Dam-free high-lighting-effect mirror surface aluminum packaging loading plate

Abstract

The utility model provides a box-dam-free high-luminous-efficiency mirror surface aluminum packaging carrier plate, and relates to the technical field of packaging carrier plates. The packaging carrier plate comprises a second bonding layer, a solder mask layer, a BT copper-clad plate and a mirror surface aluminum substrate which are sequentially arranged from top to bottom. And the aluminum frame is arranged on the upper surface of the solder mask, so that the quality technical problems of overflow and non-uniform distribution of the fluorescent glue and the process technical problem of complex packaging steps are solved. Compared with the prior art, according to the utility model, the aluminum frame is directly used on the carrier plate to form the box dam structure, and the delimited area prevents the fluorescent glue from overflowing, so that the distribution uniformity of the fluorescent glue is improved, and the packaging step is simplified.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of packaging load board especially relates to a high light efficiency mirror surface aluminum packaging load board of exempting from to surround dam. BACKGROUND

[0002] With the continuous development of LED packaging technology, COB (Chip On Board) packaging as a kind of efficient and compact packaging method has been widely used in lighting industry. This packaging method directly fixes LED chips on the substrate and connects through wires, and then covers fluorescent glue to achieve the required optical properties. COB packaging is favored due to its high-density integration, good heat dissipation performance and cost-effectiveness.

[0003] In the traditional COB packaging process, after completing the electrical connection between the chip and the load board, a fluorescent glue coating step is performed. The fluorescent glue not only provides the necessary color conversion function for the LED, but also plays a role in protecting the internal components. In order to ensure that the fluorescent glue can be accurately distributed in the designated area without overflowing to other parts, the usual practice is to artificially add a dam structure before coating. This dam is mainly made of a specific material and is designed to form a physical barrier to limit the flow range of the fluorescent glue.

[0004] Although the use of an additional dam can effectively prevent the overflow of fluorescent glue, this method also brings a series of challenges. First, the choice of dam material and installation precision directly affect the quality stability of the final product; inappropriate materials may cause chemical compatibility problems, while improper installation may cause uneven distribution of fluorescent glue, affecting the light-emitting efficiency and uniformity of the LED. Second, the addition of the dam increases the complexity of the entire packaging process, requiring more manual intervention or additional equipment support, thereby prolonging the production cycle and increasing the manufacturing cost. Therefore, how to optimize the structure of the load board to improve the problem of uneven distribution and overflow of the fluorescent glue, and how to simplify the packaging process while ensuring product quality have become technical problems to be solved. SUMMARY

[0005] The purpose of the utility model is to solve the technical problems raised in the background technology.

[0006] The utility model adopts the following technical scheme:

[0007] A high light efficiency mirror surface aluminum packaging load board exempting from dam, comprising:

[0008] A mirror surface aluminum substrate 1 is provided with a die bonding area 9 and a first adhesive layer 2 on the mirror surface aluminum substrate 1.

[0009] A BT copper clad plate 10 is arranged on the mirror aluminum substrate 1 and has a die bonding window of a die bonding area 9, and the BT copper clad plate 10 comprises a first adhesive layer 2, an insulating layer 3, a circuit layer 4, and a second adhesive layer 5;

[0010] The first adhesive layer 2 is arranged on the mirror aluminum substrate 1 and is used for bonding the insulating layer 3 and the mirror aluminum substrate 1.

[0011] The insulating layer 3 is arranged on the first adhesive layer 2.

[0012] The circuit layer 4 is arranged on the insulating layer 3.

[0013] The second adhesive layer 5 is arranged on the circuit layer 4 and is used for bonding the circuit layer 4 and the solder resist layer 5.

[0014] The solder resist layer 6 is arranged on the second adhesive layer 5 and has a die bonding window of a die bonding area and a reserved soldering surface 7.

[0015] The soldering surface 7 is arranged on the same level of the solder resist layer 6 and is symmetrically distributed along the die bonding area 9.

[0016] The aluminum frame 8 is arranged on the solder resist layer 6.

[0017] Further, the diameter size of the aluminum frame 8 is within the range of the left-right symmetric soldering surface 7.

[0018] Further, the aluminum frame 8 can be, but is not limited to, circular, square or polygonal.

[0019] Further, the aluminum frame 8 can be a single-layer or multi-layer frame and isolate fluorescent glue.

[0020] Further, the solder resist layer 6 is formed by coating photosensitive white ink and is formed after exposure and at the same time the soldering surface 7 is formed.

[0021] Further, the insulating layer 3 is made of glass cloth, epoxy resin, titanium white and whitening agent.

[0022] Further, the circuit layer 4 is composed of copper foil.

[0023] Further, the first adhesive layer 2 and the second adhesive layer 5 respectively use epoxy resin and epoxy rubber to bond the insulating layer 3 on the mirror aluminum substrate 1 and bond the solder resist layer 6 on the circuit layer 4.

