Thin film deposition equipment
By introducing a bias power supply device and an insulating coupling into the thin film deposition equipment, the safety hazards during the workpiece bias application process are solved, and electrical isolation during workpiece rotation and uniformity of thin film deposition are achieved.
Patent Information
- Application Number
- CN202423305516.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-30
- Publication Date
- 2026-01-06
- Estimated Expiration
- 2034-12-30
AI Technical Summary
Existing thin film deposition equipment poses safety hazards when applying bias voltage to the workpiece, especially the risk of conductive short circuits.
A bias power supply device is used to apply bias voltage through the workpiece positioning device, and it is isolated from the drive device by an insulating coupling to prevent the bias voltage from being conducted to the outside. Electrical isolation is ensured by combining conductive slip rings and insulating support components.
It effectively avoids power short circuits during thin film deposition, reduces safety hazards, and ensures electrical isolation and uniformity of thin film deposition during workpiece rotation.
Smart Images
Figure CN223766412U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to vacuum coating technology field, especially a film deposition equipment. BACKGROUND
[0002] Film deposition is a process of depositing thin film on a workpiece such as a substrate in a vacuum environment. Due to the need for uniformity of thin film deposition on the workpiece, the workpiece often needs to be rotated. With the requirements of film deposition practice and film deposition process, more and more film deposition processes now require the workpiece to be at a certain potential (called bias) during the film deposition process, and the potential can be adjusted according to different processes.
[0003] During the film deposition process, a bias voltage is applied to the workpiece, which is usually high voltage, which can improve the state of the plasma, increase the energy of the ions, and enhance the adhesion of the deposited film and adjust the film stress and many other properties. When a bias voltage is applied to the workpiece, a large bias current is generated, and the driving device for driving the workpiece to rotate introduced from outside the vacuum chamber may have the risk of electric short circuit, which poses a safety hazard. SUMMARY
[0004] The technical problem to be solved by the embodiments of the utility model is to provide a film deposition equipment to solve the problem of safety hazard in introducing bias voltage during the process of depositing thin film on the workpiece in the prior art.
[0005] The utility model discloses a film deposition equipment, including bias power supply device, driving device, vacuum chamber and the workpiece positioning device and deposition source arranged in vacuum chamber, wherein,
[0006] The workpiece positioning device is provided with a positioning area for positioning the workpiece;
[0007] The deposition source is used to generate thin film source material and make the thin film source material sputter outward, and the sputtering end of the deposition source is arranged towards the positioning area of the workpiece positioning device;
[0008] The voltage output end of the bias power supply device extends into the vacuum chamber and is electrically connected with the workpiece positioning device, so as to apply a bias voltage to the workpiece through the workpiece positioning device;
[0009] The driving shaft of the driving device extends into the vacuum chamber and is connected with the rotating shaft of the workpiece positioning device through an insulating coupling, and drives the workpiece positioning device to rotate.
[0010] Optionally, the bias power supply device comprises a conductive slip ring and a bias power supply, one end of the insulating coupling is connected with the driving shaft of the driving device, and the other end is connected with the rotating shaft of the workpiece positioning device, the rotor of the conductive slip ring is fixed on the rotating shaft of the workpiece positioning device, and the stator of the conductive slip ring is electrically connected with the rotor and the bias power supply respectively.
[0011] Optionally, the stator of the conductive slip ring is electrically connected with the rotor through an elastic conductive brush.
[0012] Optionally, the bias power supply device further comprises an electrical feedthrough and a wire, the electrical feedthrough is installed on the side wall of the vacuum chamber, one end of the electrical feedthrough is electrically connected with the bias power supply, and the other end is electrically connected with one end of the wire, and the other end of the wire is electrically connected with the conductive slip ring.
[0013] Optionally, the driving device comprises a driving source and a rotating feedthrough installed on the side wall of the vacuum chamber, the driving shaft of the driving source is connected with the driving shaft of the rotating feedthrough, and the driving shaft of the rotating feedthrough extends into the vacuum chamber and is connected with the rotating shaft of the workpiece positioning device through the insulating coupling.
