Vapor deposition device for silicon-carbon negative electrode

Abstract

The utility model discloses a vapor deposition device for a silicon-carbon negative electrode. The vapor deposition device comprises a base, the deposition tank is arranged at the top of the base; the tank cover is arranged on one side of the deposition tank; the cooling assembly is arranged in the deposition tank; the conveying assembly is arranged at one end of the deposition tank; the conveying assembly comprises a gas box; the outer wall of the gas box is fixedly connected with a gas inlet pipe; and the top of the gas box is fixedly connected with a motor. According to the silicon-carbon negative electrode vapor deposition device, the two gas inlet pipes are arranged outside the gas box, two groups of gas can be conveyed into the gas inlet pipes, and a motor can be started to drive a rotating rod to rotate, so that the rotating rod can drive a stirring plate to rotate; the stirring plate can uniformly mix and stir gas in the gas box, so that two groups of gas can be conveyed into the deposition tank through the connecting pipe to react, the daily use requirements of people are met, and the deposition effect is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to silicon carbon negative electrode vapor deposition technical field, concretely is a kind of silicon carbon negative electrode vapor deposition device. BACKGROUND

[0002] Silicon carbon negative electrode vapor deposition device is the key equipment for preparing silicon carbon negative electrode material, mainly through chemical vapor deposition technology realizes the deposition and coating of silicon atom on the surface of carbon material, silicon carbon negative electrode vapor deposition device is mainly applied to the preparation of silicon carbon negative electrode material, suitable for lithium ion battery, electric vehicle, energy storage system and other fields, with the continuous expansion of lithium ion battery market and the continuous progress of technology, the application prospect of silicon carbon negative electrode vapor deposition device will be more broad, silicon carbon negative electrode vapor deposition device is the key equipment for preparing high-performance silicon carbon negative electrode material, has broad application prospect and development potential, with the continuous progress of technology and the continuous expansion of market, silicon carbon negative electrode vapor deposition device will play an increasingly important role.

[0003] The silicon carbon negative electrode vapor deposition device in the prior art cannot ensure that the gases can be fully mixed when multiple gases are delivered together, and if the mixing effect is poor, the gas composition will be unevenly distributed in the reaction area, affecting the deposition effect, and the uneven gas will cause the quality of the deposition layer to be unstable, which may cause problems such as uneven thickness and composition segregation, thereby affecting the electrochemical properties of the silicon carbon negative electrode, therefore, we need a silicon carbon negative electrode vapor deposition device. UTILITY MODEL CONTENT

[0004] The utility model aims at providing a kind of silicon carbon negative electrode vapor deposition device to solve the existing problems in the above background art.

[0005] To achieve the above object, the utility model provides the following technical scheme: a kind of silicon carbon negative electrode vapor deposition device, including base;Deposition tank is located at the top of the base;Tank cover is located at the one side of the deposition tank;Cooling assembly is located in the inside of the deposition tank;Conveying assembly is located at one end of the deposition tank;The conveying assembly includes gas tank;The outer wall of the gas tank is fixedly connected with inlet pipe;The top of the gas tank is fixedly connected with motor, and the output shaft of the motor is fixedly connected with rotating rod through coupling;The outer wall of the rotating rod is fixedly connected with stirring plate;The bottom of the gas tank is fixedly connected with connecting pipe;Multiple carbon bodies are located in the inside of the deposition tank.

[0006] Preferably, the cooling assembly includes a cold water pipe, the outer wall of the deposition tank is fixedly connected with a hot water pipe, and a cooling groove is formed in the inside of the deposition tank.

[0007] Preferably, the deposition tank is provided with a cold water pipe and a hot water pipe, and the cold water pipe and the hot water pipe are respectively arranged on the two sides of the outer wall of the deposition tank.

[0008] Preferably, the cold water pipe and the hot water pipe form a fixed structure with the deposition tank, and the cold water pipe and the hot water pipe extend into the cooling groove of the deposition tank for fixation.

