Sample support and film transfer device with same

Abstract

The utility model provides a sample support and a film transfer device with the same. The sample support comprises a major arc part, a first end part and a second end part, wherein the first end part and the second end part are respectively positioned at two open ends of the major arc part; the first supporting part extends from the first end part in the axis direction and extends towards the circle center corresponding to the major arc part; the second supporting part extends from the second end part along the axis direction and extends towards the circle center; the third supporting part extends from the major arc part in the axis direction and extends towards the circle center; an included angle is formed between the axis and the plane where the major arc part is located, and the first supporting part, the second supporting part and the third supporting part are located on the same side of the plane where the major arc part is located. The film transfer device comprises the sample support and further comprises a vacuum cavity, a transferred tray and a displacement mechanism, and the transferred tray is arranged on a bottom plate of the vacuum cavity. According to the utility model, the sample support for non-vacuum adsorption is arranged in the vacuum cavity, and the sample is grabbed and transferred through the sample support in a vacuum environment.

Description

Technical Field

[0001] This utility model belongs to the field of thin film transfer technology, specifically, it relates to a sample holder and a thin film transfer device having the sample holder. Background Technology

[0002] Two-dimensional semiconductor materials are widely considered key materials for advanced node integrated circuits due to their ability to maintain excellent electrical properties at the atomic scale. Currently, high-quality two-dimensional semiconductor materials are grown using chemical vapor deposition (CVD) at temperatures reaching approximately 800 degrees Celsius. However, the substrates used to manufacture integrated circuits cannot withstand this temperature; therefore, two-dimensional semiconductor materials need to be synthesized on a growth substrate before being transferred to the target substrate.

[0003] Among current methods for transferring two-dimensional semiconductor materials, one involves transferring the material in a vacuum environment. However, in a vacuum, it is impossible to use vacuum adsorption to grasp and transfer the sample. Therefore, there is an urgent need to provide a method for grasping and transferring samples in a vacuum environment. Utility Model Content

[0004] In order to solve the technical problems existing in the prior art, the present invention provides a sample holder for grasping and transferring samples in a vacuum environment using a non-vacuum adsorption method, and a thin film transfer device having the sample holder.

[0005] A sample holder, comprising:

[0006] The superior arc portion and the first end and the second end located at the two open ends of the superior arc portion, respectively;

[0007] A first support portion extending from the first end along the axial direction and toward the center of a circle corresponding to the superior arc portion;

[0008] A second support portion extending axially from the second end and toward the center; and

[0009] A third support portion extending from the superior arc portion along the axial direction and toward the center of the circle;

[0010] The axis forms an angle with the plane containing the superior arc portion, and the first support portion, the second support portion, and the third support portion are located on the same side of the plane containing the superior arc portion.

[0011] Furthermore, in this invention, the axis is perpendicular to the plane where the superior arc portion is located.

[0012] Furthermore, in this utility model, the straight-line distance between the position of the third support portion on the curved portion and the first end is equal to the straight-line distance between the position of the third support portion on the curved portion and the second end.

[0013] Furthermore, in this invention, when the sample holder is supporting the target wafer, the first support portion is placed at the first end of the straight edge adjacent to the dominant arc edge of the target wafer, the second support portion is placed at the second end of the straight edge adjacent to the dominant arc edge of the target wafer, and the third support portion is placed at the other parts of the dominant arc edge of the target wafer besides the first end and the second end.

[0014] Furthermore, in this invention, when the sample holder supports the transfer wafer transfer film, the sample holder supports the transfer wafer stacked on the transfer wafer having the film, so that the transfer wafer is attached to the film, wherein the transfer wafer and the transfer wafer have the same shape.

[0015] Furthermore, in this invention, the straight edge of the transfer wafer is parallel to the straight edge of the transferred wafer, and the transfer wafer and the transferred wafer are offset from each other by a predetermined distance in the symmetry axis direction of the transfer wafer and / or the transferred wafer.

[0016] A thin film transfer device includes the sample holder described above.

[0017] Furthermore, in this invention, the thin film transfer device also includes: a vacuum chamber, a transfer tray, and a displacement mechanism;

[0018] The transfer tray is disposed on the bottom plate of the vacuum chamber;

[0019] The displacement mechanism is disposed on the side plate of the vacuum chamber, and the displacement mechanism is used to carry the sample holder within the vacuum chamber for movement.

