Simulation heat source with high heat flux
By using copper substrates and components to design a high heat flux density simulated heat source, the problems of inconvenient adjustment of heat source chip spacing and complex disassembly and assembly are solved, enabling fast and efficient operation of heat source chips, which is suitable for modern industrial production.
Patent Information
- Application Number
- CN202422602880.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-28
- Publication Date
- 2026-01-02
- Estimated Expiration
- 2034-10-28
AI Technical Summary
Traditional high heat flux density simulated heat sources suffer from problems such as inconvenient adjustment of heat source chip spacing, complex disassembly and assembly, and long time consumption, which affect testing efficiency and increase R&D costs.
The design employs a copper carrier plate, conductive rail, heat source chip, adjustment component, and limit component. The adjustment component adjusts the spacing of the heat source chip, the transmission component maintains consistent spacing, and the limit component facilitates quick assembly and disassembly.
It enables efficient and safe assembly and disassembly of heat source chips and adjustment of their spacing, improving work efficiency, reducing maintenance costs, and making it suitable for modern industrial production.
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Figure CN223758406U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of simulation heat source, especially high heat flow density simulation heat source. BACKGROUND
[0002] In the research and development and test process of modern electronic equipment, the heat source simulating high heat flow density is crucial, and the traditional heat source simulation equipment often has problems such as inconvenient heat source chip spacing adjustment, long disassembly and replacement time, high maintenance cost and the like, which not only affects the test efficiency, but also increases the research and development cost, and limits the wide application of the equipment.
[0003] In the prior art, some high heat flow density simulation heat sources adopt heat source chips with fixed spacing, which makes it impossible to flexibly adjust the heat source chip spacing under different test requirements, thereby affecting the accuracy and applicability of the test, and in addition, the disassembly process of the heat source chip is complex, which needs to consume a lot of time and manpower, which is unacceptable for modern industrial production pursuing high efficiency.
[0004] Therefore, the utility model provides high heat flow density simulation heat source to solve the above problems.
[0005] The information disclosed in this background section is intended only to enhance understanding of the overall background of the present utility model, and should not be construed as recognition or suggestion that this information forms the prior art that is already known to those of ordinary skill in the art. UTILITY MODEL CONTENT
[0006] The utility model aims at solving the shortcomings mentioned in the background art, and provides high heat flow density simulation heat source.
[0007] The above technical purpose of the utility model is realized by the following technical scheme: high heat flow density simulation heat source, comprising copper carrier, multiple conductive tracks, multiple heat source chips, multiple adjusting assemblies and multiple limiting assemblies.
[0008] The top side of the copper carrier is fixedly provided with two power connection strips arranged in parallel with each other, a plurality of conductive tracks are arranged on the copper carrier, the conductive track in the middle is fixedly connected with the copper carrier, a plurality of supporting pins are rotatably arranged on the plurality of conductive tracks on both sides, the plurality of supporting pins are fixedly arranged on the top side of the copper carrier, a plurality of limiting assemblies are arranged on the conductive tracks except the conductive track in the middle and connected with the copper carrier, two power connection pieces are fixedly arranged on each of the plurality of heat source chips, a plurality of guide grooves are arranged on the plurality of conductive tracks, the number of the guide grooves on the plurality of conductive tracks in the middle is two, the two power connection pieces on the same heat source chip are slidably arranged in the corresponding guide grooves, the same transmission assembly is arranged on the power connection piece on the right side of the plurality of heat source chips in the same column, a plurality of guide openings are arranged on the copper carrier, a plurality of adjusting assemblies are arranged in the corresponding two guide openings and arranged in parallel with each other, and the adjusting assemblies are connected with the front and rear heat source chips in the same column.
[0009] Preferably, the limiting assembly comprises a limiting bolt and a screw hole, a plurality of screw holes are arranged on the top side of the copper carrier, the limiting bolts are threadedly arranged on the sides of the plurality of conductive tracks except the conductive track in the middle and away from the supporting pins, and the plurality of limiting bolts are threadedly arranged in the corresponding screw holes.
