Surface liquid evaporation refrigeration device and consumer electronic product

By optimizing the heat conduction path through the design of the fan, heat sink, and water absorption component of the surface liquid evaporation cooling device, the problem of low efficiency of existing heat dissipation equipment is solved, achieving a high-efficiency, portable, and low-noise heat dissipation effect.

CN223755598UActive Publication Date: 2026-01-02GALAXY TRIBE (SHENZHEN) TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202520093422.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-01-15
Publication Date
2026-01-02
Estimated Expiration
2035-01-15

AI Technical Summary

Technical Problem

Existing heat dissipation devices such as electric fans and semiconductor heat sinks have low heat dissipation efficiency and poor portability in small electronic devices, and cannot meet the heat dissipation requirements of portability, high efficiency and low noise.

Method used

A surface liquid evaporation cooling device is adopted. Through the coordinated design of fan, heat sink and water absorption component, heat is removed by liquid evaporation. Combined with reasonable structural design and liquid evaporation principle, the heat conduction path is optimized and the evaporation rate is enhanced.

Benefits of technology

It achieves efficient heat dissipation, reduces energy consumption and noise, is compact and portable, has strong adaptability, is green and environmentally friendly, and reduces the cost of use.

✦ Generated by Eureka AI based on patent content.

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Abstract

The surface liquid evaporation refrigeration device comprises a shell, an inner container, a fan, a heat dissipation plate and a water absorption piece, an opening cavity is formed in the bottom of the shell, and a first through hole penetrating to the opening cavity is formed in the top of the shell; the inner container is provided with a second through hole penetrating through the two end walls, a water containing cavity annularly formed along the second through hole and a water conveying opening penetrating through the bottom of the inner container to the water containing cavity, the inner container is arranged in the open cavity, the fan is arranged in the second through hole, the second through hole is communicated with the first through hole, and the heat dissipation plate is arranged at the bottom of the shell. The water absorption piece is arranged on the surface of the side, close to the inner container, of the heat dissipation plate and connected with the water conveying opening. Through the synergistic effect of the fan, the heat dissipation plate and the water absorption piece, heat of the electronic equipment is transmitted to the water absorption piece through the heat dissipation plate, liquid is promoted to evaporate to generate water vapor, under the action of air flow of the fan, the liquid evaporation speed is increased, the water vapor discharges the heat to the outside through the through holes, and therefore the temperature of the equipment is rapidly reduced; efficient heat dissipation of the electronic equipment is realized.
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Description

TECHNICAL FIELD

[0001] The utility model relates to refrigeration device technical field especially, it is a surface liquid evaporation refrigeration device and consumer electronics product. BACKGROUND

[0002] With the wide application of mobile electronic devices, products such as smart phones, tablet computers and notebook computers have become indispensable tools in daily life and work. These devices provide great convenience for users due to their high performance, multi-functionality and portability. However, as the hardware performance of the device continues to improve, the heat generated during its operation also increases significantly, especially in high-load application scenarios such as gaming, video editing or long online meetings, the device's heat problem is increasingly apparent. In order to solve the problem of device heating, external or built-in heat dissipation auxiliary devices have emerged to ensure the normal operation of the device and prolong its service life.

[0003] Currently, common external heat dissipation devices include traditional electric fans and heat sinks based on semiconductor refrigeration technology. Electric fans remove heat from the surface of the device through air flow, with the characteristics of simple structure and low cost; while semiconductor heat sinks use the thermoelectric effect to conduct heat from one side to the other, and further diffuse heat to the surrounding environment by combining heat sinks and fans. These technologies have alleviated the problem of heat accumulation in electronic devices to some extent and have been applied in many scenarios.

[0004] However, existing heat dissipation solutions have many shortcomings. For example, electric fans have relatively low heat dissipation efficiency due to the low heat capacity of air and limited conduction efficiency, and the fan is bulky and has poor portability, making it difficult to adapt to small devices. Semiconductor heat sinks usually need to be used with heat sinks and fans, and the overall thickness usually reaches several centimeters or even tens of centimeters, making the appearance bulky and not very convenient to use, and requiring an external power supply to operate, resulting in high power consumption and high noise. In addition, the refrigeration efficiency of semiconductor refrigeration plates depends heavily on the heat dissipation effect of the heat dissipation surface. If the performance of the heat dissipation surface is insufficient, it will not only result in low efficiency, but also may exacerbate the overheating problem of the device due to heat backflow. Therefore, existing technology cannot fully meet the needs of small electronic devices and human body scenarios for portable, efficient and low-noise heat dissipation. SUMMARY

[0005] The utility model provides a kind of surface liquid evaporation refrigeration device, to solve the technical problems that the refrigeration device of existing heat dissipation efficiency is low, it is difficult to meet the technical problem of the rapid heat dissipation of electronic device.

[0006] In order to solve the above technical problems, the utility model provides a surface liquid evaporation refrigeration device, including shell, inner bag, fan, heat sink and water absorption spare, the shell bottom is equipped with opening cavity, and the shell top is equipped with first through -hole through to opening cavity, the inner bag is provided with the second through -hole who penetrates two end walls, along the second through -hole annularly equipped with water containing cavity and a plurality of water delivery ports who penetrate the inner bag bottom to water containing cavity, the inner bag sets up in opening cavity, the fan sets up in the second through -hole, the second through -hole is connected with first through -hole, the heat sink sets up in the shell bottom, the water absorption spare sets up in the heat sink one side surface close to the inner bag, and water absorption spare with water delivery port is connected.

