Circuit board welding cleaning device

Abstract

The utility model discloses a circuit board welding cleaning device, which belongs to the field of circuit board production equipment, and comprises a rack, a transportation module for transporting a circuit board is arranged on the rack, a cleaning box is fixed on the transportation module, a clamping mechanism is arranged in the cleaning box, a mounting frame is fixed at the top of the rack, and a clamping mechanism is arranged in the mounting frame. A conveying module is arranged on the rack, a cleaning box is arranged on the conveying module, a slag stopping shell is arranged above the conveying module, the slag stopping shell corresponds to the cleaning box in position, an air cylinder used for driving the slag stopping shell to ascend and descend is arranged on the mounting frame, a cleaning mechanism used for cleaning welding slag on the circuit board is arranged in the slag stopping shell, and a collecting mechanism used for treating disintegrating slag is further arranged on the rack. The servo motor in the cleaning mechanism drives the brush to do reciprocating rectilinear motion, the surface of a circuit board can be comprehensively, uniformly and deeply cleaned, welding slag and dust can be thoroughly cleaned, and meanwhile, the dust can be timely sucked away in the cleaning process in cooperation with a dust suction pump and a slag suction head of the collecting mechanism.

Description

Technical Field

[0001] This utility model relates to the field of circuit board production equipment technology, and in particular to a circuit board soldering and cleaning device. Background Technology

[0002] During the soldering process of circuit boards, a large amount of dust is generated and adheres to the surface of the circuit board. If this dust is not cleaned in time, it may affect the electrical performance of the circuit board, cause short circuits and other problems, and seriously affect the quality and reliability of the circuit board. The traditional cleaning method still uses manual methods to clean this dust. Manual cleaning has many drawbacks. First, the cleaning efficiency is extremely low and cannot meet the needs of large-scale production. Moreover, during the manual cleaning process, due to the lack of effective protection and collection measures, a large amount of dust often remains on the desktop and work area after cleaning. This dust not only causes serious pollution to the working environment, but may also re-adhere to the cleaned or uncleaned circuit boards in subsequent production processes, causing secondary pollution and reducing the product yield. Therefore, there is an urgent need for a high-efficiency, automatic circuit board soldering cleaning device that can effectively solve the environmental problems after cleaning. Utility Model Content

[0003] The purpose of this invention is to solve the problem that in the existing technology, when cleaning dust manually, a large amount of dust often remains on the desktop and work area after cleaning due to the lack of effective protection and collection measures. This dust not only seriously pollutes the working environment, but may also re-adhere to the cleaned or uncleaned circuit boards in the subsequent production process, causing secondary pollution and reducing the yield of products. Therefore, this invention proposes a circuit board soldering cleaning device.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] A circuit board soldering cleaning device includes a frame, a transport module for transporting circuit boards mounted on the frame, a cleaning box fixed on the transport module, a clamping mechanism inside the cleaning box, a mounting frame fixed on the top of the frame, a slag-blocking shell above the transport module corresponding to the cleaning box, a cylinder for raising and lowering the slag-blocking shell mounted on the mounting frame, a cleaning mechanism for cleaning solder slag on the circuit board inside the slag-blocking shell, a collection mechanism for handling slag fragments mounted on the frame, the collection mechanism including a slag suction head inside the slag-blocking shell, and a dust suction pump mounted on the frame, the slag inlet of the dust suction pump being connected to the slag suction head via a flexible hose.

[0006] Preferably, the clamping mechanism includes clamping plates disposed within the cleaning box, and the cleaning box is provided with an electric push rod for driving the two clamping plates to move towards the middle.

[0007] Preferably, the cleaning mechanism includes a servo motor fixed to the top of the slag-blocking shell, a turntable fixed to the output shaft end of the servo motor, a push rod fixed to the bottom of the turntable, a movable housing sliding on the outer surface of the push rod, an installation block fixed to the bottom of the movable housing, a brush fixed to the bottom of the installation block, and the slag suction head fixed to the installation block.

[0008] Preferably, the cleaning mechanism further includes limiting rods fixed on both sides of the movable housing, the limiting rods being slidably connected to the slag-blocking shell.

[0009] Preferably, the collection mechanism further includes a collection box fixed to the frame, and the slag discharge end of the dust pump is connected to the collection box through a second flexible hose.

[0010] Preferably, the collection mechanism further includes a dustproof net fixed to the side of the collection box, and the collection box has a top cover that rotates via a hinge.

[0011] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0012] 1. The servo motor in the cleaning mechanism drives the brush to perform reciprocating linear motion, which can thoroughly, evenly and deeply clean the surface of the circuit board, ensuring the complete removal of solder slag and dust. At the same time, in conjunction with the dust pump and slag suction head of the collection mechanism, dust can be sucked away in time during the cleaning process, effectively avoiding secondary pollution, greatly improving the cleanliness and quality of the circuit board, thereby improving the performance and reliability of the product.

