Computer power supply with detachable and replaceable heat dissipation assembly

By replacing screws with a clip and slot structure, and combining a trapezoidal heatsink and fan design, the problem of inconvenient disassembly of computer power supply cooling mechanisms is solved, enabling convenient replacement of cooling components and improving cooling efficiency.

CN223770613UActive Publication Date: 2026-01-06SHENZHEN XINZHIDU ELECTRONICS CO LTD
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Patent Information

Application Number
CN202520303309.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-02-25
Publication Date
2026-01-06
Estimated Expiration
2035-02-25

AI Technical Summary

Technical Problem

The current computer power supply uses screws to fix the heat dissipation mechanism, which makes disassembly inconvenient and affects repair efficiency.

Method used

The design uses a clip and slot structure to replace screws for fixing, combined with a trapezoidal radiator and fan design. The heat dissipation components can be easily replaced by inserting and removing the clips, and the fan can accelerate heat dissipation.

Benefits of technology

It enables convenient disassembly and replacement of heat dissipation components, improving the maintenance efficiency of the power supply, and accelerates the heat dissipation effect through trapezoidal heat sink and fan, thereby improving heat dissipation efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a computer power supply with a detachable heat dissipation assembly, which relates to the field of computer power supplies and comprises a power supply outer shell, the heat dissipation assembly is arranged at the top of a power supply main body and comprises a heat conduction plate, a clamping strip is arranged at the bottom of the heat conduction plate, a fixing frame is sleeved on the outer wall of the power supply main body, and the clamping strip is arranged on the fixing frame. A clamping groove is formed in the inner wall of the fixing frame, a mounting plate is mounted on one side of the power source outer shell, and a baffle is fixed to one side of the mounting plate. When the heat dissipation assembly is replaced, the installation plate is taken down firstly, then the clamping strips are taken out from the clamping grooves in the inner wall of the fixing frame, the heat dissipation assembly is taken out from the interior of the power source outer shell to be replaced, then the clamping strips on a new heat dissipation assembly are inserted into the clamping grooves again, and the heat dissipation assembly is replaced. And then the mounting plate is fixedly mounted on one side of the power supply outer shell through bolts, and meanwhile, the baffle on one side of the mounting plate abuts against the port of the clamping groove, so that the heat conducting plate is fixed in the fixing frame.
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Description

Technical Field

[0001] This utility model relates to the field of computer power supplies, specifically a computer power supply with replaceable heat dissipation components. Background Technology

[0002] As a key component of a computer system, the power supply plays a crucial role in providing stable and appropriate power to all the computer's hardware components. It converts AC power into DC power required by the computer's internal components, ensuring that hardware such as the motherboard, CPU, graphics card, and hard drive can operate stably under normal voltage and current. This is the fundamental guarantee for the normal operation of the computer.

[0003] During computer operation, various electronic components inside the power supply, such as transformers, rectifier diodes, and switching transistors, generate heat due to energy loss during the power conversion process. As computer hardware performance continues to improve, the power supply load also increases accordingly, and the generated heat becomes more significant. If this heat cannot be dissipated in time, it will cause the internal temperature of the power supply to rise, thereby affecting the electrical performance and stability of the electronic components. Generally, the heat dissipation components inside a computer power supply include cooling fans and heat sinks. Heat sinks can be installed in various ways, such as on the surface of the computer power supply or on both sides of the computer power supply, to absorb the heat generated by the computer power supply and then dissipate it using the airflow generated by the cooling fans.

[0004] The heat dissipation mechanism of existing computer power supplies is usually fixed with multiple screws. Due to the small internal space of computer power supplies, it is very inconvenient to disassemble the internal heat dissipation mechanism, which affects the repair efficiency of computer power supplies. Utility Model Content

[0005] Therefore, the purpose of this utility model is to provide a computer power supply with a replaceable heat dissipation component, so as to solve the technical problem that the heat dissipation mechanism of the existing computer power supply is fixed by screws, which makes the disassembly process of the heat dissipation mechanism inconvenient.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a computer power supply with a replaceable heat dissipation component, comprising a power supply housing, a base fixed to one side of the inner wall of the power supply housing, a power supply body mounted on the top of the base, a heat dissipation component disposed on the top of the power supply body, the heat dissipation component including a heat-conducting plate, a retaining strip disposed at the bottom of the heat-conducting plate, a fixing frame sleeved on the outer wall of the power supply body, a retaining groove disposed on the inner wall of the fixing frame, an mounting plate mounted on one side of the power supply housing, and a baffle fixed on one side of the mounting plate.

