IGBT (Insulated Gate Bipolar Translator) ultrasonic detection tool

Abstract

The utility model discloses an IGBT ultrasonic detection tool, and relates to the technical field of IGBT detection. The IGBT ultrasonic testing tool comprises a mounting table, a fixed seat and a sliding seat, the fixed seat and the sliding seat are arranged on the mounting table, the sliding seat slides towards or away from the fixed seat, the sliding seat slides to a preset position and then supports a chip to be tested together with the fixed seat, the distance between the preset position and the fixed seat is smaller than the width of the chip to be tested, a first adjusting part is arranged on the fixed seat, and a second adjusting part is arranged on the first adjusting part. A second adjusting piece is arranged on the sliding seat, the working ends of the first adjusting piece and the second adjusting piece abut against the chip to be tested, and the levelness of the chip to be tested is adjusted through the first adjusting piece and the second adjusting piece. The accuracy of the IGBT ultrasonic detection can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of IGBT detection, in particular to an IGBT ultrasonic detection tool. BACKGROUND

[0002] Power semiconductor devices are widely used in rail transportation, smart grid, industrial energy saving, electric vehicles and new energy equipment fields. It has the characteristics of energy saving, easy installation, easy maintenance, stable heat dissipation, etc. In the current power module, IGBT module is in a very important position, IGBT module includes chip, copper clad plate and copper bottom plate, among which the chip and the copper clad plate, the copper clad plate and the copper bottom plate are welded by tin solder. When the chip works, heat will be generated on the chip. The heat is transferred to the copper bottom plate through the copper clad plate, and then the heat is successively transmitted and dissipated through the copper bottom plate, so as to achieve the effect of heat dissipation and cooling of IGBT module. When the tin solder layer between the chip and the copper clad plate and the tin solder layer between the copper clad plate and the copper bottom plate has a welding cavity, the insufficient contact area of the tin solder layer will reduce the heat dissipation performance of IGBT. Therefore, in the IGBT production process, a process is needed to scan the tin layer welding between the chip and the copper clad plate and the copper clad plate and the copper bottom plate by ultrasonic wave, and measure whether the hollow rate of the product is qualified.

[0003] Ultrasonic scanning is a non-destructive testing method for imaging micro-objects by using ultrasonic waves as a transmission medium. The properties of ultrasonic pulse echo are used to excite the piezoelectric transducer to emit multiple beams of ultrasonic waves through the coupling liquid medium to the measured sample. In conventional ultrasonic scanning, the measured object is usually placed directly in the water tank, and the surface of the measured object needs to be flat, so that the ultrasonic wave can accurately penetrate the packaging material to the hollow layer through the water medium. Due to the special structure of the power module, the bottom copper bottom plate is flat, so the IGBT module needs to be turned over, and the flat copper bottom plate is placed horizontally with the face up, and the ultrasonic probe emits ultrasonic pulse echo downward. Due to the uneven phenomenon of the welding layer of the power module, the larger welding layer will show a partially shaded image during ultrasonic scanning, which will affect the measurement results. Practical new type content

[0004] The purpose of the present application is to provide an IGBT ultrasonic detection tool which can improve the accuracy of IGBT ultrasonic detection.

[0005] The embodiment of the present application is implemented as follows:

[0006] The application provides an IGBT ultrasonic detection tool, which comprises a mounting table, a fixed seat and a sliding seat arranged on the mounting table, the sliding seat slides towards or away from the fixed seat, the sliding seat supports a to-be-detected chip together with the fixed seat after sliding to a preset position, the distance between the preset position and the fixed seat is smaller than the width of the to-be-detected chip, a first adjusting piece is arranged on the fixed seat, a second adjusting piece is arranged on the sliding seat, the working end of the first adjusting piece and the second adjusting piece abuts against the to-be-detected chip, and the levelness of the to-be-detected chip is adjusted through the first adjusting piece and the second adjusting piece.

[0007] Optionally, as an implementable mode, the application further comprises a mounting seat, the to-be-detected chip is mounted on the mounting seat, and the mounting seat is placed on the fixed seat and the sliding seat.

[0008] Optionally, as an implementable mode, a plurality of mounting holes are arranged on the mounting seat, and the first adjusting piece and the second adjusting piece are respectively inserted into the mounting holes.

