Circuit board and intelligent terminal

Abstract

The utility model provides a circuit board and an intelligent terminal, the circuit board comprises a circuit board body and a conductive structure, and at least one side of the circuit board body along the thickness direction of the circuit board is used for installing electronic components; at least part of the conductive structure is arranged on the peripheral side wall of the circuit board body; the conductive structure is used for electrically conducting the electronic component and the circuit board body. Through the arrangement, the space of the circuit board is effectively utilized, and the layer number of the circuit board body and the area of the circuit board are reduced while the integration level of the circuit board is improved, so that the space ratio of the circuit board is reduced. Besides, the conductive structure located on the peripheral side wall of the circuit board body is in contact with external air, so that heat transfer between the conductive structure and the external air is facilitated, the heat dissipation efficiency and effect of the circuit board can be improved, mutual influence between heat generated by connecting lines close to each other is further reduced, and the service life of the circuit board is prolonged. And the electronic components on the circuit board body work stably and reliably.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of electronic circuit, in particular to a circuit board and a smart terminal. BACKGROUND

[0002] With the continuous development of electronic circuit integration technology, higher requirements are put forward for the integration of the circuit board.

[0003] In the process of conceiving and implementing the present application, it is found that in some smart terminals, at least the following problems exist: in some schemes, a connecting line is usually arranged inside the circuit board, and the connecting line inside the circuit board is electrically conducted through a connecting hole. However, with the continuous improvement of the integration of the circuit board, the number of connecting circuits inside the circuit board increases, which leads to an increase in the space ratio of the circuit board.

[0004] The foregoing description is to provide general background information and does not necessarily constitute the prior art. CONTENT OF THE UTILITY MODEL

[0005] In view of the above technical problems, the present application provides a circuit board and a smart terminal, which can improve the integration while reducing the space ratio of the circuit board.

[0006] The present application provides a circuit board, comprising:

[0007] A circuit board body, wherein electronic components are arranged on at least one side of the circuit board body along the thickness direction of the circuit board;

[0008] A conductive structure, at least part of the conductive structure is arranged on the peripheral side wall of the circuit board body; the conductive structure is configured to electrically conduct the electronic components and the circuit board body.

[0009] Optionally, the circuit board has at least one of the following:

[0010] The conductive structure is electroplated on the circuit board body.

[0011] The conductive structure is attached to the circuit board body.

[0012] The conductive structure is embedded in the circuit board body.

[0013] Optionally, the conductive structure comprises a conductive body and a connecting portion, the conductive body is arranged on the peripheral side wall of the circuit board body, and the connecting portion is arranged on at least one side of the circuit board body along the thickness direction of the circuit board;

[0014] The conductive body and the connecting portion are used to electrically conduct the electronic components and the circuit board body.

[0015] Optionally, the connecting portions are at least two, and the at least two connecting portions are located on the same side of the circuit board body in the thickness direction of the circuit board.

[0016] Optionally, the connecting portions include a first connecting portion and a second connecting portion, and the first connecting portion and the second connecting portion are located on opposite sides of the circuit board body in the thickness direction of the circuit board.

[0017] Optionally, the first connecting portion is at least two, and the at least two first connecting portions are arranged in an array on the circuit board body.

[0018] Optionally, the second connecting portion is at least two, and the at least two second connecting portions are arranged in an array on the circuit board body.

[0019] Optionally, the circuit board further includes a protective member, and the protective member covers at least part of the surface of the conductive structure away from the circuit board body.

[0020] Optionally, at least part of the protective member extends to the circuit board body and covers the connection between the conductive structure and the circuit board body.

[0021] Optionally, the electronic component includes a power supply connecting member, and the power supply connecting member is electrically connected to the conductive structure and the circuit board body.

[0022] The present application provides a kind of intelligent terminal, including the circuit board in the first aspect.

[0023] The circuit board and intelligent terminal provided by the present application, the circuit board includes circuit board body and conductive structure, conductive structure is arranged on the circumferential wall of circuit board body, effectively utilize the space of circuit board body, while reducing the number of layers of circuit board and the area of circuit board to reduce the space ratio of circuit board when improving the integration of circuit board.In addition, the conductive structure located on the circumferential wall of circuit board body and external air contact, beneficial to the heat transfer between conductive structure and external air, can improve the heat dissipation efficiency and effect of circuit board.At the same time, reduce the mutual influence between the heat generated by the connecting line close to each other, so that the work of electronic component on the circuit board is stable and reliable.

[0024] In addition to the technical problems solved by the above-described embodiments of the present application, the technical features constituting the technical solutions, and the beneficial effects brought by these technical features, other technical problems solved by the circuit board and intelligent terminal provided by the embodiments of the present application, other technical features included in the technical solutions, and the beneficial effects brought by these technical features will be further described in detail in the specific embodiments. BRIEF DESCRIPTION OF DRAWINGS

[0025] The accompanying drawings, which are incorporated herein and constitute part of the specification, illustrate embodiments consistent with the application and, together with the description, further serve to explain the principles of the application. In order to more clearly illustrate the technical solutions in the embodiments of the application, the drawings needed to be used in the following embodiment description will be briefly introduced. Obviously, the drawings indicated in the following embodiment description only are provided for the purpose of illustration, and for those skilled in the art, other drawings can also be obtained without creative effort.

