Auxiliary positioning device for solder paste detector

Abstract

The utility model discloses an auxiliary positioning device for a solder paste detector, which comprises an SPI (Serial Peripheral Interface) solder paste detector, a solder paste detection end is arranged in a solder paste detection area of the SPI solder paste detector, and a printing plate feeding structure positioned on the front side of the SPI solder paste detector is arranged in an inner cavity of the SPI solder paste detector. The end, facing the printing plate feeding structure, of the solder paste detection end is provided with a laser detection head. According to the technical scheme, the multiple sets of solder paste detection light supplementing mechanisms are arranged around the detection end of the SPI solder paste detection machine, the solder paste detection light supplementing mechanisms arranged in an annular array conduct light supplementing treatment on the printing plate from multiple angles, meanwhile, the soft light projection angle of each set of solder paste detection light supplementing mechanism is adjustable, and therefore all areas of the printing plate are illuminated, and the detection efficiency of the SPI solder paste detection machine is improved. The SPI solder paste detection machine is helped to position a detection area, the detection accuracy is improved, meanwhile, the photoelectric position sensor is used for monitoring the position of the printing plate, and the printing plate is helped to stay below the detection end.

Description

Technical Field

[0001] This utility model relates to the technical field of solder paste testing auxiliary equipment, specifically to an auxiliary positioning device for a solder paste testing machine. Background Technology

[0002] In the SMT industry, SPI stands for Solder Paste Inspection Equipment. It's used to inspect the height, volume, area, short circuits, and offset of solder paste after printing. Its working principle is similar to AOI (Automated Optical Inspection): a panel is visually inspected and, if no problems are found, the machine takes a picture as a standard sample. Subsequent boards are then judged based on the image and data from the first sample.

[0003] In the solder paste inspection process, the main inspection methods in the SPI field are laser inspection and stripe light inspection. The laser method uses a point laser. However, before the board reaches the inspection area, it relies mainly on the point laser emitted by the inspection head for monitoring. Once the point laser detects the board's position, the board transport is immediately stopped. However, this stopping method lacks buffering, which can cause the board's orientation to shift. Furthermore, during the inspection process, if certain areas of the board do not receive sufficient supplementary lighting, the laser from the monitoring head cannot effectively inspect the board. Therefore, those skilled in the art propose a solution for an auxiliary positioning device for solder paste inspection machines. Utility Model Content

[0004] The purpose of this utility model is to provide a technical solution for an auxiliary positioning device for a solder paste inspection machine, thereby addressing the shortcomings mentioned in the background art. To overcome the drawbacks and defects described in the background art, this technical solution includes the following:

[0005] The invention includes an SPI solder paste inspection machine. The solder paste inspection area of ​​the SPI solder paste inspection machine is provided with a solder paste inspection end. The inner cavity of the SPI solder paste inspection machine is provided with a printed circuit board feeding structure located at the front of the SPI solder paste inspection machine. A laser inspection head is installed on the end of the solder paste inspection end facing the printed circuit board feeding structure. The bottom end of the solder paste inspection end is provided with 6-8 sets of solder paste inspection supplementary lighting mechanisms arranged in a ring array around the laser inspection head.

[0006] The solder paste detection lighting mechanism includes an LED soft light, a base fixed on the upper surface of the LED soft light, and a connecting frame set on the upper surface of the base. A servo motor is fixed on the bottom surface of the connecting frame. The output end of the servo motor is connected to a drive shaft that passes through the connecting frame via a coupling, and both ends of the drive shaft are fixedly connected to the inner surface of the base.

[0007] The printed circuit board feeding structure includes several support frames and two linear transmission tracks mounted on top of the support frames. Several printed circuit board shelves are movably arranged between the linear transmission tracks. Printed circuit boards with solder paste to be tested are placed on the upper surface of each printed circuit board shelf. An L-shaped column is fixed to the rear side of the middle printed circuit board shelf. A photoelectric position sensor facing the printed circuit board is installed on the top surface of the L-shaped column.

[0008] As a preferred embodiment of this utility model: the vertical cross-section of the connecting frame is an inverted U-shape, the vertical cross-section of the base is an upright U-shape, and the connecting frame is inserted into the interior of the base.

[0009] As a preferred embodiment of this utility model, the connecting frame has round holes on both the left and right sides for the transmission shaft to pass through.

[0010] As a preferred embodiment of this utility model: a fixing ring is fixedly connected to the bottom end face of the solder paste detection terminal, and the top surface of the connecting frame is fixedly connected to the bottom surface of the fixing ring.

[0011] As a preferred embodiment of this utility model: two electrically controlled slide rails are installed on the bottom surface of the inner cavity of the solder paste detection area of ​​the SPI solder paste inspection machine, and the bottom surface of the solder paste detection end is movably set on the electrically controlled slide rails by a slider.

