Femtosecond laser drilling device based on silicon wafer processing

Abstract

The utility model relates to a femtosecond laser drilling device based on silicon wafer processing, which comprises a base, a dust suction box is arranged on the base, a drilling workpiece is detachably mounted at the top of the dust suction box, a laser head is arranged above the drilling workpiece, and the laser head is arranged on the base. The laser head moves in a first direction through the first driving piece and moves in a second direction through the second driving piece, and the first direction and the second direction are both horizontal directions and are perpendicular to each other; a negative pressure cylinder is arranged outside the laser head so as to remove dust from the upper part of a punching workpiece; negative pressure holes are distributed in the punching workpiece, the distribution of the negative pressure holes is consistent with the position to be punched, a negative pressure space communicated with the negative pressure holes is arranged in the dust collection box, a first negative pressure opening is formed in the dust collection box corresponding to the negative pressure space, and the first negative pressure opening and the negative pressure cylinder are connected with negative pressure equipment through hoses. According to the femtosecond laser drilling device based on silicon wafer machining, dust can be comprehensively removed from the upper direction and the lower direction, and the good dust removal effect is achieved.

Description

Technical Field

[0001] This utility model relates to the field of femtosecond laser applications, and in particular to a femtosecond laser drilling device based on silicon wafer processing. Background Technology

[0002] Femtosecond laser drilling utilizes a very high-frequency laser for drilling, offering advantages such as no hot spots, fewer microcracks, and high quality. Some high-precision products, such as silicon wafers, use femtosecond laser drilling. The drilling process generates dust. Current dust removal methods primarily involve placing air blowers along the laser emission path to remove dust during drilling. However, the blown dust disperses into the air, which is environmentally unfriendly, and some dust re-falls onto the product, affecting its subsequent application performance. Utility Model Content

[0003] To overcome the shortcomings of existing technologies, this invention provides a femtosecond laser drilling device based on silicon wafer processing, which can perform comprehensive and centralized dust removal from both top and bottom positions, achieving a better dust removal effect.

[0004] The technical solution adopted by this utility model to solve the above-mentioned technical problems is as follows:

[0005] A femtosecond laser drilling device includes a base, on which a dust collection box is provided. A workpiece to be drilled is detachably mounted on the top of the dust collection box. A laser head is provided above the workpiece to be drilled. The laser head moves in a first direction via a first driving member and in a second direction via a second driving member. The first and second directions are both horizontal and perpendicular to each other.

[0006] The laser head is equipped with a negative pressure cylinder to remove dust from above the workpiece being drilled; the workpiece being drilled has negative pressure holes distributed on it, and the distribution of the negative pressure holes is consistent with the position to be drilled; the dust collection box is equipped with a negative pressure space communicating with the negative pressure holes; the dust collection box corresponding to the negative pressure space is equipped with a first negative pressure port; the first negative pressure port and the negative pressure cylinder are connected to a negative pressure device through a hose.

[0007] Furthermore, the punched workpiece includes a mounting plate, and a post is integrally connected to the bottom center of the mounting plate. The negative pressure hole of the punched workpiece is set through the mounting plate and the post. An installation protrusion is formed on the outside of the post. The top of the dust collection box is provided with an installation opening. An installation recess is provided in the installation opening to cooperate with the installation protrusion, so that the punched workpiece is embedded in the dust collection box.

[0008] Furthermore, the top of the punched workpiece is provided with a mounting groove, and negative pressure holes are distributed in the mounting groove of the punched workpiece.

[0009] Furthermore, the negative pressure cylinder is a conical cylinder, and a second negative pressure port is provided on one side of the top of the conical cylinder. The second negative pressure port is connected to the negative pressure equipment through a hose.

[0010] Furthermore, the first driving component includes a gantry frame mounted on the punched workpiece, the inner bottom of the gantry frame is provided with a first slide rail and a first slide block, and the laser head is connected to the first slide block; the second driving component includes two second slide rails arranged parallel to each other on the base, the second slide rails are provided with second slide blocks, the gantry frame is fixed on the two second slide blocks, and the second slide rails and the first slide rails are arranged perpendicular to each other.