[0024] Further, the soldering surface 7 is treated by nickel-palladium-gold plating.

[0025] Compared with the prior art, the advantages and positive effects of the utility model lie in,

[0026] 1. The utility model discloses a dam structure is formed by surrounding the solder resist layer on the aluminum frame through the adhesive on the carrier plate production, is used for fixing the fluorescent glue in a certain area, prevents the overflow of fluorescent glue, leads to the loss of fluorescent glue, effect weakens.

[0027] 2. The utility model discloses a dam structure is formed by surrounding the solder resist layer on the aluminum frame through the adhesive on the carrier plate production. This design reduces the step of artificially adding the dam when the traditional COB packaging carrier plate is coated with fluorescent glue after chip packaging. Through this way, the whole packaging process becomes more concise, and the operation is more convenient, avoids the additional manual intervention, thereby improve the packaging efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 A kind of main view sectional view of the utility model is proposed to a high light efficiency mirror surface aluminum packaging carrier plate without dam;

[0029] Figure 2 A kind of structure diagram of the utility model is proposed to a high light efficiency mirror surface aluminum packaging carrier plate without dam;

[0030] Figure 3 A kind of plan view of the utility model is proposed to a high light efficiency mirror surface aluminum packaging carrier plate without dam;

[0031] Figure 4 Another plan view of the utility model is proposed to a high light efficiency mirror surface aluminum packaging carrier plate without dam;

[0032] Figure 5 A kind of preparation detailed flow chart of the utility model is proposed to a high light efficiency mirror surface aluminum packaging carrier plate without dam.

[0033] LEGEND:

[0034] 1, mirror surface aluminum substrate;2, first adhesive layer;3, insulating layer;4, solder resist layer;5, aluminum frame;6, circuit layer;7, second adhesive layer;8, welding surface;9, die bonding area;10, BT copper-clad plate. DETAILED DESCRIPTION

[0035] In order to more clearly understand the above-mentioned purposes, features and advantages of the utility model, the utility model is further described below in conjunction with the drawings and examples. It should be noted that the embodiments of the present application and the features in the examples can be combined with each other without conflict.

[0036] Many specific details are set forth in the following description in order to provide a thorough understanding of the present application. However, the present application can be practiced according to other embodiments that can not be described in detail herein, and the present application is not limited to the specific embodiments described herein.

[0037] Embodiment one

[0038] Please refer to Figures 1-3 The utility model provides a technical scheme: a kind of high light efficiency mirror surface aluminum packaging panel of exempting from to surround dam, including from top to bottom setting aluminum frame, solder mask layer, BT copper clad plate (second adhesive layer, circuit layer, insulating layer, first adhesive layer), mirror surface aluminum substrate.

[0039] Mirror surface aluminum substrate 1, the mirror surface aluminum substrate 1 is provided with die-bonding area 9, first adhesive layer 2;

[0040] BT copper clad plate 10, the BT copper clad plate 10 is arranged on the mirror surface aluminum substrate 1, and die-bonding window of die-bonding area 9 is opened.The BT copper clad plate 10 includes first adhesive layer 2, insulating layer 3, circuit layer 4, second adhesive layer 5;

[0041] First adhesive layer 2, the first adhesive layer 2 is arranged on the mirror surface aluminum substrate 1, for bonding insulating layer 3 and mirror surface aluminum substrate 1;

[0042] Insulating layer 3, the insulating layer 3 is arranged on the first adhesive layer 2;

[0043] Circuit layer 4, the circuit layer 4 is arranged on the insulating layer 3;

[0044] Second adhesive layer 5, the second adhesive layer 5 is arranged on the circuit layer 4, for bonding circuit layer 4 and solder mask layer 5;

[0045] Solder mask layer 6, be arranged on the second adhesive layer 5, and die-bonding window of die-bonding area, reserved welding surface 7 are opened;

[0046] Welding surface 7, the welding surface 7 is arranged on the same level of the solder mask layer 6, and is symmetrically distributed along the die-bonding area 9;

[0047] Aluminum frame 8, the aluminum frame 8 is arranged on the solder mask layer 6.

[0048] First adhesive layer, second adhesive layer are made of epoxy resin, epoxy rubber;

[0049] Base layer is mirror surface aluminum substrate.

[0050] Insulating layer is made of glass cloth, epoxy resin, titanium dioxide and whitening agent mixture.

[0051] The circuit layer is made of copper foil. According to the design requirement of the circuit, the required circuit pattern is formed on the BT copper-clad plate, the circuit is transferred on the copper layer, and the conductive circuit is formed by etching and film stripping.

[0052] The solder resist layer is formed by exposing the photosensitive white ink, and the copper to be soldered is exposed to form a soldering surface.

[0053] After the BT copper-clad plate is pasted with an adhesive film on the back, the two are adhered under high temperature and low pressure to form a thermoelectric separation support. An aluminum frame is adhered to the solder resist layer under the action of the adhesive to form a dam structure.

