Integrated die for cutting, bending and variable spacing of four-pin chip

Abstract

The utility model discloses a four-pin chip cutting, bending and variable-spacing integrated die which comprises a paper tape detection mechanism used for detecting whether a paper tape is straightened or not, a chip bending and blanking mechanism used for processing chips, a chip waste storage mechanism, a pinwheel feeding mechanism, a paper tape waste cutting mechanism and a chip storage mechanism. Manpower participation can be greatly reduced, machine automatic feeding stamping is achieved, the part machining consistency is high, the product quality is improved, meanwhile, the production speed is increased, waste, paper tapes and chips are automatically collected, the working environment is more concise, and operation is easy, rapid and more convenient.

Description

Technical Field

[0001] This application relates to the field of leaded chip processing technology, and in particular to an integral mold for cutting, bending, and varying the spacing of a 4-pin chip. Background Technology

[0002] Pinned chips typically refer to integrated circuit chips that use pinned packages. These chips have multiple pins for electrical connections, and each pin usually has a specific function, such as power supply, ground, signal input, or output.

[0003] Currently, bending and punching paper tape chips typically requires manual placement into a mold and manual pressing for bending and cutting. However, chip bending and punching cannot achieve adjustable spacing and can only punch and bend chips of one shape, failing to meet the need for production flexibility. Furthermore, during manual material handling, contact with the chip may deform the pins, leading to incorrect shapes after punching. Since the paper tape is placed into the mold manually, there is a lack of position detection, which may cause poor consistency in chip bending pins due to incorrect placement. Large positional deviations may result in chip scrap. To address these issues, we propose an integrated mold for cutting and bending 4-pin chips with variable spacing. Utility Model Content

[0004] The purpose of this application is to provide an integrated mold for cutting, bending, and varying the spacing of 4-pin chips. This solves the problem that chip bending and punching cannot achieve adjustable spacing and can only punch and bend chips of one shape, which cannot meet the need for production flexibility. At the same time, when manually picking up the material, contact with the chip may cause deformation of the pins, resulting in incorrect shape after punching. Since the material is manually placed into the mold, there is a lack of position detection. Incorrect placement of the paper tape may cause poor consistency of chip bending pins. When the position deviation is large, it may cause the chip to be scrapped.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A four-pin chip cutting, bending, and variable-pitch integral mold includes a paper tape detection mechanism for detecting whether the paper tape is aligned, a chip bending and punching mechanism for processing the chip, a chip waste collection mechanism, a needle wheel feeding mechanism, a paper tape waste cutting mechanism, and a chip collection mechanism.

[0007] In a further embodiment, the paper tape detection mechanism consists of an ultra-thin through-beam photoelectric switch and a chip guide rail.

[0008] In a further embodiment, the chip bending and punching mechanism consists of a chip bending and punching cylinder, a chip bending and punching die, a slotted photoelectric switch, a chip auxiliary bending cylinder, and a chip auxiliary bending connecting plate. A polyurethane stop bolt is provided between the chip bending and punching cylinder and the chip bending and punching die.

[0009] In a further embodiment, the chip waste collection mechanism consists of a waste tank and a chip waste box.

[0010] In a further embodiment, the needle wheel feeding mechanism consists of a paper tape pulling needle wheel, a laser displacement sensor, a paper tape pressure roller, and a needle wheel pulling motor. The output end of the needle wheel pulling motor is connected to the paper tape pressure roller via a coupling.

[0011] In a further embodiment, the paper tape waste cutting mechanism consists of a paper tape waste cutting cylinder, a cutter, a cutter cover plate, and a paper tape storage box.

[0012] In a further embodiment, the chip storage mechanism consists of a chip slide and a chip storage box.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] This application can significantly reduce human intervention, with automatic machine feeding and stamping, resulting in high consistency in parts processing. It improves product quality while increasing production speed, and automatically collects waste materials, paper tapes, and chips, making the working environment simpler, and the operation simpler, faster, and more convenient. Attached Figure Description

[0015] Figure 1 A schematic diagram of the overall mold for cutting, bending, and varying the spacing of a 4-pin chip.

[0016] Figure 2 A schematic front view of the overall mold for cutting, bending, and varying the spacing of a 4-pin chip.

[0017] Figure 3 A top view of the overall mold for cutting, bending, and varying the spacing of a 4-pin chip.

[0018] In the diagram: 1. Chip bending and punching cylinder; 2. Chip auxiliary bending connecting plate; 3. Chip storage box; 4. Ultra-thin through-beam photoelectric switch; 5. Chip bending and punching die; 6. Polyurethane stop bolt; 7. Paper tape waste cutting cylinder; 8. Cutting knife cover plate; 9. Cutting knife; 10. Paper tape storage box; 11. Slotted photoelectric switch; 12. Chip auxiliary bending cylinder; 13. Laser displacement sensor; 14. Chip waste box; 15. Chip slide; 16. Pinwheel pulling motor; 17. Coupling; 18. Paper tape pressure roller; 19. Chip guiding rail. Detailed Implementation

[0019] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Please see Figure 1-3 In this utility model, a 4-pin chip cutting, bending, and variable spacing integral mold includes a paper tape detection mechanism for detecting whether the paper tape is aligned. The paper tape detection mechanism consists of an ultra-thin through-beam photoelectric switch 4 and a chip guide rail 19. After the paper tape enters the chip guide rail 19, the ultra-thin through-beam photoelectric switch 4 will detect whether the paper tape is aligned.