[0026] Figure 1 A schematic diagram of a circuit board provided for the embodiments of the application;

[0027] Figure 2 An A-A sectional view of the circuit board provided for the embodiments of the application;

[0028] Figure 3 A schematic diagram of a hardware structure of an intelligent terminal for implementing the embodiments of the application.

[0029] Explanation of reference signs:

[0030] 100 - circuit board; 110 - circuit board body; 120 - conductive structure; 121 - conductive body; 122 - connecting portion;

[0031] 500 - intelligent terminal; 501 - radio frequency unit; 502 - WiFi module; 503 - audio output unit; 504 - A / V input unit; 5041 - graphic processor; 5042 - microphone; 505 - sensor; 506 - display unit; 5061 - display panel; 507 - user input unit; 5071 - touch panel; 5072 - other input device; 508 - interface unit; 509 - memory; 510 - processor; 511 - power supply.

[0032] The implementation, functional features and advantages of the application will be further described with reference to the embodiments and the accompanying drawings. Through the above drawings, the explicit embodiments of the application have been shown, and more detailed description will be given hereinafter. These drawings and textual descriptions are not intended to limit the scope of the concept of the application by any means, but to illustrate the concept of the application for those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0033] The exemplary embodiments will be described in detail herein below with reference to the drawings. Unless otherwise indicated, the same numbers on different drawings represent the same or similar elements. The implementations described in the following exemplary embodiments are not meant to represent all implementations consistent with the application. Rather, they are merely examples of apparatus and methods consistent with some aspects of the application as detailed in the appended claims.

[0034] It should be noted that, as used in this document, the terms "include," "includes," "including," "has," "have," "having," or the like, are used in the sense of "including" and not by way of rinse, such that a process, method, article, or apparatus that includes items does not include only those items but can include other items not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element preceded by "comprises a... " does not, without more limitations, foreclose the existence of additional identical elements in the process, method, article, or apparatus that includes the element. Components, features, elements, etc. having the same name or being otherwise identically named in different embodiments can or can not have the same function, structure, or significance in different embodiments, unless expressly indicated otherwise.

[0035] It should be understood that, although the terms first, second, third, etc. can be used herein to describe various information, these terms are not intended to denote a particular order or hierarchy. These terms are used only to distinguish one category of information from another. For example, without departing from the scope hereof, first information can be referred to as second information, and similarly, second information can be referred to as first information. Depending on the context, the word "if' as used herein can be interpreted to mean "when" or "in response to determining" or "in response to a determination." Also, as used herein, the singular forms "a," "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises," "comprising," "includes," "including," "has," "have," "having," and the like, when used herein, specify the presence of stated features, steps, operations, elements, components, items, kinds, and / or groups thereof, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, items, kinds, and / or groups thereof. The term "or," "and / or," "including at least one of," and the like as used herein are to be interpreted as inclusive or meaning any one or any combination. For example, "including at least one of: A; B; or C" means "A; B; C; A and B; A and C; B and C; or A and B and C." As another example, "A, B, or C" or "A, B, and / or C" means "A; B; C; A and B; A and C; B and C; or A and B and C." Only under certain modes of operation will this definition not apply. Only under certain modes of operation will this definition not apply.

[0036] It should be understood that, although the steps in the flowcharts in the embodiments of the present application are shown in sequence according to the arrows, the steps are not necessarily executed in sequence according to the arrows. Unless otherwise specified herein, the execution of the steps is not strictly limited in sequence, and the steps can be executed in other sequences. Moreover, at least part of the steps in the figures can include multiple sub-steps or multiple stages, which are not necessarily executed at the same time, but can be executed at different times, and the execution sequence is not necessarily sequential, but can be alternately executed with at least part of other steps or sub-steps or stages of other steps.

[0037] Depending on context, the word "if" as used herein can be interpreted as meaning "when" or "while" or "in response to determining" or "in response to detecting". Similarly, depending on context, the phrase "if it is determined" or "if (a stated condition or event) is detected" can be interpreted as meaning "when it is determined" or "in response to determining" or "when (a stated condition or event) is detected" or "in response to detecting (a stated condition or event)".

[0038] Depending on context, the word "if" as used herein can be interpreted as meaning "when" or "while" or "in response to determining" or "in response to detecting". Similarly, depending on context, the phrase "if it is determined" or "if (a stated condition or event) is detected" can be interpreted as meaning "when it is determined" or "in response to determining" or "when (a stated condition or event) is detected" or "in response to detecting (a stated condition or event)".

[0039] It should be understood that the specific embodiments described herein merely exemplify the application and should not be used to limit the application.

[0040] In the following description, the suffixes such as "module", "part", or "unit" used for an element are merely intended for facilitating explanation of the application and do not have specific meanings or functions themselves. Thus, "module", "part", or "unit" can be used interchangeably.