[0009] Optionally, as an implementable mode, a first via hole is arranged on the fixed seat, the first adjusting piece is mounted on the first via hole, and the operation end and the working end of the first adjusting piece respectively extend out of the first via hole.

[0010] Optionally, as an implementable mode, a second via hole is arranged on the sliding seat, the second adjusting piece is mounted on the second via hole, and the operation end and the working end of the second adjusting piece respectively extend out of the second via hole.

[0011] Optionally, as an implementable mode, a plurality of adjusting seats are arranged at the bottom of the mounting table, and the levelness of the mounting table is adjusted through the adjusting seats.

[0012] Optionally, as an implementable mode, a level gauge is further arranged on the mounting table, and the levelness of the mounting table is detected through the level gauge.

[0013] Optionally, as an implementable mode, a slide rail is arranged on the mounting table, and the sliding seat is slidingly mounted on the slide rail.

[0014] Optionally, as an implementable mode, an adjusting rod is further rotatably arranged on the mounting table, the adjusting rod is threadedly connected with the sliding seat, and the sliding seat is driven to slide towards or away from the fixed seat through the adjusting rod.

[0015] Optionally, as an implementable mode, the slide rail comprises two slide rails, and the two slide rails are parallel to each other.

[0016] The beneficial effects of the embodiments of the application include:

[0017] The IGBT ultrasonic detection tool provided by the application comprises a mounting table, a fixed seat and a sliding seat arranged on the mounting table, the sliding seat slides towards or away from the fixed seat, and the sliding seat supports the chip to be detected together with the fixed seat after sliding to a preset position. Through the slidable design of the sliding seat and the cooperation with the fixed seat, the tool can flexibly adapt to IGBT module chips of different sizes. Whether it is a small chip or a large chip, a suitable supporting position can be found on the tool, and accurate level adjustment is performed through the adjusting piece. Such good adaptability not only improves the universality of the tool, reduces the cost of enterprises due to the need to equip multiple tools for detecting different specifications of chips, but also improves the detection efficiency and meets the diversified detection needs on the production line; the first adjusting piece is arranged on the fixed seat, the second adjusting piece is arranged on the sliding seat, the working end of the first adjusting piece and the second adjusting piece abuts against the chip to be detected, and the level of the chip to be detected is adjusted through the first adjusting piece and the second adjusting piece. Through the accurate adjustment of the level of the chip by the first adjusting piece and the second adjusting piece, the influence of the uneven surface of the chip and the non-standard placement on the ultrasonic detection is effectively overcome. It is ensured that the ultrasonic wave can clearly capture the information of the welding cavity, greatly improves the accuracy of the cavity rate detection, makes the evaluation of the welding quality of the IGBT module more accurate and reliable, and helps to find potential quality problems in time. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0019] Figure 1 One of the structural schematic diagrams of the IGBT ultrasonic detection tool provided by the embodiments of the application;

[0020] Figure 2 The second structural schematic diagram of the IGBT ultrasonic detection tool provided by the embodiments of the application.

[0021] Figure: 100-IGBT ultrasonic detection tool; 110-mounting table; 111-level gauge; 112-sliding rail; 113-adjusting rod; 120-fixed seat; 121-first adjusting piece; 130-sliding seat; 131-second adjusting piece; 140-mounting seat; 150-adjusting seat. DETAILED DESCRIPTION

[0022] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the following will be combined with the accompanying drawings for the embodiments of the present application to make a clear and complete description of the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only some but not all of the embodiments of the present application. The components of the embodiments of the present application described and shown in the accompanying drawings can be arranged and designed in various different configurations.

[0023] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work are within the scope of protection of the present application.

[0024] It should be noted that: similar reference numerals and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings. In addition, the terms "first", "second", "third" and the like are only used to distinguish description, and cannot be understood as indicating or implying relative importance.

