Semiconductor refrigeration and dehumidification device

Abstract

The utility model relates to the technical field of semiconductor refrigeration devices, in particular to a semiconductor refrigeration and dehumidification device which comprises a power source and a dehumidification assembly, the power source is connected with the dehumidification assembly, one end of the dehumidification assembly is a cold end capable of absorbing heat, and the other end of the dehumidification assembly is a hot end capable of releasing heat. A first cold end air duct is detachably installed on the cold end, a first hot end air duct is detachably installed on the hot end, and the cold end or the hot end of the dehumidification assembly communicates with the interior or the exterior of a space needing to be heated or refrigerated by installing or detaching the first cold end air duct or the first hot end air duct. The dehumidification device can achieve switching among the dehumidification function, the heating function and the refrigeration function.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor refrigeration device technology, specifically to a semiconductor refrigeration dehumidification device. Background Technology

[0002] Existing refrigeration devices primarily use vapor compression refrigeration, which is characterized by its large size, heavy weight, and high power consumption. This method is only suitable for fixed, large-scale work and entertainment venues. With the current popularity of outdoor sports and camping activities, portable refrigeration devices for these needs mostly employ semiconductor refrigeration. Semiconductor refrigeration has attracted widespread attention due to its advantages such as noiselessness, simplicity, durability, and stable operation.

[0003] Patent CN111397010A discloses a semiconductor refrigeration dehumidification device, including a housing. The housing contains a cold cavity and a hot cavity separated by a semiconductor refrigeration chip. The housing has a hot cavity air inlet, a hot cavity air outlet, and a cold cavity air inlet connected to the cold cavity. The cold cavity contains heat-absorbing fins fixed to the cold end of the semiconductor refrigeration chip, and the hot cavity contains heat-releasing fins fixed to the hot end of the semiconductor refrigeration chip. A fan is located within the hot cavity. The semiconductor refrigeration chip has a cold-hot cavity connection hole connecting the cold and hot cavities. A control valve for opening or sealing the cold-hot cavity connection hole is provided on the connection hole. The control valve is electrically connected to a switch external to the housing. By using the control valve and the cold-hot cavity connection hole, dehumidification can be achieved when the cold and hot cavities are connected. When the cold and hot cavities are separated, gas can flow only in the hot cavity for effective heating, allowing the semiconductor refrigeration dehumidification device to switch between dehumidification and heating functions. However, in the above scheme, the semiconductor refrigeration dehumidifier can only switch between dehumidification and heating functions, and does not have a refrigeration function. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of existing technologies that cannot switch between dehumidification, cooling and heating functions, and to provide a semiconductor cooling dehumidification device that can cool, heat or dehumidify a small space as needed.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows:

[0006] A semiconductor cooling dehumidification device is provided, including a power supply and a dehumidification component. The power supply is connected to the dehumidification component. One end of the dehumidification component is a cold end capable of absorbing heat, and the other end is a hot end capable of releasing heat. A first cold end air duct is detachably installed on the cold end, and a first hot end air duct is detachably installed on the hot end.

[0007] This invention relates to a semiconductor refrigeration and dehumidification device. The dehumidification device is placed in a space requiring dehumidification, cooling, or heating. When dehumidification is needed, the dehumidification component is activated. The cold end of the component absorbs heat from the air, causing water vapor in the air to condense and reducing the humidity in the space. Simultaneously, the temperature of the air at the cold end decreases. The hot end releases heat, raising the temperature of the air at the hot end. The cold and hot air mix in the space, maintaining a constant air temperature. When heating is needed, one end of the first cold-end air duct is installed on the cold end, and the other end of the first cold-end air duct is located outside the space requiring heating. The dehumidification component is activated, and power is supplied to it. The cold end lowers the temperature of the outside air entering the first cold-end air duct. The first hot end lowers the temperature without affecting the air temperature inside the space, while the hot end raises the air temperature inside the space to achieve a heating effect. When cooling is needed, one end of the first hot end air duct is installed on the hot end, and the other end of the first hot end air duct is placed outside the space that needs cooling. The dehumidification component is then activated. The hot end raises the temperature of the outside air entering the first hot end air duct without affecting the air temperature inside the space, while the cold end lowers the air temperature inside the space to achieve a cooling effect. By installing or removing the first cold end air duct or the first hot end air duct, the cold end or hot end of the dehumidification component can be connected to the inside or outside of the space that needs heating or cooling, enabling the dehumidification device to switch between dehumidification, heating, and cooling functions.

