Multi-dimensional high-precision carrying platform

Abstract

The utility model discloses a multi-dimensional high-precision carrying table which comprises a bottom sliding table. The upper end of the bottom sliding table is slidably connected with a Y-axis mechanism, the upper end of the Y-axis mechanism is slidably connected with an X-axis mechanism, the upper end of the X-axis mechanism is slidably connected with a first Z-axis structure, the upper end of the first Z-axis structure is connected with a theta-axis mechanism, and the upper end of the theta-axis mechanism is connected with a carrying table mechanism. The theta-axis mechanism is used for driving the carrying table mechanism to rotate, and one side of the carrying table mechanism is connected with a second Z-axis structure. Through cooperative use of the X-axis mechanism, the Y-axis mechanism, the Z-axis mechanism and the theta-axis mechanism, the precision can be effectively improved, the X-axis structure can reach + / -5 [mu] m, the Y-axis mechanism can reach + / -5 [mu] m, the rotation precision of the theta-axis mechanism can reach + / -0.02 degrees, the first Z-axis structure can reach + / -2 [mu] m, accurate butt joint of a chip and a test machine probe card can be realized, and the test efficiency is improved. And the reject ratio of the IGBT device is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip test technical field, concretely relates to a kind of multi-dimensional high-precision stage. BACKGROUND

[0002] In order to ensure the yield of supply IGBT device, before IGBT device chip mounting, the bare chip used must be screened for defects and performance tested, to verify the electrical parameters and functions of the bare chip, to screen out the bare chip that does not meet the requirements, to ensure the quality and performance of the supply product, and to reduce the defective rate of IGBT device. When testing the bare chip, the chip and the test machine probe card need to be precisely connected, and the test probe distributed on the probe card used for chip testing has a large number and small spacing, and the pose of the test chip in space needs to be adjusted with high precision. In the related art, only the three-dimensional test chip can be adjusted, and the demand for high-precision adjustment cannot be met. SUMMARY

[0003] The utility model discloses a kind of multi-dimensional high-precision stage to solve the above problems.

[0004] The utility model discloses a kind of multi-dimensional high-precision stage to solve the above problems.

[0005] A kind of multi-dimensional high-precision stage, including bottom slide;

[0006] The upper end of the bottom slide is slidably connected with a Y-axis mechanism, the upper end of the Y-axis mechanism is slidably connected with an X-axis mechanism, the upper end of the X-axis mechanism is slidably connected with a first Z-axis structure, the upper end of the first Z-axis structure is connected with a θ-axis mechanism, the upper end of the θ-axis mechanism is connected with a stage mechanism, the θ-axis mechanism is used to drive the stage mechanism to rotate, one side of the stage mechanism is connected with a second Z-axis structure.

[0007] As a further description of the above technical solution, the second Z-axis structure includes a motor, the bottom of the motor is provided with a synchronous pulley one, the synchronous pulley one is connected with a synchronous pulley two in the stage through a synchronous belt.

[0008] As a further description of the above technical solution, the upper surface of the synchronous pulley two is chamfered.

[0009] As a further description of the above technical solution, the inside of the stage mechanism is provided with a ball rod, the bottom of the ball rod is in contact with the chamfered surface, the upper end of the ball rod is provided with a spring, the upper end of the spring is provided with a ejector rod, one side of the ejector rod is connected with a conductive side rod, the conductive side rod is connected with a receiver.

[0010] As a further description of the above technical solutions, the Y-axis mechanism comprises a Y-axis slider, the Y-axis slider is in sliding connection with the bottom sliding table, one end of the bottom sliding table is provided with a linear motor, and the linear motor is used to drive the Y-axis slider to move in the linear direction of the bottom sliding table.

[0011] As a further description of the above technical solutions, the X-axis mechanism comprises an X-axis sliding rail, the upper end of the X-axis sliding rail is in sliding connection with an X-axis slider, one end of the X-axis sliding rail is connected with a linear motor, and the linear motor is used to drive the X-axis slider to slide in the linear direction of the X-axis sliding rail.

[0012] As a further description of the above technical solutions, the theta-axis mechanism comprises a servo motor, the upper end of the servo motor is connected with a rotating table, the rotating table is connected with the bottom of the table mechanism, and the theta-axis mechanism is used to drive the table mechanism to rotate.

[0013] As a further description of the above technical solutions, the upper portion of the table mechanism is provided with a visual positioning mechanism.

[0014] As a further description of the above technical solutions, the visual positioning mechanism comprises a camera.

