Radiating device for domain control product

The heat dissipation device, with its dual-channel coupling design, utilizes parallel airflow and duct cover structure to solve the problem of limited heat dissipation effect of traditional heat dissipation devices, achieving efficient removal of internal and external heat and improving heat dissipation efficiency.

CN223758644UActive Publication Date: 2026-01-02NINGBO JUNSHENG INTELLIGENT AUTOMOBILE TECH RES INST CO LTD
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Patent Information

Application Number
CN202522260708.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-10-27
Publication Date
2026-01-02
Estimated Expiration
2035-10-27

AI Technical Summary

Technical Problem

Traditional heat dissipation devices have a single conduction path, relying solely on air cooling to remove high-temperature gases from the product's interior, resulting in limited heat dissipation effectiveness.

Method used

The heat dissipation device adopts a dual-channel coupling design, including a first heat dissipation duct and a second heat dissipation duct. The air-cooling device generates a first air force and a second air force at the first air outlet. The first air force passes through the housing space along the first heat dissipation duct and carries away the internal heat. The second air force passes through the channel between the heat dissipation fins along the second heat dissipation duct and carries away the external surface heat. A semi-enclosed chimney-like structure is formed by setting an air duct cover to improve the airflow velocity.

Benefits of technology

It achieves dual-purpose airflow, reduces turbulence loss and local resistance, improves heat dissipation efficiency, and enhances heat dissipation effect.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a domain control product heat radiation device, comprising a heat radiation housing, an accommodating space is arranged in the heat radiation housing, a first air port and a second air port which are oppositely arranged are arranged on the heat radiation housing, and the first air port, the accommodating space and the second air port are communicated to form a first heat radiation air channel; a plurality of heat dissipation fins are arranged on the outer surface of the heat dissipation shell, a heat dissipation channel is arranged between every two adjacent heat dissipation fins, and the first air opening is communicated with at least one heat dissipation channel to form a second heat dissipation air channel; and the air cooling device is arranged at the first air opening, the air cooling device applies first wind power towards the second air opening from the first air opening to the containing space, and the air cooling device applies second wind power towards the heat dissipation channel from the first air opening to at least one heat dissipation channel. The technical problems that a traditional heat dissipation device is single in conduction path, high-temperature gas in the inner space of a product is removed through wind power only through an air cooling device, and the heat dissipation effect is limited are solved.
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Description

TECHNICAL FIELD

[0001] The utility model relates to a heat dissipation device technical field, specifically, a domain control product heat dissipation device. BACKGROUND

[0002] In modern computers and domain control products, the heat dissipation problem has been a key technical problem. Especially in the case of high power operation and high performance demand, how to effectively dissipate heat has become a key factor to improve system reliability and prolong service life. The traditional heat dissipation method usually relies on heat dissipation fins and heat sinks to reduce the heat accumulation inside the device by using convection and heat conduction.

[0003] However, the related art has at least one of the following problems: the traditional heat dissipation device has a single conduction path, and only the high-temperature gas in the internal space of the product is removed by the air cooling device, and the heat dissipation effect is limited. UTILITY MODEL CONTENT

[0004] The utility model solves the technical problem that the traditional heat dissipation device has a single conduction path, and only the high-temperature gas in the internal space of the product is removed by the air cooling device, and the heat dissipation effect is limited.

[0005] To solve the above problems, the utility model provides a domain control product heat dissipation device, which comprises: a heat dissipation shell, the heat dissipation shell is provided with an accommodating space, and the heat dissipation shell is provided with a first air port and a second air port arranged oppositely, the first air port, the accommodating space and the second air port are communicated to form a first heat dissipation air duct; the outer surface of the heat dissipation shell is provided with a plurality of heat dissipation fins, and a heat dissipation channel is arranged between adjacent heat dissipation fins, the first air port is communicated with at least one heat dissipation channel to form a second heat dissipation air duct; an air cooling device is arranged at the first air port, the air cooling device applies a first air force from the first air port to the second air port to the accommodating space, and the air cooling device applies a second air force from the first air port to the heat dissipation channel to at least one heat dissipation channel.

[0006] Compared with the prior art, the technical effects achieved by the technical scheme are: through the double-channel coupling design of the first heat dissipation air duct and the second heat dissipation air duct, the traditional internal air blowing and external fin air blowing two heat dissipation paths are integrated in one action of the air cooling device, and one air is used for two purposes. The air cooling device generates the first air force and the second air force at the first air port at the same time, the first air force passes through the accommodating space along the first heat dissipation air duct, and carries away the heat of the heat source inside the heat dissipation shell; at the same time, the second air force passes through the heat dissipation channel between the heat dissipation fins along the second heat dissipation air duct, and carries away the heat on the outer surface of the heat dissipation shell.

