Non-contact detinning equipment for semi-automatic BGA (Ball Grid Array) chip based on visual positioning

Abstract

The utility model discloses a semi-automatic BGA chip non-contact detinning device based on visual positioning. The semi-automatic BGA chip non-contact detinning device comprises a workbench, a detinning device and a product bearing device, wherein the detinning device and the product bearing device are installed on the workbench. The product bearing device is arranged below the tin removing device; the product bearing device comprises a Y-axis translation mechanism, a Y-axis translation seat connected with the Y-axis translation mechanism, a preheating platform mounted on the Y-axis translation seat, and an adsorption platform mounted on the preheating platform; a heating assembly is installed in the preheating platform, and vacuum adsorption holes are formed in the adsorption platform. The non-contact tin removal device is suitable for non-contact tin removal work of various BGA chips, can realize whole-piece tin removal and single-point tin removal, and is high in automation degree, high in working effect and high in practicability.

Description

Technical Field

[0001] This utility model relates to the field of automation technology, and in particular to a non-contact desoldering device for semi-automatic BGA chips based on vision positioning. Background Technology

[0002] With the rapid development of electronic technology in recent years, the disassembly, recycling, and repair of chips in the electronics manufacturing field often require removing chips from circuit boards and cleaning the solder on their pins. As chip sizes become smaller and pin spacing becomes denser, traditional manual solder removal methods face significant challenges when dealing with these tiny and delicate chips. They cannot meet the urgent needs of modern electronics manufacturing and repair industries for efficient, precise, and non-destructive solder removal, thus requiring improvement. Utility Model Content

[0003] The purpose of this invention is to provide a semi-automatic non-contact desoldering device for BGA chips based on vision positioning. This device is suitable for non-contact desoldering of various BGA chips, and can achieve whole-chip desoldering and single-point desoldering. It has a high degree of automation, high working efficiency, and strong practicality.

[0004] To achieve the above objectives, the following technical solution is adopted:

[0005] A semi-automatic non-contact desoldering device for BGA chips based on vision positioning includes a worktable, a desoldering device and a product carrier mounted on the worktable; the product carrier is arranged below the desoldering device; the product carrier includes a Y-axis translation mechanism, a Y-axis translation base connected to the Y-axis translation mechanism, a preheating platform mounted on the Y-axis translation base, and an adsorption platform mounted on the preheating platform; a heating component is installed in the preheating platform, and a vacuum adsorption hole is opened on the adsorption platform; a first support is also connected to one end of the Y-axis translation base, and a nitrogen air knife box is also installed on the first support; the nitrogen air knife box is arranged near one end of the adsorption platform, and an air outlet is opened on the side of the nitrogen air knife box near the adsorption platform, and a first air inlet is installed on the other side of the nitrogen air knife box.

[0006] Furthermore, a second support is connected to one side of the Y-axis translation seat, and a first mounting plate is connected to the top of the second support; a first insertion hole is provided at one end of the top of the first mounting plate, and a first tin storage container is installed at the bottom of the first mounting plate corresponding to the first insertion hole; a first vacuum connector is also installed at the bottom of the first tin storage container.

[0007] Furthermore, a tool setter is also installed at the other end of the top of the first mounting plate.

[0008] Furthermore, a calibration reference block is also arranged at the top center of the first mounting plate.

[0009] Furthermore, a nitrogen-cooled box is also arranged on the workbench.

[0010] Furthermore, the desoldering device includes a fixed bracket, an X-axis translation mechanism mounted on the fixed bracket, an X-axis translation plate connected to the X-axis translation mechanism, and a desoldering mechanism mounted on the X-axis translation plate and located above the product carrier.

[0011] Furthermore, the desoldering mechanism includes a Z-axis lifting mechanism mounted on the X-axis translation plate, a Z-axis lifting plate connected to the Z-axis lifting mechanism, a desoldering mounting plate slidably arranged on one side of the Z-axis lifting plate, a desoldering seat mounted on the lower part of one side of the desoldering mounting plate, and a heating cylinder mounted on the top of the desoldering seat; the desoldering seat has a first cavity, the heating cylinder communicates with the first cavity, and a second air inlet is also installed on the top of the heating cylinder; the bottom of the desoldering seat is also equipped with an air outlet, and a desoldering suction nozzle is arranged inside the air outlet; a second solder storage tank communicating with the desoldering suction nozzle is also installed on one side of the desoldering seat; a third support is also connected to the Z-axis lifting plate, and a filter communicating with the second solder storage tank is also installed on the third support; the filter is also used to connect to an external negative pressure air source; a first fixing block is also connected to one side of the Z-axis lifting plate, and a tension spring is also connected between one end of the first fixing block and one side of the desoldering mounting plate.

[0012] Furthermore, a second fixing block is connected to the upper part of one side of the Z-axis lifting plate, and a weighing sensor is installed at the bottom of the second fixing block; the top of the desoldering mounting plate is connected to the weighing sensor.

[0013] Furthermore, a positioning camera assembly and a ring light source are also mounted on the X-axis translation plate; the ring light source is arranged below the positioning camera assembly.

