Wafer girdling workbench and girdling device

Abstract

The utility model belongs to the technical field of wafer girdling, and particularly relates to a wafer girdling workbench and a girdling device, the wafer girdling workbench comprises a middle bearing platform, an edge bearing platform and a lifting mechanism, the middle bearing platform is cylindrical and is used for supporting a thinned area of a wafer, the middle part of the edge bearing platform is provided with a circular opening through which the middle bearing platform can pass, and the lifting mechanism is used for lifting the middle bearing platform. The edge bearing platform is arranged on the side face of the middle bearing platform in a sleeving mode through a circular opening and used for supporting an outer ring step of a wafer, and the lifting mechanism is located below the edge bearing platform, connected with the edge bearing platform and used for driving the edge bearing platform to move in the height direction of the middle bearing platform. The workbench can be adapted to wafers with different outer ring step heights and effectively support the whole wafer, the universality of the workbench is higher, the tedious operation of replacing an edge bearing platform is avoided, the height difference adjustment of the workbench is faster, and the working efficiency of wafer girdling is improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to wafer ring cutting technical field, concretely relates to a wafer ring cutting workbench and ring cutting device. BACKGROUND

[0002] When using TAIKO process to grind wafer back surface, the wafer peripheral edge part is reserved, only the middle area of wafer back surface is thinned and ground, and after thinning and grinding, the wafer back surface edge forms an outer ring step. Different kinds of wafers have different requirements according to product characteristics, voltage and other requirements, the diameter of the back surface thinning and grinding area is the same, but the thickness is different, so the wafer back surface thinning and grinding edge of different kinds of wafers forms an outer ring step with different heights. When the wafer is subsequently ring cut (cutting along the wafer outer ring) to remove the outer ring step, the wafer is generally face up, in order to ensure stable and effective support of the wafer as a whole during cutting, the ring cutting workbench is provided with a corresponding height difference of the edge support to support the outer ring step, since the outer ring step heights of different kinds of wafers are different, the corresponding height difference of the edge support needs to be replaced before ring cutting, the operation is complicated and time-consuming each time, and there are risks such as screw fastening not in place, which can easily affect the ring cutting quality. SUMMARY

[0003] The technical problem to be solved by the utility model is to provide a wafer ring cutting workbench and ring cutting device which can adapt to different outer ring step heights and effectively support the wafer as a whole, the height difference of the workbench is adjusted more quickly, the wafer ring cutting operation efficiency is improved, the wafer ring cutting quality is affected, and the wafer ring cutting workbench and ring cutting device are more universal.

[0004] The utility model provides a wafer ring cutting workbench, including middle support, edge support and lifting mechanism, the middle support is cylindrical, is used for supporting the thinning area of wafer, the middle of edge support is provided with the circular opening that can pass through the middle support, the edge support is set in the side of middle support through the circular opening, is used for supporting the outer ring step of wafer, the lifting mechanism is located below edge support and is connected with edge support, is used for driving edge support moves along the height direction of middle support.

[0005] Further, the area of the surface of the edge support for contacting the outer ring step is provided with a friction increasing structure, and the friction increasing structure is arranged circumferentially outside the circular opening on the surface of the edge support.

[0006] Further, the friction increasing structure is a plurality of arc grooves, and the plurality of arc grooves are arranged circumferentially outside the circular opening on the surface of the edge support in at least two circles.

[0007] Further, a light transmission hole is arranged on the edge support.

[0008] Further, the middle support platform top is provided with adsorption holes, and the lower ends of the adsorption holes are connected with a negative pressure generator.

[0009] Further, the lifting mechanism is a lead screw lifting mechanism.

[0010] Further, the lead screw lifting mechanism drives the side support platform to move along the height direction of the middle support platform through the lifting of the lead screw, the lead screw lifting mechanism has a plurality of lead screws, the upper ends of the plurality of lead screws are connected with the side support platform, and the positions where the upper ends of the plurality of lead screws are connected with the side support platform are distributed at the corners of the side support platform.

[0011] Further, the middle support platform is arranged on a mounting seat, a plurality of guide holes are arranged on the mounting seat and located at positions outside the middle support platform, the positions and the number of the plurality of guide holes correspond to the plurality of lead screws, and the plurality of lead screws correspondingly pass through the plurality of guide holes and are connected with the side support platform.

[0012] Further, the driving assembly for lifting the plurality of lead screws is arranged on the mounting seat and located below the mounting seat.

[0013] The utility model also provides a wafer ring cutting device which is provided with the wafer ring cutting workbench.

