on which the transistor 500 is mounted, allowing the transistor 500 to move towards the first shaping surface 410 along with the mounting plate 300, and ultimately slide through the through hole 420 of the first shaping surface 410 into the circular cavity 430.

[0034] Combination Figure 1 and Figure 3 As shown, in one embodiment, the first driving assembly 200 includes a first driving cylinder 210 and a first push rod 220. The first push rod 220 passes through the recess 320 and is connected to the mounting plate 300. The first driving cylinder 210 is used to mount the body 100, and the first driving cylinder 210 drives the first push rod 220 to move along the direction of the first shaping surface 410. It can be understood that by passing the first push rod 220 through the recess 320 and connecting it to the mounting plate 300, and simultaneously welding the first driving cylinder 210 to the body 100, when the first driving cylinder 210 is activated, because the power output end of the first driving cylinder 210 is connected to the first push rod 220, the first push rod 220 acts on the recess 320 of the mounting plate 300, thereby causing the mounting plate 300 to move closer to the first shaping surface 410, and further causing the transistor 500 to pass through the circular cavity 430.

[0035] Combination Figure 1 and Figure 3As shown, in one of the embodiments, the transistor shaping mechanism 10 further comprises a shaping tube 600 and a moving plate 700, one end of the shaping tube 600 is connected to the end face of the moving plate 700, the other end of the shaping tube 600 is arranged in the rounding cavity 430 through the second shaping surface 440, and one end of the transistor 500 arranged in the positioning groove 310 passes through the rounding cavity 430 and abuts against one end of the shaping tube 600. It can be understood that one end of the shaping tube 600 is connected to the end face of the moving plate 700, the other end of the shaping tube 600 is arranged in the rounding cavity 430 through the through hole 420 of the second shaping surface 440, different specifications of the shaping tube 600 can be replaced to satisfy that the transistor 500 abuts against different specifications of the shaping tube 600, so that the end of the transistor 500 reaches different rounding degrees.

[0036] In combination Figure 1 With Figure 3 As shown, in one of the embodiments, the transistor shaping mechanism 10 further comprises a second driving assembly 800, the second driving assembly 800 comprises a second driving cylinder 810 and a second pushing rod 820, the second driving cylinder 810 is used to be installed on the body 100, the second pushing rod 820 is connected to the side wall of the moving plate 700, and the second driving cylinder 810 acts on the pushing rod to drive the power output end of the second pushing rod 820 to move the moving plate 700 towards the second shaping surface 440. It can be understood that the second driving cylinder 810 is welded on the body 100, the output end of the second driving cylinder 810 is connected to the second pushing rod 820, the shaping tube 600 is installed on the moving plate 700, when the power output end of the second driving cylinder 810 drives the second pushing rod 820 to move, and the second pushing rod 820 is connected to the moving plate 700, the pushing rod drives the moving plate 700 to move towards the second shaping surface 440, at the same time, the shaping tube 600 is installed on the end face of the moving plate 700, and then the shaping tube 600 is arranged in the rounding cavity 430 through the second shaping surface 440.

[0037] The application also provides a shaping device comprising the transistor shaping mechanism 10 of any of the above embodiments. It can be understood that by arranging the transistor 500 in the rounding cavity 430 of the shaping mold 400, and abutting the end of the transistor 500 against the inner wall of the rounding cavity 430, the contact surface of the end of the transistor 500 has more rounding due to the pressure of the rounding cavity 430, and then when the transistor 500 is installed on the device subsequently, the cylinder of the end of the transistor 500 matches the mounting hole of the device better, so as to simplify the installation process of the transistor 500 on the device.