[0007] Further, the inner bag bottom and the water absorption spare top are spaced to form an evaporation chamber, the shell is annularly provided with a plurality of heat dissipation holes penetrating into the evaporation chamber along the side wall, and the heat dissipation holes are uniformly arranged on the side wall of the shell.

[0008] Further, the water delivery port is provided with a water delivery element, one end of the water delivery element is arranged in the water containing cavity, the other end extends into the evaporation chamber through the water delivery port, and is connected with the water absorption element, for conveying the liquid in the water containing cavity to the water absorption element.

[0009] Further, the water delivery element includes a water delivery pipe and a flow guide column arranged in the water delivery pipe, one end of the water delivery pipe is fixed to the surface of the heat sink, the other end extends into the water containing cavity through the water delivery port, first and second notches are respectively arranged in the side wall of the water delivery pipe to the outer wall of the flow guide column, the first notch is located in the water containing cavity, and the second notch is located in the evaporation chamber and connected with the water absorption element.

[0010] Further, the outer diameter of the flow guide column is smaller than the pipe diameter of the water delivery pipe, and the length of the flow guide column is greater than or equal to the pipe length of the water delivery pipe.

[0011] Further, the flow guide column can be made of one or more of rubber material, glass fiber material, plastic fiber material or cotton fiber material.

[0012] Further, the first notch extends from the end of the water delivery pipe to the bottom of the water containing cavity.

[0013] Further, the heat sink is provided with an annular groove on one side close to the water absorption element, and a magnetic ring is embedded in the annular groove.

[0014] Further, the housing side wall is provided with a first water injection opening, the inner container side wall is provided with a second water injection opening penetrating to the water containing cavity, the first water injection opening corresponds to the second water injection opening, and a water injection opening plug is arranged on the first water injection opening to close the first water injection opening.

[0015] In another aspect, the utility model also provides a kind of consumer electronics, and using the surface liquid evaporation refrigeration device described above carries out heat dissipation.

[0016] Compared with prior art, the surface liquid evaporation refrigeration device provided by the utility model has the following beneficial effects:

[0017] The surface liquid evaporation refrigeration device provided by the utility model is characterized by the following: the fan, the heat dissipation plate and the water absorbing element are arranged in cooperation; when the device is used for auxiliary heat dissipation, the side provided with the heat dissipation plate is tightly attached to the surface of the electronic equipment needing heat dissipation; the water containing cavity in the inner container can deliver the internal liquid to the water absorbing element through the water delivery opening arranged at the bottom of the water containing cavity, so that the water absorbing element is kept wet; the heat generated by the electronic equipment is conducted to the water absorbing element through the heat dissipation plate, so that the liquid in the water absorbing element evaporates and generates water vapor; under the action of the airflow assisted by the fan, the evaporation speed of the liquid on the water absorbing element is significantly accelerated; under the further driving of the airflow, the water vapor can pass through the second through hole and the first through hole to efficiently discharge the heat of the heat dissipation plate to the outside, so that the temperature of the electronic equipment is rapidly reduced, and the purpose of heat dissipation is achieved; the phenomenon of reverse heat caused by the condensation of water vapor in the device is effectively avoided; the heat conduction path of the heat dissipation plate is optimized; the evaporation rate of the liquid is significantly enhanced through forced airflow circulation; and the refrigeration effect of the device is greatly improved. The device has the characteristics of energy saving, environmental protection and convenient maintenance by virtue of reasonable structure design and liquid evaporation refrigeration principle; only a small amount of liquid needs to be supplemented during use, the use cost is significantly reduced, the device is green and environmentally friendly, and the device has wide application value. In addition, the device is small, light, low in energy consumption and low in noise, and is convenient to carry and install, so that the device has strong adaptability.

[0018] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the utility model, and is not used to limit the scope of the utility model. Other features of the utility model will become easy to understand through the following description. BRIEF DESCRIPTION OF DRAWINGS

[0019] The accompanying drawings are used to better understand the scheme, and do not constitute a limitation on the utility model. Among them:

[0020] Figure 1 is a structure schematic view of the surface liquid evaporation refrigeration device provided by the utility model embodiment from one angle;

[0021] Figure 2is another angle structure schematic view of the surface liquid evaporation refrigeration device provided by the embodiment of the utility model;

[0022] Figure 3 is still another angle structure schematic view of the surface liquid evaporation refrigeration device provided by the embodiment of the utility model;

[0023] Figure 4 is the explosion structure schematic view of the surface liquid evaporation refrigeration device provided by the embodiment of the utility model;

[0024] Figure 5 is one angle structure schematic view of the inner container in the surface liquid evaporation refrigeration device provided by the embodiment of the utility model;

[0025] Figure 6 is Figure 5 the sectional view of the inner container A-A direction in the above;

[0026] Figure 7 is the partial sectional view of one angle of the inner container in the surface liquid evaporation refrigeration device provided by the embodiment of the utility model;

[0027] Figure 8 is Figure 7 the partial enlarged schematic view of B in the above;

[0028] Figure 9 is one angle structure schematic view of the shell in the surface liquid evaporation refrigeration device provided by the embodiment of the utility model;

[0029] Figure 10 is the structure schematic view of the water conveying part in the surface liquid evaporation refrigeration device provided by the embodiment of the utility model;

[0030] Figure 11 is the structure schematic view of the heat dissipation plate provided with the magnetic attraction ring in the surface liquid evaporation refrigeration device provided by the embodiment of the utility model;

[0031] Figure 12 is the structure schematic view of the general heat dissipation plate in the surface liquid evaporation refrigeration device provided by the embodiment of the utility model.