[0020] Furthermore, in this invention, the film transfer device further includes: a target tray and a gas inlet;

[0021] The target tray is disposed on the bottom plate of the vacuum chamber, and the displacement mechanism is used to carry the sample tray to move relative to the transferred tray or relative to the target tray;

[0022] The gas inlet is located on the side plate of the vacuum chamber for supplying gas into the vacuum chamber.

[0023] Furthermore, in this invention, the thin film transfer device further includes a first temperature control device and a second temperature control device disposed outside the vacuum chamber. The first temperature control device is used to adjust the temperature of the transferred tray, and the second temperature control device is used to adjust the temperature of the target tray.

[0024] Beneficial effects: The technical solution of this application has the following technical effects:

[0025] This invention features a non-vacuum adsorption sample holder within a vacuum chamber, enabling sample gripping and transfer within a vacuum environment.

[0026] It should be understood that all combinations of the foregoing concepts and the additional concepts described in more detail below can be considered as part of the utility model subject matter of this disclosure, provided that such concepts do not contradict each other.

[0027] The foregoing and other aspects, embodiments, and features of the present invention will be more fully understood from the following description in conjunction with the accompanying drawings. Other additional aspects of the present invention, such as features and / or beneficial effects of exemplary embodiments, will become apparent from the following description or may be learned through practice of specific embodiments according to the teachings of the present invention. Attached Figure Description

[0028] The accompanying drawings are not intended to be drawn to scale. In the drawings, each identical or nearly identical component shown in the various figures may be denoted by the same reference numeral. For clarity, not every component is labeled in each figure. Embodiments of various aspects of the present invention will now be described by way of example and with reference to the accompanying drawings, wherein:

[0029] Figure 1 This is a perspective view of a thin film transfer device according to an embodiment of the present invention;

[0030] Figure 2 This is a perspective view of a thin film transfer device in which the cover plate of a vacuum chamber is removed according to an embodiment of the present invention;

[0031] Figure 3 This is a three-dimensional schematic diagram of the internal configuration of a vacuum cavity according to an embodiment of the present invention;

[0032] Figure 4 This is a 3D schematic diagram of a wafer;

[0033] Figure 5 This is a three-dimensional schematic diagram of a sample holder according to an embodiment of the present invention;

[0034] Figure 6This is a perspective view showing a transferred wafer fixed on a transfer tray according to an embodiment of the present invention;

[0035] Figure 7 This is a top view showing the transfer wafer and the transferred wafer stacked in reverse according to an embodiment of the present invention.

[0036] In the figure, the meanings of the reference numerals are as follows: support 100; operating device 200; vacuum chamber 210; transfer tray 220; target tray 230; displacement mechanism 240; sample holder 250; curved section 251; first end 252; second end 253; first support section 254; second support section 255; third support section 256; gas inlet 260; XY displacement stage 241; angular displacement stage 242; shut-off valve 320; humidity sensor 280; first temperature control device 410; second temperature control device 420; dry pump 500; pure water 310; spring 221. Detailed Implementation

[0037] To better understand the technical content of this utility model, specific embodiments are described below in conjunction with the accompanying drawings. Various aspects of this utility model are described in this disclosure with reference to the accompanying drawings, which illustrate numerous illustrative embodiments. The embodiments of this disclosure are not necessarily defined to include all aspects of this utility model. It should be understood that the various concepts and embodiments described above, as well as those described in more detail below, can be implemented in any of many ways, because the concepts and embodiments disclosed in this utility model are not limited to any particular implementation. Furthermore, some aspects of this utility model can be used alone or in any suitable combination with other aspects disclosed in this utility model.

[0038] Figure 1 This is a perspective view of a thin film transfer device according to an embodiment of the present invention. Figure 2 This is a perspective view of a thin film transfer device in which the cover plate of a vacuum chamber is removed according to an embodiment of the present invention. Figure 3 This is a three-dimensional schematic diagram of the internal configuration of a vacuum cavity according to an embodiment of the present invention.