[0008] Furthermore, the dehumidification assembly includes a cold-end housing, a hot-end housing, a semiconductor element, a cold-end fan, and a hot-end fan. A partition is provided between the cold-end housing and the hot-end housing. The semiconductor element passes through the partition. The internal spaces of the cold-end housing and the hot-end housing are independent of each other. The cold side of the semiconductor element is located in the cold-end housing, and the hot side of the semiconductor element is located in the hot-end housing. The cold-end fan is installed inside the cold-end housing, and the hot-end fan is installed inside the hot-end housing. A cold air outlet is provided on the cold-end housing, and a hot air outlet is provided on the hot-end housing. The semiconductor element, the cold-end fan, and the hot-end fan are all connected to the power supply. The first cold-end air duct is detachably installed on the cold-end housing, and the cold air outlet is connected to the first cold-end air duct. The first hot-end air duct is detachably installed on the hot-end housing, and the hot air outlet is connected to the first hot-end air duct. The dehumidifier is placed in the space requiring dehumidification, cooling, or heating. When dehumidification, cooling, or heating is needed, the semiconductor element is energized. Due to the thermoelectric effect, the temperature of the cold side of the semiconductor decreases, and the temperature of the hot side increases. When dehumidification is needed, the cold side lowers the temperature of the air entering the cold end shell from the cold air inlet, causing water vapor to condense and reducing the humidity of the air in the space requiring dehumidification. The hot side increases the temperature of the air entering the hot end shell from the hot air inlet. The cold end fan blows the cold air from the cold end shell out through the cold air inlet, and the hot end fan blows the hot air from the hot end shell out through the hot air inlet. The cold and hot air mix, reducing the humidity of the air in the space requiring dehumidification while maintaining the temperature, thus achieving the dehumidification effect. When heating is needed, the first cold end air duct is installed on the cold end shell, allowing cold air to enter the outside and hot air to enter the space requiring heating, thus achieving the heating effect. When cooling is needed, the first hot end air duct is installed on the hot end shell, allowing hot air to enter the outside and cold air to enter the space requiring cooling, thus achieving the cooling effect.

[0009] Furthermore, the cold-end fan is installed on the side wall of the cold-end housing where the cold air outlet is located, and the hot-end fan is installed on the side wall of the hot-end housing where the hot air outlet is located. The side wall of the cold-end housing has a cold-end air intake, and the side wall of the hot-end housing has a hot-end air intake. A second cold-end air duct communicating with the cold-end air intake is detachably installed on the cold-end housing, and a second hot-end air duct communicating with the hot-end air intake is detachably installed on the hot-end housing. The presence of cold-end and hot-end air intakes accelerates the air exchange between the interior and exterior of the cold-end and hot-end housings, improving heat exchange efficiency and enhancing dehumidification, cooling, and heating effects.

[0010] Furthermore, a water collection tank is provided below the cold surface, and the water collection tank is connected to the cold end shell. The water collection tank serves to collect and recycle the condensate generated by the cold surface.

[0011] Furthermore, it also includes a guide plate disposed between the cold surface and the water collection tank. The guide plate has several water inlets, the area of ​​the top opening of each water inlet being larger than the area of ​​the bottom opening. The water inlets, which are wider at the top and narrower at the bottom, can guide condensate into the water collection tank. At the same time, when the condensate in the water collection tank evaporates, it can reduce the amount of water vapor entering the cold end shell from the water collection tank, thereby improving the dehumidification effect.