[0041] In conjunction with Figure 1 and Figure 2 , the present application provides a circuit board 100, which is a printed circuit board (PCB). The circuit board 100 includes a circuit board body 110, at least one side of the circuit board body 110 along a P direction for mounting electronic components.

[0042] Optionally, referring to Figure 2 , the thickness direction of the circuit board 100 is the P direction. In some embodiments, the circuit board body 110 has opposite first and second surfaces along the P direction. The first surface can be used for mounting electronic components. The circuit board body 110 has a connection line inside to electrically connect the electronic components on the first surface. Optionally, the second surface can be used for mounting electronic components, and the electronic components on the second surface are electrically connected to the connection line inside the circuit board body 110.

[0043] Optionally, the first surface and the second surface can be provided with electronic components, the electronic components on the first surface and the connecting lines inside the circuit board body 110 are electrically connected, the electronic components on the second surface can be electrically connected through the connecting lines inside the circuit board body 110, and the electronic components on the first surface and the second surface are electrically connected through the connecting lines inside the circuit board body 110.

[0044] Optionally, the connecting lines inside the circuit board body 110 can be electrically connected through the connecting holes. As the integration of the circuit board 100 improves, when the structure size of the circuit board 100 is fixed, the number of connecting lines inside the circuit board body 110 increases, and the number of connecting holes on the circuit board body 110 also increases, which will cause the accommodation area of the circuit board 100 to decrease.

[0045] In order to improve the integration of the circuit board 100 and the number of connecting lines, it is necessary to increase the area of the circuit board body 110, so that the circuit board body 110 can accommodate more connecting lines by increasing the area of the circuit board body 110. Or by increasing the layers of the circuit board body 110, so that different connecting lines are distributed on different layers of the circuit board body 110, and the connecting lines of different layers are electrically connected through the connecting holes. It is not difficult to understand that the increase of the area of the circuit board body 110 and the increase of the layers of the circuit board body 110 will cause the space ratio of the circuit board 100 to rise.

[0046] For some circuit boards 100 with limited installation conditions, the number of connecting lines inside the circuit board body 110 needs to be increased, and only the spacing between the connecting lines inside the circuit board body 110 can be reduced to accommodate more connecting lines.

[0047] However, the connecting lines will generate heat after being powered on, and the heat of each connecting line is concentrated inside the circuit board body 110 and is difficult to dissipate, which can easily cause the local temperature of the circuit board 100 to rise. In addition, the heat of the connecting lines close to each other will affect each other, which can easily cause the stability and reliability of the electronic components connected by the connecting lines to decrease.

[0048] To solve the above problems, the circuit board 100 in the present application further comprises a conductive structure 120, and at least part of the conductive structure 120 is arranged on the circumferential wall of the circuit board body 110. In this way, the conductive structure 120 forms part of the circuit of the circuit board 100, the electronic components are arranged on the first surface and / or the second surface, and the electronic components are electrically connected through the conductive structure 120 and the circuit board body 110.

[0049] In the embodiments of the present application, the conductive structure 120 is arranged on the peripheral side wall of the circuit board 100, so that part of the connection lines in the circuit board 100 can be arranged on the peripheral side wall of the circuit board body 110, so as to utilize the peripheral space of the circuit board body 110 and improve the integration of the circuit board 100.

[0050] Optionally, the conductive structure 120 is in contact with the external air, which is conducive to heat transfer between the conductive structure 120 and the external air, and the heat can be quickly dissipated. At the same time, the reduction of heat in the circuit board 100 can reduce the current interference and heat influence between the connection lines close to each other, improve the stability of the electrical connection between the circuit board body 110 and the electronic components, and improve the working reliability of the circuit board body 110 and the electronic components. At the same time, the number of layers of the circuit board 100 can be reduced, the space occupancy of the circuit board 100 can be reduced, and the cost of the circuit board 100 can be reduced.

[0051] Optionally, the circuit board 100 in the embodiments of the present application can be a multi-layer board, and the number of layers of the circuit board 100 is not specifically required in the present application.

[0052] Optionally, at least part of the conductive structure 120 is arranged on the peripheral side wall of the circuit board body 110. For example, the conductive structure 120 can be arranged on the peripheral side wall of at least one side of the circuit board body 110 in any direction. All of the conductive structures 120 can be located on the peripheral side wall of the circuit board body 110, or part of the conductive structures 120 are located on the peripheral side wall of the circuit board body 110, and part of the conductive structures 120 are located on at least one side of the circuit board body 110 in the P direction.

[0053] In some embodiments, the conductive structure 120 includes a conductive body 121 arranged on the peripheral side wall of the circuit board body 110. Optionally, the orthogonal projection of the conductive body 121 on the corresponding peripheral side wall of the circuit board body 110 is covered by the corresponding peripheral side wall of the circuit board body 110. Optionally, the side edges of the conductive body 121 in each direction are flush with the corresponding side edges of the circuit board body 110.

