VOCs low-temperature recovery device

Abstract

The utility model discloses a VOCs low-temperature recovery device which comprises a condensation box, a low-temperature box and a liquid collection box, an air inlet and an air outlet are formed in the upper portion of the condensation box, and a condensation assembly is arranged in an inner cavity of the condensation box; the low-temperature box is arranged on the upper portion of the condensation box, a liquid inlet and a liquid outlet are formed in a pair of opposite side walls of the low-temperature box respectively, the liquid inlet and the liquid outlet are matched with the condensation assembly through pipelines, and a semiconductor chilling plate used for cooling the pipelines is arranged in the low-temperature box. The liquid collecting box is arranged at the lower part of the condensing box and is used for collecting condensed liquid in an inner cavity of the condensing box, and a waste liquid outlet is formed in the lower part of the liquid collecting box; the pipeline connected with the condensation assembly is cooled through the semiconductor chilling plate, the semiconductor chilling plate does not need to use refrigerants and is free of moving parts, noise is low during operation, the refrigeration efficiency is high, energy consumption can be reduced to a certain degree, and the operation cost is reduced.

Description

Technical Field

[0001] This utility model belongs to the field of waste gas recovery and treatment technology, and specifically relates to a low-temperature VOCs recovery device. Background Technology

[0002] VOCs are various organic compounds with boiling points ranging from 50°C to 260°C at room temperature. In my country, VOCs refer to organic compounds with a saturated vapor pressure greater than 70 Pa at room temperature and a boiling point below 260°C at normal pressure, or all organic compounds with a vapor pressure greater than or equal to 10 Pa at 20°C and exhibiting volatility. VOCs waste gas is mainly generated from waste gas emissions during the production processes of petroleum, chemical, and related industries, such as factory waste gas, light industrial waste gas, printing and dyeing waste gas, pharmaceutical waste gas, steel plant waste gas, machinery manufacturing waste gas, electronics plant waste gas, electroplating plant waste gas, and paint waste gas. They generally possess characteristics such as being flammable and explosive, toxic and harmful, and difficult to treat.

[0003] Existing VOCs emission control technologies mainly include recycling technologies such as condensation, absorption, adsorption, and membrane separation, as well as destruction technologies such as thermal incineration, catalytic combustion, and biodegradation. Destruction technologies cannot achieve VOCs recycling, resulting in economic losses. Absorption, adsorption, and membrane separation methods suffer from high costs and secondary pollution.

[0004] Therefore, this application provides a VOCs low-temperature recovery device, which aims to efficiently treat VOCs waste gas and recover VOCs from the waste gas. Utility Model Content

[0005] This invention provides a low-temperature VOCs recovery device, which aims to solve the problems mentioned in the background art.

[0006] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0007] A VOCs low-temperature recovery device includes: a condenser, a low-temperature chamber, and a collection tank;

[0008] The upper part of a pair of opposite sidewalls of the condenser is provided with an air inlet and an air outlet, respectively. The inner cavity of the condenser is provided with a condensation assembly, which is used to condense and treat VOCs waste gas.

[0009] The low-temperature chamber is located above the condenser. A liquid inlet and a liquid outlet are respectively provided on a pair of opposite side walls of the low-temperature chamber. The liquid inlet and the liquid outlet are connected to the condenser assembly through pipelines. A semiconductor cooling chip for cooling the pipeline is provided in the low-temperature chamber.

[0010] The liquid collection tank is located at the bottom of the condenser and is used to collect the condensed liquid in the inner cavity of the condenser. The bottom of the liquid collection tank is provided with a waste liquid outlet.

[0011] Furthermore, the condensation assembly includes: a mounting plate, a heat pipe, and a clamping plate;

[0012] The mounting plate is L-shaped, the heat pipe is a serpentine tube with a bend in the middle to fit the mounting plate, the clamp is fixedly connected to the vertical part of the mounting plate and is used to clamp and fix the vertical part of the heat pipe; the clamp is fixedly connected to a vertical side wall of the condenser box.