[0014] Optionally, the driving device further comprises an insulating support, the insulating support is arranged in the vacuum chamber and abuts against the insulating coupling to support the insulating coupling in the vacuum chamber.
[0015] Optionally, the material of the insulating support is ceramic, glass, mica or plastic.
[0016] Optionally, the workpiece positioning device comprises a workpiece positioning frame, the front end of the workpiece positioning frame is provided with a positioning area, the rear end of the workpiece positioning frame forms the rotating shaft, both sides of the positioning area are provided with positioning clamping grooves, and the workpiece can be partially clamped in the positioning clamping grooves.
[0017] Optionally, both sides of the front end of the workpiece positioning frame extend to the deposition source along the direction of the rotating shaft of the workpiece positioning frame, and then extend to the inner side of the positioning area along the direction of the rotating shaft of the workpiece positioning frame to form the positioning clamping grooves.
[0018] Optionally, the deposition source comprises a magnetron sputtering source, an ion source or a multi-arc ion source.
[0019] Compared with the prior art, the film deposition equipment has the beneficial effects that: the workpiece positioning device is arranged to position the workpiece in the positioning area, the sputtering end of the deposition source is arranged towards the positioning area of the workpiece positioning device, the thin film source material can be generated and sputtered on the workpiece in the positioning area of the workpiece positioning device to deposit the thin film on the workpiece; the voltage output end of the bias power supply device extends into the vacuum chamber, the bias is applied to the workpiece through the workpiece positioning device, the state of the plasma is improved, the energy of the ions is improved, the adhesion of the deposited thin film is enhanced, and the characteristics such as the stress of the thin film are adjusted; the driving shaft of the driving device extends into the vacuum chamber and is connected with the rotating shaft of the workpiece positioning device through the insulating coupling, the insulating coupling can isolate and insulate the driving device from the workpiece positioning device in the vacuum chamber, the bias of the workpiece positioning device is prevented from being conducted to the outside through the driving shaft of the driving device, the power supply is prevented from being short-circuited, and the safety hazard is reduced. BRIEF DESCRIPTION OF DRAWINGS
[0020] The technical scheme of the present application will be further described in detail below with reference to the drawings and embodiments, and the drawings are as follows:
[0021] Figure 1 is a structural schematic view of the film deposition equipment provided by the present application;
[0022] Figure 2 is a structural schematic view of the conductive slip ring provided by the present application.
[0023] The reference signs in the drawings are as follows:
[0024] 110, bias power supply device; 111, conductive slip ring; 1111, stator; 1112, rotor; 1113, elastic conductive brush; 112, bias power supply; 113, electrical feedthrough; 114, wire; 120, driving device; 120a, driving shaft; 121, rotating feedthrough; 130, vacuum chamber; 140, workpiece positioning device; 140a, positioning area; 141b, rotating shaft; 141, workpiece positioning frame; 1411, positioning clamping groove; 150, deposition source; 160, insulating coupling;
[0025] A, workpiece. DETAILED DESCRIPTION
[0026] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict. The preferred embodiments of the present application will be described in detail with reference to the drawings.
[0027] The present application provides a kind of film deposition equipment, as Figure 1As shown in the figure, the thin film deposition device comprises a bias power supply device 110, a driving device 120, a vacuum chamber 130, and a workpiece positioning device 140 and a deposition source 150 arranged in the vacuum chamber 130.
[0028] The workpiece positioning device 140 is provided with a positioning area 140a for positioning the workpiece A.
[0029] The deposition source 150 is used to generate thin film source material and sputter the thin film source material outward, and the sputtering end of the deposition source 150 is arranged towards the positioning area 140a of the workpiece positioning device 140. When the deposition source 150 works, the thin film source material can be sputtered on the workpiece A in the positioning area 140a.
[0030] The voltage output end of the bias power supply device 110 extends into the vacuum chamber 130 and is electrically connected with the workpiece positioning device 140, so as to apply a bias voltage to the workpiece A through the workpiece positioning device 140.