[0010] Preferably, the transmission assembly comprises a plurality of supporting rods and a plurality of rotating pins, the rotating pins are rotatably arranged on the right power connection pieces of the plurality of heat source chips in the same column, the number of the rotating pins on the plurality of power connection pieces in the middle is two, the supporting rods are radially fixedly arranged on the plurality of rotating pins, the fixed pins are rotatably arranged at the ends of the two adjacent supporting rods close to each other, and the same supporting block is rotatably arranged on the two adjacent fixed pins.
[0011] Preferably, the transmission assembly further comprises a plurality of gear wheels one and a plurality of gear wheels two, the gear wheels two are fixedly arranged on the plurality of fixed pins, the two gear wheels two above the same supporting block are engaged, the gear wheels one are fixedly arranged on the plurality of rotating pins in the middle, and the two gear wheels one on the same power connection piece are engaged.
[0012] Preferably, the adjusting assembly comprises two fixed blocks two and a bidirectional screw rod, the fixed blocks two are fixedly arranged on the bottom sides of the two heat source chips on the front and rear sides in the same column, the two fixed blocks two are slidably arranged in the corresponding guide openings, and the same bidirectional screw rod is threadedly arranged on the two fixed blocks two.
[0013] Preferably, the adjusting assembly further comprises an adjusting wheel, and the adjusting wheel is fixedly arranged at the rear end of the bidirectional screw rod.
[0014] Preferably, the adjusting assembly further comprises two fixed blocks one, the fixed blocks one are slidably arranged on the bottom side of the copper carrier, and the bidirectional screw rod is rotatably connected with the corresponding two fixed blocks one.
[0015] Preferably, the back side of the copper carrier sheet is provided with a plurality of mounting grooves, and a plurality of adjusting wheels are respectively arranged in the corresponding mounting grooves.
[0016] Preferably, the same number of conductive sheets as the number of conductive rails are fixedly arranged on the two power connection strips, and the plurality of conductive sheets are respectively in movable abutment with the corresponding conductive rails.
[0017] Preferably, the adjusting wheel, the bidirectional screw rod, the first fixed block and the second fixed block are made of high-temperature-resistant insulating ceramic.
[0018] The beneficial effects of the high heat flux density simulation heat source are as follows: the adjusting assembly can adjust the spacing between the two heat source chips on the front and back sides of the same column, the transmission assembly can keep the same spacing between the multiple heat source chips in the same column during spacing adjustment, and the conductive rail, the power connection strip, the conductive sheet and the guide groove can provide stable power supply for the heat source chips through the power connection sheet without affecting the spacing adjustment between the multiple heat source chips in the same column.
[0019] The limiting assembly can limit the multiple conductive rails except the middle conductive rail, thereby ensuring stable power connection of the heat source chips, and facilitating quick disassembly and assembly of the whole column of heat source chips when the limiting of the multiple conductive rails except the middle conductive rail is released, thereby facilitating quick and efficient replacement of part of the heat source chips.
[0020] In summary, the high heat flux density simulation heat source can realize quick, efficient and safe heat source chip disassembly and spacing adjustment, greatly improves the work efficiency, reduces the maintenance cost, and has a wide application prospect. BRIEF DESCRIPTION OF DRAWINGS
[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.
[0022] Figure 1 Fig. 1 is a schematic diagram of the three-dimensional structure of the high heat flux density simulation heat source according to the present application;
[0023] Figure 2 Fig. 1 is a schematic diagram of the three-dimensional structure of the high heat flux density simulation heat source according to the present application;
[0024] Figure 3The utility model provides a high heat flow density simulation heat source in the adjustment subassembly, the same column in the front and rear two heat source chips and the three -dimensional structure schematic diagram of the part of the electric sheet part of the utility model is provided.
[0025] Figure 4 The utility model provides a high heat flow density simulation heat source in the structure schematic diagram of A part.