[0013] The heat pipe includes a horizontal loop and a vertical loop that are interconnected. A pair of connection ports are provided on the vertical loop. The connection ports are used to mate with the pipe. A through hole is provided on the mounting plate. The through hole is used to mate with the connection port.

[0014] Furthermore, a plurality of heat-conducting seats are provided on the vertical circuit, and a condenser plate is provided at the lower part of the heat-conducting seat. The condenser plate is wavy.

[0015] Furthermore, a mounting groove is provided on one side of the condenser box, which is used to accommodate the clamping plate, the mounting plate, and the vertical part of the heat-conducting pipe. A plurality of mating holes are provided on the upper part of the condenser box, which are used to mate with the condenser plate.

[0016] The bottom of the mounting groove is provided with several heat conduction grooves, which are used to cooperate with the clamping plate.

[0017] Furthermore, a sealing seat is provided on the upper part of the condenser box, and a mating groove is provided on the sealing seat for mating with the horizontal loop of the heat pipe.

[0018] Furthermore, control valves are provided at the air inlet, air outlet, liquid inlet, liquid outlet, and waste liquid outlet.

[0019] Furthermore, a temperature sensor is installed inside the condenser box.

[0020] Furthermore, a liquid level sensor is installed inside the collection tank.

[0021] Compared with the prior art, the present invention has the following technical effects:

[0022] 1. The VOCs low-temperature recovery device of this utility model can condense VOCs waste gas through a condensation component installed in the condensation chamber. Since volatile organic compounds (VOCs) have different saturated vapor pressures at different temperatures, their saturated vapor pressures also decrease as the temperature decreases, causing some VOCs to change from a gaseous state to a liquid state. The condensation component accelerates this phase change process, effectively improving the VOCs recovery efficiency and converting most of the VOCs in the waste gas from a gaseous state to a liquid state, thereby achieving effective separation of VOCs from the waste gas.

[0023] 2. The low-temperature chamber of the VOCs low-temperature recovery device of this utility model cools the pipeline connected to the condenser assembly through a semiconductor refrigeration chip. The semiconductor refrigeration chip has advantages such as fast cooling speed and precise temperature control, and can continuously provide a stable low-temperature environment for the condenser assembly. This ensures that the condenser assembly maintains a high-efficiency condensation effect throughout the entire operation, unaffected by fluctuations in the external ambient temperature. Compared with traditional refrigeration equipment, the semiconductor refrigeration chip does not require refrigerant, has no moving parts, operates with low noise, and has high cooling efficiency, which can reduce energy consumption and operating costs to a certain extent. Attached Figure Description

[0024] Figure 1 This is an overall isometric view of a VOCs low-temperature recovery device according to this utility model;

[0025] Figure 2 This is a front view of a VOCs low-temperature recovery device according to this utility model;

[0026] Figure 3 This is a schematic diagram of the mounting plate structure of a VOCs low-temperature recovery device according to this utility model;

[0027] Figure 4 This is a schematic diagram of the condensation component of a VOCs low-temperature recovery device according to this utility model;

[0028] Figure 5 This is a schematic diagram of the heat pipe structure of a VOCs low-temperature recovery device according to this utility model;

[0029] Figure 6 This is a schematic diagram of the condenser structure of a VOCs low-temperature recovery device according to this utility model;

[0030] Figure 7 This is a schematic diagram of the sealing seat structure of a VOCs low-temperature recovery device according to this utility model.

[0031] In the picture:

[0032] 1. Condensation chamber; 101. Mounting slot; 102. Heat transfer slot; 103. Mating hole; 104. Sealing seat;

[0033] 2. Low-temperature chamber; 3. Air inlet; 4. Air outlet; 5. Liquid inlet; 6. Liquid outlet;

[0034] 7. Liquid collection tank; 701. Waste liquid outlet;

[0035] 8. Mounting plate; 801. Through hole;

[0036] 9. Heat pipe; 901. Horizontal circuit; 902. Vertical circuit; 903. Connection port;

[0037] 10. Clamping plate; 11. Heat-conducting base; 12. Condensation fin. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to specific embodiments of this application and the accompanying drawings.