[0054] Optionally, in the P direction, the two side edges of the conductive body 121 are between the two side edges of the circuit board 100. The area of the conductive body 121 on the circuit board body 110 can be selected according to the current size of the formed via in actual use.

[0055] In some embodiments, the conductive structure 120 can further include a connecting portion 122 connected and electrically connected with the conductive body 121. Optionally, the connecting portion 122 can be arranged only on the first surface of the circuit board body 110, and can also be arranged only on the second surface of the circuit board body 110.

[0056] Optionally, the connecting portion 122 can be arranged on both the first surface and the second surface of the circuit board body 110. In this way, the electronic components, the connecting portion 122 and the conductive body 121 are electrically connected.

[0057] In the embodiments of the present application, the connecting portion 122 is arranged on the first surface and / or the second surface to electrically connect more electronic components and improve the integration of the circuit board 100. The electronic components on the first surface and / or the second surface are further electrically connected to the conductive body 121. In this way, part of the connecting lines in the circuit board body 110 are arranged on the peripheral side wall of the circuit board body 110 through the conductive structure 120, which facilitates the layout of the connecting lines in the circuit board body 110. The connecting portion 122 in the conductive structure 120 increases the heat dissipation area of the conductive structure 120 and improves the heat dissipation effect of the circuit board 100.

[0058] Optionally, the arrangement of the connecting portion 122 can reduce the number of connecting holes on the circuit board body 110, increase the effective design area of the circuit board 100, improve the utilization rate of the layout space inside the circuit board body 110, and further improve the integration of the circuit board 100.

[0059] In some embodiments, the connecting portion 122 can be at least two, and the at least two connecting portions 122 are located on the same side of the circuit board body 110 along the thickness direction of the circuit board 100.

[0060] Optionally, the connecting portion 122 can be two, and the two connecting portions 122 can be located on the first surface or the second surface of the circuit board body 110. Optionally, the connecting portion 122 can be three, of which two connecting portions 122 are located on the first surface or the second surface, and the other connecting portion 122 is located on the second surface or the first surface.

[0061] In the embodiments of the present application, the connecting portion 122 is concentrated on one side of the circuit board body 110 as much as possible, which facilitates the layout of the circuit board 100 and improves the overall design flexibility of the circuit board 100. In addition, the connecting portion 122 is concentrated on one side of the circuit board 100 to simplify the manufacturing and assembly process of the circuit board 100, so that the welding or installation of multiple electronic components can be completed in the same mounting process.

[0062] In some embodiments, the connecting portion 122 includes a first connecting portion, and the first connecting portion is located on the first surface of the circuit board body 110. A second connecting portion is located on the second surface of the circuit board body 110. Optionally, the first connecting portion and the second connecting portion are located on opposite sides of the circuit board body 110 along the thickness direction of the circuit board 100, which can reduce signal interference and crosstalk to help improve signal integrity; and the opposite sides of the circuit board body 110 can be installed with electronic components, which can improve the integration and functional density of the circuit board 100.

[0063] In some embodiments, the first connecting portion can be at least two, the at least two first connecting portions are arranged in an array on the first surface, and each first connecting portion is in electrical conduction with the conductive body 121, so that the first surface of the circuit board body 110 is connected to more electronic components through the conductive structure 120, so as to improve the integration of the circuit board 100.

[0064] In some embodiments, the second connecting portion can be at least two, the at least two second connecting portions are arranged in an array on the second surface, and each second connecting portion is in electrical conduction with the conductive body 121, so that the second surface of the circuit board body 110 is connected to more electronic components through the conductive structure 120, further improving the integration of the circuit board 100.

[0065] Optionally, the first connecting portion and the second connecting portion can be arranged on the corresponding first surface and second surface at the same time. The number of the first connecting portion and the second connecting portion is not specifically required in the embodiments of the present application.

[0066] Optionally, the plurality of electronic components are in electrical conduction with the conductive structure 120. Each electronic component generates heat when working. The connecting portion 122 is in electrical connection and thermal conduction with the conductive body 121. Thus, the heat conduction between the conductive structure 120 and the external air is improved, the temperature concentration on the circuit board 100 is prevented, the local overheating of the circuit board 100 is reduced, the safety and reliability of the circuit board 100 are further improved, and the service life of the circuit board 100 is prolonged.

[0067] In some embodiments, the circuit board 100 further comprises a protective member (not shown in the figure), which covers the surface of the conductive structure 120 away from the circuit board body 110.

[0068] Optionally, the protective member can be an insulating member, which covers the surface of the conductive structure 120 away from the circuit board body 110. Thus, the conductive structure 120 can avoid electrical conduction with other components of the device after contacting each other during use, and the electrical connection safety and stability between the circuit board 100 and the external device are improved.

[0069] In some embodiments, the protective member can also be a waterproof member, which can cover the outer surface of the conductive structure 120. In the actual use of the conductive structure 120, the protective member can prevent external water vapor from causing short circuit of the conductive structure 120, and improve the electrical connection safety and reliability of the circuit board 100.