[0054] The number of aluminum frames used can be selected according to actual needs, such as Figure 4 Two aluminum frames are separated by fluorescent glue doped with different colorants.

[0055] As shown in Figures 1-4 The aluminum frame is circular, but the overall shape of the aluminum frame can be square or polygonal, depending on the actual situation.

[0056] A manufacturing method of a dam-free high-light-efficiency mirror aluminum packaging board is also provided. Please refer to Figure 5 , comprising the following steps:

[0057] S1: BT copper-clad plate pretreatment, remove the surface oxide layer and dry, then paste the photosensitive dry film on the plate surface by high temperature and low pressure;

[0058] S2: circuit exposure and development, form the required circuit pattern on the BT copper-clad plate, realize the circuit transfer on the copper layer;

[0059] S3: etching and film stripping, etch the copper outside the circuit part of the copper layer, and then remove the dry film under the action of strong alkali;

[0060] S4: solder resist, clean and dry the BT copper-clad plate after film stripping, print photosensitive white ink on the circuit layer with a blocking point to form a solder resist layer while setting a soldering surface;

[0061] S5: after curing the photosensitive white ink with an oven, the ink is exposed;

[0062] S6: solder pad surface treatment, the copper at the soldering surface position is treated with nickel-palladium-gold surface treatment, and gold is deposited on the surface;

[0063] S7: drill positioning holes on the surface of the solder resist layer of the BT copper-clad plate, perform positioning windowing, and ring out the die bonding area;

[0064] S8: mirror aluminum cleaning, then paste an adhesive film on the back of the BT copper-clad plate, and adhere the two under high temperature and low pressure to form a thermoelectric separation support;

[0065] S9: After combination, the aluminum frame is adhered to the solder resist layer under the action of the adhesive to form a dam structure.

[0066] The above is only a preferred embodiment of the present application, and is not intended to limit the present application in other forms. Any skilled person in the art can modify or change the above disclosed technology content to equivalent embodiments applied to other fields, but any simple modification, equivalent change and modification made to the above embodiments without departing from the technical solution content of the present application, in accordance with the technical essence of the present application, still belong to the protection scope of the technical solution of the present application.

Claims

1. A dam-free high light efficiency mirror surface aluminum package carrier board, characterized in that, The application relates to a mirror surface aluminum substrate (1) provided with a die bonding area (9) and a first adhesive layer (2); a BT copper clad plate (10) provided on the mirror surface aluminum substrate (1) and provided with a die bonding window of the die bonding area (9), the BT copper clad plate (10) comprising the first adhesive layer (2), an insulation layer (3), a circuit layer (4) and a second adhesive layer (5); the first adhesive layer (2) is arranged on the mirror surface aluminum substrate (1) and used for bonding the insulation layer (3) and the mirror surface aluminum substrate (1); the insulation layer (3) is arranged on the first adhesive layer (2); the circuit layer (4) is arranged on the insulation layer (3); the second adhesive layer (5) is arranged on the circuit layer (4) and used for bonding the circuit layer (4) and a solder resist layer (6); the solder resist layer (6) is arranged on the second adhesive layer (5) and provided with a die bonding window of the die bonding area (9) and a reserved soldering surface (7); the soldering surface (7) is arranged on the same layer of the solder resist layer (6) and symmetrically distributed along the die bonding area (9); an aluminum frame (8) is arranged on the solder resist layer (6). The diameter of the aluminum frame (8) is within the range of the soldering surface (7). The aluminum frame (8) is circular or polygonal. The aluminum frame (8) is a single-layer or multi-layer frame and separates fluorescent glue. The solder resist layer (6) is formed by coating photosensitive white ink and is formed after exposure and simultaneously forms the soldering surface (7). The circuit layer (4) is composed of a copper foil. The first adhesive layer (2) uses epoxy resin to bond the insulation layer (3) on the mirror surface aluminum substrate (1), and the second adhesive layer (5) uses epoxy rubber to bond the solder resist layer (6) on the circuit layer (4). The soldering surface (7) is treated by nickel-palladium-gold sinking. ​ ​ 2. The high light efficiency mirror surface aluminum package carrier without dam according to claim 1, wherein, ​ 3. The high light efficiency mirror surface aluminum package carrier without dam according to claim 1, wherein, ​ 4. The high light efficiency mirror surface aluminum package carrier without dam according to claim 1, wherein, ​ 5. The high light efficiency mirror surface aluminum package carrier without dam according to claim 1, wherein, ​ 6. The high light efficiency mirror surface aluminum package board without dam according to claim 1, wherein, ​ 7. The high light efficiency mirror surface aluminum package board without dam according to claim 1, wherein, ​ 8. The high light efficiency mirror surface aluminum package board without dam according to claim 1, wherein, ​

Images