[0038] Compared with the prior art, the present disclosure has at least the following advantages:

[0039] The first drive assembly 200 drives the mounting fixed plate 300 to move towards the shaping die 400, and the shaping die 400 is welded on the body 100; the mounting fixed plate 300 is provided with a positioning groove 310, the positioning groove 310 is used for mounting the transistor 500, so that the transistor 500 can be arranged on the mounting fixed plate 300 through the positioning groove 310, and a through hole 420 and a rounding cavity 430 are arranged in the side wall of the shaping die 400 close to the mounting fixed plate 300; when the first drive assembly 200 drives the mounting fixed plate 300 to move close to the shaping die 400, the transistor 500 mounted on the mounting fixed plate 300 is driven to move, so that the mounting fixed plate 300 drives the transistor 500 to move to the shaping die 400 to a first predetermined position; when moving to the first predetermined position, the abutting end of the transistor 500 moves into the through hole 420; when the transistor 500 reaches the first predetermined position, the first drive assembly 200 continues to drive the transistor 500 on the mounting fixed plate 300 to slide in the rounding cavity 430, so that the transistor 500 reaches a second predetermined position; when the transistor 500 reaches the second predetermined position, the transistor 500 in the rounding cavity 430 abuts against the inner wall of the rounding cavity 430; in the process of sliding in the rounding cavity 430, the end of the transistor 500 abuts against the inner wall of the rounding cavity 430, so that the abutting end of the transistor 500 is more rounded, thereby simplifying the installation process of the transistor 500 on the equipment, and avoiding the situation that the transistor 500 cannot be installed on the mounting hole of the equipment because the cylinder of the end of the transistor 500 is not rounded enough.

[0040] The above-described embodiments only express several embodiments of the present disclosure, and the description is more specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present disclosure, several modifications and improvements can be made, which belong to the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure patent should be subject to the appended claims.

Claims

1. A transistor shaping mechanism, characterized by, The transistor shaping mechanism comprises a machine body, a first driving assembly, a mounting fixed plate and a shaping mold. The mounting fixed plate is mounted on the machine body, and a power output end of the first driving assembly is connected to the mounting fixed plate.

2. The transistor shaping mechanism according to claim 1, characterized by The first driving assembly drives the mounting fixed plate to move towards the shaping mold.

3. The transistor shaping mechanism according to claim 2, wherein The mounting fixed plate is provided with a positioning groove for mounting a transistor.

4. The transistor shaping mechanism of claim 2, wherein, The shaping mold is fixed on the machine body and is provided with a through hole and a rounding cavity.

5. The transistor shaping mechanism of claim 2, wherein, When the mounting fixed plate moves to a first predetermined position, the abutting end of the transistor moves into the through hole.

6. The transistor shaping mechanism according to claim 5, wherein When the mounting fixed plate moves to a second predetermined position, the abutting end of the transistor passes through the through hole and slides in the rounding cavity and abuts against the peripheral wall of the rounding cavity.

7. The transistor shaping mechanism of claim 3, wherein, The shaping mold is provided with a first shaping surface adjacent to the mounting fixed plate.

8. The transistor shaping mechanism according to claim 7, wherein A plurality of through holes are arranged on the first shaping surface.

9. A shaping apparatus characterized by comprising: Each transistor passes through each through hole and slides in the rounding cavity. The shaping mold is further provided with a second shaping surface opposite to the first shaping surface. The mounting fixed plate is provided with a notch on the side wall close to the first driving assembly. The power output end of the first driving assembly is connected to the mounting fixed plate through the notch. The first driving assembly comprises a first driving cylinder and a first pushing rod. The first pushing rod is connected to the mounting fixed plate through the notch. The first driving cylinder is mounted on the machine body and drives the first pushing rod to move along the first shaping surface. The transistor shaping mechanism further comprises a shaping tube and a moving plate. One end of the shaping tube is connected to the end face of the moving plate. The other end of the shaping tube passes through the rounding cavity through the second shaping surface. One end of the transistor arranged in the positioning groove passes through the rounding cavity and abuts against one end of the shaping tube. The transistor shaping mechanism further comprises a second driving assembly. The second driving assembly comprises a second driving cylinder and a second pushing rod. The second driving cylinder is mounted on the machine body. The second pushing rod is connected to the side wall of the moving plate. The second driving cylinder acts on the pushing rod to drive the power output end of the pushing rod to move the moving plate towards the second shaping surface. The transistor shaping mechanism comprises any one of claims 1 to 8.

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