[0070] In some embodiments, at least part of the protective member extends to the circuit board body 110 and covers the connection between the conductive structure 120 and the circuit board body 110.

[0071] In the embodiments of the present application, the protective member covers the connection between the conductive structure 120 and the circuit board body 110, which can reduce the accidental conduction between the circuit board 100 and the outside and the water inlet at the connection between the conductive structure 120 and the circuit board body 110, and further ensure the electrical connection safety and reliability of the circuit board 100.

[0072] Optionally, the protective member in the embodiments of the present application can only cover the connection between the conductive structure 120 and the circuit board body 110. The protective member can also cover the connection between the conductive structure 120 and the circuit board body 110 and the side of the conductive body 121 away from the circuit board body 110. For this, the embodiments of the present application do not make specific requirements.

[0073] Optionally, various different connection modes between the conductive structure 120 and the circuit board body 110 are described.

[0074] In the process of designing the connection circuit of the circuit board 100, the connection circuit can only be designed on a two-dimensional plane, that is, the connection circuit can only be arranged on the opposite surfaces of each layer of the circuit board body 110 along the thickness direction of the circuit board 100. It is difficult to design the conductive structure 120 on the peripheral side wall of the circuit board body 110 by software, and it can be understood that it is also difficult to process the conductive structure 120 on the peripheral side wall of the circuit board body 110 on the processing production line of the circuit board 100.

[0075] In some embodiments, the conductive structure 120 can be electroplated on the circuit board body 110. In this way, the conductive structure 120 can form a uniform hierarchical conductive structure 120 on the circuit board body 110, which can reduce the resistance and improve the overall conductive performance of the circuit board 100. In addition, such a hierarchical conductive structure 120 will not cause the overall space ratio of the circuit board 100 to increase on the basis of meeting the electrical conduction.

[0076] Optionally, the conductive structure 120 in the embodiments of the present application can use corrosion-resistant metal materials, such as copper and gold, when electroplating, which can protect the circuit board 100 from corrosion by environmental factors (such as moisture and chemicals), and prolong the service life of the circuit board 100. The electrical conductivity of copper and gold is relatively stable, so that the electronic components of the circuit board 100 running through the conductive structure 120 are stable and reliable.

[0077] In other embodiments, the conductive structure 120 can be attached to the circuit board body 110.

[0078] In the process of producing the circuit board 100, the circuit board body 110 can be mounted on the circuit board body 110 through a surface mount technology (SMT) so as to stabilize the connection between the conductive structure 120 and the circuit board body 110. In addition, the surface mount technology can be completed through a highly automated device, which can improve the production efficiency of the circuit board 100 and the consistency of the assembly of the circuit board 100.

[0079] In some embodiments, the conductive structure 120 can also be embedded in the circuit board body 110.

[0080] Optionally, the circuit board body 110 can be provided with a containing structure, such as a groove, a hole, etc., on the circumferential side wall, so as to accommodate the conductive structure 120 through the containing structure, so that the conductive structure 120 is connected to the circuit board body 110 in an embedded manner.

[0081] For some multi-layer boards, the multi-layer boards are sequentially stacked along the thickness direction of the circuit board 100, and the circuit board body 110 is formed through a pressing process. In the process of pressing the multi-layer boards, the conductive structure 120 can be previously placed on the circumferential side of each layer board. In the process of pressing and molding the multi-layer boards, the conductive structure 120 is embedded in the circuit board body 110.

[0082] In some embodiments, the electronic component includes a power supply connecting piece, which is electrically connected to the conductive structure 120 and the circuit board body 110.

[0083] Optionally, the conductive structure is connected to the power supply through the power supply connecting piece, forming a power supply path. In the process of using the circuit board 100, the conductive structure 120 on the circumferential side of the circuit board body 110 forms heat conduction with the external air, so as to conduct the heat generated in the conductive structure 120 to the external air, which can reduce the local overheating of the conductive structure 120 in use, improve the heat dissipation performance of the circuit board 100, further ensure the safety and reliability of the circuit board 100, and bring good user experience.

[0084] Optionally, when the circuit board 100 is connected with the external power supply, a connecting hole needs to be arranged on the circuit board 100, and further, in order to meet the overcurrent requirement and heat dissipation requirement of the power supply, the aperture of the connecting hole on the circuit board 100 needs to be relatively large, which will result in that the available space of the circuit board 100 is reduced, and the area of the circuit board 100 and / or the level of the circuit board 100 is increased, that is, the space ratio of the circuit board 100 is increased. In the embodiment of the present application, the electrically-conductive structure 120 is connected with the power supply through the power supply connecting piece, which can meet the overcurrent performance requirement and heat dissipation requirement of the power supply. At the same time, the number of the connecting holes on the circuit board body 110 is reduced, the space utilization of the circuit board 100 is improved, and the integration of the circuit board 100 is further improved.