[0039] like Figure 1-2 As shown, a VOCs low-temperature recovery device includes: a condensation chamber 1, a low-temperature chamber 2, and a liquid collection tank 7;

[0040] The upper part of a pair of opposite sidewalls of the condenser box 1 is provided with an air inlet 3 and an air outlet 4 respectively. The inner cavity of the condenser box 1 is provided with a condensation assembly, which is used to condense and treat VOCs waste gas.

[0041] The low-temperature chamber 2 is located above the condenser chamber 1. A liquid inlet 5 and a liquid outlet 6 are respectively provided on a pair of opposite side walls of the low-temperature chamber 2. The liquid inlet 5 and the liquid outlet 6 are connected to the condenser assembly through pipelines. The low-temperature chamber 2 is provided with a semiconductor cooling chip for cooling the pipelines, specifically by cooling the pipelines that supply coolant to the condenser assembly.

[0042] The liquid collection tank 7 is located at the lower part of the condenser 1 and is used to collect the condensed liquid in the inner cavity of the condenser 1. The lower part of the liquid collection tank 7 is provided with a waste liquid outlet 701.

[0043] The condensation assembly installed in condenser 1 can condense VOCs in the waste gas. Since volatile organic compounds (VOCs) have different saturated vapor pressures at different temperatures, their saturated vapor pressure decreases as the temperature decreases, causing some VOCs to change from a gaseous state to a liquid state. The condensation assembly accelerates this phase change process, effectively improving the VOCs recovery efficiency and converting most of the VOCs in the waste gas from a gaseous state to a liquid state, thereby achieving effective separation of VOCs from the waste gas.

[0044] The cryogenic chamber 2 uses a thermoelectric cooler to cool the piping connected to the condenser assembly. The thermoelectric cooler offers advantages such as rapid cooling and precise temperature control, providing a consistently stable low-temperature environment for the condenser assembly. This ensures the condenser assembly maintains high-efficiency condensation throughout operation, unaffected by fluctuations in ambient temperature. Compared to traditional refrigeration equipment, thermoelectric coolers do not require refrigerant, have no moving parts, operate with low noise, and offer high cooling efficiency, thus reducing energy consumption and operating costs to some extent.

[0045] like Figure 3-4 As shown, the condensation assembly includes: a mounting plate 8, a heat pipe 9, and a clamping plate 10;

[0046] The mounting plate 8 is L-shaped, the heat pipe 9 is a serpentine tube with a bend in the middle to fit the mounting plate 8, the clamping plate 10 is fixedly connected to the vertical part of the mounting plate 8, and is used to clamp and fix the vertical part of the heat pipe 9; the clamping plate 10 is fixedly connected to a vertical side wall of the condenser box 1.

[0047] The heat pipe 9 includes a horizontal loop 901 and a vertical loop 902 that are interconnected. The vertical loop 902 is provided with a pair of connection ports 903, which are used to cooperate with the pipe. The mounting plate 8 is provided with a through hole 801, which is used to cooperate with the connection port 903.

[0048] In one specific embodiment, the two connection ports 903 form a loop with the inner cavity of the heat pipe 9, which facilitates the flow of coolant inside and completes heat transfer.

[0049] The mounting plate 8 is L-shaped, and the heat pipe 9 is bent in the middle to fit it. This design allows the heat pipe 9 to fit tightly against the mounting plate 8, increasing the contact area and connection stability between the two. The clamping plate 10 is fixedly connected to the vertical part of the mounting plate 8 and clamps and fixes the vertical part of the heat pipe 9, further enhancing the fixing effect of the heat pipe 9 and preventing it from shaking or shifting due to fluid impact or other factors during operation, thus ensuring the stability of the overall structure of the condenser assembly.