[0012] Furthermore, the cold side is provided with a first heat exchange structure for increasing the heat exchange area, and the hot side is provided with a second heat exchange structure for increasing the heat exchange area. The first and second heat exchange structures increase the heat exchange area, which can improve the heat exchange efficiency inside the cold end shell and the hot end shell, and improve the condensation, cooling or heating effect.

[0013] Furthermore, the first heat exchange structure includes a plurality of condensing fins, which are fixedly connected to the cold surface. The end of the condensing fin furthest from the cold surface is lower than the end of the condensing fin connected to the cold surface. When the semiconductor device is operating, the cold surface lowers the temperature of the condensing fins. Air inside the cold end housing comes into contact with the condensing fins, water vapor condenses on the condensing fins, and the condensate flows into the water collection tank along the condensing fins under the influence of gravity.

[0014] Furthermore, the cross-section of the condensing fins is wavy. The wavy cross-section of the condensing fins can intensify airflow turbulence, enhance heat exchange between the air and the condensing fins, and improve the cooling and dehumidification effects.

[0015] Furthermore, the condenser fins are provided with drainage holes on their crests. By providing drainage holes on the crests of the condenser fins, the condensate generated on the crests can flow directly into the water collection tank through the drainage holes, eliminating the need for it to flow into the troughs and then along the condenser fins into the water collection tank, thus improving the condensate collection efficiency.

[0016] Furthermore, the second heat exchange structure includes a plurality of parallel-arranged heat sinks. When the semiconductor device is operating, the hot surface raises the temperature of the heat sinks, and air contacts the heat sinks for heat exchange, increasing the heat exchange area, improving heat exchange efficiency, and enhancing the heating effect.

[0017] Compared with the prior art, the beneficial effects of this utility model are:

[0018] The semiconductor refrigeration and dehumidification device of this utility model: 1. By installing or disassembling the first cold-end air duct or the first hot-end air duct, the cold end or hot end of the dehumidification component is connected to the interior or exterior of the space that needs to be heated or cooled, so that the dehumidification device can switch between dehumidification, heating and cooling functions; 2. A water collection tank is set below the cold side of the semiconductor element for collecting and recovering condensate; 3. A guide plate is set between the semiconductor element and the water collection tank to guide the condensate into the water collection tank and reduce the water vapor entering the cold end shell from the water collection tank, thereby improving the dehumidification effect. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the cooling mode of the semiconductor refrigeration and dehumidification device of this utility model;

[0020] Figure 2 This is a schematic diagram of the heating mode of the semiconductor refrigeration and dehumidification device of this utility model;

[0021] Figure 3 This is a schematic diagram of the dehumidification mode of the semiconductor refrigeration dehumidification device of this utility model;

[0022] Figure 4 This is a first structural schematic diagram of the dehumidification component of the semiconductor refrigeration dehumidification device of this utility model;

[0023] Figure 5 This is a second structural schematic diagram of the dehumidification component of the semiconductor refrigeration dehumidification device of this utility model.

[0024] In the attached diagram: 1. Dehumidification assembly; 11. Semiconductor element; 111. Cold side; 1111. First heat exchange structure; 112. Hot side; 1121. Second heat exchange structure; 12. Cold end shell; 121. Cold air outlet; 122. Cold end air intake; 13. Hot end shell; 131. Hot air outlet; 132. Hot end air intake; 14. Partition; 15. Cold end fan; 16. Hot end fan; 2. First cold end air duct; 3. Second cold end air duct; 4. First hot end air duct; 5. Second hot end air duct; 6. Water collection tank; 61. Guide plate; 7. Power supply. Detailed Implementation

[0025] The present invention will be further described below with reference to specific embodiments. The accompanying drawings are for illustrative purposes only, representing schematic diagrams rather than actual physical objects, and should not be construed as limiting the scope of this patent. To better illustrate the embodiments of the present invention, some components in the drawings may be omitted, enlarged, or reduced, and do not represent the actual dimensions of the product. It is understandable to those skilled in the art that some well-known structures and their descriptions may be omitted in the drawings.