[0085] Optionally, in the process of using the power supply, because the overcurrent of the power supply is large, the heat generated by the power supply is large. In the embodiment of the present application, the electrically-conductive structure 120 is arranged on the circumferential side wall of the circuit board body 110, which can improve the heat dissipation efficiency and heat dissipation effect of the power supply path, and reduce the influence of the heat generated by the power supply path on other connection lines in the circuit board body 110, and improve the electrically-conductive and working stability and reliability of each electronic component on the circuit board 100.

[0086] The circuit board 100 provided by the embodiment of the present application comprises a circuit board body 110 and an electrically-conductive structure 120. The circuit board body 110 is used for mounting electronic components along at least one side of the thickness direction of the circuit board 100; at least part of the electrically-conductive structure 120 is arranged on the circumferential side wall of the circuit board body 110; and the electrically-conductive structure 120 is used for electrically conducting the electronic components and the circuit board body 110. In this way, the connection lines of the circuit board body 110 can be arranged on the circumferential side wall of the circuit board body 110 through the electrically-conductive structure 120, which can improve the integration of the circuit board 100 while reducing the number of layers of the circuit board 100 and the area of the circuit board 100, so as to reduce the space ratio of the circuit board 100. In addition, the electrically-conductive structure 120 on the circumferential side wall of the circuit board body 110 is in contact with the external air, which is beneficial to the heat transfer between the electrically-conductive structure 120 and the external air, can improve the heat dissipation efficiency and effect of the circuit board 100, reduce the mutual influence between the heat generated by the connection lines close to each other, and make the electronic components on the circuit board 100 work stably and reliably.

[0087] Optionally, the embodiment of the present application can also provide a smart terminal 500 comprising the circuit board 100 in any of the preceding embodiments.

[0088] The smart terminal 500 in the embodiment of the present application comprises the circuit board 100 in any of the preceding embodiments. Through the circuit board 100 in the embodiment of the present application, the integration of the circuit board 100 in the smart terminal 500 can be improved, and the space ratio of the smart terminal 500 can be reduced.

[0089] In some embodiments, the smart terminal can be implemented in various forms. For example, the smart terminal described in the present application can include a smart terminal such as a smartphone, a tablet computer, a notebook computer, a palmtop computer, a personal digital assistant (PDA), a portable media player (PMP), a navigation device, a wearable device, a smart band, a pedometer, and the like, and a fixed terminal such as a digital TV, a desktop computer, and the like.

[0090] Referring to FIG. 5, Figure 3 The smart terminal 500 can include an RF (Radio Frequency) unit 501, a WiFi module 502, an audio output unit 503, an A / V (audio / video) input unit 504, a sensor 505, a display unit 506, a user input unit 507, an interface unit 508, a memory 509, a processor 510, and a power supply 511, and the like. Those skilled in the art will appreciate that the smart terminal structure shown in FIG. 5 does not constitute a limitation on the smart terminal 500, and the smart terminal 500 can include more or less components than those shown in the drawing, or combine certain components, or arrange the components differently. Figure 3 Those skilled in the art will appreciate that the smart terminal structure shown in FIG. 5 does not constitute a limitation on the smart terminal 500, and the smart terminal 500 can include more or less components than those shown in the drawing, or combine certain components, or arrange the components differently.

[0091] Hereinafter, the components of the smart terminal 500 will be described in detail. Figure 3

[0092] ​The radio frequency unit 501 can be used for receiving and sending signals in the process of information or communication. Specifically, after receiving the downlink information of the base station, the radio frequency unit 501 processes the information for the processor 510. In addition, the radio frequency unit 501 sends the uplink data to the base station. Generally, the radio frequency unit 501 includes, but is not limited to, an antenna, at least one amplifier, a transceiver, a coupler, a low noise amplifier, a duplexer, etc. In addition, the radio frequency unit 501 can also communicate with the network and other devices through wireless communication. The above wireless communication can use any communication standard or protocol, including but not limited to GSM (Global System for Mobile Communication), GPRS (General Packet Radio Service), CDMA2000 (Code Division Multiple Access 2000), WCDMA (Wideband Code Division Multiple Access), TD-SCDMA (Time Division-Synchronous Code Division Multiple Access), FDD-LTE (Frequency Division Duplexing-Long Term Evolution), TDD-LTE (Time Division Duplexing-Long Term Evolution), 5G, etc.

[0093] The WiFi belongs to a short-distance wireless transmission technology. The WiFi module 502 can help the user to send and receive e-mails, browse web pages, and access streaming media, etc. It provides the user with wireless broadband Internet access. Although Figure 3 The WiFi module 502 is shown, but it can be understood that it does not belong to the essential components of the smart terminal 500, and can be omitted according to the needs without changing the essence of the application.

[0094] The audio output unit 503 can convert audio data received by the radio frequency unit 501 or the WiFi module 502 or stored in the memory 509 into an audio signal and output it as a sound when the smart terminal 500 is in a call signal receiving mode, a talk mode, a recording mode, a voice recognition mode, a broadcast receiving mode, etc. Moreover, the audio output unit 503 can also provide audio output related to a specific function performed by the smart terminal 500 (e.g., a call signal receiving sound, a message receiving sound, etc.). The audio output unit 503 can include a speaker, a buzzer, etc.