[0007] By adopting the above technical solution, the technical problem of inconvenient disassembly of the heat dissipation mechanism caused by the screw fixing method of the existing computer power supply is solved. When it is necessary to replace the heat dissipation component, the mounting plate on one side of the power supply casing is removed, and then the clip in the heat dissipation component is taken out from the slot on the inner wall of the fixing frame, so that the heat dissipation component can be taken out from the inside of the power supply casing for replacement. Then, the clip on the new heat dissipation component is reinserted into the slot, and the mounting plate is fixed to one side of the power supply casing with bolts. At the same time, the baffle on one side of the mounting plate abuts against the port of the slot, so that the heat conduction plate is fixed inside the fixing frame, which facilitates the replacement of the heat dissipation component inside the power supply casing.

[0008] The present invention is further configured such that a locking block is fixed to the outer wall of the mounting plate, and a bolt is installed on one side of the locking block.

[0009] By adopting the above technical solution, personnel use bolts to install and fix the mounting plate to one side of the power supply housing using clips.

[0010] The present invention is further configured such that the top of the heat-conducting plate is provided with multiple sets of heat sinks, and the heat sinks are configured as trapezoids.

[0011] By adopting the above technical solution, the heat-conducting plate conducts the heat generated by the main power supply component to the heat sink. The heat sink is set in a trapezoidal shape, which increases the contact area between the heat sink and the air, thereby accelerating the heat dissipation effect of the heat sink on the main power supply component.

[0012] The present invention is further provided that the inner wall of the radiator is provided with multiple sets of heat dissipation holes.

[0013] By adopting the above technical solution, the air blown into the radiator is blown onto the heat-conducting plate through the heat dissipation holes, thereby accelerating the heat exchange efficiency between the heat-conducting plate and the air.

[0014] The present invention is further provided that an isolation plate is installed at the bottom of the heat-conducting plate, and the isolation plate is made of cubic boron nitride material.

[0015] By adopting the above technical solution, the isolation plate has a certain degree of insulation, preventing leakage from the power supply body and causing injury to personnel during the replacement of heat dissipation components. At the same time, the isolation plate has good thermal conductivity, reducing the impact of the isolation plate on the heat conduction plate on the power supply body.

[0016] The present invention is further configured such that a connecting rod is fixed to the top of the heat-conducting plate, and a wind guide plate is provided at the end of the connecting rod.

[0017] By adopting the above technical solution, the air guide plates on both sides of the radiator direct a portion of the air generated by the fan to both sides of the power supply body, thereby accelerating the heat exchange between the power supply body and the air.

[0018] The present invention is further configured such that a motor is installed on one side of the inner wall of the power supply housing, and a fan is connected to the end of the motor.

[0019] By adopting the above technical solution, the motor drives the fan connected to the end to operate. The fan rotates at high speed and generates a certain amount of air. The air generated by the fan blows towards the radiator, thereby accelerating the heat exchange between the radiator and the air.

[0020] The present invention is further provided that an air inlet is provided on one side of the power supply housing and an exhaust vent is provided at one end of the power supply housing.

[0021] By adopting the above technical solution, outside air enters the power supply casing through the air inlet and is discharged from the inside of the power supply casing through the air outlet, thereby creating circulating air inside the power supply casing.

[0022] In summary, the present invention has the following main advantages:

[0023] 1. This utility model solves the technical problem that the heat dissipation mechanism of existing computer power supplies is inconvenient due to the screw fixing method. By setting up a power supply casing, power supply body, fixing frame, heat dissipation component, clip, slot and baffle, it solves the technical problem that the heat dissipation mechanism of the existing computer power supply is fixed by screws. When the heat dissipation component needs to be replaced, the mounting plate on one side of the power supply casing is removed, and then the clip in the heat dissipation component is taken out from the slot on the inner wall of the fixing frame, so that the heat dissipation component can be taken out from the inside of the power supply casing for replacement. Then the clip on the new heat dissipation component is inserted back into the slot, and then the mounting plate is fixed to one side of the power supply casing with bolts. At the same time, the baffle on one side of the mounting plate abuts against the port of the slot, so that the heat conduction plate is fixed inside the fixing frame, which makes it convenient for personnel to replace the heat dissipation component inside the power supply casing.