[0014] The utility model discloses a wafer ring cutting device which comprises a workbench, a middle support platform arranged on the workbench, a side support platform arranged on the middle support platform and a lifting mechanism arranged below the middle support platform and connected with the middle support platform and the side support platform. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a longitudinal section view of the wafer in the ring cutting posture.

[0016] Figure 2 It is a top view of the middle support platform of the utility model arranged on the mounting seat.

[0017] Figure 3The utility model discloses a top view of the edge support platform.

[0018] Figure 4 The utility model discloses the cooperation schematic drawing of middle support platform, edge support platform and lifting mechanism.

[0019] In the drawing: 1, mounting seat;11, guide hole;2, middle support platform;21, adsorption hole;3, edge support platform;31, round opening;32, arc slot;33, mounting hole;34, light transmission hole;4, lifting mechanism;41, screw rod;42, threaded sleeve;43, rotary drive part;44, transmission assembly;100, wafer;101, thinning area;102, outer ring step;200, cutting part. Specific implementation

[0020] As Figures 2-4 shown, the utility model provides a wafer ring cutting workbench, and the wafer ring cutting workbench includes middle support platform 2, edge support platform 3 and lifting mechanism 4. The middle support platform 2 is cylindrical, and the top of middle support platform 2 is used to support the thinning area 101 of wafer 100. The width or diameter of edge support platform 3 is greater than the diameter of middle support platform 2, and the middle of edge support platform 3 is provided with round opening 31, and the size of round opening 31 can be passed through middle support platform 2, and edge support platform 3 is sleeved on the side of middle support platform 2 through round opening 31, and the clearance fit between round opening 31 and middle support platform 2, and edge support platform 3 is used to support the outer ring step 102 of wafer 100. Lifting mechanism 4 is located below edge support platform 3 and is connected with edge support platform 3, and lifting mechanism 4 is used to drive edge support platform 3 to move along the height direction of middle support platform 2.

[0021] The posture of wafer 100 when ring cutting is as Figure 1The wafer ring cutting workbench provided by the utility model can effectively support the circular thinning area 101 of the wafer 100 through the cylindrical middle support platform 2, can effectively support the outer ring step 102 of the wafer 100 in a ring shape through the edge support platform 3, and when the wafer 100 with different outer ring step 102 heights is ring cut, the edge support platform 3 with the corresponding height difference does not need to be replaced for adjustment, but the edge support platform 3 is driven to move along the height direction of the middle support platform 2 through the lifting mechanism 4, namely the edge support platform 3 is driven to lift, so that the height difference between the surface of the edge support platform 3 and the top of the middle support platform 2 is adjusted, the wafer 100 with different outer ring step 102 heights is adapted, and the wafer 100 as a whole is effectively supported, the workbench is more versatile, meanwhile, the lifting mechanism 4 is below the edge support platform 3 and does not interfere with the work of the cutting component 200. The utility model avoids the complicated operation of replacing the edge support platform 3, the height difference adjustment of the workbench is faster, the operation efficiency of the wafer 100 ring cutting is improved, the risk of screw fastening not being in place existing in the replacement of the edge support platform 3 is avoided, and the influence on the wafer 100 ring cutting quality is reduced.

[0022] The area of the surface of the edge support platform 3 for contacting the outer ring step 102 is provided with a friction increasing structure, and the friction increasing structure is arranged in a ring shape around the outside of the circular opening 31 of the surface of the edge support platform 3. Since the back surface of the wafer 100 is attached with a film during the machining process, the roughness of the surface of the edge support platform 3 can be increased based on the arrangement of the friction increasing structure, a ring-shaped area with corresponding roughness is formed, the film on the surface of the outer ring step 102 can be better attached, the friction between the film on the surface of the outer ring step 102 is increased, the slipping during the ring cutting process is avoided, the arrangement of the negative pressure adsorption structure on the edge support platform 3 is omitted, and the structural complexity of the edge support platform 3 is reduced.

[0023] The friction increasing structure is a plurality of arc grooves 32, and the arc groove 32 is specifically an arc line-shaped groove. Figure 3 As shown in the figure, the plurality of arc grooves 32 are arranged in at least two rings around the outside of the circular opening 31 of the surface of the edge support platform 3. Based on the arrangement, the surface of the edge support platform 3 can be relatively flat and stress concentration caused by local protrusions can be avoided, and the edge support platform 3 can be provided with effective roughness requirements through the arc grooves 32.

[0024] In the utility model, the light transmission hole 34 is arranged on the edge support platform 3, and the light transmission requirement in some machining processes can be met.