[0032] In the drawing, 10, shell;11, open cavity;12, first through hole;13, heat dissipation hole;14, first water inlet;15, water inlet plug;20, inner container;21, second through hole;22, water containing cavity;23, water conveying port;24, second water inlet;25, installation groove;26, waterproof cover;30, water conveying part;31, water conveying pipe;311, first notch;312, second notch;32, flow guide column;40, heat dissipation plate;41, annular groove;42, magnetic attraction ring;43, magnetic part;50, fan;60, water absorbing part;70, driving part;71, battery;72, circuit board;73, switch;74, indicator lamp. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the present application will be apparently and completely described below with reference to the drawings in the embodiments of the present application and the embodiments. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0034] In the description of the present application, it should be noted that, for the orientation words, such as the terms "middle", "upper", "lower", "inner", "outer" and the like, the indicated orientation and position relationship is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and cannot be understood as limiting the specific protection scope of the present application.

[0035] In addition, the terms "first", "second" are only used for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. Therefore, the "first", "second" features can be explicitly or implicitly included one or more features, and in the description of the present application, the meaning of "at least" is one or more, unless otherwise explicitly and specifically limited.

[0036] In the present application, unless otherwise explicitly specified and limited, the terms "assembly", "connection", "connection" should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can also be mechanically connected; it can be directly connected, or it can be connected through an intermediate medium; it can be connected between two elements. For those skilled in the art, the specific meaning of the above-mentioned terms in the present application can be understood according to the specific circumstances.

[0037] For example, the terms "first", "second" are only used for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. Therefore, the "first", "second" features can be explicitly or implicitly included one or more features, and in the description of the present application, the meaning of "at least" is one or more, unless otherwise explicitly and specifically limited. Figures 1-9The utility model discloses an embodiment provides a surface liquid evaporation refrigeration device, including shell 10, inner bag 20, fan 50, heat sink 40 and water absorption spare 60, the bottom of shell 10 is seted up opening cavity 11, and the top of shell 10 is seted up the first through -hole 12 that passes through to opening cavity 11, the second through -hole 21 that is set up in the both ends wall of inner bag 20 is penetrated, along the circumferential of second through -hole 21 seted up water -containing cavity 22 and the multiple water delivery port 23 that are penetrated inner bag 20 bottom to water -containing cavity 22, inner bag 20 sets up in opening cavity 11, fan 50 sets up in second through -hole 21, and second through -hole 21 is connected with first through -hole 12, and heat sink 40 sets up in the bottom of shell 10, and water absorption spare 60 sets up in the one side surface of heat sink 40 close to inner bag 20, and water absorption spare 60 is connected with water delivery port 23.

[0038] The utility model discloses an embodiment provides a surface liquid evaporation refrigeration device, including shell 10, inner bag 20, fan 50, heat sink 40 and water absorption spare 60, the bottom of shell 10 is seted up opening cavity 11, and the top of shell 10 is seted up the first through -hole 12 that passes through to opening cavity 11, the second through -hole 21 that is set up in the both ends wall of inner bag 20 is penetrated, along the circumferential of second through -hole 21 seted up water -containing cavity 22 and the multiple water delivery port 23 that are penetrated inner bag 20 bottom to water -containing cavity 22, inner bag 20 sets up in opening cavity 11, fan 50 sets up in second through -hole 21, and second through -hole 21 is connected with first through -hole 12, and heat sink 40 sets up in the bottom of shell 10, and water absorption spare 60 sets up in the one side surface of heat sink 40 close to inner bag 20, and water absorption spare 60 is connected with water delivery port 23.

[0039] The heat dissipation plate 40 is made of a material with good thermal conductivity, such as aluminum, copper, aluminum alloy, etc. The molecules of these materials are arranged in order. According to the law of heat conduction, heat always transfers from a higher temperature object to a lower temperature object. The heat dissipation plate 40 can effectively transfer the heat on the electronic device to the water absorption part 60 and other parts. In order to achieve the effect of rapid wetting and evaporation, the water absorption part 60 can be made of a material with strong water absorption, such as water absorption cotton, non-woven fabric, fiber material or capillary material. The liquid in the water absorption part 60 is evenly distributed by the capillary action of the water absorption cotton and effectively stores the liquid. When needed, the liquid can also be released in time to promote the evaporation process of the liquid. The water absorption part 60 is usually in the form of a sheet and is attached to the surface of the heat dissipation plate 40. The water absorption cotton is in close contact with the heat dissipation plate 40, which can more efficiently transfer the heat absorbed by the heat dissipation plate 40 to the water absorption part 60. In this way, the liquid in the water absorption part 60 is more easily absorbed by the heat conducted by the heat dissipation plate 40, thereby accelerating the evaporation of the liquid.