[0026] In the accompanying drawings of this utility model, the same or similar reference numerals correspond to the same or similar components. In the description of this utility model, it should be understood that if terms such as "upper," "lower," "left," and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0027] Example 1

[0028] like Figures 1 to 5 The first embodiment of the semiconductor cooling dehumidification device of this utility model is shown, including a power supply 7 and a dehumidification component 1. The power supply 7 is connected to the dehumidification component 1. One end of the dehumidification component 1 is a cold end that can absorb heat, and the other end is a hot end that can release heat. A first cold end air duct 2 is detachably installed on the cold end, and a first hot end air duct 4 is detachably installed on the hot end.

[0029] This utility model discloses a semiconductor refrigeration and dehumidification device. The dehumidification device is placed in a space requiring dehumidification, cooling, or heating. When dehumidification is needed, such as... Figure 3 As shown, when dehumidification component 1 is activated, its cold end absorbs heat from the air, causing water vapor in the air to condense and reducing the humidity in the space. Simultaneously, the temperature of the air at the cold end decreases, while the temperature of the air at the hot end releases heat, raising the temperature of the air at the hot end. The cold and hot air mix in the space, and the overall air temperature remains constant. When heating is required, such as... Figure 2 As shown, one end of the first cold-end air duct 2 is installed on the cold end, and the other end of the first cold-end air duct 2 is placed outside the space requiring heating. The dehumidification component 1 is activated, and the power supply 7 powers the dehumidification component 1. The cold end lowers the temperature of the outside air entering the first cold-end air duct 2 without affecting the air temperature inside the space, while the hot end raises the air temperature inside the space, achieving a heating effect. When cooling is required, such as... Figure 1 As shown, one end of the first hot end air duct 4 is installed on the hot end, and the other end of the first hot end air duct 4 is located outside the space that needs to be cooled. When the dehumidification component 1 is activated, the hot end raises the temperature of the outside air entering the first hot end air duct 4 without affecting the air temperature inside the space, while the cold end lowers the air temperature inside the space to achieve a cooling effect.

[0030] like Figures 3 to 5As shown, the dehumidification assembly 1 includes a cold-end housing 12, a hot-end housing 13, a semiconductor element 11, a cold-end fan 15, and a hot-end fan 16. A partition 14 is provided between the cold-end housing 12 and the hot-end housing 13. The semiconductor element 11 passes through the partition 14. The internal spaces of the cold-end housing 12 and the hot-end housing 13 are independent of each other. The cold side 111 of the semiconductor element 11 is located in the cold-end housing 12, and the hot side 112 of the semiconductor element 11 is located in the hot-end housing 13. The cold-end fan 15 is installed on the cold-end housing 13. Inside the housing 12, the hot end fan 16 is installed inside the hot end housing 13. The cold end housing 12 has a cold air vent 121, and the hot end housing 13 has a hot air vent 131. The semiconductor element 11, the cold end fan 15, and the hot end fan 16 are all connected to the power supply 7. The first cold end air duct 2 is detachably installed on the cold end housing 12, and the cold air vent 121 is connected to the first cold end air duct 2. The first hot end air duct 4 is detachably installed on the hot end housing 13, and the hot air vent 131 is connected to the first hot end air duct 4. When the dehumidifier is placed in a space requiring dehumidification, cooling, or heating, power supply 7 energizes the semiconductor element 11. Due to the thermoelectric effect, the temperature of the cold side 111 of the semiconductor decreases, and the temperature of the hot side 112 increases. When dehumidification is required, the cold side 111 lowers the temperature of the air entering the cold end housing 12 from the cold air inlet 121, causing water vapor to condense and reducing the humidity of the air in the space requiring dehumidification. The hot side 112 increases the temperature of the air entering the hot end housing 13 from the hot air inlet 131. The cold end fan 15 blows the cold air from the cold end housing 12 through... The cold air outlet 121 blows out hot air, and the hot-end fan 16 blows hot air from inside the hot-end outer casing 13 through the hot air outlet 131. The cold air and hot air mix, which reduces the humidity of the air in the space that needs to be dehumidified while keeping the temperature constant, thus achieving the dehumidification effect. When heating is required, the first cold-end air duct 2 is installed on the cold-end outer casing 12, allowing cold air to enter the outside and hot air to enter the space that needs to be heated, thus achieving the heating effect. When cooling is required, the first hot-end air duct 4 is installed on the hot-end outer casing 13, allowing hot air to enter the outside and cold air to enter the space that needs to be cooled, thus achieving the cooling effect.