[0009] Preferably, the gas inlet pipe on the gas tank forms a fixed structure, and the number of the gas inlet pipe is two, and the two gas inlet pipes are symmetrically arranged with the median line of the gas tank as the axis of symmetry.

[0010] Preferably, the motor forms a rotating structure with the rotating rod and the stirring plate, and the number of the stirring plate is multiple, and the multiple stirring plates are fixed at equal distances on the outer wall of the rotating rod.

[0011] Preferably, the gas tank forms a fixed structure with the deposition tank through the connecting pipe, and the connecting pipe is arranged between the gas tank and the deposition tank.

[0012] Compared with the prior art, the beneficial effects of the silicon-carbon negative electrode vapor deposition device are as follows:

[0013] (1) By arranging two gas inlet pipes outside the gas tank, two groups of gas can be transported into the gas tank, and by starting the motor, the motor can drive the rotating rod to rotate, the rotating rod can drive the stirring plate to rotate, and the stirring plate can uniformly mix and stir the gas in the gas tank, so that the two groups of gas can be transported into the deposition tank through the connecting pipe for reaction, meeting the daily use needs of people and improving the deposition effect.

[0014] (2) The deposition tank can heat the gas inside, and at high temperature, the silicon-containing gas raw material can be cracked into silicon and hydrogen, and the silicon atoms can be deposited in the porous carbon pore channel to form nanosilicon. After deposition, the external cooling agent can be transported by starting the external cooling agent through the cold water pipe, so that the cooling agent can flow into the cooling groove to absorb heat, and be transported into the hot water pipe for discharge, thereby improving the need for cooling the heat in the deposition tank, and facilitating the opening of the tank cover to take out the porous carbon body. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a schematic diagram of the main structure of the utility model;

[0016] Figure 2 It is a schematic diagram of the deposition tank and the connecting pipe structure of the utility model;

[0017] Figure 3 It is a schematic diagram of the rotating rod and the stirring plate structure of the utility model;

[0018] Figure 4 It is a schematic diagram of the deposition tank and the cooling groove structure of the utility model.

[0019] In the figure: 1, base; 2, deposition tank; 3, tank cover; 4, cooling assembly; 401, cold water pipe; 402, hot water pipe; 403, cooling tank; 5, conveying assembly; 501, gas tank; 502, gas inlet pipe; 503, motor; 504, rotating rod; 505, stirring plate; 506, connecting pipe; 6, porous carbon body. DETAILED DESCRIPTION

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used in the description herein is for describing particular embodiments only and is not intended to be limiting of the application; the present application will be described with reference to the drawings in which is shown by way of illustration various embodiments of the application. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The use of the terms "including," "comprising," or "having" and variations thereof herein is intended to be broad and encompass the terms "consisting of" and "consisting essentially of," and variations thereof. The use of the terms "first," "second," and the like does not imply a limitation on the number of objects that can comprise the elements, but rather the order in which the objects are described.

[0021] Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase that in various places in the specification are not necessarily all referring to the same embodiment, nor are they necessarily mutually exclusive of one another. As will be apparent to those of ordinary skill in the art, embodiments described herein can be combined with other embodiments.

[0022] The utility model discloses a kind of silicon-carbon negative electrode vapor deposition devices, as shown in Figure 1 、 Figure 2 、 Figure 3 And Figure 4 As shown, including base 1;Deposition tank 2 is located at the top of base 1;Tank cover 3 is located at one side of deposition tank 2;Cooling assembly 4 is located in the inside of deposition tank 2;Cooling assembly 4 includes cold water pipe 401, the outer wall of deposition tank 2 is fixedly connected with hot water pipe 402, and cooling tank 403 is arranged in the inside of deposition tank 2;Conveying assembly 5 is located at one end of deposition tank 2;Conveying assembly 5 includes gas tank 501;The outer wall of gas tank 501 is fixedly connected with gas inlet pipe 502;Motor 503 is fixedly connected at the top of gas tank 501, and the output shaft of motor 503 is fixedly connected with rotating rod 504 through coupling;The outer wall of rotating rod 504 is fixedly connected with stirring plate 505;The bottom of gas tank 501 is fixedly connected with connecting pipe 506;Porous carbon body 6 is located in the inside of deposition tank 2.

