Photoelectric chip repair platform
By combining continuous wave laser with a temperature sensor and a coaxial cable for the camera module, the problem of low repair efficiency and damage to other chips in existing technologies is solved, achieving efficient and safe removal of optoelectronic chips and reducing the failure rate of optical modules.
Patent Information
- Application Number
- CN202422726827.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-08
- Publication Date
- 2026-01-02
- Estimated Expiration
- 2034-11-08
AI Technical Summary
In the current process of repairing optoelectronic chips, heating methods such as hot air guns are inefficient and can easily damage other chips, resulting in a high failure rate of optical modules and difficulty in efficiently removing failed chips.
The system employs continuous wave laser to destroy the adhesive, combined with temperature sensors and camera modules for real-time monitoring. A coaxial cable is designed for precise heating control, and limit blocks and a peeling mechanism are used to ensure safe removal of the optoelectronic chip.
This improved the efficiency of removing optoelectronic chips, avoided damage to other chips, reduced the failure rate of optical modules, and enhanced the reliability and efficiency of repair.
Smart Images
Figure CN223758691U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to optical communication technical field, concretely is a kind of optical-electric chip's repair platform. BACKGROUND
[0002] The construction from cloud computing, data center, mobile internet leads to the strong demand of global market to 400G, 800G, 1.6T etc. rate high-speed optical module (hereinafter referred to as: high-speed optical module), in order to realize photoelectric conversion and signal modulation and demodulation etc. functions, high-speed optical module will use a lot of optical-electric chips (hereinafter referred to as: optical-electric chip) such as: TIA, Driver, COC, COS, PIC etc. various forms.
[0003] In the production process of high-speed optical module, because of 5M1E (man-machine material method test ring) factor, various undesirable phenomena will inevitably occur, the undesirable phenomenon caused by the above-mentioned optical-electric chip accounts for the top three of the total undesirable phenomenon of optical module.
[0004] In order to meet the electrical connection demand of high-speed optical module, silver glue is used to bond optical-electric chip on PCBA or other substrate most of the time, because the surface area of this chip is generally larger, so it is difficult to take down the optical-electric chip completely and replace new material after the optical-electric chip fails, which will lead to the scrap of the whole high-speed optical module; Even if 5M1E can be controlled to the extreme, a large number of defective products will be produced in the manufacturing process, which will seriously affect the cost of the company.
[0005] The existing repair scheme is to contact the optical-electric chip to be disassembled by hot air gun, tungsten copper or other heat-conducting metal, after the heat is conducted to the silver glue under the optical-electric chip, the molecular structure of the silver glue is damaged, and then the optical-electric chip is pushed down.
[0006] In the operation process, in order to avoid damaging other chips, hot air gun nozzle or heat-conducting metal structure is designed to be relatively small, and this will lead to lower heat conduction efficiency; In order to realize better heat exchange, hot air gun nozzle or heat-conducting metal is in close contact with the optical-electric chip to be disassembled; In the case of heating and close contact, the whole optical module will have a large bending stress, which may affect other chips of the optical module, leading to defective products. UTILITY MODEL CONTENTS
[0007] The utility model aims at providing a kind of optical-electric chip's repair platform, at least can solve the partial defect in the prior art.
[0008] To achieve the above object, the utility model discloses the following technical scheme: a kind of repair platform of optoelectronic chip, including the operation table for depositing product to be repaired, further including laser module for emitting continuous wave laser, temperature sensor for monitoring laser heating temperature and camera module for monitoring the condition of product to be repaired, the continuous wave laser is shot to the just above optoelectronic chip of product to be repaired.
[0009] Further, the continuous wave laser, the temperature sensor and the camera module are located on the same axis.
[0010] Further, the operation table is provided with a limiting block, and the product to be repaired is arranged on the limiting block.
[0011] Further, the limiting block has a groove for embedding the product to be repaired.
[0012] Further, the limiting block is a heat preservation block.
[0013] Further, the camera module is connected with a display.
[0014] Further, it further includes a peeling mechanism for peeling the optoelectronic chip on the product to be repaired.
[0015] Further, the peeling mechanism includes a knife holder and a push knife detachably arranged on the knife holder.
[0016] Further, the knife holder is arranged on a linear guide rail.
[0017] Further, the laser module includes a laser head and a fiber laser, and the fiber laser is connected to the laser head through an optical fiber.