[0025] In the description of the present application, it should also be noted that, unless otherwise explicitly specified and limited, the terms "setting", "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or detachably connected, or integrally connected; it can be mechanically connected, or electrically connected; it can be directly connected, or indirectly connected through an intermediate medium, or the internal communication of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0026] Please refer to Figure 1 and Figure 2 The present embodiment provides an IGBT ultrasonic detection tool 100, which comprises a mounting table 110, a fixed seat 120 and a sliding seat 130 arranged on the mounting table 110, the sliding seat 130 slides towards or away from the fixed seat 120, the sliding seat 130 supports the to-be-tested chip together with the fixed seat 120 after sliding to a preset position, the distance between the preset position and the fixed seat 120 is less than the width of the to-be-tested chip, the fixed seat 120 is provided with a first adjusting piece 121, the sliding seat 130 is provided with a second adjusting piece 131, the working end of the first adjusting piece 121 and the second adjusting piece 131 abuts against the to-be-tested chip, and the levelness of the to-be-tested chip is adjusted through the first adjusting piece 121 and the second adjusting piece 131.

[0027] The IGBT ultrasonic detection tool 100 of the present application mainly consists of a mounting table 110, a fixed seat 120 and a sliding seat 130. The mounting table 110 serves as the basic support component of the entire tool, providing a stable mounting platform for the fixed seat 120 and the sliding seat 130. It is designed with sufficient strength and stability to ensure that it does not shake or displace during the detection process, thereby ensuring the reliability of the detection results. The fixed seat 120 and the sliding seat 130:

[0028] The sliding seat 130 can slide towards or away from the fixed seat 120. Through this flexible sliding design, it can adapt to IGBT module chips of different sizes. When the sliding seat 130 slides to the preset position, it forms a support structure for the chip together with the fixed seat 120, ensuring that the chip is in a stable position during the detection process and avoiding detection errors caused by unstable chip placement.

[0029] The fixed seat 120 is provided with a first adjusting member 121, and the sliding seat 130 is provided with a second adjusting member 131. The working ends of these two adjusting members are in contact with the chip to be tested. Through the operation of the operator on the adjusting members, the levelness of the chip to be tested can be accurately adjusted. In actual detection, due to the possible existence of slight unevenness on the surface of the chip or the inclination during placement, it may affect the propagation path and reflection effect of the ultrasonic wave, and thus affect the measurement accuracy of the void rate. Through the fine adjustment of the first adjusting member 121 and the second adjusting member 131, the chip can be brought to an ideal level state, ensuring that the ultrasonic wave can penetrate the tin layer welding area between the chip and the copper-clad substrate, the copper-clad substrate and the copper bottom plate vertically and uniformly, thereby improving the accuracy and reliability of the detection results. Among them, the first adjusting member 121 and the second adjusting member 131 are both micrometer structures to ensure the adjustment accuracy.

[0030] The IGBT ultrasonic testing fixture 100 provided in this application includes a mounting platform 110 and a fixed base 120 and a sliding base 130 disposed on the mounting platform 110. The sliding base 130 slides toward or away from the fixed base 120. After sliding to a preset position, the sliding base 130 and the fixed base 120 jointly support the chip under test. Through the sliding design of the sliding base 130 and its cooperation with the fixed base 120, the fixture can flexibly adapt to IGBT module chips of different sizes. Whether the chip is small or large, a suitable support position can be found on the fixture, and the level can be precisely adjusted by adjusting the adjustment components. This excellent adaptability not only improves the versatility of the tooling, reducing the cost for companies to equip themselves with multiple toolings for testing different chip specifications, but also improves testing efficiency and meets the diverse testing needs of the production line. A first adjusting member 121 is provided on the fixed base 120, and a second adjusting member 131 is provided on the sliding base 130. The working ends of the first adjusting member 121 and the second adjusting member 131 abut against the chip under test, adjusting the level of the chip through the first adjusting member 121 and the second adjusting member 131. The precise adjustment of the chip's level by the first adjusting member 121 and the second adjusting member 131 effectively overcomes the influence of uneven chip surfaces and improper placement on ultrasonic testing. This ensures that the ultrasonic waves can accurately penetrate the solder layer area, clearly capturing information about solder voids, greatly improving the accuracy of void rate detection, making the assessment of IGBT module soldering quality more accurate and reliable, helping to promptly detect potential quality problems, and improving product yield and reliability.

[0031] In one possible embodiment of this application, such as Figure 1 and Figure 2 As shown, it also includes a mounting base 140, on which the chip under test is mounted. The mounting base 140 is placed on the fixed base 120 and the sliding base 130.

[0032] The mounting bracket 140 provides a stable mounting platform for the chip, further ensuring the chip's positional stability during the testing process. It also facilitates the installation and removal of the chip, improving testing efficiency.