[0039] Refer to together Figures 1 to 3 According to an embodiment of the present invention, a film transfer device includes a support 100 and an operating device 200 disposed on the support 100, wherein the film transfer is performed within the operating device 200.

[0040] Specifically, the operating device 200 includes: a vacuum chamber 210, a transfer tray 220, a target tray 230, a displacement mechanism 240, a sample holder 250, and a gas inlet 260.

[0041] The transfer tray 220, target tray 230, displacement mechanism 240 and sample holder 250 are all disposed inside the vacuum chamber 210, while the gas inlet 260 is disposed on the side plate of the vacuum chamber 210 for introducing water vapor or vacuum gas (e.g., but not limited to nitrogen).

[0042] Furthermore, the transfer tray 220 and the target tray 230 are disposed on the bottom plate of the vacuum chamber 210, and the transfer tray 220 and the target tray 230 can be independently adjusted in temperature.

[0043] A displacement mechanism 240 is disposed on the side plate of the vacuum chamber 210 and is used to move the sample holder 250 within the vacuum chamber 210. As an example, the displacement mechanism 240 includes an XY displacement stage 241 disposed on the side plate of the vacuum chamber 210 and an angular displacement stage 242 disposed on the XY displacement stage 241, with the sample holder 250 disposed on the angular displacement stage 242. The XY displacement stage 241 is used to adjust the horizontal and vertical position of the sample holder 250 within the vacuum chamber 210, while the angular displacement stage 242 is used to adjust the tilt of the sample holder 250 so that the sample holder 250 faces the transfer tray 220 and / or the target tray 230 during film transfer.

[0044] A gas inlet 260 is disposed on the side plate of the vacuum chamber 210 for supplying water vapor or vacuum gas into the vacuum chamber 210. Specifically, the gas inlet 260 is connected to pure water 310 and a vacuum gas source (not shown) via a gas pipe (not labeled). A shut-off valve 320 (e.g., a three-way shut-off valve) is installed on the water pipe. By controlling the shut-off valve 320, the gas inlet 260 is controlled to supply water vapor or vacuum gas into the vacuum chamber 210. The vacuum gas is, for example, but not limited to, nitrogen. In addition, a humidity sensor 280 is also disposed inside the vacuum chamber 210 for detecting the humidity inside the vacuum chamber 210.

[0045] In order to independently adjust the temperature of the transferred tray 220 and the target tray 230, the ice-assisted film transfer device according to the embodiment of the present invention further includes a first temperature control device 410 and a second temperature control device 420 disposed outside the vacuum chamber. The first temperature control device 410 is used to adjust and control the temperature of the transferred tray 220, while the second temperature control device 420 is used to adjust and control the temperature of the target tray 230.

[0046] Furthermore, the ice-assisted thin-film transfer device according to an embodiment of the present invention also includes a dry pump 500, which is connected to the interior of the vacuum chamber 210 to perform vacuuming treatment on the interior of the vacuum chamber 210.

[0047] As described in the background art, since thin film transfer devices perform thin film transfer in a vacuum environment, vacuum adsorption cannot be used to transfer the thin film. Therefore, according to an embodiment of the present invention, a sample holder 250 is provided to mechanically support the transition wafer. The structure of the wafer is described below.

[0048] Figure 4 This is a 3D schematic diagram of a wafer. (Refer to...) Figure 4 Wafers are typically shaped like a curved circle. In this article, a curved circle generally refers to the shape that appears after cutting along the chord of a circle (which does not pass through the center of the circle), and its edges are usually composed of a curved edge and straight edges at the two open ends that close the curved edge.

[0049] Figure 5 This is a three-dimensional schematic diagram of a sample holder according to an embodiment of the present invention.

[0050] Reference Figure 5 According to an embodiment of the present invention, the sample holder 250 includes: a curved portion 251 and a first end portion 252 and a second end portion 253 located at the two open ends of the curved portion 251; a first support portion 254 extending from the first end portion 252 along the axial direction and toward the center of a circle corresponding to the curved portion 251; a second support portion 255 extending from the second end portion 253 along the axial direction and toward the center of a circle; and a third support portion 256 extending from the curved portion 251 along the axial direction and toward the center of a circle; wherein the axial direction forms an angle with the plane where the curved portion 251 is located, and the first support portion 254, the second support portion 255, and the third support portion 256 are located on the same side of the plane where the curved portion 251 is located.