[0050] The heat pipe 9 includes interconnected horizontal loops 901 and vertical loops 902. This design allows the coolant to flow in loops in different directions, forming a more complex flow path. The coolant flows alternately in the horizontal loops 901 and vertical loops 902, which helps to evenly absorb heat from the exhaust gas and avoids localized excessively high or low temperatures, further improving the uniformity and efficiency of heat exchange. The clamping plate 10 is made of a material with good thermal conductivity, facilitating heat transfer from the heat pipe 9.

[0051] like Figure 5 As shown, a plurality of heat-conducting seats 11 are provided on the vertical circuit 902, and a condenser plate 12 is provided at the lower part of the heat-conducting seat 11. The condenser plate 12 is wavy.

[0052] The heat-conducting seat 11 is installed on the vertical circuit 902, which can effectively transfer the low temperature of the coolant in the vertical circuit 902 to the condenser 12. Due to the good thermal conductivity of the heat-conducting seat 11, the resistance to heat transfer is reduced, and the cooling capacity of the coolant is quickly and efficiently transferred to the condenser 12, allowing the condenser 12 to quickly reach a lower temperature, creating favorable conditions for the condensation of VOCs exhaust gas.

[0053] The condenser plate 12 is designed in a wave shape, which greatly increases its surface area compared with the traditional flat condenser plate. The larger surface area means more contact space with VOCs exhaust gas, allowing VOCs in the exhaust gas to come into more full contact with the low temperature condenser plate 12, thereby accelerating the heat exchange rate and enabling more VOCs to cool rapidly on the surface of the condenser plate and condense into liquid, effectively improving the efficiency of condensation recovery.

[0054] like Figure 6 As shown, a mounting groove 101 is provided on one side of the condenser box 1. The mounting groove 101 is used to accommodate the vertical parts of the clamping plate 10, the mounting plate 8, and the heat pipe 9. A plurality of mating holes 103 are provided on the upper part of the condenser box 1. The mating holes 103 are used to mate with the condenser plate 12.

[0055] The bottom of the mounting groove 101 is provided with a plurality of heat conduction grooves 102, which are used to cooperate with the clamping plate 10.

[0056] The mounting slot 101 on one side of the condenser box 1 is used to accommodate the vertical parts of the clamping plate 10, mounting plate 8, and heat pipe 9. This design allows the condenser assembly to be installed as a relatively independent module. During installation, the operator only needs to place the assembled condenser assembly into the mounting slot 101, simplifying the installation steps, reducing installation difficulty, and improving installation efficiency. At the same time, the modular design also facilitates subsequent disassembly and maintenance of the condenser assembly.

[0057] The heat conduction groove 102 at the bottom of the mounting groove 101 cooperates with the clamping plate 10 to enhance the heat conduction performance between the clamping plate 10 and the condenser box 1.

[0058] like Figure 3 and Figure 7 As shown, a sealing seat 104 is provided on the upper part of the condenser box 1, and a mating groove is provided on the sealing seat 104. The mating groove is used to mate with the horizontal circuit 901 of the heat pipe 9.

[0059] During the condensation process, the condensation chamber 1 is filled with VOCs waste gas. The mating groove on the sealing seat 104 fits tightly with the horizontal circuit 901 of the heat conduction pipe 9, effectively filling the gap between them and forming a good sealing structure. This prevents the waste gas from leaking out from the connection between the upper part of the condensation chamber 1 and the heat conduction pipe 9, ensuring the safety of the device operation, preventing toxic and harmful VOCs waste gas from being released into the surrounding environment and causing pollution and harm, and ensuring that the waste gas is fully condensed in the condensation chamber, thus improving the VOCs recovery efficiency.

[0060] In one specific embodiment, the air inlet 3, air outlet 4, liquid inlet 5, liquid outlet 6, and waste liquid outlet 701 are all equipped with control valves.

[0061] In one specific embodiment, a temperature sensor is provided inside the condenser box 1.

[0062] In one specific embodiment, a liquid level sensor is provided inside the liquid collection tank 7.