[0033] In one possible embodiment of this application, such as Figure 1 and Figure 2 As shown, the mounting base 140 is provided with multiple mounting holes, and the first adjusting member 121 and the second adjusting member 131 are respectively inserted into the mounting holes.

[0034] This plug-in connection method allows the adjustment component to act more precisely on the mounting base 140. By cooperating with the mounting hole, the adjustment component can be finely adjusted according to the actual situation of the chip to ensure that the chip's levelness reaches the optimal state, so as to meet the strict flatness requirements of ultrasonic testing.

[0035] In an embodiment of the present application, as shown in Figure 1 and Figure 2 The first through hole is arranged on the fixing seat 120, and the first adjusting member 121 is installed on the first through hole. The operation end and the working end of the first adjusting member 121 respectively extend out of the first through hole.

[0036] In an embodiment of the present application, as shown in Figure 1 and Figure 2 The second through hole is arranged on the sliding seat 130, and the second adjusting member 131 is installed on the second through hole. The operation end and the working end of the second adjusting member 131 respectively extend out of the second through hole.

[0037] The design of the through hole provides convenience for the installation and operation of the adjusting member. The operation end is convenient for the operator to perform the adjusting action, and the working end can accurately adjust the levelness of the chip, so that the whole adjusting process is more flexible and efficient.

[0038] In an embodiment of the present application, as shown in Figure 1 and Figure 2 The bottom of the mounting table 110 is provided with a plurality of adjusting seats 150, and the levelness of the mounting table 110 is adjusted through the adjusting seats 150.

[0039] Before detection, it is necessary to first ensure that the mounting table 110 is in a horizontal state to provide a stable detection basis. The design of the adjusting seat 150 can be fine-tuned through rotation, lifting and the like, so that the levelness of the mounting table 110 meets the detection requirements, reduces the error introduced by the uneven mounting table 110, and ensures the accuracy of the detection result.

[0040] In an embodiment of the present application, as shown in Figure 1 and Figure 2 The mounting table 110 is further provided with a level 111, and the levelness of the mounting table 110 is detected through the level 111. During the adjustment of the levelness of the mounting table 110, the operator can adjust the adjusting seat 150 in real time according to the indication of the level 111 until the mounting table 110 is in a horizontal state as indicated by the level 111. The arrangement of the level 111 improves the precision and efficiency of the levelness adjustment of the mounting table 110, and provides a reliable guarantee for the subsequent chip detection.

[0041] In an embodiment of the present application, as shown in Figure 1 and Figure 2 The mounting table 110 is provided with a sliding rail 112, and the sliding seat 130 is slidingly installed on the sliding rail 112.

[0042] Further, the adjusting rod 113 is rotatably arranged on the mounting table 110, and the adjusting rod 113 is threadedly connected with the sliding seat 130, so that the sliding seat 130 is driven to slide towards or away from the fixed seat 120 through the adjusting rod 113.

[0043] Further, the sliding rails 112 include two parallel sliding rails.

[0044] Specifically, the sliding rails 112 provide a stable guiding effect for the sliding of the sliding seat 130, so that the movement track of the sliding seat 130 is accurate and stable, and the deviation or shaking during the sliding process is avoided. Meanwhile, the sliding seat 130 is driven to slide towards or away from the fixed seat 120 through the rotation of the adjusting rod 113. The thread transmission has high precision and stability, and the rotation angle and the number of turns of the adjusting rod 113 can be accurately controlled by the operator, so that the precise displacement of the sliding seat 130 is realized, and the distance between the fixed seat 120 and the sliding seat 130 is adjusted conveniently to adapt to chips of different sizes, thereby improving the universality and practicality of the tool. The two parallel sliding rails 112 can better support the sliding seat 130, so that the sliding seat 130 is more stable during the sliding process, and the stability and reliability of the tool are further improved. During the detection process, the stable sliding seat 130 can ensure that the chip is always in the correct detection position, thereby improving the precision of ultrasonic detection.

