Dust removal device for electronic component processing

Abstract

The utility model belongs to the technical field of dust removal devices, and discloses a dust removal device for electronic component processing, which comprises a lower shell and an upper shell, a lifting mechanism is arranged between the lower shell and the upper shell, a plurality of cylinders are fixedly arranged at the top end of the lower shell, a plurality of groups of lower through holes are formed in the lower shell, and the lower through holes are communicated with the upper shell. A plurality of groups of lower through holes are formed in the upper shell, a lower elastic sealing piece is arranged in each group of lower through holes, a plurality of groups of upper through holes are formed in the upper shell, an upper elastic sealing piece is arranged in each group of upper through holes, a fan and a filter box are further arranged on the outer side of the upper shell, one end of the fan is communicated with the interior of the upper shell, the other end of the fan is communicated with the filter box, and the filter box is communicated with the interior of the lower shell; according to the utility model, through the cooperation of the fan, the filter box, the upper shell, the lower shell and the like, dust on the surface of an electronic component can be cleaned through the circular flow of wind power.

Description

Technical Field

[0001] This utility model belongs to the technical field of dust removal devices, specifically a dust removal device for electronic component processing. Background Technology

[0002] During the processing of electronic components, it is sometimes necessary to clean the dust on the surface of the electronic components using a dust removal device. Conventional dust removal devices typically place the electronic components together and then suck up the dust from the surface of the electronic components in a manner similar to a vacuum cleaner. Due to the large area involved, the dust removal effect needs to be improved. Utility Model Content

[0003] In view of the above situation and to overcome the defects of the prior art, this utility model provides a dust removal device for electronic component processing, which effectively solves the problem that conventional dust removal devices place electronic components together and then suck up the dust on the surface of the electronic components in a manner similar to a vacuum cleaner. Due to the large area, the dust removal effect needs to be improved.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a dust removal device for electronic component processing, comprising a lower housing and an upper housing, wherein a lifting mechanism is provided between the lower housing and the upper housing, a plurality of cylindrical bodies are fixedly provided at the top of the lower housing, and a plurality of lower through holes are provided on the lower housing, wherein a lower elastic seal is provided in each set of lower through holes, and a plurality of upper through holes are provided on the upper housing, wherein an upper elastic seal is provided in each set of upper through holes, and a fan and a filter box are also provided on the outside of the upper housing, wherein one end of the fan is connected to the interior of the upper housing, and the other end of the fan is connected to the filter box, and the filter box is connected to the interior of the lower housing.

[0005] Preferably, each group of lower through holes is provided with multiple lower through holes, and all of the multiple lower through holes are located on the inner side of the cylinder.

[0006] Preferably, each group of upper through holes is provided with multiple holes, and the multiple holes are all located on the inner side of the area on the upper shell corresponding to the cylinder.

[0007] Preferably, the lower elastic seal includes a sealing block and a support spring, wherein the sealing block is in a sliding fit with the corresponding lower through hole, and the support spring is located between the sealing block and the inner bottom wall of the lower housing.

[0008] Preferably, the sealing block includes a top rod portion, a sealing portion, a cover plate portion, and a positioning portion that are connected in sequence from top to bottom; wherein the radius of the top rod portion, the radius of the sealing portion, and the radius of the cover plate portion increase sequentially, the sealing portion is in a sealing sliding fit with the lower through hole, and the support spring is in a movable sleeve fit with the positioning portion.

[0009] Preferably, the structure of the upper elastic seal is the same as that of the lower elastic seal.

[0010] Preferably, the lifting mechanism includes an electric push rod, an upper support is fixedly mounted on the upper housing, a lower support is fixedly mounted on the lower housing, the electric push rod is fixedly mounted on the upper support, and the output end of the electric push rod is fixedly mounted on the lower support.

[0011] Preferably, multiple sets of guide mechanisms are provided between the upper housing and the lower housing. The guide mechanism includes an upper connecting block, a lower connecting block, and a guide rod. The upper connecting block is fixedly mounted on the upper housing, the lower connecting block is fixedly mounted on the lower housing, and the guide rod is fixedly mounted on the lower connecting block. The guide rod slides in conjunction with the rod hole on the upper connecting block.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] During operation, the combination of the fan, filter box, upper housing, and lower housing allows for the circulation of air to clean dust from the surface of electronic components. The upper and lower elastic seals ensure that the upper and lower housings remain sealed after separation, thereby reducing heat loss. Attached Figure Description

[0014] The accompanying drawings are provided to further understand the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation thereof.