[0024] 2. This utility model incorporates a fan, a heat-conducting plate, a radiator, and air guide plates. The heat-conducting plate transfers the heat generated by the main power supply component to the radiator. The radiator is trapezoidal, increasing the contact area between the radiator and the air, thereby accelerating the heat dissipation effect of the radiator on the main power supply component. Simultaneously, a motor drives the fan connected to the end to rotate, generating a certain amount of air at high speed. The air generated by the fan blows towards the radiator, thereby accelerating the heat exchange between the radiator and the air. The air blown into the radiator is then blown onto the heat-conducting plate through the heat dissipation holes. At the same time, the air guide plates on both sides of the radiator guide a portion of the air generated by the fan to both sides of the main power supply component, accelerating the heat exchange between the main power supply component and the air. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the overall device of this utility model;

[0026] Figure 2 This is a cross-sectional view of the power supply housing of this utility model;

[0027] Figure 3 This is a schematic diagram of the overall heat dissipation component of this utility model;

[0028] Figure 4 This is a schematic diagram of the overall mounting plate of this utility model.

[0029] In the diagram: 1. Power supply housing; 101. Exhaust vent; 102. Air inlet; 2. Mounting plate; 201. Bolt; 202. Clip; 203. Baffle; 3. Fan; 301. Motor; 4. Main power supply component; 5. Fixing frame; 501. Base; 502. Slot; 6. Heat-conducting plate; 601. Isolation plate; 602. Clip; 603. Radiator; 604. Heat dissipation hole; 605. Connecting rod; 606. Air guide plate. Detailed Implementation

[0030] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0031] The embodiments of this utility model will be described below based on its overall structure.

[0032] A computer power supply with a replaceable heatsink, such as Figure 1 - Figure 4 As shown, the power supply includes a power supply housing 1, a base 501 fixed to one side of the inner wall of the power supply housing 1, a power supply body 4 mounted on the top of the base 501, a heat dissipation assembly on the top of the power supply body 4, the heat dissipation assembly including a heat conduction plate 6, a retaining strip 602 at the bottom of the heat conduction plate 6, a fixing frame 5 fitted onto the outer wall of the power supply body 4, a retaining groove 502 on the inner wall of the fixing frame 5, a mounting plate 2 mounted on one side of the power supply housing 1, and a baffle 203 fixed to one side of the mounting plate 2. This design solves the problem of the existing computer power supply's heat dissipation mechanism being fixed with screws, which makes disassembly difficult. A relatively inconvenient technical issue arises when replacing the heat dissipation component. The mounting plate on one side of the power supply casing is removed, and the clips in the heat dissipation component are then removed from the slots on the inner wall of the mounting frame. This allows the heat dissipation component to be removed from the inside of the power supply casing for replacement. The clips on the new heat dissipation component are then reinserted into the slots, and the mounting plate is bolted to one side of the power supply casing. Simultaneously, a baffle on one side of the mounting plate blocks the port of the slot, thus securing the heat-conducting plate inside the mounting frame. This facilitates the replacement of the heat dissipation component inside the power supply casing.

[0033] Please see Figure 4 The outer wall of the mounting plate 2 is fixed with a clip 202, and a bolt 201 is installed on one side of the clip 202. Personnel use the bolt 201 to install and fix the mounting plate 2 to one side of the power supply housing 1 through the clip 202.

[0034] Please see Figure 2 The top of the heat-conducting plate 6 is provided with multiple heat sinks 603, and the heat sinks 603 are set in a trapezoidal shape. The heat-conducting plate 6 conducts the heat generated by the power supply main unit 4 to the heat sinks 603. The trapezoidal shape of the heat sinks 603 increases the contact area between the heat sinks 603 and the air, thereby accelerating the heat dissipation effect of the heat sinks 603 on the power supply main unit 4.

[0035] Please see Figure 3 The inner wall of the radiator 603 is provided with multiple sets of heat dissipation holes 604. The air blown into the radiator 603 is blown onto the heat conduction plate 6 through the heat dissipation holes 604, thereby accelerating the heat exchange efficiency between the heat conduction plate 6 and the air.

[0036] Please see Figure 3 An isolation plate 601 is installed at the bottom of the heat-conducting plate 6. The isolation plate 601 is made of cubic boron nitride material. The isolation plate 601 has a certain degree of insulation to prevent leakage of the power supply body 4 from causing injury to personnel during the replacement of heat dissipation components. At the same time, the isolation plate 601 has good thermal conductivity to reduce the impact of the isolation plate 601 on the heat conduction of the power supply body 4 on the heat-conducting plate 6.

[0037] Please see Figure 3 A connecting rod 605 is fixed to the top of the heat-conducting plate 6, and a guide plate 606 is provided at the end of the connecting rod 605. The guide plates 606 on both sides of the radiator 603 guide a part of the air generated by the fan 3 to both sides of the power supply body 4, thereby accelerating the heat exchange between the power supply body 4 and the air.

[0038] Please see Figure 2 A motor 301 is installed on one side of the inner wall of the power supply housing 1. A fan 3 is connected to the end of the motor 301. The motor 301 drives the fan 3 connected to the end to run. The fan 3 rotates at high speed and generates a certain amount of air. The air generated by the fan 3 blows towards the radiator 603, thereby accelerating the heat exchange between the radiator 603 and the air.