[0025] When ring cutting is performed, the cutting position of the cutting component 200 on the wafer 100 corresponds to the edge area of the middle platform 2, that is, the middle platform 2 is the main ring cutting platform during the ring cutting operation. In the utility model, the top of the middle platform 2 is provided with an adsorption hole 21, the upper end of the adsorption hole 21 is located on the top surface of the middle platform 2, the lower end of the adsorption hole 21 extends along the bottom or side surface of the middle platform 2 and penetrates through, and a gas pipe passing through the adsorption hole 21 is connected with a negative pressure generator, so that the adsorption hole 21 generates a certain adsorption force through the negative pressure generator to adsorb the thinning area 101 of the wafer 100, and the thinning area 101 is stably located on the top of the middle platform 2 during the ring cutting process without relative rotation and displacement. The negative pressure generator can be an air extraction mechanism, a vacuum pump or other negative pressure generating mechanism, and the number of adsorption holes 21 is multiple.

[0026] The lifting mechanism 4 can be an electric push rod or other, and in the utility model, the lifting mechanism 4 is preferably a screw rod lifting mechanism, which has strong carrying capacity and high precision.

[0027] The screw rod lifting mechanism specifically drives the edge platform 3 to move along the height direction of the middle platform 2 through the lifting driving edge of the screw rod 41. The screw rod lifting mechanism has a plurality of screw rods 41, the upper ends of the plurality of screw rods 41 are connected with the edge platform 3, and the positions where the upper ends of the plurality of screw rods 41 are connected with the edge platform 3 are distributed at the corners of the edge platform 3, so as to improve the support stability of the edge platform 3.

[0028] The middle platform 2 is specifically arranged on the mounting seat 1, and the width or diameter of the mounting seat 1 is greater than the diameter of the middle platform 2. A plurality of guide holes 11 are formed on the area of the mounting seat 1 outside the middle platform 2, the number of the plurality of guide holes 11 is the same as that of the plurality of screw rods 41, and the positions of the plurality of guide holes 11 correspond to those of the plurality of screw rods 41. The plurality of screw rods 41 correspondingly pass through the plurality of guide holes 11 and are connected with the edge platform 3. When the edge platform 3 is driven to lift, the screw rods 41 move axially along the guide holes 11 in which the screw rods 41 are arranged, the guide holes 11 can guide the movement of the screw rods 41, and the stability of the lifting of the edge platform 3 is improved. The driving assembly for lifting the plurality of screw rods 41 in the screw rod lifting mechanism and the aforementioned negative pressure generator are arranged on the mounting seat 1 and below the mounting seat 1, so as to reduce the occupation of the space on the side surface of the middle platform 2.

[0029] In the utility model, the corners of the edge platform 3 are provided with a plurality of mounting holes 33 which are the same in number as the plurality of screw rods 41 and correspond in position, and screws or other fasteners pass through the corresponding mounting holes 33 and are connected with the corresponding screw rods 41, so that the screw rods 41 are connected with the edge platform 3.

[0030] In one embodiment of the utility model, the number of screw rods 41 in the screw rod lifting mechanism is four, the screw rod lifting mechanism is a worm screw rod lifting machine with four screw rods 41 linked together, and the specific structure is the same as the prior art, and the driving assembly for driving the four screw rods 41 to lift is arranged below the mounting seat 1.

[0031] In another embodiment of the utility model, the number of screw rods 41 in the screw rod lifting mechanism is eight, the driving assembly of the screw rod lifting mechanism includes a rotating driving member 43 and eight threaded sleeves 42, the threaded sleeve 42 is a sleeve with threads arranged on the inner side, the eight screw rods 41 are correspondingly arranged in the eight threaded sleeves 42 and are threadedly connected, the output end of the rotating driving member 43 is drivingly connected to one of the threaded sleeves 42 through a set of transmission assemblies 44, and each adjacent two threaded sleeves 42 among the eight threaded sleeves 42 are drivingly connected through a set of transmission assemblies 44, so that the eight threaded sleeves 42 are synchronously driven to rotate by the rotating driving member 43, and the eight screw rods 41 are synchronously driven to lift. In this embodiment, the driving assembly further includes a housing, the eight threaded sleeves 42 are all rotatably arranged in the housing, and the housing is provided with through holes corresponding to the positions of the two ends of the eight threaded sleeves 42, so that the screw rods 41 can extend out of the two ends of the corresponding threaded sleeves 42 along the housing, the rotating driving member 43 is arranged on the housing, and the output end of the rotating driving member 43 is rotatably arranged in the housing, and all the transmission assemblies 44 are located in the housing. The driving assembly is fixed to the mounting seat 1 by the housing and is arranged below the mounting seat 1. The rotating driving member 43 is a motor or other, and the transmission assembly 44 is a synchronous belt wheel transmission assembly or a chain wheel transmission assembly.