[0026] Figure 5 The utility model provides a high heat flow density simulation heat source in the three -dimensional structure schematic diagram of the part of the electric track of either side, the support pin and the limiting subassembly.
[0027] In the drawing: 1, copper carrier piece;11, electric contact strip;12, electrically conductive sheet;2, electric track;21, limiting bolt;22, guide slot;3, heat source chip;31, electric sheet;4, support rod;41, rotating pin;42, gear one;43, gear two;5, fixed block one;51, fixed block two;52, bidirectional screw;53, adjusting wheel. DETAILED DESCRIPTION
[0028] The technical scheme of the utility model will be described clearly and completely in combination with specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the utility model, not all the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by the person skilled in the art without making creative efforts belong to the protection scope of the utility model.
[0029] REFERENCE Figures 1-5, high heat flow density simulation heat source, including copper carrier 1, a plurality of conductive tracks 2 and a plurality of heat source chips 3, the top side of the copper carrier 1 is fixedly installed with two power strips 11 arranged in parallel with each other, a plurality of conductive tracks 2 are arranged on the copper carrier 1, and the conductive track 2 located in the middle is fixedly connected with the copper carrier 1, a plurality of conductive tracks 2 are arranged on the copper carrier 1, and the conductive track 2 located in the middle is fixedly connected with the copper carrier 1, a plurality of support pins are rotatably installed on the plurality of conductive tracks 2 located on both sides, a plurality of support pins are fixedly installed on the top side of the copper carrier 1, a plurality of screw holes are formed on the top side of the copper carrier 1, a plurality of limiting bolts 21 are threadedly installed on the side away from the support pin of the plurality of conductive tracks 2 except the conductive track 2 in the middle, a plurality of limiting bolts 21 are respectively threadedly installed in the corresponding screw holes, which can provide limiting effect for the plurality of conductive tracks 2 except the conductive track 2 in the middle, a plurality of heat source chips 3 are fixedly installed with two power strips 31, a plurality of guide grooves 22 are formed on the plurality of conductive tracks 2, and the number of guide grooves 22 on the plurality of conductive tracks 2 located in the middle is two, the two power strips 31 located on the same heat source chip 3 are respectively slidably installed in the corresponding guide grooves 22, a plurality of power strips 31 are rotatably installed on the plurality of heat source chips 3 located in the same column, and the number of rotating pins 41 on the plurality of power strips 31 located in the middle is two, a plurality of rotating pins 41 are radially fixedly installed with support rods 4, one end of the adjacent two support rods 4 is rotatably installed with a fixed pin, the adjacent two fixed pins are rotatably installed with the same support block, a plurality of fixed pins are fixedly sleeved with a gear two 43, the two gears two 43 located above the same support block are engaged, a plurality of rotating pins 41 are fixedly sleeved with a gear one 42, the two gears one 42 located on the same power strip 31 are engaged, which can synchronously control the interval between the plurality of heat source chips 3 in the same column to be adjusted synchronously and keep the interval change consistent, so as to adjust the interval between the plurality of heat source chips 3 in the same column, a plurality of guide holes are formed on the copper carrier 1, the bottom side of the two heat source chips 3 located on the front and rear sides in the same column is fixedly installed with a fixed block two 51, the two fixed blocks two 51 are respectively slidably installed in the corresponding guide holes, the two fixed blocks two 51 are threadedly installed with the same bidirectional screw rod 52, which can control the two fixed blocks two 51 to drive the front and rear two heat source chips 3 in the same column to move reversely and synchronously when the bidirectional screw rod 52 rotates, in order to facilitate the operator to control the rotation of the bidirectional screw rod 52, the rear end of the bidirectional screw rod 52 is fixedly installed with an adjusting wheel 53, and in order to ensure the working stability of the bidirectional screw rod 52, the bottom side of the copper carrier 1 is slidably installed with a plurality of fixed blocks one 5, the bidirectional screw rod 52 is rotatably connected with the corresponding two fixed blocks one 5.