[0031] A cold-end fan 15 is installed on the side wall of the cold-end housing 12 where the cold air outlet 121 is located, and a hot-end fan 16 is installed on the side wall of the hot-end housing 13 where the hot air outlet 131 is located. The side wall of the cold-end housing 12 where the cold air outlet 121 is located is connected to the partition 14. A cold-end air intake 122 is provided on the opposite side wall of the side wall of the cold-end housing 12 where the cold air outlet 121 is located. The side wall of the hot-end housing 13 where the hot air outlet 131 is located is connected to the partition 14. A hot-end air intake 132 is provided on the opposite side wall of the side wall of the hot-end housing 13 where the hot air outlet 131 is located. A second cold-end air duct 3 communicating with the cold-end air intake 122 is detachably installed on the cold-end housing 12, and a second hot-end air duct 5 communicating with the hot-end air intake 132 is detachably installed on the hot-end housing 13. Setting up cold-end air intake 122 and hot-end air intake 132 can accelerate the air exchange speed between the inside and outside of the cold-end shell 12 and the hot-end shell 13, improve heat exchange efficiency, and enhance the effects of dehumidification, cooling and heating.

[0032] In this embodiment, thermally conductive silicone grease is applied to both the cold side 111 and the hot side 112 of the semiconductor element 11. The cold end housing 12 is connected to the first cold end air duct 2 and the second cold end air duct 3, and the hot end housing 13 is connected to the first hot end air duct 4 and the second hot end air duct 5 by snap-fit ​​connections. Both the cold end housing 12 and the hot end housing 13 are provided with square snap-fit ​​openings for engaging with the first cold end air duct 2, the second cold end air duct 3, the first hot end air duct 4, or the second hot end air duct 5.

[0033] In this embodiment, the cold air inlet 121 and the hot air inlet 131 are multiple square holes arranged in parallel, while the cold end air intake 122 and the hot end air intake 132 are densely packed small holes. The semiconductor refrigeration dehumidification device also includes a controller, a humidity sensor, and a wind speed sensor. The humidity sensor, wind speed sensor, semiconductor element 11, cold end fan 15, and hot end fan 16 are all connected to the controller. The humidity sensor and wind speed sensor are installed on the cold end air intake 122 and the hot end air intake 132. The humidity sensor and wind speed sensor monitor the humidity and wind speed of the cold end air intake 122 and the hot end air intake 132, and transmit signals to the controller. The controller adjusts the working state of the semiconductor element 11, the cold end fan 15, and the hot end fan 16 so that the wind speed of the dehumidification device and the humidity of the air reach the set values.

[0034] The working principle of the semiconductor cooling and dehumidification device in this embodiment is as follows: The dehumidification device is placed in a space requiring dehumidification, cooling, or heating. When dehumidification, cooling, or heating is required, the power supply 7 energizes the semiconductor element 11. Due to the thermoelectric effect, the temperature of the cold surface 111 of the semiconductor decreases, and the temperature of the hot surface 112 increases. When dehumidification is required, such as... Figure 3As shown, the cold side 111 lowers the temperature of the air entering the cold-end outer casing 12 from the cold-end air intake 122, causing water vapor to condense and reducing the humidity of the air in the space requiring dehumidification. The hot side 112 increases the temperature of the air entering the hot-end outer casing 13 from the hot-end air intake 132. The cold-end fan 15 blows the cold air from the cold-end outer casing 12 out through the cold air outlet 121, and the hot-end fan 16 blows the hot air from the hot-end outer casing 13 out through the hot air outlet 131. The cold and hot air mix, reducing the humidity of the air in the space requiring dehumidification while maintaining a constant temperature, thus achieving dehumidification. When heating is required, such as... Figure 2 As shown, the first cold-end air duct 2 and the second cold-end air duct 3 are installed on the cold-end outer shell 12. Outside air enters the cold-end outer shell 12 through the second cold-end air duct 3 and the cold-end air intake 122. The air cooled by the cold surface 111 enters the outside through the cold air outlet 121 and the first cold-end air duct 2. The hot air in the hot-end outer shell 13 enters the space that needs to be heated, thus achieving a heating effect. When cooling is required, such as... Figure 1 As shown, the first hot end air duct 4 and the second hot end air duct 5 are installed on the hot end outer shell 13. Outside air enters the hot end outer shell 13 through the second hot end air duct 5 and the hot end air intake 132. The air heated by the hot surface 112 enters the outside through the hot air intake 131 and the first hot end air duct 4. The cold air in the cold end outer shell 12 enters the space that needs to be cooled, thereby achieving a cooling effect.