[0031] The driving shaft 120a of the driving device 120 extends into the vacuum chamber 130 and is connected with the rotating shaft 141b of the workpiece positioning device 140 through the insulating coupling 160 and drives the workpiece positioning device 140 to rotate. The driving device 120 drives the workpiece positioning device 140 to rotate, so as to drive the workpiece A in the positioning area 140a to rotate, so that the deposition of the thin film on the workpiece A is more uniform.
[0032] According to the embodiment, the workpiece A can be positioned in the positioning area 140a by arranging the workpiece positioning device 140, the sputtering end of the deposition source 150 is arranged towards the positioning area 140a of the workpiece positioning device 140, the thin film source material can be generated and sputtered on the workpiece A in the positioning area 140a of the workpiece positioning device 140, so as to deposit the thin film on the workpiece A; the voltage output end of the bias power supply device 110 extends into the vacuum chamber 130, a bias voltage is applied to the workpiece A through the workpiece positioning device 140, the state of the plasma is improved, the energy of the ions is increased, so as to enhance the adhesion of the deposited thin film and adjust the stress of the thin film, etc., the driving shaft 120a of the driving device 120 extends into the vacuum chamber 130 and is connected with the rotating shaft 141b of the workpiece positioning device 140 through the insulating coupling 160, the insulating coupling 160 can isolate and insulate the driving device 120 from the workpiece positioning device 140 in the vacuum chamber 130, so as to avoid that the workpiece positioning device 140 with the bias voltage conducts the bias voltage to the outside through the driving shaft 120a of the driving device 120, avoid power short circuit and reduce the safety hazard.
[0033] In optional embodiments of the present application, the deposition source 150 includes a magnetron sputtering source, an ion source or a multi-arc ion source. For example, the deposition source 150 is a magnetron sputtering source, which can provide a relatively high deposition rate, so that a thicker film can be deposited in a shorter time, and because the motion of particles in the sputtering process is controlled by the magnetic field, better uniformity can be achieved, so that the film deposited on the surface of the workpiece A is uniform and dense.
[0034] With reference to Figure 1 and Figure 2 In optional embodiments of the present application, the bias power supply device 110 includes a conductive slip ring 111 and a bias power supply 112, one end of the insulating coupling 160 is connected with the driving shaft 120a of the driving device 120, and the other end is connected with the rotating shaft 141b of the workpiece positioning device 140, the stator 1111 of the conductive slip ring 111 is fixedly sleeved on the rotating shaft 141b of the workpiece positioning device 140, and the rotor 1112 of the conductive slip ring 111 is electrically connected with the stator 1111 and the bias power supply 112 respectively.
[0035] The conductive slip ring 111 is a device used to transmit power or signals between rotating parts. It is usually composed of a fixed part (usually called stator 1111) and a rotating part (usually called rotor 1112). The function of the conductive slip ring 111 is to maintain electrical connection while rotating, allowing current or signals to be transmitted from the fixed part to the rotating part without being disconnected due to rotation.
[0036] The bias power supply 112 is used to provide a bias voltage.
[0037] By setting the conductive slip ring 111 and the bias power supply 112, the bias power supply 112 can apply a bias to the workpiece positioning device 140 through the conductive slip ring 111 under the condition that the workpiece positioning device 140 is rotating, and then apply a bias to the workpiece A through the workpiece positioning device 140, improve the state of the plasma, increase the energy of the ions, and enhance the adhesion of the deposited film and adjust the stress characteristics of the film, etc.
[0038] Optionally, with reference to Figure 2 The rotor 1112 of the conductive slip ring 111 is electrically connected with the stator 1111 through an elastic conductive brush 1113. The elastic conductive brush 1113 has a certain bending ability and can adapt to the rotating motion of the rotor 1112 of the conductive slip ring 111, maintaining good contact with the stator 1111 when the rotor 1112 moves, maintaining stable electrical connection and ensuring the transmission quality of signals or power.
[0039] The material of the elastic conductive brush 1113 is a metal that can conduct electricity, such as copper, silver, copper alloy, etc.