[0018] Compared with the prior art, the repair platform of optoelectronic chip has the following advantages: the continuous wave laser is used to damage the glue, compared with the existing heating method using hot air gun, other chips are not damaged, and the efficiency of removing the optoelectronic chip is improved. BRIEF DESCRIPTION OF DRAWINGS
[0019] Figure 1 The utility model provides a kind of repair platform of optoelectronic chip of each component connection schematic diagram of the utility model embodiment;
[0020] Figure 2 The continuous wave laser, temperature sensor and camera module of the repair platform of optoelectronic chip provided by the utility model embodiment are located on the same axis, as shown in the schematic diagram;
[0021] Figure 3 The operation table, limiting block, product to be repaired and optoelectronic chip of the repair platform of optoelectronic chip provided by the utility model embodiment are shown in the schematic diagram.
[0022] Figure 4 A dynamic schematic view of a photoelectric chip peeling off from a product to be repaired on a photoelectric chip repair platform according to the present application is provided;
[0023] In the drawing, 1 is an operation table, 20 is a laser head, 21 is a fiber laser, 22 is an optical fiber, 23 is a continuous wave laser, 30 is a temperature sensor, 31 is a temperature sensor controller, 4 is a camera module, 5 is a product to be repaired, 50 is a photoelectric chip, 6 is a limiting block, 7 is a display, 80 is a tool holder, 81 is a tool pusher, and 82 is a linear guide rail. DETAILED DESCRIPTION
[0024] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.
[0025] Please refer to Figure 1 , Figure 2 , Figure 3 and Figure 4 The present application provides a photoelectric chip repair platform, which comprises an operation table 1 for placing a product to be repaired 5, a laser module for emitting a continuous wave laser 23, a temperature sensor 30 for monitoring the temperature of laser heating, and a camera module 4 for monitoring the condition of the product to be repaired 5. The continuous wave laser 23 is directed to the top of the photoelectric chip 50 of the product to be repaired 5. In the present embodiment, the continuous wave laser 23 is used to damage the glue, which can improve the efficiency of removing the photoelectric chip 50 without damaging other chips compared with the existing heating method using a hot air gun. Specifically, the laser module is used to emit the continuous wave laser 23 to the top of the photoelectric chip 50. The heat of the continuous wave laser 23 can quickly damage the silver glue molecular structure under the photoelectric chip 50, which cannot be achieved by using a pulse laser. During the heating process, the temperature sensor 30 is used to detect the temperature of laser heating in real time to avoid excessive temperature. Meanwhile, the camera module 4 is used to monitor the on-site condition to ensure that the photoelectric chip 50 peeling operation is carried out normally. The camera module 4 is preferably a CCD camera. The temperature sensor 30 collects the temperature data on the photoelectric chip 50 to be heated and feeds back to the temperature sensor controller 31, which displays the real-time temperature. When the single temperature exceeds a certain range, the temperature sensor controller 31 will alarm. The glue used to bond the photoelectric chip 50 and the product to be repaired 5 will accelerate the molecular movement of the adhesive after being heated, thereby reducing the curing degree.
[0026] Please refer to Figure 1 and Figure 2 , the continuous wave laser 23, the temperature sensor 30 and the camera module 4 are located on the same axis. In this embodiment, the continuous wave laser 23, the temperature sensor 30 and the camera module 4 are designed on the same axis, which can avoid the situation that the heating position of the continuous wave laser 23 is out of synchronization with the position detected by the temperature sensor 30 and the position observed by the CCD camera. The continuous wave laser 23 is invisible to the human eye, and the use of this coaxial arrangement can avoid heating deviation.
[0027] Please refer to Figure 1 , Figure 2 , Figure 3 and Figure 4 , the operating table 1 is provided with a limiting block 6, and the product to be repaired 5 is arranged on the limiting block 6. In this embodiment, the limiting block 6 can limit the product to be repaired 5 to a certain extent, which facilitates the peeling of the optoelectronic chip 50 from it. Preferably, the limiting block 6 has a groove for embedding the product to be repaired 5, and the limiting can be achieved through the groove. Preferably, the limiting block 6 is a heat preservation block, which can maintain the temperature of laser irradiation and avoid rapid heat loss. Therefore, it is not necessary to use the clamp in the prior art, and the push knife 81 can easily peel the optoelectronic chip 50 from the product to be repaired 5. The heat preservation block can be made of plastic material, which can store heat by using the heat insulation property of plastic.
[0028] Please refer to Figure 1 , Figure 2 , Figure 3 and Figure 4 , the camera module 4 is connected with a display 7. In this embodiment, the display 7 is used to display the shooting picture of the camera module 4 in real time, which facilitates the on-site viewing of the staff.