[0007] In one example of the utility model, the first heat dissipation air duct and the second heat dissipation air duct have the same extension direction.

[0008] Compared with the prior art, the technical effects reached by adopting the technical scheme are: the first heat dissipation air duct and the second heat dissipation air duct are arranged to extend in the same direction, so that the air flow generated by the air cooling device is consistent in direction in the two air ducts, and the air flow forms a "parallel connection in the same direction". The design reduces the turbulent flow loss and local resistance of the air flow at the bifurcation and convergence.

[0009] In one example of the utility model, further include: air duct cover, air duct cover is capped in the heat dissipation passage that forms second heat dissipation air duct is away from the one side of heat dissipation shell.

[0010] Compared with the prior art, the technical effects reached by adopting the technical scheme are: by setting up the air duct cover, the heat dissipation passage forms a semi-closed "chimney" structure, which can prevent the air flow from escaping too early, and improve the air flow speed.

[0011] In one example of the utility model, further include: heat dissipation assembly, heat dissipation assembly is arranged in the containing space, and is embedded in the side of heat dissipation shell that is provided with heat dissipation fins.

[0012] Compared with the prior art, the technical effects reached by adopting the technical scheme are: the heat dissipation assembly is arranged inside the containing space, and the heat dissipation assembly is embedded on the side of the heat dissipation shell provided with the heat dissipation fins, so that the heat can be rapidly spread to the surface of the shell through the heat dissipation assembly, and then heat exchanged with the external air flow through the heat dissipation fins, greatly increasing the heat dissipation efficiency.

[0013] In one example of the utility model, the heat dissipation assembly includes: heat pipe group, the heat pipe group is embedded in the heat dissipation shell; heat dissipation fin, the heat dissipation fin is capped on part of the heat pipe group, and is attached to the inner surface of the heat dissipation shell.

[0014] Compared with the prior art, the technical effects reached by adopting the technical scheme are: the heat pipe group utilizes phase change heat transfer, and can rapidly migrate heat at extremely low temperature difference; the heat dissipation fin enlarges the contact area with the inner surface of the heat dissipation shell, and improves the interface heat conduction efficiency.

[0015] In one example of the utility model, the heat pipe group includes: first heat pipe, the first heat pipe is linear, and the extension direction of the first heat pipe is perpendicular to the extension direction of the heat dissipation fin; second heat pipe, the second heat pipe is L-shaped, and the part of the second heat pipe capped by the heat dissipation fin is arranged in parallel with the first heat pipe, and the part of the second heat pipe not capped by the heat dissipation fin is arranged perpendicular to the first heat pipe.

[0016] Compared with the prior art, the technical effects reached by adopting the technical scheme are: the extension direction of the first heat pipe is perpendicular to the extension direction of the heat dissipation fin, so that the second air flow applied by the air cooling device can take away as much heat of the first heat pipe as possible when passing through the heat dissipation passage between the heat dissipation fins; the part of the second heat pipe not capped by the heat dissipation fin is arranged perpendicular to the first heat pipe, forming a planar heat conduction network with the first heat pipe, so that the coverage of the heat pipe group is increased.

[0017] In one example of the utility model, the side of the heat dissipation shell provided with the first air port is provided with a clamping groove, and the air cooling device is clamped in the clamping groove.

[0018] Compared with the prior art, the technical effects reached by adopting the technical scheme are that the clamping groove provides circumferential positioning for the air cooling device, so that the air cooling device operates more stably.

[0019] In one example of the utility model, the groove wall of the clamping groove is communicated with the heat dissipation channel forming the second heat dissipation air duct.

[0020] In one example of the utility model, the first air port is matched with the air port shape of the air cooling device.

[0021] Compared with the prior art, the technical effects reached by adopting the technical scheme are that the first air port is matched with the air port shape of the air cooling device, so that the gap eddy current and backflow loss can be eliminated.

[0022] In one example of the utility model, the second air port comprises a plurality of air outlet holes arranged along the shell wall where the second air port is located.