[0014] Furthermore, a laser displacement sensor is also installed on the X-axis translation plate.

[0015] By adopting the above solution, the beneficial effects of this utility model are:

[0016] This invention is applicable to non-contact desoldering of various BGA chips, and can achieve both whole-chip and single-point desoldering. It features a high degree of automation, high efficiency, and strong practicality. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the tin removal device of this utility model;

[0019] Figure 3This is a schematic diagram of the product support device of this utility model;

[0020] The following are explanations of the labels in the attached diagram:

[0021] 1. Workbench; 2. Desoldering device; 3. Product carrying device; 4. Nitrogen flow regulating component; 11. Nitrogen air-cooled box; 21. Fixed bracket; 22. X-axis translation mechanism; 23. X-axis translation plate; 24. Z-axis lifting mechanism; 25. Z-axis lifting plate; 26. Desoldering mounting plate; 27. Ring light source; 31. Y-axis translation mechanism; 32. Y-axis translation seat; 33. Preheating platform; 34. Adsorption platform; 35. Vacuum adsorption hole; 36. First support; 37. Nitrogen air knife box; 38. Second support; 261. Desoldering base; 262. Heating cylinder; 263. Air outlet; 264. Desoldering suction nozzle; 265. Second solder storage tank; 266. Filter; 267. Tension spring; 268. Weighing sensor; 269. Positioning camera assembly; 260. Laser displacement sensor; 371. First air inlet connector; 381. First mounting plate; 382. First solder storage tank; 383. Tool setter; 384. Calibration reference block. Detailed Implementation

[0022] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0023] Reference Figures 1 to 3 As shown, this utility model provides a semi-automatic non-contact desoldering device for BGA chips based on vision positioning. In one embodiment, it includes a workbench 1, a desoldering device 2 and a product carrying device 3 installed on the workbench 1. The product carrying device 3 is arranged below the desoldering device 2. The product carrying device 3 includes a Y-axis translation mechanism 31, a Y-axis translation seat 32 connected to the Y-axis translation mechanism 31, a preheating platform 33 installed on the Y-axis translation seat 32, and an adsorption platform 34 installed on the preheating platform 33. A heating component is installed in the preheating platform 33, and a vacuum adsorption hole 35 is opened on the adsorption platform 34. One end of the Y-axis translation seat 32 is also connected to a first support 36, and a nitrogen air knife box 37 is also installed on the first support 36. The nitrogen air knife box 37 is arranged near the adsorption platform 34, and an air outlet is opened on the side of the nitrogen air knife box 37 near the adsorption platform 34. A first air inlet connector 371 is installed on the other side of the nitrogen air knife box 37.

[0024] Continue to refer to Figures 1 to 3As shown, in this embodiment, the Y-axis translation mechanism 31 adopts a linear module. The heating component includes four heating tubes installed in the preheating platform 33. The preheating platform 33 has a vacuum passage in the middle that communicates with the vacuum adsorption hole 35. The bottom of the preheating platform 33 is equipped with a vacuum negative pressure interface that communicates with the vacuum passage. The vacuum negative pressure interface is used to connect to an external negative pressure gas source. When the chip is placed on the adsorption platform 34, the chip is adsorbed and limited through the vacuum adsorption hole 35. At the same time, the heating tubes can heat the adsorption platform 34 to heat the chip, thereby accelerating the melting rate of the solder on the chip and facilitating the removal of solder by the desoldering device 2. Meanwhile, during the desoldering process of the chip, nitrogen can be blown onto the chip through the outlet of the nitrogen air knife box 37 (connected to the nitrogen source through the first gas connector 371) to prevent oxygen from contacting the chip pads during the desoldering process, which would cause the chip pads to oxidize.

[0025] In one embodiment, a second support 38 is connected to one side of the Y-axis translation seat 32, and a first mounting plate 381 is connected to the top of the second support 38. A first insertion hole is provided at one end of the top of the first mounting plate 381, and a first tin storage tank 382 is installed at the bottom of the first mounting plate 381 corresponding to the first insertion hole. A first vacuum connector is also installed at the bottom of the first tin storage tank 382. A layer of filtered nickel foam is provided inside the first tin storage tank 382. After tin removal, the tin removal nozzle 264 of the tin removal device 2 is inserted into the first tin storage tank 382. The first vacuum connector is connected to an external negative pressure air source to suck down the tin dross and prevent the tin dross from solidifying and clogging the nozzle.

[0026] Meanwhile, a tool setter 383 is also installed at the other end of the top of the first mounting plate 381, and a calibration reference block 384 is arranged in the middle of the top of the first mounting plate 381. After replacing the desoldering nozzle 264, it can be quickly aligned and calibrated by the tool setter 383 and the calibration reference block 384. In addition, a nitrogen air-cooled box 11 is also arranged on the workbench 1. After the chip is desoldered, the chip can be placed in the nitrogen air-cooled box 11 (nitrogen gas is introduced into it) to prevent oxidation of the chip pads. The nitrogen air-cooled box 11 and the nitrogen air knife box 37 can use existing components. In addition, a nitrogen flow rate regulating component 4 is also arranged on the workbench 1. The nitrogen flow rate regulating component 4 includes a flow meter and a pressure reducing valve, which can regulate the flow rate of nitrogen introduced into the nitrogen air knife box 37 and the nitrogen air-cooled box 11 to meet different operating environments.