[0015] The beneficial effects of the present application are as follows:

[0016] The X-axis mechanism, the Y-axis structure, the Z-axis mechanism and the theta-axis mechanism are used in cooperation, so that the precision can be effectively improved, the X-axis structure can reach ±5 microns, the Y-axis mechanism can reach ±5 microns, the rotation precision of the theta-axis mechanism can reach ±0.02 degrees, and the first Z-axis structure can reach ±2 microns, so that the chip and the test machine probe card can be precisely connected, and the defective rate of the IGBT device is reduced.

[0017] In order to more clearly illustrate the structural features and effects of the present application, the present application will be described in detail below in combination with the drawings and specific embodiments. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 is a perspective view of the multi-dimensional high-precision table provided by the present application;

[0019] Figure 2 is a front view of the multi-dimensional high-precision table provided by the present application;

[0020] Figure 3 is a side view of the multi-dimensional high-precision table provided by the present application;

[0021] Figure 4 is a sectional view of the table mechanism and the second Z-axis mechanism in cooperation provided by the present application;

[0022] Figure 5 is a schematic view of the synchronous pulley two provided by the utility model.

[0023] The drawing reference: 1, the bottom slide; 2, Y axis mechanism; 3, X axis mechanism; 4, first Z axis structure; 5, θ axis mechanism; 6, stage mechanism; 601, synchronous pulley two; 602, synchronous belt; 603, ball rod; 604, spring; 605, ejector rod; 606, conductive side pole; 7, second Z axis structure; 701, motor; 702, synchronous pulley one. DETAILED DESCRIPTION

[0024] To make the purpose, technical scheme and advantages of the utility model embodiment more clear, the technical scheme in the utility model embodiment will be clearly and completely described below with the drawings in the utility model embodiment.

[0025] As Figures 1-5 As shown in one embodiment, a multi-dimensional high-precision stage includes a bottom slide 1, which has a certain length. A Y-axis mechanism 2 is slidably connected to the upper end of the bottom slide 1, and can move in the length direction of the bottom slide 1. An X-axis mechanism 3 is slidably connected to the upper end of the Y-axis mechanism 2, so that the X-axis mechanism 3 can slide in the direction of the Y-axis length. A first Z-axis mechanism 4 is slidably connected to the upper end of the X-axis mechanism 3, so that the first Z-axis mechanism can move in the length direction of the X-axis mechanism 3. A θ-axis mechanism 5 is connected to the upper end of the first Z-axis mechanism 4. The upper end of the θ-axis mechanism 5 is connected to a stage mechanism 6. The θ-axis mechanism 5 is used to drive the stage mechanism 6 to rotate, thereby adjusting the angle of the stage structure and the test chip above. One side of the stage mechanism 6 is connected to a second Z-axis structure 7. Through the cooperation of the second Z-axis mechanism and the stage mechanism 6, the testing and disconnection testing of the chip can be realized.

[0026] Through the cooperation of the X-axis mechanism 3, Y-axis structure, Z-axis mechanism and θ-axis mechanism 5, the precision can be effectively improved. The X-axis structure can reach ±5 μm, the Y-axis mechanism 2 can reach ±5 μm, and the rotation precision of the θ-axis mechanism 5 can reach ±0.02°. The first Z-axis structure 4 can reach ±2 μm, which can realize the precise butt joint of the chip and the test machine probe card, and reduce the defective rate of IGBT devices.

[0027] Reference Figures 4-5The second Z-axis structure 7 comprises a motor 701, and a synchronous pulley one 702 is arranged at the bottom of the motor 701 and connected with a synchronous pulley two 601 in the platform through a synchronous belt 602. The upper surface of the synchronous pulley two 601 is a bevel surface, and a ball rod 603 is arranged in the platform mechanism 6 and in contact with the bevel surface at the bottom, a spring 604 is arranged at the upper end of the ball rod 603, a top rod 605 is arranged at the upper end of the spring 604, a conductive side rod 606 is connected to one side of the top rod 605 and connected with a receiver. When the motor 701 rotates, the ball rod 603 drives the top rod 605 to move up and down through the cooperation of the synchronous pulley one 702, the synchronous belt 602 and the synchronous pulley two 601, so as to realize the contact and separation of the top rod 605 and the chip. When the chip is tested for electrical parameters, the top rod 605 contacts the chip, and the related electrical parameters are transmitted to the side rod through the top rod 605, and the rear end of the side rod is connected with the receiver for analyzing the related feedback parameters.