[0015] In the attached diagram:

[0016] Figure 1 This is a schematic diagram of the structure of a dust removal device for electronic component processing according to the present invention;

[0017] Figure 2 This is a schematic diagram of the cylinder mounting structure of this utility model;

[0018] Figure 3 This is a schematic diagram of the sealing block structure of this utility model;

[0019] Figure 4 This is one of the schematic diagrams of the upper shell structure of this utility model;

[0020] Figure 5 This is the second schematic diagram of the upper shell structure of this utility model.

[0021] In the diagram: 1. Lower shell; 2. Upper shell; 3. Cylinder; 4. Lower through hole; 5. Upper through hole; 6. Fan; 7. Filter box; 8. Sealing block; 9. Support spring; 10. Top rod; 11. Sealing part; 12. Cover plate; 13. Positioning part; 14. Electric push rod; 15. Upper support; 16. Lower support; 17. Upper connecting block; 18. Lower connecting block; 19. Guide rod. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0023] Depend on Figure 1-5 The present invention relates to a dust removal device for electronic component processing, comprising a lower housing 1 and an upper housing 2. A lifting mechanism is provided between the lower housing 1 and the upper housing 2. Multiple cylinders 3 are fixedly provided at the top of the lower housing 1. Multiple sets of lower through holes 4 are provided on the lower housing 1, and a lower elastic seal is provided in each set of lower through holes 4. Multiple sets of upper through holes 5 are provided on the upper housing 2, and an upper elastic seal is provided in each set of upper through holes 5. A fan 6 and a filter box 7 are also provided on the outside of the upper housing 2. One end of the fan 6 is connected to the inside of the upper housing 2, and the other end of the fan 6 is connected to the filter box 7. The filter box 7 is connected to the inside of the lower housing 1.

[0024] In this design, the electronic components are placed inside the cylinder 3 during use. Then, the upper housing 2 is lowered by a lifting mechanism. After the upper housing 2 descends, it seals the opening of the cylinder 3 on the lower housing 1. At the same time, the upper elastic seal on the upper housing 2 positions and fixes the electronic components. When the electronic components are compressed, they squeeze the lower elastic seal on the lower housing 1. Eventually, the lower elastic seal stops sealing the lower through hole 4, and the upper elastic seal stops sealing the upper through hole 5. Then, the fan 6 generates airflow. The airflow passes through the filter box 7, the lower housing 1, the lower through hole 4, the cylinder 3, the upper through hole 5, and the upper housing 2 in sequence before being sucked back in. The airflow cleans the dust on the surface of the electronic components. The filter box 7 is equipped with a filter element and other structures to filter the dust in the airflow.

[0025] It should be noted that after cleaning, the electronic components can be flipped over and placed back on to ensure the cleaning effect on the dust on the electronic components.

[0026] Specifically, each set of lower through holes 4 is provided with multiple holes, and all of the multiple lower through holes 4 are located on the inner side of the cylinder 3.

[0027] Specifically, each set of upper through holes 5 is provided with multiple holes, and the multiple upper through holes 5 are all located on the inner side of the area on the upper shell 2 corresponding to the cylinder 3.

[0028] Specifically, the lower elastic seal includes a sealing block 8 and a support spring 9, wherein the sealing block 8 is in a sealing sliding fit with the corresponding lower through hole 4, and the support spring 9 is located between the sealing block 8 and the inner bottom wall of the lower housing 1.

[0029] The sealing block 8 includes a top rod part 10, a sealing part 11, a cover plate part 12 and a positioning part 13 connected in sequence from top to bottom; wherein the radius of the top rod part 10, the radius of the sealing part 11 and the radius of the cover plate part 12 increase sequentially, the sealing part 11 is in a sealing sliding fit with the lower through hole 4, and the support spring 9 is in a movable sleeve fit with the positioning part 13.

[0030] With this design, under normal conditions, the sealing part 11 and the cover plate part 12 on the sealing block 8 work together to seal the lower through hole 4 under the action of the supporting spring 9. When the electronic components squeeze the sealing block 8, the sealing part 11 and the cover plate part 12 will no longer block the lower through hole 4. At this time, the airflow can enter the interior of the cylinder 3 from the interior of the lower housing 1 through the lower through hole 4.

[0031] It should be noted that arc-shaped grooves can be provided on the outer walls of both sides of the sealing part 11, or the sealing part 11 and the top rod part 10 can be made to transition in a conical shape, which can reduce the difficulty of aligning the sealing part 11 with the lower through hole 4.