[0040] With reference to Figure 1In the alternative embodiment of the present application, the bias power supply device 110 further comprises an electrical feedthrough 113 and a wire 114, the electrical feedthrough 113 is mounted on the sidewall of the vacuum chamber 130, one end of the electrical feedthrough 113 is electrically connected with the bias power supply 112, and the other end is electrically connected with one end of the wire 114, and the other end of the wire 114 is electrically connected with the conductive slip ring 111.
[0041] The electrical feedthrough 113, as a key interface between the external environment and the vacuum in the vacuum chamber 130, can introduce the bias voltage of the bias power supply 112 into the vacuum chamber 130, and then transmit it to the conductive slip ring 111 through the wire 114, and finally apply the bias voltage to the workpiece A through the conductive slip ring 111 and the workpiece positioning device 140.
[0042] Reference Figure 1 In the alternative embodiment of the present application, the driving device 120 comprises a driving source (not shown in the figure) and a rotary feedthrough 121 mounted on the sidewall of the vacuum chamber 130, the driving shaft of the driving source is connected with the driving shaft 120a of the rotary feedthrough 121, the driving shaft 120a of the rotary feedthrough 121 extends into the vacuum chamber 130 and is connected with the rotating shaft 141b of the workpiece positioning device 140 through the insulating coupling 160.
[0043] The rotary feedthrough 121 allows the power of the external driving source to be transmitted into the vacuum chamber 130 through the driving shaft 120a while maintaining the vacuum environment, and drives the workpiece positioning device to rotate. It not only ensures the air tightness of the vacuum chamber 130, but also ensures the smoothness and accuracy of the rotary motion.
[0044] The rotary feedthrough 121 can adopt a magnetic fluid rotary feedthrough, which is a feedthrough with a magnetic fluid seal, and can transmit the driving force of the driving source to the workpiece positioning device 140 in the vacuum chamber 130 while maintaining the sealing state of the vacuum chamber 130.
[0045] The driving source can be a servo motor, a multi-phase motor or other power components that can drive rotation.
[0046] In the alternative embodiment of the present application, the driving device 120 further comprises an insulating support (not shown in the figure), which is arranged in the vacuum chamber 130 and abuts against the insulating coupling 160 to support the insulating coupling 160 in the vacuum chamber 130.
[0047] The arrangement of the insulating support can support the position of the insulating coupling 160 in the vacuum chamber 130, and ensure its correct installation and stability. This helps to reduce the vibration and instability of the components in the system.
[0048] Optionally, the material of the insulating support is ceramic, glass, mica or plastic. Illustratively, the material of the insulating support is ceramic.
[0049] Reference Figure 1 In the optional embodiment of the present application, the workpiece positioning device 140 comprises a workpiece positioning frame 141, the front end of the workpiece positioning frame 141 is provided with a positioning area 140a, the rear end of the workpiece positioning frame 141 is formed with a rotating shaft 141b, and the two sides of the positioning area 140a are provided with positioning clamping grooves 1411, and the workpiece A can be partially clamped in the positioning clamping grooves 1411.
[0050] The positioning area 140a at the front end of the workpiece positioning frame 141 can place the workpiece A, the workpiece A is partially clamped in the positioning clamping grooves 1411, and the workpiece A is stably positioned in the positioning area 140a, so that the workpiece A is prevented from moving or deviating during operation, and the film is deposited on the workpiece A.
[0051] Reference Figure 1 In the optional embodiment of the present application, the two side edges of the front end of the workpiece positioning frame 141 extend to the deposition source 150 along the direction of the rotating shaft 141b of the workpiece positioning frame 141, and then are bent to extend to the inner side of the positioning area 140a to form the positioning clamping grooves 1411.
[0052] The positioning clamping grooves 1411 are formed by the side edges of the workpiece positioning frame 141 being bent and extending, and no additional positioning structure for the workpiece A needs to be added to the workpiece positioning frame 141, so that the workpiece positioning frame 141 is simple to assemble.