[0013] 2. By adopting a collaborative working mode of transport module, clamping mechanism, cleaning mechanism and collection mechanism, the dust cleaning operation after circuit board soldering is automated. Compared with the traditional manual cleaning method, the cleaning efficiency is greatly improved, which can meet the needs of large-scale production and significantly reduce the production cycle and cost. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural diagram of a circuit board soldering and cleaning device proposed in this utility model;

[0015] Figure 2 This is a side view of the overall structure of a circuit board welding and cleaning device proposed in this utility model;

[0016] Figure 3 This is a schematic diagram of the internal structure of the slag-blocking shell of a circuit board welding cleaning device proposed in this utility model;

[0017] Figure 4 This utility model proposes a circuit board soldering cleaning device. Figure 3 Enlarged schematic diagram of the structure at point A in the middle.

[0018] In the diagram: 1. Frame; 2. Transport module; 3. Cleaning box; 41. Clamping plate; 42. Electric push rod; 5. Mounting frame; 6. Slag-blocking shell; 71. Servo motor; 72. Turntable; 73. Push rod; 74. Moving shell; 75. Mounting block; 76. Brush; 77. Limiting rod; 81. Slag suction head; 82. Dust pump; 83. Hose 1; 84. Collection box; 85. Hose 2; 86. Dustproof net; 87. Top cover. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0020] Example 1

[0021] Reference Figures 1-4 A circuit board welding cleaning device includes a frame 1, a transport module 2 for transporting circuit boards on the frame 1, a cleaning box 3 fixed on the transport module 2, a clamping mechanism inside the cleaning box 3, a mounting frame 5 fixed on the top of the frame 1, a slag-blocking shell 6 above the transport module 2, the slag-blocking shell 6 corresponding to the cleaning box 3, a cylinder for driving the slag-blocking shell 6 to rise and fall on the mounting frame 5, a cleaning mechanism for cleaning welding slag on the circuit board inside the slag-blocking shell 6, a collection mechanism for handling slag on the frame 1, the collection mechanism including a slag suction head 81 inside the slag-blocking shell 6, a dust suction pump 82 installed on the frame 1, and the slag inlet end of the dust suction pump 82 connected to the slag suction head 81 through a hose 83.

[0022] Furthermore, the clamping mechanism includes a clamping plate 41 disposed inside the cleaning box 3, and an electric push rod 42 disposed on the cleaning box 3 for driving the two clamping plates 41 to move towards the middle.

[0023] Furthermore, the cleaning mechanism includes a servo motor 71 fixed to the top of the slag-blocking shell 6, a turntable 72 fixed to the output shaft end of the servo motor 71, a push rod 73 fixed to the bottom of the turntable 72, a movable housing 74 sliding on the outer surface of the push rod 73, an installation block 75 fixed to the bottom of the movable housing 74, a brush 76 fixed to the bottom of the installation block 75, and a slag suction head 81 fixed to the installation block 75.

[0024] Furthermore, the cleaning mechanism also includes limiting rods 77 fixed on both sides of the movable housing 74, and the limiting rods 77 are slidably connected to the slag-blocking housing 6.

[0025] It should be noted that: when the circuit board to be cleaned is placed in the cleaning box 3, the electric push rod 42 is activated, and the electric push rod 42 pushes the two clamping plates 41 to move towards the middle until the circuit board is firmly clamped, the transport module 2 starts to work, transporting the cleaning box 3 containing the circuit board to the designated cleaning position below the slag-blocking shell 6. At this time, the cylinder on the mounting frame 5 is activated, driving the slag-blocking shell 6 to descend to a suitable height, so that it tightly covers the top of the cleaning box 3, forming a relatively closed cleaning space. The servo motor 71 is activated, and its output shaft drives the turntable 72 to rotate. The push rod 73 at the bottom of the turntable 72 then makes a circular motion. Due to the sliding cooperation between the push rod 73 and the moving shell 74, the moving shell 74 makes a reciprocating linear motion along the slag-blocking shell 6 under the guidance of the limit rod 77. The brush 76 at the bottom of the mounting block 75 performs a comprehensive cleaning of the surface of the circuit board.

[0026] The further advantage of using the above method is that it enables a comprehensive, uniform, and thorough cleaning of the circuit board surface, ensuring the complete removal of solder slag and dust.

[0027] It should be noted that the transport module 2 consists of a motor, a rotating roller and a transport belt. The motor drives the rotating shaft to rotate, thereby driving the transport belt to run. The cleaning box 3 is fixed on the transport belt.