[0040] The shell 10 and the inner container 20 can be integrally formed, that is, directly manufactured as a whole component through injection molding, die casting or other processes. On the one hand, the integrally formed structure of the shell 10 and the inner container 20 can eliminate the connection points in the traditional design, reduce the possibility of loose connection, poor sealing and other problems, and avoid the loosening and leakage of the connection between the shell 10 and the inner container 20 due to factors such as material expansion, shrinkage or vibration under high temperature or long-term use, thereby effectively enhancing the overall stability and durability of the device. On the other hand, after the shell 10 and the inner container 20 are integrally formed, the joint or connection between the inner container 20 and the shell 10 is reduced or completely eliminated, thereby avoiding the problem of poor sealing or leakage that may be caused by the traditional connection between the inner container 20 and the shell 10. Especially in the liquid transfer system (such as the water containing cavity 22 and the water outlet 23), this structure design can effectively avoid liquid leakage and vapor overflow, thereby ensuring the sealing performance and normal operation of the device.

[0041] In addition, in order to improve the stability of the liquid transmission to the water absorption part 60 and ensure the reliable operation of the device under various use conditions, a plurality of water outlets 23 are distributed at the bottom of the water containing cavity 22. Even if the device is tilted at a large angle, the liquid in the water containing cavity 22 can still flow out through one or more of the water outlets 23 under the action of gravity, thereby avoiding the problem of water flow interruption of the water absorption part 60 due to the failure of a single water outlet 23 to supply water in time. At the same time, in different use environments (such as uneven placement surface, vibration conditions, etc.), the flow path of the liquid in the water containing cavity 22 may change. The design of multiple water outlets 23 provides multiple flow paths for the liquid, and the multiple water outlets 23 can disperse the liquid flow pressure, thereby avoiding the problem of uneven flow rate or blockage caused by single-point water outlet. In this way, the liquid in the water containing cavity 22 can be more efficiently utilized, and the uniform wetting of the water absorption part 60 can be ensured, thereby improving the overall refrigeration effect.

[0042] It should be noted that liquid evaporation is an endothermic process, that is, liquid needs to absorb energy when it changes from liquid to gas. During the evaporation process, high-energy molecules on the surface of the liquid escape and take away heat, thereby reducing the temperature of the liquid. At this time, the liquid absorbs heat from the surrounding environment, usually through the heat transferred by the contact surface (such as the heat sink 40). The main reason for accelerating the evaporation and discharge of the liquid by the fan 50 is that the water vapor is not discharged in time, but stays inside or on the surface of the device, which will cool and condense into water droplets. The latent heat released during the condensation process will have a counteractive effect on the heat dissipation system, reducing the heat dissipation effect of the device, and even causing the temperature of the device to rise. By discharging the water vapor in time, the reverse heat phenomenon of the heat sink 40 can be effectively avoided, and the effect of rapid heat dissipation can be achieved.

[0043] As shown in Figures 1-4 In an optional embodiment of the present application, the inner container 20 is spaced apart from the top of the water absorbing element 60 to form an evaporation chamber, and the outer shell 10 is provided with a plurality of heat dissipation holes 13 extending to the evaporation chamber along the side wall. The heat dissipation holes 13 are uniformly arranged on the side wall of the outer shell 10.

[0044] Specifically, the inner container 20 is spaced apart from the top of the water absorbing element 60 to form an evaporation chamber, which provides sufficient flow space for the evaporation of the liquid, and the water vapor can be effectively released and avoided from accumulating. Through the effective water vapor release space, the airflow can flow smoothly, thereby enhancing the efficiency of the evaporation process and ensuring that the water vapor can quickly and effectively take away heat, achieving better heat dissipation effect of the electronic device. At the same time, cooperating with the plurality of heat dissipation holes 13 uniformly arranged on the side wall of the outer shell 10, the airflow circulation channel is increased, and the airflow can fully circulate between the evaporation chamber and the outside and take away the generated water vapor, enhancing the heat dissipation effect of the entire device and avoiding the accumulation of water vapor in a local area, thereby improving the liquid evaporation speed and the efficiency of heat removal.

[0045] It should be noted that the liquid in the water containing cavity 22 can be selected according to different application requirements, and the selected liquid should have good evaporation characteristics, which can evaporate rapidly at a lower temperature and absorb heat, thereby effectively taking away the heat generated by the electronic device. Common liquids such as water, ethanol, acetone, etc. have good evaporation characteristics and can be used for efficient heat dissipation.

[0046] As shown in Figure 6 , Figure 7 and Figure 8 In an optional embodiment of the present application, a water conveying element 30 is arranged on the water conveying port 23, one end of the water conveying element 30 is arranged in the water containing cavity 22, the other end extends into the evaporation chamber through the water conveying port 23, and is connected with the water absorbing element 60, for conveying the liquid in the water containing cavity 22 to the water absorbing element 60.

[0047] Specifically, due to the uncertain arrangement angle of the device during use, the liquid may not flow stably due to the influence of gravity. By erecting the water conveying member 30 between the water storage cavity 22 and the water absorbing member 60, the number of water conveying members 30 is consistent with the number of water conveying openings 23, the process of liquid flowing from the water storage cavity 22 to the water absorbing member 60 is more stable and uniform, the capillary action of the water absorbing member 60 is promoted, and the situation of poor liquid flow or uneven distribution is effectively avoided, so that the device can work stably under different use conditions, reduce the waste of liquid, enhance the adaptability of the device, reduce energy consumption, and meet the concept of energy saving and environmental protection. The water conveying member 30 can select different materials according to needs, such as water conveying pipes 31, water absorbing rods, etc. These materials not only can effectively absorb liquid, but also can provide better evaporation effect, further enhancing the heat dissipation efficiency. Especially the water absorbing rod, such as polypropylene, cotton fiber and polyurethane foam, etc. Because it has good liquid adsorption and flow guiding capacity, even in the case of large angle inclination or even inversion of the device, it can still uniformly convey liquid to the surface of the water absorbing member 60, can adapt to different use environments, has strong stability and adaptability, and is not easy to cause uneven liquid flow or stagnation due to gravity or inclination angle.