[0012] As a preferred embodiment of this utility model, the bottom surface of the support frame is fixedly connected to the bottom surface of the cavity within the solder paste inspection area of ​​the SPI solder paste inspection machine.

[0013] As a preferred embodiment of this utility model, the monitoring endpoint of the photoelectric position sensor is arranged perpendicularly to the detection endpoint of the laser detection head.

[0014] The technical effects and advantages provided by this utility model in the above technical solution are as follows:

[0015] In this technical solution, several sets of solder paste detection lighting mechanisms are set around the detection head of the SPI solder paste inspection machine. The solder paste detection lighting mechanisms arranged in a ring array provide lighting treatment to the printed circuit board from multiple angles. At the same time, the soft light projection angle of each set of solder paste detection lighting mechanisms is adjustable, thereby illuminating various areas of the printed circuit board and helping the SPI solder paste inspection machine to locate the inspection area. This not only improves the accuracy of the inspection, but also uses photoelectric position sensors to monitor the position of the printed circuit board and help the printed circuit board stay below the detection head. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.

[0017] Figure 1 This is a schematic diagram of the overall structure of the solder paste inspection machine;

[0018] Figure 2 This is a schematic diagram of the solder paste detection terminal;

[0019] Figure 3 A schematic diagram of the printing plate feeding structure;

[0020] Figure 4 A schematic diagram of a solder paste inspection and illumination mechanism;

[0021] Figure 5 This is a magnified schematic diagram of the solder paste inspection and illumination mechanism.

[0022] Explanation of reference numerals in the attached figures:

[0023] 1. SPI solder paste inspection machine; 2. Solder paste inspection end; 3. Solder paste inspection lighting mechanism; 31. LED soft light; 32. Base; 33. Drive shaft; 34. Connecting frame; 35. Servo motor; 4. Printed board feeding structure; 41. Support frame; 42. Printed board shelf; 43. Linear transmission track; 44. L-shaped column; 45. Photoelectric position sensor; 5. Laser inspection head; 6. Fixing ring. Detailed Implementation

[0024] To provide a clearer explanation and description of the technical solution and implementation of this utility model, several preferred specific embodiments for implementing the technical solution of this utility model are introduced below.

[0025] The following description is exemplary in nature and is not intended to limit the scope, application, or use of this disclosure. It should be understood that in all these figures, the same or similar reference numerals indicate the same or similar parts and features. The figures are merely schematic representations of the concept and principles of embodiments of this disclosure and do not necessarily show the specific dimensions and scale of each embodiment. Specific details or structures of embodiments of this disclosure may be exaggerated in particular portions of certain figures. The disclosures of various publications, patents, and published patent specifications cited herein are incorporated herein by reference in their entirety. The technical solutions of this utility model will be clearly and completely described below in conjunction with embodiments of this utility model. Obviously, the described embodiments are only a part of the embodiments of this utility model.

[0026] Examples, see attached instruction manual Figure 1-5 As shown:

[0027] A preferred technical solution for an auxiliary positioning device for a solder paste inspection machine includes the following:

[0028] The system includes an SPI solder paste inspection machine 1, a solder paste inspection end 2 in the solder paste inspection area of ​​the SPI solder paste inspection machine 1, a printed circuit board feeding structure 4 located in front of the SPI solder paste inspection machine 1 in the inner cavity, a laser inspection head 5 installed on the end of the solder paste inspection end 2 facing the printed circuit board feeding structure 4, and 6-8 sets of solder paste inspection supplementary lighting mechanisms 3 arranged in a ring array around the laser inspection head 5 at the bottom of the solder paste inspection end 2.

[0029] The solder paste inspection lighting mechanism 3 includes an LED soft light 31, a base 32 fixed on the upper surface of the LED soft light 31, and a connecting frame 34 set on the base 32. A servo motor 35 is fixed on the bottom surface of the connecting frame 34. A drive shaft 33 passing through the connecting frame 34 is connected to the output end of the servo motor 35 through a coupling. Both ends of the drive shaft 33 are fixedly connected to the inner surface of the base 32.

[0030] The printed circuit board feeding structure 4 includes several support frames 41 and two linear transmission tracks 43 mounted on top of the support frames 41. Several printed circuit board shelves 42 are movably arranged between the linear transmission tracks 43. Printed circuit boards with solder paste to be tested are placed on the upper surface of each printed circuit board shelf 42. An L-shaped column 44 is fixed to the rear side of the middle printed circuit board shelf 42. A photoelectric position sensor 45 facing the printed circuit board is installed on the top surface of the L-shaped column 44.

[0031] The vertical cross-section of the connecting frame 34 is an inverted U-shape, and the vertical cross-section of the base 32 is an upright U-shape. The connecting frame 34 is inserted into the base 32. The left and right sides of the connecting frame 34 are provided with round holes for the drive shaft 33 to pass through. A fixing ring 6 is fixedly connected to the bottom end face of the solder paste detection end 2. The top surface of the connecting frame 34 is fixedly connected to the bottom surface of the fixing ring 6.