[0053] As shown in Figure 1 and Figure 2 , the specific working process of the film deposition equipment of the embodiment of the present application introducing bias is as follows:
[0054] When the workpiece A is fixed on the workpiece positioning frame 141 of the workpiece positioning device 140, the driving source of the driving device 120 outside the vacuum chamber 130 gives the rotating feedthrough 121 a rotating motion, which is transmitted to the workpiece A fixed on the workpiece positioning frame 141 and the workpiece A through the insulating coupling 160, so as to drive the workpiece A to rotate. The electrical signal of the bias power supply 112 outside the vacuum chamber 130 is transmitted to the stator 1111 of the conductive slip ring 111 through the electrical feedthrough 113 and the wire 114, the elastic conductive brush 1113 on the stator 1111 of the conductive slip ring 111 is in contact with the rotor 1112 of the conductive slip ring 111, and the workpiece A is biased by the workpiece positioning frame 141 connected with the rotor 1112 of the conductive slip ring 111.
[0055] It should be understood that the above embodiments are only used to illustrate the technical solutions of the present application, but not to limit them, and the technical solutions recorded in the above embodiments can be modified by those skilled in the art, or some technical features can be replaced by equivalents; and all these modifications and replacements shall belong to the protection scope of the claims of the present application.
Claims
1. A thin film deposition apparatus, characterized by, The bias power supply device, the driving device, the vacuum chamber, and a workpiece positioning device and a deposition source arranged in the vacuum chamber; wherein, The workpiece positioning device is provided with a positioning area for positioning a workpiece; The deposition source is used for generating a thin film source material and sputtering the thin film source material outward, and a sputtering end of the deposition source is arranged towards the positioning area of the workpiece positioning device; The voltage output end of the bias power supply device extends into the vacuum chamber and is electrically connected with the workpiece positioning device to apply a bias voltage to the workpiece through the workpiece positioning device; The driving shaft of the driving device extends into the vacuum chamber and is connected with the rotating shaft of the workpiece positioning device through an insulating coupling and drives the workpiece positioning device to rotate.
2. The thin film deposition apparatus of claim 1, wherein The bias power supply device includes a conductive slip ring and a bias power supply, one end of the insulating coupling is connected with the driving shaft of the driving device, and the other end is connected with the rotating shaft of the workpiece positioning device, the rotor of the conductive slip ring is fixed on the rotating shaft of the workpiece positioning device, and the stator of the conductive slip ring is electrically connected with the rotor and the bias power supply.
3. The thin film deposition apparatus of claim 2, wherein, The stator of the conductive slip ring is electrically connected with the rotor through an elastic conductive brush.
4. The thin film deposition apparatus of claim 2, wherein The bias power supply device further includes an electrical feedthrough and a wire, the electrical feedthrough is installed on the side wall of the vacuum chamber, one end of the electrical feedthrough is electrically connected with the bias power supply, and the other end is electrically connected with one end of the wire, the other end of the wire is electrically connected with the conductive slip ring.
5. The thin film deposition apparatus of claim 1, wherein The driving device includes a driving source and a rotating feedthrough installed on the side wall of the vacuum chamber, the driving shaft of the driving source is connected with the driving shaft of the rotating feedthrough, and the driving shaft of the rotating feedthrough extends into the vacuum chamber and is connected with the rotating shaft of the workpiece positioning device through the insulating coupling.
6. The thin film deposition apparatus of claim 5, wherein The driving device further includes an insulating support arranged in the vacuum chamber and abutting against the insulating coupling to support the insulating coupling in the vacuum chamber.
7. The thin film deposition apparatus of claim 6, wherein The insulating support is made of ceramic, glass, mica or plastic.
8. The thin film deposition apparatus of claim 2, wherein, The workpiece positioning device includes a workpiece positioning frame, the front end of the workpiece positioning frame is provided with a positioning area, the rear end of the workpiece positioning frame forms the rotating shaft, both sides of the positioning area are provided with positioning clamping grooves, and the workpiece can be partially clamped in the positioning clamping grooves.
9. The thin film deposition apparatus of claim 8, wherein, Both sides of the front end of the workpiece positioning frame extend towards the deposition source along the direction of the rotating shaft of the workpiece positioning frame, and then bend towards the inside of the positioning area to form the positioning clamping grooves.
10. The thin film deposition apparatus according to any one of claims 1 to 9, wherein The deposition source includes a magnetron sputtering source, an ion source or a multi-arc ion source.