[0095] The A / V input unit 504 is configured to receive audio or video signals. The A / V input unit 504 can include a graphics processor (GPU) 5041 and a microphone 5042. The graphics processor 5041 processes image data of a still picture or a video obtained by an image capture device (e.g., a camera) in a video capture mode or an image capture mode. Processed image frames can be displayed on the display unit 506. Processed image frames can be stored in the memory 509 (or other storage medium) or transmitted via the radio frequency unit 501 or the WiFi module 502. The microphone 5042 can receive sound (audio data) via the microphone 5042 in a telephone call mode, a recording mode, a voice recognition mode, or the like, and can process such sound into audio data. Processed audio (voice) data can be converted into a format that can be transmitted to a mobile communication base station via the radio frequency unit 501 in the case of the telephone call mode. The microphone 5042 can implement various types of noise cancellation (or suppression) algorithms to cancel (or suppress) noise or interference generated in the process of receiving and transmitting audio signals.

[0096] The intelligent terminal 500 further includes at least one sensor 505, such as a light sensor, a motion sensor, and other sensors. Optionally, the light sensor includes an ambient light sensor and a proximity sensor. The ambient light sensor can adjust the brightness of the display panel 5061 according to the brightness of ambient light. The proximity sensor can turn off the display panel 5061 and / or the backlight when the intelligent terminal 500 is moved to the ear. As one of the motion sensors, the accelerometer sensor can detect the magnitude of acceleration in each direction (generally three axes), and can detect the magnitude and direction of gravity when at rest. The accelerometer sensor can be used in applications for identifying the posture of the mobile phone (such as switching between landscape and portrait screens, related games, and magnetometer posture calibration), vibration recognition related functions (such as a pedometer and tapping), and the like. The intelligent terminal 500 can also be configured with a fingerprint sensor, a pressure sensor, an iris sensor, a molecular sensor, a gyroscope, a barometer, a hygrometer, a thermometer, an infrared sensor, and other sensors, which are not described herein.

[0097] The display unit 506 is configured to display information input by a user or information provided to the user. The display unit 506 can include a display panel 5061, which can be configured in the form of a liquid crystal display (LCD), an organic light-emitting diode (OLED), or the like.

[0098] The user input unit 507 can be configured to receive input digital or character information, and to generate key signal input with respect to user's setting and function control of the intelligent terminal 500.

[0099] Optionally, the user input unit 507 can include a touch panel 5071 and other input devices 5072. The touch panel 5071, also called touch screen, can collect user's touch operation (such as user's operation on or near the touch panel 5071 using finger, stylus or any suitable object or accessory) and drive corresponding connection device according to pre-set program. The touch panel 5071 can include two parts: touch detection device and touch controller.

[0100] Optionally, the touch detection device detects user's touch position and the signal caused by touch operation, and transmits the signal to the touch controller; the touch controller receives touch information from the touch detection device, converts it into touch coordinates and sends it to the processor 510, and can also receive command from the processor 510 and execute it. In addition, the touch panel 5071 can be implemented in various types such as resistive, capacitive, infrared and surface acoustic wave. In addition to the touch panel 5071, the user input unit 507 can also include other input devices 5072. Optionally, the other input devices 5072 can include but not limited to one or more of physical keyboard, function key (such as volume control button, on-off button, etc.), trackball, mouse, joystick, etc., which are not limited here.

[0101] Optionally, the touch panel 5071 can cover the display panel 5061, and when the touch panel 5071 detects touch operation on or near it, it transmits to the processor 510 to determine the type of touch event, and then the processor 510 provides corresponding visual output on the display panel 5061 according to the type of touch event. Although in the above embodiment, the touch panel 5071 and the display panel 5061 are realized as two independent components to achieve the input and output functions of the intelligent terminal 500, in some embodiments, the touch panel 5071 and the display panel 5061 can be integrated to achieve the input and output functions of the intelligent terminal 500, which are not limited here. Figure 3

[0102] ​The interface unit 508 serves as an interface through which at least one external device can be connected to the intelligent terminal 500. For example, the external device can include a wired or wireless headset port, an external power supply (or battery charger) port, a wired or wireless data port, a memory card port, a port for connecting a device having an identification module, an audio input / output (I / O) port, a video I / O port, an earphone port, and the like. The interface unit 508 can be used to receive input (e.g., data information, power, and the like) from an external device and transfer the received input to one or more elements within the intelligent terminal 500 or can be used to transfer data between the intelligent terminal 500 and an external device.

[0103] The memory 509 can be used to store software programs as well as various data. The memory 509 can include a program storage area and a data storage area, and the program storage area can store, for example, an operating system, application programs (e.g., a sound play function, an image play function, and the like) required for at least one function, and the like, and the data storage area can store, for example, data created according to a use of the mobile phone (e.g., audio data, a phonebook, and the like), and the like. In addition, the memory 509 can include a high-speed random access memory, and can further include a nonvolatile memory such as at least one of a magnetic disk storage device, a flash memory device, or other non-volatile solid state storage device.