[0011] The advantages of this utility model, employing the above-mentioned technical solution, are as follows: Firstly, the femtosecond laser drilling device based on silicon wafer processing, through the cooperation of a negative pressure cylinder and a laser head, can achieve centralized negative pressure suction and dust removal from above the drilling position, resulting in good dust collection and removal efficiency. Secondly, through the cooperation of the drilling workpiece and the dust collection box, it can achieve centralized negative pressure suction and dust removal from below the silicon wafer product. The drilling workpiece not only provides good support, but also, because the negative pressure holes and drilling positions are distributed in a consistent manner, it can more effectively collect and remove dust, resulting in better dust removal efficiency. Centralized dust removal can prevent dust from spreading to the surrounding area, making dust removal timely and efficient.

[0012] The perforated parts can be replaced according to product requirements, and different perforation types make the products more flexible to use. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the structure of one embodiment of the present utility model;

[0014] Figure 2 for Figure 1 Partial cross-sectional structural schematic diagram;

[0015] Figure 3 for Figure 1 A schematic diagram of the structure of a punched workpiece.

[0016] In the diagram, 1. Base, 2. Dust collection box, 3. Drilled workpiece, 4. Laser head, 5. First driving component, 6. Second driving component, 7. Negative pressure cylinder, 8. Hose, 9. Negative pressure equipment; 21. Negative pressure space, 202. First negative pressure port, 301. Negative pressure hole, 302. Mounting plate, 303. Hole post, 304. Mounting protrusion, 305. Mounting groove, 501. Portal frame, 502. First slide rail, 503. First slide block, 601. Second slide rail, 602. Second slide block. Detailed Implementation

[0017] To clearly illustrate the technical features of this solution, the present invention will be described in detail below through specific embodiments and in conjunction with the accompanying drawings. In the description of this specification, the reference to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., means that the specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0018] like Figure 1-3 As shown, in this embodiment, the femtosecond laser drilling device based on silicon wafer processing includes a base 1, on which a dust collection box 2 is mounted. A workpiece 3 is detachably mounted on the top of the dust collection box 2. A laser head 4 is mounted above the workpiece 3. The laser head 4 moves in a first direction via a first driving member 5 and in a second direction via a second driving member 6. Both the first and second directions are horizontal and perpendicular to each other. A negative pressure cylinder 7 is provided outside the laser head 4 to remove dust from above the workpiece 3. Negative pressure holes 301 are distributed on the workpiece 3, and the distribution of the negative pressure holes 301 is consistent with the position to be drilled. A negative pressure space 201 communicating with the negative pressure holes is provided inside the dust collection box 2. A first negative pressure port 202 is provided on the dust collection box 2 corresponding to the negative pressure space 201. The first negative pressure port 202 and the negative pressure cylinder 7 are connected to a negative pressure device 9 via a flexible hose 8. The negative pressure device can be, but is not limited to, a structure combining a fan and a dust collection bag.

[0019] Operating principle: During operation, the silicon wafer is placed on the punching workpiece 3. After the negative pressure device 9 is started, it can be positioned and fixed through the negative pressure holes. The punching position corresponds to the distribution of negative pressure holes. During the punching process, the negative pressure cylinder will move with the laser head to punch holes and effectively suck away the dust on the surface of the silicon wafer. The dust generated in the holes will be sucked away through the negative pressure holes. The two work together to achieve centralized and effective dust removal.

[0020] In one embodiment, the perforated workpiece can be structured as follows: Specifically, the perforated workpiece 3 includes a mounting plate 302, and a post 303 is integrally connected to the bottom center of the mounting plate 302. The negative pressure hole of the perforated workpiece 3 passes through the mounting plate 302 and the post 303. A mounting protrusion 304 is formed on the outside of the post 303. The top of the dust collection box 2 is provided with a mounting opening, and a mounting recess that cooperates with the mounting protrusion is provided in the mounting opening, so that the perforated workpiece is embedded and installed in the dust collection box 2.