[0023] After the technical scheme of the utility model is adopted, the following technical effects can be achieved:

[0024] (1) through the double-channel coupling design of the first heat dissipation air duct and the second heat dissipation air duct, the traditional internal air blowing and the external fin air blowing two heat dissipation paths are integrated in one action of the air cooling device, so that one air is used for two purposes. The air cooling device simultaneously generates the first air force and the second air force at the first air port, the first air force passes through the containing space along the first heat dissipation air duct and carries away the heat of the heat source inside the heat dissipation shell; at the same time, the second air force passes through the heat dissipation channel between the heat dissipation fins along the second heat dissipation air duct and carries away the heat on the surface of the heat dissipation shell;

[0025] (2) the first heat dissipation air duct and the second heat dissipation air duct are arranged to extend in the same direction, so that the airflow generated by the air cooling device is completely consistent in direction in the two air ducts, forming "same direction parallel" flow. This design reduces the turbulent loss and local resistance of the airflow at the bifurcation and convergence;

[0026] (3) by arranging the air duct cover, the heat dissipation channel forms a semi-closed "chimney" structure, which can prevent the airflow from escaping too early, and improve the airflow speed. BRIEF DESCRIPTION OF DRAWINGS

[0027] In order to more clearly illustrate the technical scheme of the embodiments of the utility model, the drawings to be used in the embodiment description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the utility model, and other drawings can be obtained by those skilled in the art without creative labor.

[0028] Figure 1 A structure schematic view of a domain control product heat dissipation device provided by the present application is shown in the figure.

[0029] Figure 2 For Figure 1 A cooperation structure schematic view of the heat dissipation shell, the air cooling device and the heat dissipation assembly is shown in the figure.

[0030] Figure 3 For Figure 1 A structure schematic view of the heat dissipation shell is shown in the figure.

[0031] Figure 4 For Figure 1 A structure schematic view of the heat dissipation shell from another perspective is shown in the figure.

[0032] Explanation of reference signs:

[0033] 100, domain control product heat dissipation device; 10, heat dissipation shell; 11, containing space; 12, first air port; 13, second air port; 14, clamping groove; 20, heat dissipation fin; 21, heat dissipation channel; 30, air cooling device; 40, air duct cover; 50, heat dissipation assembly; 51, heat pipe group; 511, first heat pipe; 512, second heat pipe; 52, heat dissipation fin. DETAILED DESCRIPTION

[0034] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application, and cannot be understood as a limitation of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0035] In the description of the present application, it should be noted that, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0036] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application will be described in detail below with reference to the drawings.

[0037] Reference Figure 1It is a structure schematic view of a domain control product heat dissipation device provided by the embodiment of the utility model, specifically, see Figures 2-4 The domain control product heat dissipation device 100 comprises: a heat dissipation shell 10 and a forced air cooling device 30, the heat dissipation shell 10 is internally provided with a containing space 11, and the heat dissipation shell 10 is provided with a first air inlet 12 and a second air inlet 13 arranged oppositely, the first air inlet 12, the containing space 11 and the second air inlet 13 are communicated to form a first heat dissipation air duct; the outer surface of the heat dissipation shell 10 is provided with a plurality of heat dissipation fins 20, and a heat dissipation channel 21 is arranged between adjacent heat dissipation fins 20, the first air inlet 12 is communicated with at least one heat dissipation channel 21 to form a second heat dissipation air duct; the forced air cooling device 30 is arranged at the first air inlet 12, and the forced air cooling device 30 applies a first air force to the containing space 11 from the first air inlet 12 towards the second air inlet 13, and the forced air cooling device 30 applies a second air force to at least one heat dissipation channel 21 from the first air inlet 12 towards the heat dissipation channel 21.

[0038] Further, the double-channel coupling design of the first heat dissipation air duct and the second heat dissipation air duct integrates the traditional internal air blowing and the external fin air blowing two heat dissipation paths in one action of the forced air cooling device 30, and realizes one air for two uses. The forced air cooling device 30 simultaneously generates the first air force and the second air force at the first air inlet 12, the first air force passes through the containing space 11 along the first heat dissipation air duct and carries away the heat of the heat source inside the heat dissipation shell 10, and simultaneously, the second air force passes through the heat dissipation channel 21 between the heat dissipation fins 20 along the second heat dissipation air duct and carries away the heat of the outer surface of the heat dissipation shell 10.

[0039] Preferably, the first heat dissipation air duct and the second heat dissipation air duct have the same extension direction.