[0048] It should be noted that in order to further improve the stability and reliability of liquid conveying, the liquid supply process is optimized by setting the water conveying member 30 at the water conveying opening 23 and introducing a liquid conveying device. The liquid conveying device (such as a micro pump, a liquid level control device, etc.) cooperates with the water conveying member 30 (such as the water conveying pipe 31) to provide additional power support for the flow of liquid, solves the problem of insufficient gravity caused by large inclination angle of the device or poor water conveying caused by low liquid level in the water storage cavity 22, and the liquid conveying device can drive the liquid to flow through the water conveying member 30 to the water absorbing member 60, thereby ensuring that the water absorbing member 60 is always wet to maintain the normal capillary action.

[0049] As shown in Figure 8 and Figure 10 In an optional embodiment of the present application, the water conveying member 30 includes a water conveying pipe 31 and a flow guiding column 32 arranged in the water conveying pipe 31. One end of the water conveying pipe 31 is fixed on the surface of the heat dissipation plate 40, and the other end extends into the water storage cavity 22 through the water conveying opening 23. First and second notches 311 and 312 are respectively arranged at the two ends of the water conveying pipe 31, and the first notch 311 is located in the water storage cavity 22 and the second notch 312 is located in the evaporation chamber and connected with the water absorbing member 60.

[0050] Specifically, the flow guide column 32 is arranged in the water delivery pipe 31 and can guide the liquid to flow along the wall of the water delivery pipe 31 or a specific path, avoid turbulence or stagnant flow of the liquid in the water delivery pipe 31, effectively regulate the liquid flow in the water delivery pipe 31, prevent the liquid from flowing too fast in the water delivery pipe 31 by controlling the flow, and ensure that the liquid enters the water containing cavity 22 and the evaporation chamber at a uniform flow rate, thereby ensuring the stability and reliability of the system. At the same time, the water delivery pipe 31 is provided with a first notch 311 and a second notch 312 penetrating the side wall of the water delivery pipe 31 to the outer wall of the flow guide column 32 at both ends of the water delivery pipe 31, and the number of the first notch 311 and the second notch 312 is usually multiple. The first notch 311 is located in the water containing cavity 22, that is, the first notch 311 is the water inlet end of the water delivery pipe 31, which can ensure that the liquid in the water containing cavity 22 can smoothly enter the water delivery pipe 31, avoid the liquid flow being blocked due to a single pipe opening, improve the efficiency and uniformity of the liquid inflow, and reduce the resistance of the liquid in the inflow pipeline; and the second notch 312 is located in the evaporation chamber and connected with the water absorbing part 60. The liquid can flow to the water absorbing part 60 from all directions through the second notch 312, which helps to accelerate the wetting speed of the water absorbing part 60 and ensures that the water absorbing part 60 always maintains a relatively wet state, thereby improving the overall working efficiency of the system. Through uniform liquid distribution, local dryness or excessive wetness is avoided, and normal operation of the equipment is ensured.

[0051] By arranging the flow guide column 32 in the water delivery pipe 31 to limit the flow of the liquid, in combination with the ingenious design of the first notch 311 and the second notch 312, the water flow rate can be accurately adjusted, and the water flow is effectively controlled during transportation, which avoids the waste caused by too fast water flow and prevents ineffective transportation caused by too slow water flow. The flow guide column 32 plays a regulating role when the water flow passes through it, which limits the flow rate by narrowing the water flow channel and promotes the water flow to maintain a reasonable speed during transportation. This regulation enables the system to ensure stable water flow transportation while avoiding energy loss and potential resource waste caused by excessive flow rate.

[0052] As shown in Figure 10 In an optional embodiment of the present application, the outer diameter of the flow guide column 32 is smaller than the pipe diameter of the water delivery pipe 31, and the length of the flow guide column 32 is greater than or equal to the pipe length of the water delivery pipe 31.

[0053] Specifically, the outer diameter of the flow guide column 32 is smaller than the pipe diameter of the water delivery pipe 31, so that a flow space can be formed around the flow guide column 32, the liquid can smoothly enter the water delivery pipe 31 through the first gap 311, and flow along the water delivery pipe 31, and finally flow to the second gap 312 to avoid the liquid flow being blocked, ensuring that the liquid flow is more stable and uniform, and improving the operation efficiency of the system. At the same time, since there is enough gap between the flow guide column 32 and the water delivery pipe 31, the liquid can flow freely in this space and be effectively regulated, the flow rate can be kept uniform, reducing the impact force or instability phenomenon caused by uneven liquid flow, and ensuring that the system can operate stably.

[0054] The length of the flow guide column 32 is greater than or equal to the pipe length of the water delivery pipe 31, which can effectively prevent the liquid flow direction from being affected when the device is tilted. The length of the flow guide column 32 ensures smooth flow of the liquid at any angle, avoiding irregular liquid flow and affecting the normal operation of the system. At the same time, the length of the flow guide column 32 is sufficient, which not only facilitates plugging and replacement, but also facilitates cleaning the inner wall of the water delivery pipe 31. Since impurities will inevitably exist when using liquid, these impurities will accumulate and contaminate the pipe wall over time. The design of the flow guide column 32 allows the water delivery pipe 31 to be easily disassembled and cleaned when needed, extending the service life of the equipment. In addition, the length of the flow guide column 32 is greater than or equal to the pipe length of the water delivery pipe 31, so that the design can avoid the risk of the flow guide column 32 falling out of the pipe due to being too short, ensuring its stability and reliability during the entire use process.