[0051] It should be noted that three supports are shown here (i.e., the first support 254, the second support 255, and the third support 256). It should be understood that the number of supports is merely an example, and the present invention is not limited thereto; for example, two, four, or more supports are all possible.

[0052] Preferably, the axis is perpendicular to the plane where the superior arc portion 251 is located. That is, each support portion (i.e., the first support portion 254, the second support portion 255, and the third support portion 256) is approximately "L" shaped, wherein the inner curve of the "L" shape faces the center.

[0053] Furthermore, in order to stably support the wafer, the straight-line distance between the position of the third support portion 256 on the curved portion 251 and the first end portion 252 is equal to the straight-line distance between the position of the third support portion 256 on the curved portion 251 and the second end portion 253. That is to say, the lines connecting the position of the third support portion 256 on the curved portion 251 and the first end portion 252, the lines connecting the position of the third support portion 256 on the curved portion 251 and the second end portion 253, and the lines connecting the first end portion 252 and the second end portion 253 form an "isosceles triangle" shape, but the present invention is not limited to this.

[0054] The following is a detailed description of placing a wafer using the sample holder 250 according to an embodiment of the present invention. (See also...) Figure 4 and Figure 5 When the sample holder 250 is holding the wafer, the first holder 254 is placed on the wafer (its structure is shown in reference). Figure 4 The first end of the curved edge of the wafer is adjacent to the straight edge, the second support 255 is placed at the second end of the curved edge of the wafer adjacent to the straight edge (e.g., the first end and the second end are symmetrical about the wafer's axis of symmetry), and the third support 256 is placed at the other parts of the curved edge of the wafer other than the first end and the second end (e.g., the intersection of the wafer's axis of symmetry and the curved edge).

[0055] Furthermore, when the sample holder 250 holds the transfer wafer transfer film, the sample holder 250 holds the transfer wafer stacked on the wafer to be transferred having the film, so that the transfer wafer is attached to the film, wherein the transfer wafer and the wafer to be transferred have the same shape. The wafer to be transferred is usually fixed on the transfer tray 220. Figure 6 This is a perspective view showing a transferred wafer fixed on a transfer tray 220 according to an embodiment of the present invention. (Refer to...) Figure 6 The wafer is elastically fixed to the edge of the wafer by the spring tabs 221 on the transfer tray 220. One spring tab 221 is fixed to the curved edge of the wafer and two spring tabs 221 are fixed to the straight edge of the wafer, but this invention is not limited thereto.

[0056] Furthermore, in order to avoid interference from the spring and each support portion (i.e., the first support portion 254, the second support portion 255 and the third support portion 256) on the transfer of the thin film, according to the embodiments of the present invention, the transfer wafer and the wafer being transferred are stacked in the same direction. Figure 7 This is a top view showing the transfer wafer and the transferred wafer stacked in reverse according to an embodiment of the present invention. (Refer to...) Figure 7After being stacked, the straight edge of the transfer wafer overlaps the curved edge of the transferred wafer, while the curved edge of the transfer wafer overlaps the straight edge of the transferred wafer. The straight edges of the transfer wafer and the transferred wafer are parallel to each other, and the transfer wafer and the transferred wafer are offset from each other by a predetermined distance along their axes of symmetry. Therefore, the predetermined offset distance is sufficient to ensure that the spring and support do not interfere with the wafer placement; that is, after the transfer wafer and the transferred wafer are stacked, the spring or support is prevented from being located between them.

[0057] The following will describe in detail the thin film transfer process using the aforementioned thin film transfer apparatus. The thin film may be formed from a two-dimensional semiconductor material, but this invention is not limited to this.

[0058] First, a transfer wafer with a thin film formed from a two-dimensional semiconductor material on its surface is mechanically fixed onto a transfer tray 220. Simultaneously, a sample holder 250 containing a transition wafer is fixed to the bottom of an upper movable component (i.e., an angular displacement stage 241), with the sample holder 250 facing downwards towards the transfer tray 220 (i.e., the transition wafer facing the thin film on the transfer wafer). The target wafer is then fixed onto a target tray 230. After all wafers are in place, the vacuum chamber 210 is closed, and a vacuum is evacuated using a dry pump 500. The transition wafer is a semiconductor substrate such as a silicon wafer.