[0035] Example 2

[0036] This embodiment is the second embodiment of the semiconductor refrigeration dehumidification device of this utility model. This embodiment is similar to the first embodiment, except that a water collection tank 6 is provided below the cold surface 111, and the water collection tank 6 is connected to the cold end outer shell 12. The water collection tank 6 serves to collect and recover the condensate generated by the cold surface 111, such as... Figure 4 As shown.

[0037] like Figure 4 and Figure 5 As shown, it also includes a baffle plate 61, which is located between the cold surface 111 and the water collection tank 6. The baffle plate 61 has several water inlets, and the area of ​​the top opening of the water inlets is larger than the area of ​​the bottom opening. The water inlets, which are wider at the top and narrower at the bottom, can guide condensate into the water collection tank 6. At the same time, when the condensate in the water collection tank 6 evaporates, it can reduce the amount of water vapor entering the cold end shell 12 from the water collection tank 6, thereby improving the dehumidification effect.

[0038] In this embodiment, the guide plate 61 is located at the opening of the water collection tank 6 and is connected to the partition plate 14.

[0039] Example 3

[0040] This embodiment is the third embodiment of the semiconductor refrigeration dehumidification device of this utility model. This embodiment is similar to the second embodiment, except that the cold surface 111 is provided with a first heat exchange structure 1111 for increasing the heat exchange area, and the hot surface 112 is provided with a second heat exchange structure 1121 for increasing the heat exchange area. The first heat exchange structure 1111 and the second heat exchange structure 1121 increase the heat exchange area, which can improve the heat exchange efficiency in the cold end shell 12 and the hot end shell 13, and improve the condensation, cooling or heating effect.

[0041] like Figure 4 As shown, the first heat exchange structure 1111 includes several condensing fins, which are fixedly connected to the cold surface 111. The end of the condensing fin away from the cold surface 111 is lower than the end connected to the cold surface 111. When the semiconductor element 11 is working, the cold surface 111 lowers the temperature of the condensing fins. The air inside the cold end housing 12 comes into contact with the condensing fins, and water vapor condenses on the condensing fins. The condensate flows into the water collection tank 6 along the condensing fins under the influence of gravity.

[0042] The condenser fins have a wavy cross-section. This wavy cross-section intensifies airflow turbulence, enhances heat exchange between the air and the condenser fins, and improves cooling and dehumidification efficiency.

[0043] The condenser fins have drainage holes on their crests. These drainage holes allow condensate generated on the crests to flow directly into the collection tank 6, eliminating the need for it to flow into the troughs and then along the condenser fins into the collection tank 6, thus improving condensate collection efficiency.

[0044] like Figure 4 As shown, the second heat exchange structure 1121 includes a plurality of parallel-arranged heat sinks. When the semiconductor element 11 is working, the hot surface 112 raises the temperature of the heat sinks, and the air contacts the heat sinks to exchange heat, increasing the heat exchange area, improving the heat exchange efficiency, and improving the heating effect.