[0055] It should be noted that the height of the water delivery pipe 31 in the water containing cavity 22 is usually required to be 3 / 4 of the height of the water containing cavity 22. This height design can ensure that the liquid level in the water containing cavity 22 is maintained within a relatively stable range, and the water delivery pipe 31 can smoothly absorb and transport liquid under most working conditions, thereby ensuring the sufficiency and stability of the liquid supply.

[0056] As shown in Figure 10 In an optional embodiment of the present application, the flow guide column 32 can be made of one or more of rubber material, glass fiber material, plastic fiber material or cotton fiber material.

[0057] Specifically, when the device does not require excessive flow rate, the flow guide column 32 made of rubber material, glass fiber material or plastic fiber material can effectively regulate the flow rate of the liquid, wherein the rubber has good flexibility and elasticity, can adapt to different working conditions, and is particularly suitable for occasions requiring low flow rate; the glass fiber material has strong temperature resistance, corrosion resistance and strength, and is suitable for application scenarios requiring higher durability and stability, which can maintain stable performance in high flow rate or high temperature environment to prevent the flow guide column 32 from being damaged. The plastic fiber material generally has lighter mass and higher strength, so that the flow guide column 32 can maintain sufficient structural stability while reducing the weight of the overall device. This is of great significance for easy installation, transportation and cost saving. When the device requires a larger flow rate, a cotton fiber material such as a water-absorbing cotton swab can be used. The cotton fiber has good water absorption and air permeability, which can better regulate and distribute the flow under the flow of liquid with a larger flow rate, ensuring smooth and uniform distribution of liquid flow. The cotton fiber material is particularly suitable for some high-flow and high-humidity application scenarios.

[0058] It should be noted that, according to actual needs, the flow guide column 32 can be made of a combination of rubber, glass fiber, plastic fiber material and cotton fiber material. For example, in the case of requiring both low flow rate and certain strength, rubber and glass fiber material can be used in combination; and in the case of requiring rapid moisture absorption and large flow rate, cotton fiber and rubber material can be combined. This multi-material combination can more flexibly adapt to different working environments and improve the performance and stability of the device.

[0059] As shown in Figure 8 , in an optional embodiment of the present application, the first gap 311 extends from the end of the water delivery pipe 31 to the bottom of the water containing cavity 22.

[0060] Specifically, the first gap 311, as a water inlet, gradually extends from the end of the water delivery pipe 31 to the bottom of the water containing cavity 22, which can maximize the smooth flow of liquid in the water containing cavity 22 into the water delivery pipe 31, avoiding the situation that the liquid is difficult to flow into the pipe due to improper gap position, ensuring the continuity and stability of liquid flow, and reducing the situation of liquid stagnation or poor flow in the water containing cavity 22. After the liquid enters the second gap 312 from the first gap 311, it can effectively wet the water absorbing element 60, which uniformly absorbs the liquid to ensure that it always remains wet, thereby improving the heat dissipation efficiency of the device and achieving the expected use effect.

[0061] As shown in Figure 11 , in an optional embodiment of the present application, the heat dissipation plate 40 is provided with an annular groove 41 on the side close to the water absorbing element 60, and a magnetic ring 42 is embedded in the annular groove 41.

[0062] Specifically, by setting the annular groove 41 on the heat dissipation plate 40 and embedding the magnetic ring 42, the device can be directly adsorbed on the surface of the electronic equipment during use, and the user can easily adsorb the device at the desired position, so that the device can be firmly attached to the electronic equipment without the need for additional support or fixing device, avoiding the trouble of complex fixing or installation of traditional devices, simplifying the operation process, and greatly improving the convenience and use efficiency of the device. The magnetic ring 42 can provide strong adsorption force to ensure that the device will not easily slide or fall off during use. Even in the case of slight vibration on the surface of the equipment, the magnetic ring 42 can maintain the stability of the device and ensure good contact between the water absorption part 60 and the surface of the electronic equipment. The heat dissipation plate 40 with the built-in magnetic ring 42 is usually suitable for electronic components, metal shells, magnetic supports and other devices with built-in magnetic parts 43. These devices usually have magnetism or can be adsorbed by additional magnetic parts 43, so that the heat dissipation plate 40 can be firmly adsorbed on the surface of the electronic product that needs to be cooled by the magnetic ring 42.

[0063] In order to make the surface liquid evaporation refrigeration device adapt to more heat dissipation products, a general heat dissipation plate 40 without magnetic ring 42 is also designed, and the specific structure is that a plurality of magnetic parts 43 are arranged on the heat dissipation plate 40. When the device is used for heat dissipation, some magnetic parts 43 can be attached to the surface or back of the heat dissipation product, and then the remaining magnetic parts 43 on the heat dissipation plate 40 can also be used to firmly attach the surface liquid evaporation refrigeration device to the surface of the heat dissipation product.

[0064] It should be noted that different heat dissipation devices or electronic equipment may have different surface materials and shapes. In order to improve the applicability of the device and cope with various types of heat dissipation devices, in addition to the design of the magnetic ring 42, other fixing components such as fixing ropes, fixing buckles, adhesive stickers or PU nano anti-slip pads can be arranged on the shell 10 or the heat dissipation plate 40 to ensure that the device can adapt to various surfaces and provide more fixing methods. Whether it is a smooth metal surface or a surface of other materials, the device can be firmly fixed by these additional fixing components.