[0030] In this embodiment, in order to avoid the influence of the setting of the adjusting wheel 53 on the overall size of the device, and at the same time not to affect the normal function of the adjusting wheel 53, a plurality of installation grooves are formed on the rear side of the copper carrier 1, and a plurality of adjusting wheels 53 are respectively located in the corresponding installation grooves.
[0031] In this embodiment, in order to ensure that the multiple conductive tracks 2 are powered through the power connection strip 11, the same number of conductive pieces 12 as the number of conductive tracks 2 are fixedly installed on the two power connection strips 11, and the multiple conductive pieces 12 are respectively in movable abutment with the corresponding conductive tracks 2.
[0032] In this embodiment, in order to ensure stability and safety in a high-temperature environment, the materials of the adjusting wheel 53, the bidirectional screw rod 52, the fixed block one 5, and the fixed block two 51 are high-temperature-resistant insulating ceramics.
[0033] Working principle: in use, first, the bidirectional screw rod 52 is rotated by the adjusting wheel 53, so that the fixed block two 51 drives the front and rear heat source chips 3 to move in reverse synchronously, thereby adjusting the distance between the heat source chips 3, and at the same time, the multiple gear one 42 and the multiple gear two 43 are arranged to ensure that the heat source chips 3 in the same column can move synchronously when the distance is adjusted, keeping the consistency of the distance, which not only improves the accuracy of the adjustment, but also ensures the stability of the heat source chips 3 in a high-temperature working environment.
[0034] When it is necessary to replace part of the heat source chips, the limiting bolt 21 is unscrewed from the screw hole, and then the two sides of the conductive track 2 are rotated based on the corresponding support pin as the center, so that the power connection piece can be separated from the guide groove, and then the fixed block one 5 is controlled to slide along the bottom side of the copper carrier 1 away from the middle conductive track 2 by the adjusting wheel 53 and the bidirectional screw rod 52, so that the whole column of heat source chips 3 can be disassembled, and then the heat source chips 3 that need to be replaced are replaced separately or the whole column of heat source chips 3 is directly replaced, and then installed, and in the disassembly process, the limiting bolt 21 is disassembled in the order from outside to inside, and similarly, the limiting bolt 21 is installed in the order from inside to outside, avoiding unnecessary interference to other heat source chips 3 in the disassembly process, and at the same time, since the power connection strip 11 is in movable abutment with the conductive track 2, the normal power supply of the heat source chips 3 can be ensured after installation is completed.
[0035] Since the materials of the adjusting wheel 53, the bidirectional screw rod 52, the fixed block one 5, and the fixed block two 51 are high-temperature-resistant insulating ceramics, the stable operation of the equipment in a long-time high-temperature working environment is ensured, and the insulation performance avoids the risk of electric shock, improving the operation safety.
[0036] The high heat flow density simulation heat source provided by the utility model is introduced in detail. The principle and implementation mode of the utility model are described by applying specific embodiments, and the above embodiment is only used for helping to understand the method and core idea of the utility model. It should be pointed out that the ordinary skilled in the art can make some improvements and modifications to the utility model without departing from the principle of the utility model, and these improvements and modifications also fall within the protection scope of the utility model claim.