[0045] The working principle of the semiconductor refrigeration dehumidification device in this embodiment is as follows: After water vapor condenses on the condensing fins, part of the condensate flows through the drain hole to the guide plate 61, and the other part flows into the trough of the condensing fins and, under the action of gravity, flows along the condensing fins to the guide plate 61; the condensate flowing to the guide plate 61 flows into the water collection tank 6 through the water inlet. The water inlet, which is wider at the top and narrower at the bottom, makes it easier for the condensate to flow into the water collection tank 6, while reducing the amount of water vapor entering the cold end shell 12 from the water collection tank 6, thus improving the dehumidification effect.

[0046] In the specific implementation of the above embodiments, the technical features can be combined in any non-contradictory way. For the sake of brevity, not all possible combinations of the above technical features are described. However, as long as the combination of these technical features is not contradictory, it should be considered to be within the scope of this specification.

[0047] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating this utility model, and are not intended to limit the implementation of this utility model. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A semiconductor refrigeration dehumidifying device characterized by comprising: The dehumidification assembly (1) comprises a cold end shell (12), a hot end shell (13), a semiconductor element (11), a cold end fan (15) and a hot end fan (16), a partition (14) is arranged between the cold end shell (12) and the hot end shell (13), the semiconductor element (11) penetrates through the partition (14), the internal spaces of the cold end shell (12) and the hot end shell (13) are independent of each other, a cold surface (111) of the semiconductor element (11) is located in the cold end shell (12), a hot surface (112) of the semiconductor element (11) is located in the hot end shell (13), the cold end fan (15) is installed in the cold end shell (12), the hot end fan (16) is installed in the hot end shell (13), a cold air outlet (121) is formed in the cold end shell (12), a hot air outlet (131) is formed in the hot end shell (13), the semiconductor element (11), the cold end fan (15) and the hot end fan (16) are connected with the power supply (7), the first cold end air duct (2) is detachably installed on the cold end shell (12), the cold air outlet (121) is in communication with the first cold end air duct (2), the first hot end air duct (4) is detachably installed on the hot end shell (13), and the hot air outlet (131) is in communication with the first hot end air duct (4).

2. The semiconductor refrigeration dehumidifying device according to claim 1, characterized by The cold end fan (15) is installed on the side wall of the cold end shell (12) where the cold air outlet (121) is located, the hot end fan (16) is installed on the side wall of the hot end shell (13) where the hot air outlet (131) is located, a cold end air suction port (122) is arranged on the side wall of the cold end shell (12), a hot end air suction port (132) is arranged on the side wall of the hot end shell (13), a second cold end air duct (3) in communication with the cold end air suction port (122) is detachably installed on the cold end shell (12), and a second hot end air duct (5) in communication with the hot end air suction port (132) is detachably installed on the hot end shell (13).

3. The semiconductor refrigeration dehumidifying device according to claim 2, characterized by A water collecting groove (6) is arranged below the cold surface (111), and the water collecting groove (6) is in communication with the cold end shell (12).

4. The semiconductor refrigeration dehumidifying device according to claim 2, characterized by A guide plate (61) is further arranged between the cold surface (111) and the water collecting groove (6).

5. The semiconductor refrigeration dehumidifying device according to claim 4, wherein The cold surface (111) is provided with a first heat exchange structure (1111) for increasing the heat exchange area, and the hot surface (112) is provided with a second heat exchange structure (1121) for increasing the heat exchange area.

6. The semiconductor refrigeration dehumidification device according to any one of claims 2 to 5, characterized in that, ​ 7. The semiconductor refrigeration dehumidification device according to claim 6, characterized in that, The first heat exchange structure (1111) comprises a plurality of condensation fins fixedly connected with the cold surface (111), and an end of each condensation fin away from the cold surface (111) is lower than an end of the condensation fin connected with the cold surface (111).

8. The semiconductor refrigeration dehumidification device according to claim 7, characterized in that, The cross section of each condensation fin is wavy.

9. The semiconductor refrigeration dehumidification device according to claim 8, characterized in that, A drainage hole is arranged on a wave crest of each condensation fin.

10. The semiconductor refrigeration dehumidifying device according to claim 6, wherein The second heat exchange structure (1121) comprises a plurality of parallel arranged radiating fins.

Images