[0065] As shown in Figure 2 , Figure 3 and Figure 4 , in an optional embodiment of the present application, a first water inlet 14 is formed in the side wall of the shell 10, and a second water inlet 24 is formed in the side wall of the inner container 20 and penetrates the water storage cavity 22. The first water inlet 14 corresponds to the second water inlet 24, and a water inlet plug 15 is arranged on the first water inlet 14 to close the first water inlet 14.

[0066] Specifically, by setting the first water inlet 14 and the second water inlet 24, the user can inject liquid through the first water inlet 14 when needed, and the liquid will flow into the water cavity 22 through the second water inlet 24. The water inlet plug 15 can effectively close the first water inlet 14 after the water injection is completed, preventing liquid leakage and ensuring that the system will not be affected by liquid overflow during use, maintaining the stability and safety of the device.

[0067] It should be noted that the setting of the water inlet plug 15 prevents liquid leakage during device transportation or storage, ensuring that the device can maintain a seal under various conditions. This design not only ensures stability during long-term storage and use, but also effectively prevents liquid loss during device movement, improving the safety of the device.

[0068] As shown in Figure 2 , Figure 3 and Figure 4 , in an optional embodiment of the present application, a driving member 70 and a waterproof cover 26 are further included, the driving member 70 is connected with the fan 50, the waterproof cover 26 is arranged at the top of the inner container 20, and a mounting groove 25 corresponding to the waterproof cover 26 is further formed at the top of the inner container 20, and the driving member 70 is arranged in the mounting groove 25.

[0069] Specifically, the setting of the waterproof cover 26 can effectively prevent electronic components such as the battery 71 and the circuit board 72 from being corroded by moisture, ensuring long-term stable operation of the device in a humid environment, especially when the fan 50 is working, it may carry water vapor or water droplets in the air, the waterproof cover 26 can provide additional protection for internal components, preventing short circuits or corrosion caused by moisture. The driving member 70 provides continuous power for the operation of the fan 50, which includes the battery 71 and the circuit board 72, and the battery 71 and the circuit board 72 are arranged in the mounting groove 25, not only ensuring their stable position, but also effectively reducing the influence of external vibration on the battery 71 or the circuit board 72, thereby improving the durability and safety of the device. The integrated installation of the battery 71 and the circuit board 72 cooperates with the waterproof cover 26, making the overall appearance of the device more compact, and the internal components are effectively protected. At the same time, the design of the waterproof cover 26 makes the device more tidy in appearance, not only improving the functionality, but also improving the appearance quality of the product, making it more suitable for the needs of modern consumers. Among them, the battery 71 can be a 500mAh lithium battery 71, and the fan 50 can be a 0.35w electric fan 50, with a theoretical endurance of 7 hours, removing normal losses during operation, and the actual measured device endurance time is greater than 4.5 hours.

[0070] In order to facilitate charging, the shell 10 and the inner container 20 are provided with corresponding USB / Type-C charging interfaces, and the circuit board 72 supplies power to the battery 71. The user only needs to charge the battery 71 through the standard USB or Type-C interface, avoids the cumbersome operation, and makes the charging process more convenient. Due to the popularity of USB and Type-C interfaces, this design can adapt to a wide range of charging equipment, and improves the compatibility of the device. In order to facilitate the opening and closing of the fan 50, the driving part 70 further includes a switch 73 and a corresponding working indicator lamp 74. The switch 73 can easily start or stop the fan 50 when needed, and control the working state of the fan 50; and the working indicator lamp 74 can display the working state of the fan 50 in real time, so that the user can clearly understand the current running state of the equipment. This design is convenient for user operation, and improves the ease of use of the equipment.

[0071] In addition, the surface liquid evaporation refrigeration device can be further extended to intelligent operation, such as through the built-in temperature and humidity sensor, the device can monitor the temperature and humidity of the surrounding environment in real time, and automatically adjust the working mode to achieve the best refrigeration effect. For example, when the temperature exceeds the preset threshold, the device can automatically start the fan 50 and the liquid evaporation system to improve the evaporation rate; if the environmental humidity is high, the fan speed is automatically reduced to avoid excessive evaporation. Through the APP, the user can remotely adjust the working speed of the fan 50, and accurately control the running state of the equipment according to the change of the temperature and humidity of the environment. The water storage cavity 22 is provided with a water level sensor, which can detect the water level of the water storage cavity 22. When the water level is lower than the preset standard, the system will notify the user through the working indicator lamp 74 and the APP to supplement the water source in time, so as to avoid the decrease of the refrigeration effect or the damage of the equipment caused by insufficient water.

[0072] The utility model embodiment further provides a kind of consumer electronics, such as mobile phone, tablet computer, notebook computer and computer host etc., can all use this surface liquid evaporation refrigeration device to dissipate heat, when using, just the side that the surface liquid evaporation refrigeration device is provided with heat sink 40 is pasted in the surface of consumer electronics needing to dissipate heat, then opening switch 73, so that fan 50 operates can the heat of consumer electronics is conducted to outside, realizes the rapid cooling of consumer electronics.