[0032] Specifically, the structure of the upper elastic seal is the same as that of the lower elastic seal.

[0033] Specifically, the lifting mechanism includes an electric push rod 14, an upper support 15 is fixedly installed on the upper housing 2, a lower support 16 is fixedly installed on the lower housing 1, the electric push rod 14 is fixedly installed on the upper support 15, and the output end of the electric push rod 14 is fixedly installed on the lower support 16; with this design, the upper housing 2 and the lower housing 1 can be moved closer or further apart by adjusting the electric push rod 14.

[0034] Specifically, multiple sets of guiding mechanisms are provided between the upper housing 2 and the lower housing 1. The guiding mechanisms include an upper connecting block 17, a lower connecting block 18, and a guide rod 19. The upper connecting block 17 is fixedly mounted on the upper housing 2, the lower connecting block 18 is fixedly mounted on the lower housing 1, and the guide rod 19 is fixedly mounted on the lower connecting block 18. The guide rod 19 slides with the rod hole on the upper connecting block 17. This design can improve the stability when the upper housing 2 and the lower housing 1 move relative to each other through the guide rod 19.

Claims

1. A dust removal device for electronic component processing, comprising a lower housing (1) and an upper housing (2), a lifting mechanism being arranged between the lower housing (1) and the upper housing (2), characterized in that, The top end of the lower shell (1) is fixedly provided with a plurality of barrels (3), a plurality of groups of lower through holes (4) are formed in the lower shell (1), each group of lower through holes (4) is provided with a lower elastic sealing piece, a plurality of groups of upper through holes (5) are formed in the upper shell (2), each group of upper through holes (5) is provided with an upper elastic sealing piece, the outer side of the upper shell (2) is further provided with a fan (6) and a filter box (7), one end of the fan (6) is in communication with the inside of the upper shell (2), the other end of the fan (6) is in communication with the filter box (7), and the filter box (7) is in communication with the inside of the lower shell (1).

2. The dust removing apparatus for electronic component processing according to claim 1, characterized by: Each group of lower through holes (4) is provided with a plurality of groups of lower through holes (4), and the plurality of lower through holes (4) are located on the inner side of the barrel (3).

3. The dust removing apparatus for electronic component processing according to claim 1, characterized by: Each group of upper through holes (5) is provided with a plurality of groups of upper through holes (5), and the plurality of upper through holes (5) are located on the inner side of the corresponding region of the barrel (3) on the upper shell (2).

4. The dust removing apparatus for electronic component processing according to claim 1, characterized by: The lower elastic sealing piece comprises a sealing block (8) and a supporting spring (9), wherein the sealing block (8) is in sealing sliding fit with the corresponding lower through hole (4), and the supporting spring (9) is located between the sealing block (8) and the inner bottom wall of the lower shell (1).

5. The dust removing apparatus for electronic component processing according to claim 4, characterized by: The sealing block (8) comprises a top rod portion (10), a sealing portion (11), a cover plate portion (12) and a positioning portion (13) which are sequentially connected in one body from top to bottom, wherein the radius size of the top rod portion (10), the radius size of the sealing portion (11) and the radius size of the cover plate portion (12) increase in sequence, the sealing portion (11) is in sealing sliding fit with the lower through hole (4), and the supporting spring (9) is in movable sleeve joint fit with the positioning portion (13).

6. The dust removing apparatus for electronic component processing according to claim 1, characterized by: The structure of the upper elastic sealing piece is the same as that of the lower elastic sealing piece.

7. The dust removing apparatus for electronic component processing according to claim 1, characterized by: The lifting mechanism comprises an electric push rod (14), the upper shell (2) is fixedly provided with an upper support (15), the lower shell (1) is fixedly provided with a lower support (16), the electric push rod (14) is fixedly arranged on the upper support (15), and the output end of the electric push rod (14) is fixedly arranged with the lower support (16).

8. The dust removing apparatus for electronic component processing according to claim 1, characterized by: A plurality of groups of guide mechanisms are further arranged between the upper shell (2) and the lower shell (1), the guide mechanism comprises an upper connecting block (17), a lower connecting block (18) and a guide rod (19), wherein the upper connecting block (17) is fixedly arranged on the upper shell (2), the lower connecting block (18) is fixedly arranged on the lower shell (1), the guide rod (19) is fixedly arranged on the lower connecting block (18), and the guide rod (19) is in sliding fit with the rod hole on the upper connecting block (17).

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