[0023] Specifically, in the embodiment, the scheme mainly comprises the following steps: two gas inlet pipes 502 are arranged outside the gas tank 501, two groups of gas are delivered into the gas tank 501, the motor 503 is started, the motor 503 drives the rotating rod 504 to rotate, the rotating rod 504 drives the stirring plate 505 to rotate, the stirring plate 505 uniformly mixes and stirs the gas in the gas tank 501, and then the two groups of gas are delivered into the deposition tank 2 through the connecting pipe 506 to react, thereby meeting the daily use requirement of people and improving the deposition effect.

[0024] As shown in Figure 1 , Figure 2 , Figure 3 and Figure 4 in the further preferred embodiment of the utility model, the deposition tank 2 is provided with a cold water pipe 401 and a hot water pipe 402, the cold water pipe 401 and the hot water pipe 402 are arranged on the two sides of the outer wall of the deposition tank 2 respectively, the cold water pipe 401 and the hot water pipe 402 constitute a fixed structure through the deposition tank 2, and the cold water pipe 401 and the hot water pipe 402 extend into the cooling groove 403 of the deposition tank 2 respectively for fixation.

[0025] In the embodiment, the arrangement of the cold water pipe 401 and the hot water pipe 402 is facilitated, the fixing effect of the deposition tank 2 and the cold water pipe 401 and the hot water pipe 402 is improved, the coolant can be delivered by the cold water pipe 401, the coolant delivered into the cooling groove 403 of the deposition tank 2 can be heat-absorbed, the heat-absorbed coolant can be discharged by the hot water pipe 402, and the cooling effect of the deposition tank 2 is improved.

[0026] As shown in Figure 1 , Figure 2 , Figure 3 and Figure 4 in the further preferred embodiment of the utility model, the gas inlet pipe 502 on the gas tank 501 constitutes a fixed structure, the number of the gas inlet pipe 502 is two, and the two gas inlet pipes 502 are symmetrically arranged with the vertical line of the gas tank 501 as the axis of symmetry.

[0027] In the embodiment, the connection effect of the gas tank 501 and the gas inlet pipe 502 is improved, and the two gas inlet pipes 502 can deliver two kinds of gas into the gas tank 501 for mixing.

[0028] As shown in Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, the motor 503 and the stirring plate 505 constitute a rotating structure through the rotating rod 504, and the number of the stirring plates 505 is multiple, and the multiple stirring plates 505 are fixed at the outer wall of the rotating rod 504 at equal distances.

[0029] In the embodiment, the motor 503 can drive the rotating rod 504 to rotate, and the rotating rod 504 can drive the multiple stirring plates 505 to rotate, so that the stirring plates 505 can mix and process multiple gases.

[0030] In the further preferred embodiment of the utility model, as shown in Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the gas tank 501 and the deposition tank 2 constitute a fixed structure through the connecting pipe 506, and the connecting pipe 506 is arranged between the gas tank 501 and the deposition tank 2.

[0031] In the embodiment, the connection effect of the gas tank 501 and the connecting pipe 506 is strengthened, so that the gas in the gas tank 501 can be transported into the deposition tank 2 through the connecting pipe 506.

[0032] It should be noted that, for the foregoing embodiments, in order to simply describe, they are all expressed as a series of action combinations, but those skilled in the art should know that the utility model is not limited by the action sequence described, because according to the utility model, some steps can be performed in other sequences or simultaneously. Secondly, those skilled in the art should know that the embodiments described in the specification all belong to preferred embodiments, and the actions and modules involved are not necessarily necessary for the utility model.