[0059] Secondly, when the pressure inside the vacuum chamber 210 reaches 0.1 to 1 Pa (i.e., the first preset pressure), the temperature of the transfer tray 220 is cooled to -40 to -3 degrees Celsius (i.e., the first preset temperature), while the temperature of the target tray 230 is raised to 50 to 120 degrees Celsius (i.e., the second preset temperature).

[0060] Next, after the temperature stabilizes, the position of the sample holder 250 containing the transition wafer is adjusted to be directly above the transfer tray 220 by the operation of the displacement mechanism 240, and kept parallel to the transfer tray 220, with the transition wafer facing the transfer tray 220 and the distance between the transition wafer and the transfer tray 220 being 3 to 20 micrometers, but the present invention is not limited to this.

[0061] Next, pure water 310 is converted into water vapor and introduced into the vacuum chamber 210 under the control of the shut-off valve 320, raising the pressure inside the vacuum chamber 210 to 1000–2000 Pa (i.e., the second preset pressure). According to the phase diagram of water, at this temperature of -40 to -3 degrees Celsius, water vapor on the surface of the transferred wafer will first liquefy and then freeze, eventually filling the gap between the transferred wafer and the transition wafer. Using ice as a medium, the thin film on the surface of the transferred wafer adheres to the transition wafer. This is because water molecules are polar and exhibit strong hydrogen bonding during the bonding process with the substrate or thin film, while the thin film and substrate only have weak van der Waals interactions. Therefore, the thin film can detach from the substrate and adhere to the ice. Similarly, according to the phase diagram of water, at this temperature of 50–120 degrees Celsius, there will be no liquid water or solid ice on the surface of the target tray 230 on which the target wafer is fixed.

[0062] Next, the sample holder 250 is slowly raised by operating the displacement mechanism 240 until the ice and film detach from the surface of the transferred wafer. Then, the sample holder 250 is rapidly raised to the appropriate position by operating the displacement mechanism 240, and its position is adjusted to be directly above the target tray 230. At the same time, temperature control of the transferred tray 220 is stopped.

[0063] Next, the water vapor supply is stopped through the shut-off valve 320, and the vacuum chamber 210 is evacuated to 0.1–1 Pa (i.e., the first preset pressure) using the dry pump 500. Then, vacuum gas (e.g., nitrogen) is introduced into the vacuum chamber 210 through the shut-off valve 320, bringing the pressure inside the vacuum chamber 210 to 1000–2000 Pa (i.e., the second preset pressure). This evacuation and gas-passing process is repeated 2–3 times (this invention is not limited to this step), ultimately maintaining the vacuum chamber 210 in a vacuum state (i.e., the pressure at the first preset pressure). During this process, the temperature of the target tray 230 is controlled to be between -10 and 0 degrees Celsius.

[0064] Next, keeping the sample holder 250 parallel to the target tray 230, the position of the sample holder 250 is slowly lowered by operating the displacement mechanism 240 until the film contacts the target wafer on the target tray 230. The target tray 230 has a self-leveling mechanism to ensure that the upper surface of the target wafer is completely adhered to the film.

[0065] Finally, the temperature of the target tray 230 is raised to 0–10 degrees Celsius (i.e., the third preset temperature). According to the phase diagram of water, solid ice sublimates into water vapor. Ultimately, as all the ice sublimates, the thin film detaches from the transition wafer on the sample holder 250 and is successfully transferred to the target wafer on the target tray 230.

[0066] Furthermore, the last step described above can be replaced by the following steps: Water vapor is continued to be introduced into the vacuum chamber 210 through the shut-off valve 320, raising the pressure inside the vacuum chamber to 1000–2000 Pa (i.e., the second preset pressure), and then the temperature of the target tray 230 is raised to 0–10 degrees Celsius (i.e., the fourth preset temperature). According to the phase diagram of water, solid ice melts into liquid water, thereby achieving separation of the thin film from the transition wafer on the sample holder 250. Then, the position of the sample holder 250 is raised by operating the displacement mechanism 240, and the water vapor is stopped by the shut-off valve 320, raising the temperature of the target tray 230 to 50–100 degrees Celsius (i.e., the fifth preset temperature), removing residual moisture from the surface of the thin film through evaporation.