Claims
1. A high heat flux density simulation heat source, characterized by, Copper carrier sheet (1), a plurality of conductive tracks (2), a plurality of heat source chips (3), a plurality of adjusting assemblies and a plurality of limiting assemblies are included. Two power connection strips (11) are fixedly installed on the top side of the copper carrier sheet (1) and arranged in parallel with each other. A plurality of conductive tracks (2) are arranged on the copper carrier sheet (1), and the conductive track (2) located in the middle is fixedly connected with the copper carrier sheet (1). A plurality of support pins are rotatably installed on the plurality of conductive tracks (2) located on both sides, and are fixedly installed on the top side of the copper carrier sheet (1). A plurality of limiting assemblies are arranged on the conductive tracks (2) except for the conductive track (2) located in the middle and connected with the copper carrier sheet (1). A plurality of heat source chips (3) are fixedly installed with two power connection sheets (31). A plurality of guide grooves (22) are formed in the plurality of conductive tracks (2), and the number of the guide grooves (22) in the plurality of conductive tracks (2) located in the middle is two. The two power connection sheets (31) located on the same heat source chip (3) are slidably installed in the corresponding guide grooves (22). The power connection sheets (31) located on the right side of the plurality of heat source chips (3) in the same column are provided with the same transmission assembly. A plurality of guide openings are formed in the copper carrier sheet (1), and a plurality of adjusting assemblies are arranged in the corresponding two guide openings and arranged in parallel with each other. The adjusting assemblies are connected with the front and rear two heat source chips (3) in the same column.
2. The high heat flux density analog heat source of claim 1, wherein: The limiting assembly includes a limiting bolt (21) and a screw hole. A plurality of screw holes are formed in the top side of the copper carrier sheet (1). The limiting bolts (21) are threadedly installed on the sides of the plurality of conductive tracks (2) except for the conductive track (2) located in the middle and away from the support pins. The plurality of limiting bolts (21) are threadedly installed in the corresponding screw holes.
3. The high heat flux density analog heat source of claim 1, wherein: The transmission assembly includes a plurality of support rods (4) and a plurality of rotating pins (41). The rotating pins (41) are rotatably installed on the plurality of power connection sheets (31) located on the right side of the plurality of heat source chips (3) in the same column. The number of the rotating pins (41) located on the plurality of power connection sheets (31) in the middle is two. The support rods (4) are radially fixedly installed on the plurality of rotating pins (41). The ends of the adjacent two support rods (4) are rotatably installed with a fixed pin. The adjacent two fixed pins are rotatably installed with the same support block.
4. The high heat flux density analog heat source of claim 3, wherein: The transmission assembly further includes a plurality of gear wheels one (42) and a plurality of gear wheels two (43). The gear wheels two (43) are fixedly sleeved on the plurality of fixed pins. The two gear wheels two (43) located above the same support block are engaged. The gear wheels one (42) are fixedly sleeved on the plurality of rotating pins (41) located in the middle. The two gear wheels one (42) located on the same power connection sheet (31) are engaged.
5. The high heat flux density analog heat source of claim 1, wherein: The adjusting assembly includes two fixed blocks two (51) and a bidirectional screw rod (52). The bottom sides of the two heat source chips (3) located on the front and rear sides in the same column are fixedly installed with the fixed blocks two (51). The two fixed blocks two (51) are slidably installed in the corresponding guide openings. The bidirectional screw rod (52) is threadedly installed on the two fixed blocks two (51).
6. The high heat flux density analog heat source of claim 5, wherein: The adjusting assembly further comprises an adjusting wheel (53), and the rear end of the bidirectional screw rod (52) is fixedly installed with the adjusting wheel (53).
7. The high heat flux density analog heat source of claim 6, wherein: The adjusting assembly further comprises two fixed blocks one (5), and the bottom side of the copper specimen slide (1) is slidably installed with a plurality of fixed blocks one (5), and the bidirectional screw rod (52) is rotationally connected with the corresponding two fixed blocks one (5).
8. The high heat flux density analog heat source of claim 6, wherein: The rear side of the copper specimen slide (1) is provided with a plurality of installation grooves, and the plurality of adjusting wheels (53) are respectively located in the corresponding installation grooves.
9. The high heat flux density analog heat source of claim 1, wherein: The two power connection strips (11) are fixedly installed with the same number of conductive sheets (12) as the conductive rails (2), and the plurality of conductive sheets (12) are respectively movably abutted against the corresponding conductive rails (2).
10. The high heat flux density analog heat source of claim 7, wherein: The materials of the adjusting wheel (53), the bidirectional screw rod (52), the fixed block one (5) and the fixed block two (51) are high-temperature-resistant insulating ceramics.