[0027] In one embodiment, the desoldering device 2 includes a fixed bracket 21, an X-axis translation mechanism 22 mounted on the fixed bracket 21, an X-axis translation plate 23 connected to the X-axis translation mechanism 22, and a desoldering mechanism mounted on the X-axis translation plate 23 and located above the product carrier 3; the desoldering mechanism includes a Z-axis lifting mechanism 24 mounted on the X-axis translation plate 23, a Z-axis lifting plate 25 connected to the Z-axis lifting mechanism 24, a desoldering mounting plate 26 slidably arranged on one side of the Z-axis lifting plate 25, a desoldering seat 261 mounted on the lower part of one side of the desoldering mounting plate 26, and a heating cylinder 262 mounted on the top of the desoldering seat 261; the desoldering seat 261 has a first cavity, and the heating cylinder 262... 62 is connected to the first cavity, and a second air inlet is installed on the top of the heating cylinder 262; an air outlet 263 is installed at the bottom of the desoldering base 261, and a desoldering suction nozzle 264 is arranged inside the air outlet 263; a second tin storage tank 265 connected to the desoldering suction nozzle 264 is installed on one side of the desoldering base 261; a third support is connected to the Z-axis lifting plate 25, and a filter 266 connected to the second tin storage tank 265 is installed on the third support; the filter 266 is also used to connect to an external negative pressure air source; a first fixing block is connected to one side of the Z-axis lifting plate 25, and a tension spring 267 is connected between one end of the first fixing block and one side of the desoldering mounting plate 26.

[0028] In this embodiment, the desoldering mechanism is provided in two sets, which can be equipped with desoldering nozzles 264 of different specifications to meet different usage requirements. The X-axis translation mechanism 22 and the Z-axis lifting mechanism 24 adopt linear modules. With the cooperation of the two, the desoldering nozzles 264 can be driven to perform translation and lifting movements, which facilitates the suction of solder. During desoldering, the second air inlet is connected to an external positive pressure air source. The heating cylinder 262 can heat the gas and then blow it out from the air outlet 263 to the chip for targeted heating of the chip, thereby increasing the melting rate of the solder. After the solder melts, the desoldering nozzles 264 suck the solder dross into the second solder storage tank 265. At the same time, a filter 266 is provided to filter the incoming gas and prevent blockage.

[0029] Meanwhile, a second fixing block is connected to the upper part of one side of the Z-axis lifting plate 25, and a weighing sensor 268 is installed at the bottom of the second fixing block; the top of the desoldering mounting plate 26 is connected to the weighing sensor 268. The weighing sensor 268 is a tension-compression integrated sensor. By detecting the signal of the weighing sensor 268, it can be determined whether the desoldering head is in contact with the chip, ensuring the safety of desoldering. In addition, a positioning camera assembly 269 and a ring light source 27 are also installed on the X-axis translation plate 23; the ring light source 27 is arranged below the positioning camera assembly 269. The positioning camera assembly 269 can be used to position the chip. At the same time, a laser displacement sensor 260 is also installed on the X-axis translation plate 23. The laser displacement sensor 260 can measure the distance between the desoldering head and the chip surface in real time to ensure that the desoldering head can effectively pick up the solder dross while avoiding damage to the chip.

[0030] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A semi-automatic non-contact tin removal apparatus for BGA chips based on visual positioning, characterized in that, The tin removal device and the product bearing device are arranged on the workbench, and the product bearing device is arranged below the tin removal device.

2. The vision positioning based semi-automatic non-contact desmear device for BGA chips according to claim 1, wherein, The Y-axis translation seat is connected with a first support at one end, and a nitrogen air knife box is arranged on the first support.

3. The vision positioning based semi-automatic non-contact desmear device for BGA chips according to claim 2, wherein, The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket.

4. The vision positioning based semi-automatic non-contact desmear device for BGA chips according to claim 3, wherein, The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket.

5. The vision positioning based semi-automatic non-contact desmear device for BGA chips according to claim 1, wherein, The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket.

6. The vision positioning based semi-automatic non-contact desmear device for BGA chips according to claim 1, wherein, The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket.

7. The vision positioning based semi-automatic non-contact desmear device for BGA chips according to claim 6, wherein, The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket.

8. The vision positioning based semi-automatic non-contact desmear device for BGA chips according to claim 7, wherein, The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket.

9. The vision positioning based semi-automatic non-contact desmear device for BGA chips according to claim 6, wherein, The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket.

10. The vision positioning based semi-automatic non-contact desmear device for BGA chips according to claim 6, wherein, The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first installation plate is provided with a first socket at one end of the top, and a first tin storage tank is arranged at the bottom of the first installation plate corresponding to the first socket. The first

Images