[0104] The processor 510 is a control center of the intelligent terminal 500, which connects all parts of the intelligent terminal 500 through various interfaces and lines, performs various functions of the intelligent terminal 500 and processes data by running or executing software programs and / or modules stored in the memory 509 and calling data stored in the memory 509, and thus monitors the entire intelligent terminal 500. The processor 510 can include one or more processing units, and preferably, the processor 510 can integrate an application processor and a modem processor, and the application processor can mainly process an operating system, a user interface, and application programs, and the like, and the modem processor can mainly process wireless communication. It can be understood that the above-described modem processor can also not be integrated into the processor 510.

[0105] The intelligent terminal 500 can further include a power supply 511 (e.g., a battery) for supplying power to each component, and preferably, the power supply 511 can be logically connected to the processor 510 through a power management system, so that the power management system can perform functions of managing charging, discharging, and power consumption management, and the like.

[0106] Although Figure 3 The intelligent terminal 500 can further include a Bluetooth module, and the like, which are not shown.

[0107] In some embodiments, the circuit board 100 can be a main board of the intelligent terminal 500, and can serve to carry electronic components such as the target storage chip, the processor chip, and the power management chip, and to realize electrical connection between the target storage chip, the processor chip, and the power management chip.

[0108] It can be understood that the above scenarios are only examples and do not constitute a limitation on the application scenarios of the technical solutions provided by the embodiments of the present application. The technical solutions provided by the embodiments of the present application can also be applied to other scenarios. For example, those skilled in the art can know that, with the evolution of system architecture and the emergence of new business scenarios, the technical solutions provided by the embodiments of the present application are also applicable to similar technical problems.

[0109] The above sequence numbers of the embodiments of the present application are only for description, and do not represent the advantages and disadvantages of the embodiments.

[0110] The units in the device of the embodiments of the present application can be combined, divided, and deleted according to actual needs.

[0111] In the present application, for the same or similar term concept, technical solution and / or application scenario description, generally only the first time is described in detail, and the repeated description is not repeated in the following, in order to be brief, when understanding the technical solutions and the like of the present application, for the same or similar term concept, technical solution and / or application scenario description and the like which are not described in detail, the relevant description can be referred to the previous description. In addition, the description of each embodiment in the present application is different, and the part which is not described or recorded in a certain embodiment can be referred to the relevant description of other embodiments.

[0112] The technical features of the technical solutions of the present application can be combined arbitrarily, in order to make the description simple, the combination of each technical feature in the above embodiments is not described, however, as long as the combination of these technical features does not exist contradiction, it should be considered that the range is recorded in the present application.

[0113] Finally, it should be pointed out that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the above embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the above embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A circuit board, characterized in that, include: A circuit board body (110) is provided with electronic components on at least one side along the thickness direction of the circuit board (100); A conductive structure (120), at least a portion of which is disposed on the peripheral sidewall of the circuit board body (110); the conductive structure (120) is configured to electrically conduct the electronic components and the circuit board body (110).

2. The circuit board according to claim 1, characterized in that, Includes at least one of the following: The conductive structure (120) is electroplated on the circuit board body (110); The conductive structure (120) is attached to the circuit board body (110); The conductive structure (120) is embedded in the circuit board body (110).

3. The circuit board according to claim 1 or 2, characterized in that, The conductive structure (120) includes a conductive body (121) and a connecting portion (122). The conductive body (121) is disposed on the peripheral sidewall of the circuit board body (110), and the connecting portion (122) is disposed on at least one side of the circuit board body (110) along the thickness direction of the circuit board (100). The conductive body (121) and the connecting part (122) are configured to electrically connect the electronic components and the circuit board body (110).

4. The circuit board according to claim 3, characterized in that, There are at least two connecting portions (122), and at least two of the connecting portions (122) are located on the same side of the circuit board body (110) along the thickness direction of the circuit board (100).

5. The circuit board according to claim 4, characterized in that, The connecting portion (122) includes a first connecting portion and a second connecting portion, which are located on opposite sides of the circuit board body (110) along the thickness direction of the circuit board (100).

6. The circuit board according to claim 5, characterized in that, The first connection portion includes at least two, and the at least two first connection portions are arranged in an array on the circuit board body (110); and / or, The second connection portion includes at least two, and the at least two second connection portions are arranged in an array on the circuit board body (110).

7. The circuit board according to claim 1 or 2, characterized in that, The circuit board also includes a protective element that covers at least a portion of the surface of the conductive structure (120) facing away from the circuit board body (110).

8. The circuit board according to claim 7, characterized in that, At least a portion of the protective element extends to the circuit board body (110) and covers the connection between the conductive structure (120) and the circuit board body (110).

9. The circuit board according to claim 1 or 2, characterized in that, The electronic component includes a power connector, which is electrically connected to the conductive structure (120) and the circuit board body (110).

10. A smart terminal, characterized in that, Includes the circuit board (100) as described in any one of claims 1 to 9.

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