[0032] The utility model also provides a wafer ring cutting device which is provided with the wafer ring cutting workbench. When the wafer 100 with different outer ring steps 102 heights is ring cut, the wafer ring cutting workbench does not need to replace the edge support platform 3 with the corresponding height difference for adjustment, but drives the edge support platform 3 to move along the height direction of the middle support platform 2 through the lifting mechanism 4, thereby adjusting the height difference between the surface of the edge support platform 3 and the top of the middle support platform 2, adapting to the wafer 100 with different outer ring step 102 heights and effectively supporting the whole wafer 100, the workbench has higher universality, avoids the cumbersome operation of replacing the edge support platform 3, the height difference adjustment of the workbench is faster, improves the wafer 100 ring cutting operation efficiency, avoids the risk of screw fastening not in place when the edge support platform 3 is replaced, and reduces the influence on the wafer 100 ring cutting quality.

[0033] Those skilled in the art should understand that the above discussion of any embodiment is only intended to be illustrative and is not intended to be limiting to the scope of the present application; the above embodiments or technical features among different embodiments can also be combined, the steps can be implemented in any order, and there are many other changes to different aspects of one or more embodiments of the present application as described above, which are not provided in details for the sake of brevity.

[0034] One or more embodiments of the present application are intended to cover all such alternatives, modifications, and variations as falling within the broad scope of the application. Accordingly, any omission, modification, equivalent replacement, improvement, etc. made within the spirit and principle of one or more embodiments of the present application should be included in the scope of the present application.

Claims

1. A wafer ring cutting station, characterized by, The supporting device comprises a middle support platform (2), an edge support platform (3) and a lifting mechanism (4), the middle support platform (2) is cylindrical and is used for supporting a thinning area (101) of a wafer (100), the edge support platform (3) is provided with a circular opening (31) in the middle part, the edge support platform (3) is sleeved on the side of the middle support platform (2) through the circular opening (31) and is used for supporting an outer ring step (102) of the wafer (100), and the lifting mechanism (4) is located below the edge support platform (3) and is connected with the edge support platform (3) and is used for driving the edge support platform (3) to move along the height direction of the middle support platform (2).

2. The wafer ring cutting station of claim 1 wherein, The edge support platform (3) is provided with a plurality of arc grooves (32) on the surface thereof and around the outer side of the circular opening (31).

3. The wafer ring cutting station of claim 2, wherein, The edge support platform (3) is provided with a plurality of arc grooves (32) on the surface thereof and around the outer side of the circular opening (31).

4. The wafer ring cutting station of any one of claims 1 to 3, wherein, The edge support platform (3) is provided with a plurality of arc grooves (32) on the surface thereof and around the outer side of the circular opening (31).

5. The wafer ring saw table of any one of claims 1-3, wherein the ring saw table further comprises a ring saw blade disposed within the ring saw blade housing and configured to cut the wafer into the plurality of dies. The middle support platform (2) is provided with an adsorption hole (21) on the top thereof, and the lower end of the adsorption hole (21) is connected with a negative pressure generator.

6. The wafer ring saw table of any one of claims 1-3, wherein, The lifting mechanism (4) is a lead screw lifting mechanism.

7. The wafer ring cutting station of claim 6 wherein, The lead screw lifting mechanism drives the edge support platform (3) to move along the height direction of the middle support platform (2) through the lifting of a lead screw (41), the lead screw lifting mechanism is provided with a plurality of lead screws (41), the upper ends of the plurality of lead screws (41) are connected with the edge support platform (3), and the positions, at which the upper ends of the plurality of lead screws (41) are connected with the edge support platform (3), are distributed at the corners of the edge support platform (3).

8. The wafer ring cutting station of claim 7 wherein, The middle support platform (2) is arranged on a mounting seat (1), the mounting seat (1) is provided with a plurality of guide holes (11) on the area outside the middle support platform (2), the positions and the number of the plurality of guide holes (11) correspond to the plurality of lead screws (41), and the plurality of lead screws (41) pass through the plurality of guide holes (11) and are connected with the edge support platform (3).

9. The wafer ring cutting station of claim 7 or 8, wherein, The driving assembly for lifting the plurality of lead screws (41) in the lead screw lifting mechanism is arranged on the mounting seat (1) and below the mounting seat (1).

10. A wafer ring cutting apparatus, characterized by, The wafer ring cutting workbench is provided.

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