[0029] Please refer to Figure 1 , Figure 2 , Figure 3 and Figure 4The repair platform also includes a peeling mechanism for peeling the optoelectronic chip 50 on the product to be repaired 5. In this embodiment, the optoelectronic chip 50 on the product to be repaired 5 can be peeled off by using the peeling mechanism. Preferably, the peeling mechanism includes a knife holder 80 and a push knife 81 detachably arranged on the knife holder 80. The peeling mechanism can be refined into the knife holder 80 and the push knife 81. The heated optoelectronic chip 50 is pushed off from the product to be repaired 5 by the push knife 81. The knife holder 80 can facilitate the arrangement of the push knife 81. The push knife 81 can be detachably mounted on the knife holder 80, and the push knife 81 can be replaced as needed. Preferably, the knife holder 80 is arranged on a linear guide rail 82. When peeling the optoelectronic chip 50, only the knife holder 80 needs to be slidably arranged on the linear guide rail 82. The extension direction of the linear guide rail 82 is the direction of peeling the optoelectronic chip 50. After the optoelectronic chip 50 of the product to be repaired 5 is irradiated and heated by the continuous wave laser 23, the replaceable push knife 81 in the peeling mechanism is replaced with a size suitable for the type of optoelectronic chip 50. Preferably, the width of the replaceable push knife 81 on the contact side of the optoelectronic chip 50 is between 60% and 80%. The optoelectronic chip 50 can be peeled off more quickly. Preferably, according to the size and area of the optoelectronic chip 50, the limit thrust of the knife holder 80 is set according to the relationship between the area and the adhesion strength in the MIL-STD-883 protocol, so as to avoid excessive thrust from damaging other chips or elements on the product to be repaired 5. As shown in Figure 4 , after the knife holder 80 with the replaced push knife 81 is moved to the position one shown in the first figure of the dynamic schematic diagram of Figure 4 , the knife holder 80 moves forward on the linear guide rail 82 to the position two shown in the second figure of the dynamic schematic diagram of Figure 4 . The push knife 81 of the knife holder 80 contacts the optoelectronic chip 50 on the product to be repaired 5. Continue to move forward. The knife holder 80 reaches the position three shown in the third figure of the dynamic schematic diagram of Figure 4 . At this time, the optoelectronic chip 50 on the product to be repaired 5 is pushed down. Preferably, the linear guide rail 82 fixing the knife holder 80 can edit the stroke of the knife holder 80 to avoid excessive stroke from position one to position three, which may damage other chips or elements on the product to be repaired 5. After the optoelectronic chip 50 on the product to be repaired 5 is pushed off, the residual glue and gold wire and gold ball are gently hung off with a scalpel. The cleaned product to be repaired 5 can be re-pasted with the optoelectronic chip 50 for continued use.
[0030] Please refer to Figure 1 , Figure 2 , Figure 3 and Figure 4The laser module comprises a laser head 20 and a fiber laser 21, and the fiber laser 21 is connected to the laser head 20 through an optical fiber 22. In the embodiment, the fiber laser 21 has an output power greater than 25W and a wavelength greater than 800nm, and a red light indicating aiming and positioning is provided. The optical fiber diameter of the optical fiber 22 is greater than 150um. The laser head 20 in the temperature control assembly converges the continuous wave laser 23 of the fiber laser 21 transmitted through the optical fiber 22 to the photoelectric chip 50 of the product 5 to be repaired.
[0031] Although the embodiments of the present application have been shown and described, it should be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.
Claims
1. A rework platform for optoelectronic chips, comprising an operating table for resting the product to be reworked, characterized in that: The laser module for emitting continuous wave laser, the temperature sensor for monitoring the laser heating temperature, the peeling mechanism for peeling the photoelectric chip on the product to be repaired, and the camera module for monitoring the condition of the product to be repaired, the continuous wave laser is shot to the photoelectric chip of the product to be repaired, the operating table is provided with a limiting block, the product to be repaired is arranged on the limiting block, the limiting block is a heat preservation block, the heat preservation block is a plastic block, the peeling mechanism comprises a knife holder and a push knife which is detachably arranged on the knife holder, and the knife holder is arranged on a linear guide rail.
2. The repair platform for optoelectronic chips of claim 1, wherein: The continuous wave laser, the temperature sensor and the camera module are located on the same axis.
3. The repair platform for optoelectronic chips of claim 1, wherein: The limiting block has a groove for embedding the product to be repaired.
4. The repair platform for optoelectronic chips of claim 1, wherein: The camera module is connected with a display.
5. The repair platform for optoelectronic chips of claim 1, wherein: The laser module comprises a laser head and a fiber laser, and the fiber laser is connected to the laser head through an optical fiber.