[0028] Optionally, the Y-axis mechanism 2 comprises a Y-axis sliding block, which is in sliding connection with the bottom sliding table 1. One end of the bottom sliding table 1 is provided with a linear motor, which is used to drive the Y-axis sliding block to move in the linear direction of the bottom sliding table 1. The linear motor can be a high-precision motor.

[0029] Optionally, the X-axis mechanism 3 comprises an X-axis sliding rail, and an X-axis sliding block is in sliding connection with the upper end of the X-axis sliding rail. One end of the X-axis sliding rail is connected with a linear motor, which is used to drive the X-axis sliding block to slide in the linear direction of the X-axis sliding rail. The linear motor can be a high-precision motor.

[0030] Optionally, the θ-axis mechanism 5 comprises a servo motor 701, and a rotating table is connected to the upper end of the servo motor 701. The rotating table is connected with the bottom of the platform mechanism 6, and the θ-axis mechanism 5 is used to drive the platform mechanism 6 to rotate. The servo motor 701 can be a high-precision motor.

[0031] Optionally, a visual positioning mechanism is arranged above the platform mechanism 6. In some embodiments, the visual positioning mechanism can be a camera. The visual positioning mechanism takes a photo of the carrier plate on the platform mechanism 6 to give a corrected spatial coordinate, and then moves through the X-axis mechanism 3, the Y-axis mechanism 2, the first Z-axis mechanism, the second Z-axis mechanism and the θ-axis mechanism 5 to realize correction, so as to accurately and precisely adjust the pose of the test chip in space.

[0032] The standard parts used in the utility model can be purchased from the market, the special-shaped parts can be ordered according to the description and the drawings, the specific connection mode of each part adopts the conventional means such as bolt, rivet and welding in the prior art, the machinery, parts and equipment adopt the conventional type in the prior art, the conventional connection mode is adopted for circuit connection in the prior art, and the specific connection mode will not be described in detail here, and the contents not described in detail in the description belong to the prior art known by the professional technical personnel in the field.

[0033] The above description of disclosed embodiments enables those skilled in the art to make or use the utility model. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the utility model. Therefore, the utility model will not be limited to these embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A multi-dimensional high-precision stage, characterized in that, The bottom slide table is provided with a Y-axis mechanism, the upper end of the Y-axis mechanism is slidably connected with an X-axis mechanism, the upper end of the X-axis mechanism is slidably connected with a first Z-axis mechanism, the upper end of the first Z-axis mechanism is connected with a θ-axis mechanism, the upper end of the θ-axis mechanism is connected with a stage mechanism, the θ-axis mechanism is used to drive the stage mechanism to rotate, and one side of the stage mechanism is connected with a second Z-axis mechanism. The second Z-axis mechanism comprises a motor, and the bottom of the motor is provided with a synchronous pulley one.

2. The multi-dimensional high precision stage of claim 1, wherein, The upper surface of the synchronous pulley two is an inclined surface.

3. The multi-dimensional high precision stage of claim 2, wherein, The inside of the stage mechanism is provided with a ball rod, the bottom of the ball rod is in contact with the inclined surface, the upper end of the ball rod is provided with a spring, the upper end of the spring is provided with a top rod, one side of the top rod is connected with a conductive side rod, and the conductive side rod is connected with a receiver.

4. The multi-dimensional high precision stage of claim 3, wherein, The Y-axis mechanism comprises a Y-axis sliding block, the Y-axis sliding block is slidably connected with the bottom slide table, one end of the bottom slide table is provided with a linear motor, and the linear motor is used to drive the Y-axis sliding block to move in the linear direction of the bottom slide table.

5. The multi-dimensional high precision stage of claim 1, wherein, The X-axis mechanism comprises an X-axis sliding rail, the upper end of the X-axis sliding rail is slidably connected with an X-axis sliding block, one end of the X-axis sliding rail is connected with a linear motor, and the linear motor is used to drive the X-axis sliding block to slide in the linear direction of the X-axis sliding rail.

6. The multi-dimensional high precision stage of claim 1, wherein, The θ-axis mechanism comprises a servo motor, the upper end of the servo motor is connected with a rotating table, the rotating table is connected with the bottom of the stage mechanism, and the θ-axis mechanism is used to drive the stage mechanism to rotate.

7. The multi-dimensional high precision stage of claim 1, wherein, The upper side of the stage mechanism is provided with a visual positioning mechanism.

8. The multi-dimensional high precision stage of claim 1, wherein, The visual positioning mechanism comprises a camera.

9. The multi-dimensional high precision stage of claim 8, wherein, ​

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