[0022] The chip bending and punching mechanism for chip processing consists of a chip bending and punching cylinder 1, a chip bending and punching die 5, a slotted photoelectric switch 11, a chip auxiliary bending cylinder 12, and a chip auxiliary bending connecting plate 2. A polyurethane stop bolt 6 is provided between the chip bending and punching cylinder 1 and the chip bending and punching die 5. The chip auxiliary bending cylinder 12 presses down on the upper die to complete the punching and bending action. Then, the chip auxiliary bending connecting plate 2 bends the chip to ensure that the terminals are perpendicular to the chip. The polyurethane stop bolt 6 effectively ensures the stability of the punching mechanism.

[0023] The chip waste collection mechanism consists of a waste tank and a chip waste box 14. After stamping, the waste falls into the tank and leads to the chip waste box 14.

[0024] The needle wheel feeding mechanism consists of a paper tape pulling needle wheel, a laser displacement sensor 13, a paper tape pressure roller 18, and a needle wheel pulling motor 16. The output end of the needle wheel pulling motor 16 is connected to the paper tape pressure roller 18 through a coupling 17. The paper tape enters the power mechanism and passes through the needle wheel for conveying.

[0025] The paper tape waste cutting mechanism consists of a paper tape waste cutting cylinder 7, a cutter 9, a cutter cover plate 8, and a paper tape storage box 10. The paper tape waste is cut into the paper tape storage box 10 by pressing down the cutter 9 through the paper tape waste cutting cylinder 7.

[0026] The chip storage mechanism consists of a chip slide 15 and a chip slide 15. After the stamping action is completed, the chip slides into the chip slide 15 through the chip slide 15.

[0027] The working principle of this application is as follows: First, the paper tape is loaded into the chip guide rail 19. The paper tape is manually threaded into the needle wheel conveyor mechanism. After the ultra-thin through-beam photoelectric switch 4 detects that the paper tape is aligned, the entire mechanism starts to run. After the slotted photoelectric switch 11 detects the chip, the chip bending and punching cylinder 1 works, pressing down the chip bending and punching die 5 to complete the punching and bending. The waste and the chip fall into the chip storage box 3 and the chip waste box 14, respectively. The chip auxiliary bending cylinder 12 pushes, driving the auxiliary bending connecting plate 2 to bend the chip, so that the chip and the terminal reach a 90° clamping angle. The chip-assisted bending cylinder 12 retracts, the chip bending and punching die 5 rises upward, the needle wheel rotates clockwise, and it advances one material position. The laser displacement sensor 13 controls its precise movement distance. The paper tape waste cutting cylinder 7 drives the cutter 9 to cut the remaining paper tape, which falls into the paper tape collection box 10. The paper tape waste cutting cylinder 7 retracts, and the above steps are repeated to achieve automatic feeding, automatic punching and bending, and automatic collection of waste and finished products. This greatly improves the problems of low processing efficiency, low product qualification rate, and insufficient production capacity caused by manual punching.

[0028] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A single mold for cutting, bending, and varying the spacing of a 4-pin chip, characterized in that: The paper tape detection mechanism is composed of an ultrathin light barrier photoelectric switch (4) and a chip guide rail (19).

2. The overall die for cutting and bending and changing the distance of a 4-pin chip according to claim 1, characterized in that: The chip bending and punching mechanism is composed of a chip bending and punching cylinder (1), a chip bending and punching die (5), a slot photoelectric switch (11), a chip auxiliary bending cylinder (12) and a chip auxiliary bending connecting plate (2).

3. The overall die for cutting and bending and changing the distance of a 4-pin chip according to claim 1, characterized in that: The chip waste receiving mechanism is composed of a waste groove and a chip waste box (14).

4. The one-piece die for cutting and bending and spacing 4-pin chips according to claim 1, wherein: The needle wheel feeding mechanism is composed of a paper tape pulling needle wheel, a laser displacement sensor (13), a paper tape pressing wheel (18) and a needle wheel pulling motor (16).

5. The one-piece die for 4-pin chip sing, bending and spacing of claim 1, wherein: The paper tape waste cutting mechanism is composed of a paper tape waste cutting cylinder (7), a cutter (9), a cutter cover plate (8) and a paper tape receiving box (10).

6. The one-piece die for 4-pin chip sing, bending and spacing of claim 1, wherein: The chip receiving mechanism is composed of a chip chute (15) and a chip receiving box (3).

7. The one-piece die for 4-pin chip sing, bending and spacing of claim 1, wherein: ​

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