[0021] Furthermore, the top of the punched workpiece is provided with a mounting groove 305, and negative pressure holes are distributed in the mounting groove of the punched workpiece.

[0022] In one embodiment, in order to achieve better gas collection effect, the negative pressure cylinder 7 can be a conical cylinder, and a second negative pressure port is provided on one side of the top of the conical cylinder 7. The second negative pressure port is connected to the negative pressure device 9 through a hose.

[0023] In one embodiment, the first driving member 5 includes a gantry frame 501 mounted on the punched workpiece. The inner bottom of the gantry frame 501 is provided with a first slide rail 502 and a first slide block 503, and the laser head 4 is connected to the first slide block 503. The second driving member 6 includes two second slide rails 601 parallel to each other on the base. The second slide rails 601 are provided with second slide blocks 602. The gantry frame 501 is fixed on the two second slide blocks 602, and the second slide rails 601 and the first slide rails 502 are arranged perpendicular to each other. Existing commercially available structures can be directly used for the slide rails and slide blocks.

[0024] The laser head can also be fixed to the first slide block by a telescopic cylinder to achieve vertical adjustment as needed.

[0025] The above specific embodiments should not be construed as limiting the scope of protection of this utility model. For those skilled in the art, any alternative improvements or modifications made to the embodiments of this utility model shall fall within the scope of protection of this utility model.

[0026] Any aspects of this utility model not described in detail are known to those skilled in the art.

Claims

1. A femtosecond laser drilling apparatus based on silicon wafer processing, characterized by, The base is provided with a dust suction box, the top of the dust suction box is detachably provided with a punching workpiece, the top of the punching workpiece is provided with a laser head, the laser head is moved in a first direction by a first driving member and is moved in a second direction by a second driving member, the first direction and the second direction are both horizontal directions and are perpendicular to each other. A negative pressure cylinder is arranged outside the laser head to remove dust from above the punching workpiece; negative pressure holes are distributed on the punching workpiece, the distribution of the negative pressure holes is consistent with the position to be punched, a negative pressure space is arranged in the dust suction box and communicates with the negative pressure holes, a first negative pressure port corresponding to the negative pressure space is arranged on the dust suction box, and the first negative pressure port and the negative pressure cylinder are connected to a negative pressure device through a hose.

2. The femtosecond laser drilling apparatus based on silicon wafer processing according to claim 1, wherein, The punching workpiece comprises a placement plate, a hole column is integrally connected to the bottom middle part of the placement plate, the negative pressure holes of the punching workpiece are arranged through the placement plate and the hole column, an installation protrusion is formed outside the hole column, a mounting port is arranged on the top of the dust suction box, and a mounting recess matched with the installation protrusion is arranged in the mounting port, so that the punching workpiece is embedded and mounted in the dust suction box.

3. The femtosecond laser drilling apparatus based on silicon wafer processing according to claim 1 or 2, characterized in that, A placement groove is arranged on the top of the punching workpiece, and the negative pressure holes are distributed in the placement groove.

4. The femtosecond laser drilling apparatus based on silicon wafer processing according to claim 1, wherein, The negative pressure cylinder is a conical cylinder, a second negative pressure port is arranged on one side of the top of the conical cylinder, and the second negative pressure port is connected to the negative pressure device through a hose.

5. The femtosecond laser drilling apparatus based on silicon wafer processing according to claim 1, wherein, The first driving member comprises a door-shaped frame arranged on the punching workpiece, a first sliding rail and a first sliding seat are arranged on the inner bottom of the door-shaped frame, and the laser head is connected to the first sliding seat; The second driving member comprises two second sliding rails arranged in parallel on the base, a second sliding seat is arranged on each second sliding rail, the door-shaped frame is fixedly arranged on the two second sliding seats, and the second sliding rails and the first sliding rail are arranged perpendicular to each other.

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