[0032] Two electrically controlled slide rails are installed on the bottom surface of the inner cavity of the solder paste inspection area of ​​the SPI solder paste inspection machine 1, and the bottom surface of the solder paste inspection end 2 is movably set on the electrically controlled slide rails by a slider. The bottom surface of the support frame 41 is fixedly connected to the bottom surface of the inner cavity of the solder paste inspection area of ​​the SPI solder paste inspection machine 1. The monitoring end point of the photoelectric position sensor 45 is arranged perpendicularly to the detection end point of the laser detection head 5.

[0033] Based on the above-described preferred technical solution, the workflow of this technical solution is explained as follows:

[0034] The printed circuit board is placed on the upper surface of each printed circuit board shelf 42. After the linear transport track 43 pulls the printed circuit board shelf 42 into the SPI solder paste inspection machine 1, the laser inspection head 5 starts working. After the position of the printed circuit board on the printed circuit board shelf 42 is detected by the photoelectric position sensor 45, the photoelectric position sensor 45 will control the linear transport track 43 to stop operating, and the electronically controlled slide rail and slider will control the solder paste inspection end head 2 to move left and right to above the current printed circuit board, thereby achieving the positioning effect of the inspection position. During the inspection process, several sets of solder paste inspection supplementary lighting mechanisms 3 around the laser inspection head 5 will provide supplementary lighting for the printed circuit board. By controlling the servo motor 35 to drive the transmission shaft 33 to rotate, the LED soft light 31 and the base 32 will tilt from a horizontal state, thereby changing the supplementary lighting area.

[0035] The foregoing description only illustrates certain exemplary embodiments of the present invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. An auxiliary positioning device for a tin paste detection machine, comprising a SPI tin paste detection machine (1), characterized in that: The tin paste detection area of the SPI tin paste detection machine (1) is provided with a tin paste detection end head (2), the inner cavity of the SPI tin paste detection machine (1) is provided with a printed board feeding structure (4) located at the front side of the SPI tin paste detection machine (1), a laser detection head (5) is mounted on the end head of the tin paste detection end head (2) facing the printed board feeding structure (4), and the bottom end of the tin paste detection end head (2) is provided with 6-8 groups of tin paste detection light supplement mechanisms (3) arranged in an annular array around the laser detection head (5). The tin paste detection light supplement mechanism (3) comprises an LED soft light lamp (31), a base (32) fixed on the upper surface of the LED soft light lamp (31), and a connecting frame (34) arranged above the base (32). The bottom surface of the connecting frame (34) is fixed with a servo motor (35), the output end of the servo motor (35) is connected with a transmission shaft (33) penetrating through the connecting frame (34) through a shaft coupling, and the two ends of the transmission shaft (33) are fixedly connected with the inner side surface of the base (32). The printed board feeding structure (4) comprises a plurality of support frames (41) and two linear transmission tracks (43) arranged on the top of the support frames (41), and a plurality of printed board shelves (42) are movably arranged between the linear transmission tracks (43). The upper surface of the printed board shelf (42) is placed with a printed board to be detected, and the rear side of the printed board shelf (42) is fixed with an L-shaped stand (44). The top surface of the L-shaped stand (44) is provided with a photoelectric position sensor (45) facing the printed board.

2. The auxiliary positioning device for a tin paste inspection machine according to claim 1, characterized in that: The vertical section of the connecting frame (34) is in inverted U shape, the vertical section of the base (32) is in upright U shape, and the connecting frame (34) is inserted into the inside of the base (32).

3. The auxiliary positioning device for a tin paste inspection machine according to claim 1, wherein: Round holes are formed in the left and right sides of the connecting frame (34) for the transmission shaft (33) to penetrate through.

4. The auxiliary positioning device for a tin paste inspection machine according to claim 1, wherein: The bottom surface of the tin paste detection end head (2) is fixedly connected with a fixing ring (6), and the top surface of the connecting frame (34) is fixedly connected with the bottom surface of the fixing ring (6).

5. The auxiliary positioning device for a tin paste inspection machine according to claim 1, wherein: Two electric control slides are mounted on the bottom surface of the inner cavity of the tin paste detection area of the SPI tin paste detection machine (1), and the bottom surface of the tin paste detection end head (2) is movably arranged on the electric control slides through a sliding block.

6. The auxiliary positioning device for a tin paste inspection machine according to claim 1, wherein: The bottom surface of the support frame (41) is fixedly connected with the bottom surface of the inner cavity of the tin paste detection area of the SPI tin paste detection machine (1).

7. The auxiliary positioning device for a tin paste inspection machine according to claim 1, wherein: The monitoring end of the photoelectric position sensor (45) is vertically arranged with the detection end of the laser detection head (5).

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