[0040] Further, the first heat dissipation air duct and the second heat dissipation air duct are arranged to extend in the same direction, so that the airflow generated by the forced air cooling device 30 has the same direction in the two air ducts and forms a same-direction parallel flow. This design reduces the turbulent loss and local resistance of the airflow at the bifurcation and convergence.

[0041] Preferably, the domain control product heat dissipation device 100 further comprises an air duct cover 40, and the air duct cover 40 is covered on the side of the heat dissipation channel 21, away from the heat dissipation shell 10, of the second heat dissipation air duct.

[0042] Further, the air duct cover 40 refers to a plate-shaped structure covering the side of the heat dissipation channel 21, away from the heat dissipation shell 10, and can be realized by fixing a metal or plastic material through buckling or screws, and is used for restraining the airflow direction in the heat dissipation channel 21; by arranging the air duct cover 40, the heat dissipation channel 21 forms a semi-closed "chimney" structure, which can prevent the airflow from escaping too early, and improve the airflow speed.

[0043] Preferably, the domain control product heat dissipation device 100 further comprises a heat dissipation assembly 50, which is arranged in the accommodation space 11 and embedded on the side of the heat dissipation shell 10 provided with the heat dissipation fins 20.

[0044] Further, the heat dissipation assembly 50 is arranged in the accommodation space 11 and forms an embedded connection with the side of the heat dissipation shell 10 provided with the heat dissipation fins 20. The heat dissipation assembly 50 is in close contact with the heat dissipation shell 10 by embedding, so that the heat generated by the domain control product can be directly transmitted to the area where the heat dissipation fins 20 are located through the heat dissipation assembly 50.

[0045] Preferably, the heat dissipation assembly 50 comprises: a heat pipe group 51 embedded in the heat dissipation shell 10; and a heat dissipation fin 52 covering part of the heat pipe group 51 and being in close contact with the inner surface of the heat dissipation shell 10.

[0046] Specifically, the heat pipe group 51 is embedded in the heat dissipation shell 10 to directly absorb the heat generated by the domain control product. The heat dissipation fin 52 covers part of the surface of the heat pipe group 51 and is in close contact with the inner wall of the shell, so that the heat is further diffused to the heat dissipation shell 10 after being transmitted to the heat dissipation fin 52 through the heat pipe. The heat dissipation fins 20 on the surface of the heat dissipation shell 10 remove the heat through air flow, and the air flow circulation in the heat dissipation channel 21 is accelerated by the wind force generated by the air cooling device 30. In this way, the heat is efficiently conducted through the multi-layer conduction path of the heat pipe group 51, the heat dissipation fin 52 and the heat dissipation shell 10.

[0047] Further, the heat pipe group 51 utilizes phase change heat transfer to quickly migrate heat at extremely low temperature difference; and the heat dissipation fin 52 expands the contact area with the inner surface of the heat dissipation shell 10 to improve the interface heat conduction efficiency.

[0048] Preferably, the heat pipe group 51 comprises: a first heat pipe 511, which is linear, and the extension direction of the first heat pipe 511 is perpendicular to the extension direction of the heat dissipation fin 20; and a second heat pipe 512, which is L-shaped, and the part of the second heat pipe 512 covered by the heat dissipation fin 52 is arranged in parallel with the first heat pipe 511, and the part of the second heat pipe 512 not covered by the heat dissipation fin 52 is arranged perpendicular to the first heat pipe 511.

[0049] Further, the extension direction of the first heat pipe 511 is perpendicular to the extension direction of the heat dissipation fin 20, and the second air flow generated by the air cooling device 30 can carry away as much heat as possible from the first heat pipe 511 when passing through the heat dissipation channel 21 between the heat dissipation fins 20; and the part of the second heat pipe 512 not covered by the heat dissipation fin 52 is arranged perpendicular to the first heat pipe 511 to form a planar heat conduction network with the first heat pipe 511, so that the coverage of the heat pipe group 51 is increased.

[0050] Specifically, the straight first heat pipe 511 is arranged in the heat dissipation shell 10, and quickly absorbs and conducts heat to the area of the heat dissipation fin 20 through the phase change material. The L-shaped second heat pipe 512 is divided into a parallel section and a vertical section, the parallel section forms a longitudinal heat dissipation path together with the first heat pipe 511, and the vertical section extends to an area not covered by the heat dissipation fin 52 to form a transverse auxiliary heat dissipation path. The heat dissipation fin 52 covers the parallel section of the first heat pipe 511 and the second heat pipe 512, and transmits heat to the heat dissipation fin 20 by being attached to the inner surface of the heat dissipation shell 10, and the vertical section of the second heat pipe 512 not covered directly conducts heat to other areas of the shell. In this way, heat is conducted through heat pipe branches in different directions to achieve multi-path conduction, avoiding the problem of limited single-direction heat dissipation efficiency.