[0028] Based on Example 1, Example 2:

[0029] Reference Figures 1-4 A circuit board welding cleaning device includes a frame 1, a transport module 2 for transporting circuit boards on the frame 1, a cleaning box 3 fixed on the transport module 2, a clamping mechanism inside the cleaning box 3, a mounting frame 5 fixed on the top of the frame 1, a slag-blocking shell 6 above the transport module 2, the slag-blocking shell 6 corresponding to the cleaning box 3, a cylinder for driving the slag-blocking shell 6 to rise and fall on the mounting frame 5, a cleaning mechanism for cleaning welding slag on the circuit board inside the slag-blocking shell 6, a collection mechanism for handling slag on the frame 1, the collection mechanism including a slag suction head 81 inside the slag-blocking shell 6, a dust suction pump 82 installed on the frame 1, and the slag inlet end of the dust suction pump 82 connected to the slag suction head 81 through a hose 83.

[0030] Furthermore, the collection mechanism also includes a collection box 84 fixed to the frame 1, and the slag discharge end of the dust pump 82 is connected to the collection box 84 through a hose 85.

[0031] Furthermore, the collection mechanism also includes a dustproof net 86 fixed to the side of the collection box 84, and a top cover 87 that rotates on the collection box 84 via a hinge.

[0032] During cleaning, the vacuum pump 82 is activated, sucking in the cleaned dust through the suction head 81. The dust is then transported to the collection box 84 via hose 1 83, the vacuum pump 82, and hose 2 85. After cleaning, the cylinder drives the baffle shell 6 to rise, and the transport module 2 transports the cleaned circuit board to the next process or a designated location. The dustproof net 86 on the side of the collection box 84 effectively prevents dust from being blown out in the opposite direction during the operation of the vacuum pump 82. When the dust in the collection box 84 accumulates to a certain level, the top cover 87 on the collection box 84 is opened for cleaning. After cleaning, the top cover 87 is closed to ensure the airtightness of the collection box 84 for future use.

[0033] The further advantage of adopting the above method is that it can remove dust in a timely manner during the cleaning process, effectively avoid secondary pollution, greatly improve the cleanliness and quality of the circuit board, and thus enhance the performance and reliability of the product.

[0034] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A circuit board solder cleaning apparatus comprising a frame (1), characterized in that, The rack (1) is provided with a conveying module (2) for conveying circuit boards, the conveying module (2) is fixed with a cleaning box (3), the cleaning box (3) is provided with a clamping mechanism, the top of the rack (1) is fixed with a mounting frame (5), the top of the conveying module (2) is provided with a slag blocking shell (6), the slag blocking shell (6) corresponds to the position of the cleaning box (3), the mounting frame (5) is provided with a cylinder for driving the slag blocking shell (6) to ascend and descend, the slag blocking shell (6) is provided with a cleaning mechanism for cleaning the welding slag on the circuit board, and the rack (1) is further provided with a collecting mechanism for processing the slag, the collecting mechanism comprising a slag suction head (81) arranged in the slag blocking shell (6), a dust suction pump (82) is mounted on the rack (1), and the slag suction end of the dust suction pump (82) is communicated with the slag suction head (81) through a hose (83).

2. A circuit board solder cleaning apparatus as defined in claim 1, wherein, The clamping mechanism comprises a clamping plate (41) arranged in the cleaning box (3), and the cleaning box (3) is provided with an electric push rod (42) for driving the two clamping plates (41) to move towards the middle.

3. The circuit board solder cleaning apparatus of claim 1, wherein, The cleaning mechanism comprises a servo motor (71) fixed on the top of the slag blocking shell (6), the output shaft end of the servo motor (71) is fixed with a rotating disc (72), the bottom of the rotating disc (72) is fixed with a push rod (73), the outer surface of the push rod (73) is slidably provided with a moving shell (74), the bottom of the moving shell (74) is fixed with a mounting block (75), the bottom of the mounting block (75) is fixed with a brush (76), and the slag suction head (81) is fixed on the mounting block (75).

4. A circuit board solder cleaning apparatus as defined in claim 3, wherein The cleaning mechanism further comprises limiting rods (77) fixed on the two side surfaces of the moving shell (74), and the limiting rods (77) are slidably connected with the slag blocking shell (6).

5. The circuit board solder cleaning apparatus of claim 1, wherein, The collecting mechanism further comprises a collecting box (84) fixed on the rack (1), and the slag outlet end of the dust suction pump (82) is communicated with the collecting box (84) through a hose (85).

6. A circuit board solder cleaning apparatus as defined in claim 5, wherein, The collecting mechanism further comprises a dustproof net (86) fixed on the side surface of the collecting box (84), and the collecting box (84) is provided with a top cover (87) rotatable through a hinge. The collecting mechanism further comprises a dustproof net (86) fixed on the side surface of the collecting box (84), and the collecting box (84) is provided with a top cover (87) rotatable through a hinge.

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