[0063] These control valves can be integrated with the device's control system to achieve automated and intelligent control. Through sensors, the system monitors the relevant parameters of exhaust gas flow, temperature, pressure, and coolant in real time. The control system can automatically adjust the opening of each control valve according to the preset program, so that the device is always in the best operating state. This automated control method not only improves processing efficiency and stability, but also reduces the labor intensity and human error of manual operation.

[0064] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several modifications and improvements can be made without departing from the inventive concept of the present utility model, and these all fall within the protection scope of the present utility model.

Claims

1. A VOCs cryogenic recovery apparatus, characterized by, The application relates to a condensing device for VOCs waste gas, which comprises a condensing box (1), a low-temperature box (2) and a liquid collecting box (7). An air inlet (3) and an air outlet (4) are arranged on the upper parts of a pair of opposite side walls of the condensing box (1) respectively, and a condensing assembly is arranged in the inner cavity of the condensing box (1) and used for condensing treatment of VOCs waste gas. The low-temperature box (2) is arranged on the upper part of the condensing box (1), a liquid inlet (5) and a liquid outlet (6) are arranged on a pair of opposite side walls of the low-temperature box (2) respectively, the liquid inlet (5) and the liquid outlet (6) are matched with the condensing assembly through pipelines, and a semiconductor refrigerating sheet for cooling the pipelines is arranged in the low-temperature box (2). The liquid collecting box (7) is arranged on the lower part of the condensing box (1) and is used for collecting the condensed liquid in the inner cavity of the condensing box (1), and a waste liquid outlet (701) is arranged on the lower part of the liquid collecting box (7). The condensing assembly comprises a mounting plate (8), a heat-conducting pipe (9) and a clamping plate (10).

2. The VOCs cryogenic recovery apparatus according to claim 1, wherein, The mounting plate (8) is L-shaped, the heat-conducting pipe (9) is a serpentine pipe, the middle part of the heat-conducting pipe (9) is bent and arranged to be matched with the mounting plate (8), the clamping plate (10) is fixedly connected with the vertical part of the mounting plate (8) and is used for clamping and fixing the vertical part of the heat-conducting pipe (9), and the clamping plate (10) is fixedly connected with a vertical side wall of the condensing box (1). The heat-conducting pipe (9) comprises horizontal loops (901) and vertical loops (902) which are communicated with each other, a pair of connecting ports (903) are arranged on the vertical loops (902) and are used for being matched with the pipelines, and through holes (801) are arranged on the mounting plate (8) and are used for being matched with the connecting ports (903). A plurality of heat-conducting seats (11) are arranged on the vertical loops (902), the lower parts of the heat-conducting seats (11) are provided with condensing sheets (12), and the condensing sheets (12) are wave-shaped.

3. The VOCs cryogenic recovery apparatus of claim 2, wherein, One side of the condensing box (1) is provided with a mounting groove (101) which is used for accommodating the clamping plate (10), the mounting plate (8) and the vertical part of the heat-conducting pipe (9), a plurality of matching holes (103) are formed in the upper part of the condensing box (1) and are used for being matched with the condensing sheets (12), and a plurality of heat-conducting grooves (102) are formed in the bottom of the mounting groove (101) and are used for being matched with the clamping plate (10).

4. The VOCs cryogenic recovery apparatus of claim 3, wherein, The upper part of the condensing box (1) is provided with a sealing seat (104), the sealing seat (104) is provided with a matching groove which is used for being matched with the horizontal loops (901) of the heat-conducting pipe (9). The air inlet (3), the air outlet (4), the liquid inlet (5), the liquid outlet (6) and the waste liquid outlet (701) are all provided with control valves.

5. The VOCs cryogenic recovery apparatus of claim 4, wherein, The inner cavity of the condensing box (1) is provided with a temperature sensor.

6. The VOCs cryogenic recovery apparatus of claim 1, wherein, The inner cavity of the liquid collecting box (7) is provided with a liquid level sensor.

7. The VOCs cryogenic recovery apparatus of claim 1, wherein, ​ 8. The VOCs cryogenic recovery apparatus of claim 1, wherein, ​

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