[0033] In several embodiments provided by the present application, it should be understood that the disclosed device can be implemented by other ways. For example, the device embodiments described above are only schematic, and for example, the division of the above units can be different, for example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the display or discussion of the coupling or communication connection between the units can be indirect coupling or direct coupling or communication connection between the units, which can be electrical or other forms.

[0034] The units described as separate components can or can not be physically separate, and the components displayed as units can or can not be physical units, that is, they can be located in one place, or can be distributed on multiple network units. According to actual needs, some or all of the units can be selected to achieve the purpose of the embodiment scheme.

[0035] The above examples are only used to illustrate the technical solutions of the present application, and are not intended to limit the protection scope of the present application. Obviously, the described examples are only some of the embodiments of the present application, not all the embodiments. Based on these examples, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of the present application. Although the present application has been described in detail with reference to the above examples, those of ordinary skill in the art can still combine, add or delete the features in the embodiments of the present application according to the circumstances without creative labor, so as to obtain different other technical solutions which do not deviate from the concept of the present application in essence, and these technical solutions also fall within the scope of the present application.

Claims

1. A silicon-carbon negative electrode vapor deposition apparatus, characterized by: It includes base (1); Deposition tank (2) provided on the top of the base (1); Tank cover (3) provided on one side of the deposition tank (2); Cooling assembly (4) provided in the deposition tank (2); Conveying assembly (5) provided at one end of the deposition tank (2);The conveying assembly (5) includes gas tank (501);The outer wall of the gas tank (501) is fixedly connected with the air inlet pipe (502);The top of the gas tank (501) is fixedly connected with the motor (503);The output shaft of the motor (503) is fixedly connected with the rotating rod (504) through the shaft coupling;The outer wall of the rotating rod (504) is fixedly connected with the stirring plate (505);The bottom of the gas tank (501) is fixedly connected with the connecting pipe (506); The porous carbon body (6) is provided in the deposition tank (2).

2. The silicon-carbon negative electrode vapor deposition device of claim 1, wherein: The cooling assembly (4) includes a cold water pipe (401), and the outer wall of the deposition tank (2) is fixedly connected with a hot water pipe (402), and the inside of the deposition tank (2) is provided with a cooling groove (403).

3. The silicon-carbon negative electrode vapor deposition device of claim 2, wherein: The deposition tank (2) is provided with a cold water pipe (401) and a hot water pipe (402), and the cold water pipe (401) and the hot water pipe (402) are arranged on the outer wall of the deposition tank (2) respectively.

4. The silicon-carbon negative electrode vapor deposition device of claim 2, wherein: The cold water pipe (401) and the hot water pipe (402) constitute a fixed structure through the deposition tank (2), and the cold water pipe (401) and the hot water pipe (402) are respectively inserted into the cooling groove (403) of the deposition tank (2) for fixation.

5. The silicon-carbon negative electrode vapor deposition device of claim 1, wherein: The air inlet pipe (502) on the gas tank (501) constitutes a fixed structure, and the number of the air inlet pipe (502) is two, and the two air inlet pipes (502) are symmetrically arranged with the vertical line of the gas tank (501) as the axis of symmetry.

6. The silicon-carbon negative electrode vapor deposition device of claim 1, wherein: The motor (503) constitutes a rotating structure with the rotating rod (504) and the stirring plate (505), and the number of the stirring plate (505) is multiple, and the multiple stirring plates (505) are fixedly arranged on the outer wall of the rotating rod (504) at equal distances.

7. The silicon-carbon negative electrode vapor deposition device of claim 1, wherein: The gas tank (501) constitutes a fixed structure with the deposition tank (2) through the connecting pipe (506), and the connecting pipe (506) is arranged between the gas tank (501) and the deposition tank (2).

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