[0039] Please see Figure 2 An air inlet 102 is provided on one side of the power supply housing 1, and an exhaust 101 is provided at one end of the power supply housing 1. Outside air enters the power supply housing 1 through the air inlet 102 and is discharged from the interior of the power supply housing 1 through the exhaust 101, thereby creating circulating air inside the power supply housing 1.

[0040] The working principle of this utility model is as follows: During the operation of the computer power supply, the main power supply component 4 generates a large amount of heat. The heat conduction plate 6 conducts the heat generated by the main power supply component 6 to the heat sink 603. The heat sink 603 is trapezoidal, which increases the contact area between the heat sink 603 and the air, thereby accelerating the heat dissipation effect of the heat sink 603 on the main power supply component 4. At the same time, the motor 301 drives the fan 3 connected to the end to operate. The fan 3 rotates at high speed and generates a certain amount of air. The air generated by the fan 3 blows towards the heat sink 603, thereby accelerating the heat exchange between the heat sink 603 and the air. The air blown into the heat sink 603 is blown onto the heat conduction plate 6 through the heat dissipation holes 604. At the same time, the air guide plates 606 on both sides of the heat sink 603 direct a portion of the air generated by the fan 3 towards the main power supply component. The airflow is guided on both sides of the power supply body 4 to accelerate the heat exchange between the power supply body 4 and the air. After the air absorbs the heat of the power supply body 4, it is discharged from the power supply housing 1 through the exhaust hole 101 on one side of the power supply housing 1. When the heat dissipation component needs to be replaced, the mounting plate 2 on one side of the power supply housing 1 is removed, and then the clip 602 in the heat dissipation component is taken out from the slot 502 on the inner wall of the fixing frame 5, so that the heat dissipation component can be taken out from the inside of the power supply housing 1 for replacement. Then the clip 602 on the new heat dissipation component is inserted back into the slot 502, and then the mounting plate 2 is installed and fixed on one side of the power supply housing 1 with bolts 201. At the same time, the baffle 203 on one side of the mounting plate 2 abuts against the port of the slot 502, so that the heat conduction plate 6 is fixed inside the fixing frame 5.

[0041] Although embodiments of the present invention have been shown and described, these specific embodiments are merely explanations of the present invention and are not intended to limit the invention. The specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions, and variations to the embodiments as needed without departing from the principles and spirit of the present invention, provided that such modifications, substitutions, and variations are within the scope of the claims of the present invention and are protected by patent law.

Claims

1. A computer power supply with a detachable heat dissipation assembly, comprising a power supply outer housing (1), characterized in that: The inner wall of the power shell body (1) is fixed with a base (501), the top of the base (501) is installed with a power main body (4), the top of the power main body (4) is provided with a heat dissipation assembly, the heat dissipation assembly comprises a heat conduction plate (6), the bottom of the heat conduction plate (6) is provided with a clamping strip (602), the outer wall of the power main body (4) is sleeved with a fixed frame (5), the inner wall of the fixed frame (5) is provided with a clamping groove (502), one side of the power shell body (1) is installed with a mounting plate (2), and the mounting plate (2) is fixed with a baffle (203) on one side.

2. The computer power supply of claim 1, wherein: The outer wall of the mounting plate (2) is fixed with a clamping block (202), and the clamping block (202) is installed with a bolt (201) on one side.

3. The computer power supply of claim 1, wherein: The top of the heat conduction plate (6) is provided with a plurality of heat dissipation fins (603), and the heat dissipation fins (603) are arranged in a trapezoidal shape.

4. The computer power supply of claim 3, wherein: The inner wall of the heat dissipation fin (603) is provided with a plurality of groups of heat dissipation holes (604).

5. A computer power supply with a replaceable heat dissipation component according to claim 1, characterized in that: The bottom of the heat conduction plate (6) is installed with an isolation plate (601), and the isolation plate (601) is made of cubic boron nitride material.

6. The computer power supply of claim 1, wherein: The top of the heat conduction plate (6) is fixed with a connecting rod (605), and the end of the connecting rod (605) is provided with an air deflector (606).

7. The computer power supply of claim 1, wherein: the heat sink assembly is removable and replaceable. The inner wall of the power shell body (1) is installed with a motor (301), and the end of the motor (301) is connected with a fan (3).

8. The computer power supply of claim 1, wherein: The power shell body (1) is provided with an air inlet hole (102) on one side, and the power shell body (1) is provided with an air outlet hole (101) at one end.