[0067] In summary, the thin film transfer device and its sample holder according to the embodiments of this utility model provide a non-vacuum adsorption sample holder in a vacuum chamber, thereby enabling sample gripping and transfer in a vacuum environment.

[0068] The terms “exemplary,” “example,” etc., used throughout this specification mean “serving as an example, instance, or illustration” and do not imply “preferred” or “advantageous” than other embodiments. Detailed descriptions are included for the purpose of providing an understanding of the described techniques. However, these techniques can be practiced without these detailed descriptions. In some instances, well-known structures and apparatuses are shown in block diagram form to avoid obscuring the concepts of the described embodiments.

[0069] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Those skilled in the art to which this invention pertains can make various modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of this invention shall be determined by the claims.

Claims

1. A sample holder, characterized by, The sample holder comprises: an arcuate portion (251), a first end portion (252) and a second end portion (253) located at two open ends of the arcuate portion (251) respectively; a first supporting portion (254) extending along an axis direction from the first end portion (252) and towards a center of a circle corresponding to the arcuate portion (251); a second supporting portion (255) extending along the axis direction from the second end portion (253) and towards the center of the circle; and a third supporting portion (256) extending along the axis direction from the arcuate portion (251) and towards the center of the circle; wherein the axis forms an angle with a plane in which the arcuate portion (251) is located, and the first supporting portion (254), the second supporting portion (255) and the third supporting portion (256) are located on the same side of the plane in which the arcuate portion (251) is located.

2. The sample holder of claim 1, wherein, The axis is perpendicular to the plane in which the arcuate portion (251) is located.

3. The sample holder of claim 1 or 2, wherein, The arcuate portion (251) is configured to set a straight line distance between a position of the third supporting portion (256) and the first end portion (252) equal to a straight line distance between the position of the third supporting portion (256) and the second end portion (253).

4. The sample holder of claim 1, wherein, When the sample holder is placed on a target wafer, the first supporting portion (254) is placed at a first end of a straight line edge adjacent to an arcuate edge of the target wafer, the second supporting portion (255) is placed at a second end of the straight line edge adjacent to the arcuate edge of the target wafer, and the third supporting portion (256) is placed at a portion of the arcuate edge of the target wafer other than the first end and the second end.

5. The sample holder of claim 4, wherein, When the sample holder is placed on a transfer wafer transfer film, the sample holder is configured to place the transfer wafer on a transferred wafer with the film, so that the transfer wafer is attached to the film, wherein the transfer wafer and the transferred wafer have the same shape.

6. The sample holder of claim 5, wherein, The straight line edge of the transfer wafer is parallel to the straight line edge of the transferred wafer, and the transfer wafer and the transferred wafer are offset from each other by a predetermined distance in a direction of a symmetry axis of the transfer wafer and / or the transferred wafer.

7. A film transfer apparatus characterized by, The sample holder of any one of claims 1 to 6.

8. The film transfer apparatus of claim 7, wherein, The film transfer device further comprises a vacuum chamber (210), a transferred tray (220) and a displacement mechanism (240); The transferred tray (220) is arranged on a bottom plate of the vacuum chamber (210); The displacement mechanism (240) is arranged on a side plate of the vacuum chamber (210), and the displacement mechanism (240) is configured to carry the sample holder (250) to move in the vacuum chamber (210).

9. The film transfer apparatus of claim 8, wherein, The film transfer device further comprises a target tray (230) and a gas inlet (260); The target tray (230) is arranged on the bottom plate of the vacuum chamber (210), and the displacement mechanism (240) is configured to carry the sample holder to move relative to the transferred tray (220) or relative to the target tray (230); The gas inlet (260) is arranged on a side plate of the vacuum cavity (210) and used for conveying gas into the vacuum cavity (210).

10. The film transfer apparatus of claim 9, wherein, The film transfer device further comprises a first temperature control device (410) and a second temperature control device (420) arranged outside the vacuum cavity (210), the first temperature control device (410) is used for adjusting the temperature of the transferred tray (220), and the second temperature control device (420) is used for adjusting the temperature of the target tray (230).

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