[0051] Preferably, the heat dissipation shell 10 is provided with a clamping groove 14 on one side of the first air inlet 12, and the air cooling device 30 is embedded in the clamping groove 14.

[0052] Preferably, the groove wall of the clamping groove 14 is communicated with the heat dissipation channel 21 forming the second heat dissipation air duct.

[0053] Preferably, the first air inlet 12 is matched with the air outlet shape of the air cooling device 30.

[0054] Specifically, the first air inlet 12 refers to the air inlet provided on the heat dissipation shell 10, which can be realized in a rectangular, circular or polygonal structure, and the size is consistent with the size of the air outlet of the air cooling device 30. The air outlet shape of the air cooling device 30 refers to the contour shape of the air outlet of the air cooling device 30, which can be realized in the same geometric shape as the first air inlet 12, for example, when the first air inlet 12 is rectangular, the air outlet of the air cooling device 30 is also designed in a rectangular shape. The first air inlet 12 is matched with the air outlet shape of the air cooling device 30, which can eliminate gap vortex and backflow loss.

[0055] Preferably, the second air inlet 13 includes a plurality of air outlet holes arranged along the shell wall where the second air inlet 13 is located.

[0056] Although the utility model discloses as above, the utility model is not limited to this. Any person skilled in the art, without departing from the spirit and scope of the utility model, can make various changes and modifications, therefore the protection scope of the utility model should be limited by the range defined in the claims.

Claims

1. A device for cooling a domain control product, characterized in that It comprises: a heat dissipation shell, which is provided with a containing space, and is provided with a first air inlet and a second air inlet arranged oppositely, the first air inlet, the containing space and the second air inlet are communicated to form a first heat dissipation air duct; the outer surface of the heat dissipation shell is provided with a plurality of heat dissipation fins, and a heat dissipation channel is arranged between adjacent heat dissipation fins, the first air inlet and at least one heat dissipation channel are communicated to form a second heat dissipation air duct; an air cooling device is arranged at the first air inlet, the air cooling device applies a first air force to the containing space from the first air inlet towards the second air inlet, and the air cooling device applies a second air force to at least one heat dissipation channel from the first air inlet towards the heat dissipation channel.

2. The domain control product heat dissipation device according to claim 1, wherein the first heat dissipation air duct and the second heat dissipation air duct extend in the same direction. It further comprises:

3. The domain control product heat dissipation device according to claim 1, characterized in that, an air duct cover, which covers the side of the heat dissipation channel away from the heat dissipation shell to form the second heat dissipation air duct. It further comprises:

4. The domain control product heat dissipation device according to claim 1, characterized in that, a heat dissipation assembly, which is arranged in the containing space and is embedded on the side of the heat dissipation shell provided with the heat dissipation fins. The heat dissipation assembly comprises:

5. The domain control product heat dissipation device according to claim 4, characterized in that, a heat pipe group, which is embedded in the heat dissipation shell; a heat dissipation fin, which covers part of the heat pipe group and is attached to the inner surface of the heat dissipation shell. The heat pipe group comprises:

6. The domain control product heat dissipation device according to claim 5, characterized in that, a first heat pipe, which is linear, and the extension direction of the first heat pipe is perpendicular to the extension direction of the heat dissipation fins; a second heat pipe, which is L-shaped, the part of the second heat pipe covered by the heat dissipation fin is arranged in parallel with the first heat pipe, and the part of the second heat pipe not covered by the heat dissipation fin is arranged perpendicular to the first heat pipe.

7. The domain control product heat dissipation device according to claim 1, wherein the side of the heat dissipation shell provided with the first air inlet is provided with a clamping groove, and the air cooling device is embedded in the clamping groove.

8. The domain control product heat dissipation device according to claim 7, wherein the groove wall of the clamping groove is communicated with the heat dissipation channel forming the second heat dissipation air duct.

9. The domain control product heat dissipation device according to claim 1, wherein the shape of the first air inlet matches the air inlet of the air cooling device.

10. The domain control product heat dissipation device according to claim 1, wherein the second air inlet comprises a plurality of air outlets arranged along the shell wall where the second air inlet is arranged. ​ ​ ​ ​ ​