[0073] The surface liquid evaporation refrigeration device provided by the embodiment of the utility model can be applied to the working scene of surface heat dissipation of consumer electronic equipment, and provides a user with a refrigeration device which is efficient and portable, simple in structure and remarkable in heat dissipation effect. When the surface liquid evaporation refrigeration device is used, the actual working process of realizing the rapid heat dissipation of the object surface by the heat dissipation plate 40 through the opening of the fan 50 is as follows: when the device is used for auxiliary heat dissipation, the side provided with the heat dissipation plate 40 is first tightly attached to the surface of the electronic equipment which needs heat dissipation, the water-containing cavity 22 in the inner container 20 will continuously deliver the internal liquid to the water absorbing part 60 through the water delivery opening 23 (or the water delivery part 30) formed at the bottom, so that the water absorbing part 60 is kept wet, the heat generated by the electronic equipment is conducted to the water absorbing part 60 through the heat dissipation plate 40, the liquid in the water absorbing part 60 is evaporated and water vapor is generated, under the action of the airflow assisted by the fan 50, the evaporation speed of the liquid on the water absorbing part 60 is significantly accelerated, and the water vapor is further driven by the airflow and is discharged to the outside through the second through hole 21, the first through hole 12 and the plurality of heat dissipation holes 13 formed in the side wall of the shell 10, so that the heat of the heat dissipation plate 40 is efficiently discharged to the outside, the temperature of the electronic equipment is rapidly reduced, the purpose of heat dissipation is finally achieved, the reverse heat phenomenon caused by the condensation of water vapor in the device is effectively avoided, the heat conduction path of the heat dissipation plate 40 is optimized, and the evaporation rate of the liquid is significantly enhanced through forced airflow circulation, and the refrigeration effect is greatly improved. The device has the characteristics of energy saving, environmental protection and convenient maintenance by virtue of the reasonable structure design and the liquid evaporation refrigeration principle, only a small amount of liquid needs to be supplemented in the use process, the use cost is significantly reduced, it is green and environmentally friendly, and it has wide application value.

[0074] The above-described specific embodiments further illustrate the purpose, technical solutions and beneficial effects of the utility model, and it should be understood that the above-described specific embodiments are only for the specific embodiments of the utility model and are not used to limit the protection scope of the utility model. It is particularly pointed out that, for those skilled in the art, any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model should be included in the protection scope of the utility model.

Claims

1. A surface liquid evaporation refrigeration device, characterized by, The surface liquid evaporation refrigeration device comprises a shell, an inner container, a fan, a heat dissipation plate and a water absorbing element, an open cavity is formed in the bottom of the shell, a first through hole is formed in the top of the shell and extends to the open cavity, a second through hole is formed in the upper end wall of the inner container, a water storage cavity is formed around the second through hole, and a plurality of water delivery openings are formed in the bottom of the inner container and extend to the water storage cavity, the inner container is arranged in the open cavity, the fan is arranged in the second through hole, the second through hole is communicated with the first through hole, the heat dissipation plate is arranged on the bottom of the shell, the water absorbing element is arranged on the side surface of the heat dissipation plate close to the inner container, and the water absorbing element is connected with the water delivery opening.

2. The surface liquid evaporation refrigeration device according to claim 1, characterized in that, An evaporation chamber is formed between the bottom of the inner container and the top of the water absorbing element, a plurality of heat dissipation holes are formed in the side wall of the shell and extend to the evaporation chamber, and the heat dissipation holes are uniformly arranged on the side wall of the shell.

3. The surface liquid evaporation refrigeration device according to claim 2, characterized in that, A water delivery element is arranged on the water delivery opening, one end of the water delivery element is arranged in the water storage cavity, the other end of the water delivery element extends to the evaporation chamber through the water delivery opening, and the water delivery element is connected with the water absorbing element, so as to deliver the liquid in the water storage cavity to the water absorbing element.

4. The surface liquid evaporation refrigeration device according to claim 3, characterized in that, The water delivery element comprises a water delivery pipe and a flow guide column arranged in the water delivery pipe, one end of the water delivery pipe is fixed on the surface of the heat dissipation plate, the other end of the water delivery pipe extends to the water storage cavity through the water delivery opening, first and second notches are formed in the side wall of the water delivery pipe and extend to the outer wall of the flow guide column, the first notch is located in the water storage cavity, and the second notch is located in the evaporation chamber and connected with the water absorbing element.

5. The surface liquid evaporation refrigeration device according to claim 4, wherein, The outer diameter of the flow guide column is smaller than the pipe diameter of the water delivery pipe, and the length of the flow guide column is greater than or equal to the pipe length of the water delivery pipe.

6. The surface liquid evaporation refrigeration device according to claim 5, wherein, The flow guide column can be made of one or more of rubber material, glass fiber material, plastic fiber material or cotton fiber material.

7. The surface liquid evaporation refrigeration device according to claim 4, wherein, The first notch extends from the end of the water delivery pipe to the bottom of the water storage cavity.

8. The surface liquid evaporation refrigeration device according to claim 1, wherein, An annular groove is formed in the side of the heat dissipation plate close to the water absorbing element, and a magnetic ring is embedded in the annular groove.

9. The surface liquid evaporation refrigeration device according to claim 1, wherein, A first water inlet is formed in the side wall of the shell, a second water inlet is formed in the side wall of the inner container and extends to the water storage cavity, the first water inlet corresponds to the second water inlet, a water inlet plug is arranged on the first water inlet, and the first water inlet is closed by the water inlet plug.

10. A consumer electronic product characterized by: The surface liquid evaporation refrigeration device is used for heat dissipation.