[0045] In use of the IGBT ultrasonic detection tool 100 of the present application, first, the levelness of the mounting table 110 is preliminarily adjusted by observing the level meter 111 on the mounting table 110 and using the adjusting seat 150. The adjusting knob of the adjusting seat 150 is rotated so that the four corners of the mounting table 110 are on the same horizontal plane as much as possible, until the bubble in the level meter 111 is in the center position or within the allowable error range, at which time it is indicated that the mounting table 110 has been basically leveled. According to the size of the IGBT chip to be detected, the adjusting rod 113 on the mounting table 110 is rotated to slide the sliding seat 130 on the slide rail 112 towards or away from the fixed seat 120. The position of the sliding seat 130 is accurately controlled through the threaded transmission of the adjusting rod 113, so that the distance between the sliding seat 130 and the fixed seat 120 is slightly greater than the length of the chip, so that the chip can be placed smoothly. The chip to be detected is installed on the mounting seat 140, and it is ensured that the chip is tightly attached to the mounting seat 140 without looseness or deviation. Then the mounting seat 140 is placed on the fixed seat 120 and the sliding seat 130, so that the chip is located between the two, and the position of the chip is preliminarily adjusted so that it is approximately in the center position. The levelness of the chip is fine-tuned using the first adjusting member 121 on the fixed seat 120 and the second adjusting member 131 on the sliding seat 130. The operating ends of the first adjusting member 121 and the second adjusting member 131 are operated to make the working ends of the adjusting members lightly abut against the surface of the chip, and the extension lengths of the adjusting members are adjusted according to the actual situation of the surface of the chip, until the chip reaches a completely level state. The levelness of the chip can be detected using a level measuring tool (such as a high-precision electronic level gauge) to ensure that the levelness meets the requirements of ultrasonic detection.

[0046] The chip and the tool with adjusted levelness are placed in the working area of the ultrasonic detection equipment, and the equipment is started according to the operation procedures of the ultrasonic detection equipment, so that the ultrasonic probe emits ultrasonic pulse echoes downward to scan and detect the chip to be detected, record the detection data and images, and analyze and judge whether the cavity rate of the IGBT chip is qualified.

[0047] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Those skilled in the art can make various changes and modifications to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. An IGBT ultrasonic detection tool, characterized by, The device comprises a mounting table, a fixed seat and a sliding seat arranged on the mounting table, the sliding seat slides towards or away from the fixed seat, the sliding seat supports the chip to be tested together with the fixed seat after sliding to a preset position, the distance between the preset position and the fixed seat is less than the width of the chip to be tested, a first adjusting member is arranged on the fixed seat, a second adjusting member is arranged on the sliding seat, the working end of the first adjusting member and the second adjusting member abuts against the chip to be tested, and the levelness of the chip to be tested is adjusted through the first adjusting member and the second adjusting member.

2. The IGBT ultrasonic detection tooling of claim 1, wherein, The device further comprises a mounting seat, the chip to be tested is mounted on the mounting seat, and the mounting seat is placed on the fixed seat and the sliding seat.

3. The IGBT ultrasonic detection tooling of claim 2, wherein, A plurality of mounting holes are arranged on the mounting seat, and the first adjusting member and the second adjusting member are respectively inserted into the mounting holes.

4. The IGBT ultrasonic detection tooling of claim 1, wherein, A first through hole is arranged on the fixed seat, the first adjusting member is mounted on the first through hole, and the operation end and the working end of the first adjusting member respectively extend out of the first through hole.

5. The IGBT ultrasonic detection tooling of claim 1, wherein, A second through hole is arranged on the sliding seat, the second adjusting member is mounted on the second through hole, and the operation end and the working end of the second adjusting member respectively extend out of the second through hole.

6. The IGBT ultrasonic detection tooling of claim 1, wherein, A plurality of adjusting seats are arranged at the bottom of the mounting table, and the levelness of the mounting table is adjusted through the adjusting seats.

7. The IGBT ultrasonic detection tooling of claim 6, wherein, A level gauge is further arranged on the mounting table, and the levelness of the mounting table is detected through the level gauge.

8. The IGBT ultrasonic detection tooling of claim 1, wherein, A slide rail is arranged on the mounting table, and the sliding seat is slidingly mounted on the slide rail.

9. The IGBT ultrasonic detection tooling of claim 8, wherein, An adjusting rod is further rotatably arranged on the mounting table, the adjusting rod is threadedly connected with the sliding seat, and the sliding seat is driven to slide towards or away from the fixed seat through the adjusting rod.

10. The IGBT ultrasonic detection tooling of claim 8, wherein, The slide rail comprises two slide rails, and the two slide rails are parallel to each other.

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